WO2009031602A1 - ポリアミドの製造方法および樹脂組成物 - Google Patents
ポリアミドの製造方法および樹脂組成物 Download PDFInfo
- Publication number
- WO2009031602A1 WO2009031602A1 PCT/JP2008/065932 JP2008065932W WO2009031602A1 WO 2009031602 A1 WO2009031602 A1 WO 2009031602A1 JP 2008065932 W JP2008065932 W JP 2008065932W WO 2009031602 A1 WO2009031602 A1 WO 2009031602A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- producing polyamide
- polyamide
- general formula
- compound represented
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/676,448 US9188860B2 (en) | 2007-09-06 | 2008-09-04 | Method for producing polyamide and resin composition |
KR1020107007360A KR101523798B1 (ko) | 2007-09-06 | 2008-09-04 | 폴리아미드의 제조 방법 및 수지 조성물 |
JP2008543600A JP5577595B2 (ja) | 2007-09-06 | 2008-09-04 | ポリアミドの製造方法および樹脂組成物 |
CN2008801057974A CN101796100B (zh) | 2007-09-06 | 2008-09-04 | 聚酰胺的制造方法以及树脂组合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007231165 | 2007-09-06 | ||
JP2007-231165 | 2007-09-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009031602A1 true WO2009031602A1 (ja) | 2009-03-12 |
Family
ID=40428915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/065932 WO2009031602A1 (ja) | 2007-09-06 | 2008-09-04 | ポリアミドの製造方法および樹脂組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9188860B2 (ja) |
JP (1) | JP5577595B2 (ja) |
KR (1) | KR101523798B1 (ja) |
CN (1) | CN101796100B (ja) |
TW (1) | TWI475045B (ja) |
WO (1) | WO2009031602A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011152063A1 (ja) * | 2010-06-04 | 2011-12-08 | 日本化薬株式会社 | ポリベンゾオキサゾール樹脂及びその前駆体樹脂 |
JP2012077048A (ja) * | 2010-10-05 | 2012-04-19 | Toray Fine Chemicals Co Ltd | ジアシル誘導体の製造方法 |
JP2012077045A (ja) * | 2010-10-05 | 2012-04-19 | Toray Fine Chemicals Co Ltd | 高純度ジアシル誘導体 |
JP2013231027A (ja) * | 2012-04-02 | 2013-11-14 | Ihara Nikkei Kagaku Kogyo Kk | アシルトリアゾール誘導体およびその製造方法 |
JP2017014191A (ja) * | 2015-07-06 | 2017-01-19 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 化合物、有機膜組成物、有機膜、およびパターン形成方法 |
JP2017179364A (ja) * | 2016-03-28 | 2017-10-05 | 東レ株式会社 | ポリアミド樹脂の製造方法およびそれを用いた感光性樹脂組成物の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106661153B (zh) * | 2014-08-26 | 2019-11-08 | 德山齿科株式会社 | 聚合性单体及其制造方法、固化性组合物以及树脂部件 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09183846A (ja) * | 1995-08-31 | 1997-07-15 | Siemens Ag | ポリ−o−ヒドロキシアミド及びポリ−o−メルカプトアミドの製造方法 |
JPH10168173A (ja) * | 1996-12-11 | 1998-06-23 | Siemens Ag | ポリベンゾオキサゾール及びポリベンゾチアゾール前駆体の製造方法 |
JP2002371133A (ja) * | 2001-06-14 | 2002-12-26 | Nitto Denko Corp | ポリベンゾオキサゾール前駆体の製法およびそれにより得られたポリベンゾオキサゾール前駆体ならびに感光性ポリベンゾオキサゾール前駆体組成物 |
JP2006162791A (ja) * | 2004-12-03 | 2006-06-22 | Sumitomo Bakelite Co Ltd | ポジ型感光性樹脂組成物、並びにそれを用いた半導体装置及び表示素子 |
JP2007193322A (ja) * | 2005-12-22 | 2007-08-02 | Asahi Kasei Electronics Co Ltd | ポジ型感光性樹脂組成物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3411659A1 (de) | 1984-03-29 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von polyoxazol- und polythiazol-vorstufen |
ATE67611T1 (de) | 1986-10-02 | 1991-10-15 | Hoechst Celanese Corp | Polyamide mit hexafluorisopropyliden-gruppen, diese enthaltende positiv arbeitende lichtempfindliche gemische und damit hergestellte aufzeichnungsmaterialien. |
DE3850809D1 (de) | 1987-05-18 | 1994-09-01 | Siemens Ag | Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen. |
JPH03167628A (ja) | 1989-11-28 | 1991-07-19 | Sony Corp | 索表乗算器 |
EP0761719B1 (de) | 1995-08-31 | 2001-03-28 | Infineon Technologies AG | Verfahren zur Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden |
JP4466092B2 (ja) | 2004-01-30 | 2010-05-26 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造法及び電子部品 |
-
2008
- 2008-09-04 US US12/676,448 patent/US9188860B2/en not_active Expired - Fee Related
- 2008-09-04 JP JP2008543600A patent/JP5577595B2/ja active Active
- 2008-09-04 KR KR1020107007360A patent/KR101523798B1/ko active IP Right Grant
- 2008-09-04 CN CN2008801057974A patent/CN101796100B/zh active Active
- 2008-09-04 WO PCT/JP2008/065932 patent/WO2009031602A1/ja active Application Filing
- 2008-09-05 TW TW097134011A patent/TWI475045B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09183846A (ja) * | 1995-08-31 | 1997-07-15 | Siemens Ag | ポリ−o−ヒドロキシアミド及びポリ−o−メルカプトアミドの製造方法 |
JPH10168173A (ja) * | 1996-12-11 | 1998-06-23 | Siemens Ag | ポリベンゾオキサゾール及びポリベンゾチアゾール前駆体の製造方法 |
JP2002371133A (ja) * | 2001-06-14 | 2002-12-26 | Nitto Denko Corp | ポリベンゾオキサゾール前駆体の製法およびそれにより得られたポリベンゾオキサゾール前駆体ならびに感光性ポリベンゾオキサゾール前駆体組成物 |
JP2006162791A (ja) * | 2004-12-03 | 2006-06-22 | Sumitomo Bakelite Co Ltd | ポジ型感光性樹脂組成物、並びにそれを用いた半導体装置及び表示素子 |
JP2007193322A (ja) * | 2005-12-22 | 2007-08-02 | Asahi Kasei Electronics Co Ltd | ポジ型感光性樹脂組成物 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011152063A1 (ja) * | 2010-06-04 | 2011-12-08 | 日本化薬株式会社 | ポリベンゾオキサゾール樹脂及びその前駆体樹脂 |
JP2011256219A (ja) * | 2010-06-04 | 2011-12-22 | Nippon Kayaku Co Ltd | ポリベンゾオキサゾール樹脂及びその前駆体樹脂 |
JP2012077048A (ja) * | 2010-10-05 | 2012-04-19 | Toray Fine Chemicals Co Ltd | ジアシル誘導体の製造方法 |
JP2012077045A (ja) * | 2010-10-05 | 2012-04-19 | Toray Fine Chemicals Co Ltd | 高純度ジアシル誘導体 |
JP2013231027A (ja) * | 2012-04-02 | 2013-11-14 | Ihara Nikkei Kagaku Kogyo Kk | アシルトリアゾール誘導体およびその製造方法 |
JP2017014191A (ja) * | 2015-07-06 | 2017-01-19 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 化合物、有機膜組成物、有機膜、およびパターン形成方法 |
JP2017179364A (ja) * | 2016-03-28 | 2017-10-05 | 東レ株式会社 | ポリアミド樹脂の製造方法およびそれを用いた感光性樹脂組成物の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5577595B2 (ja) | 2014-08-27 |
JPWO2009031602A1 (ja) | 2010-12-16 |
KR101523798B1 (ko) | 2015-05-28 |
KR20100059942A (ko) | 2010-06-04 |
US9188860B2 (en) | 2015-11-17 |
CN101796100B (zh) | 2012-07-18 |
CN101796100A (zh) | 2010-08-04 |
TW200920764A (en) | 2009-05-16 |
TWI475045B (zh) | 2015-03-01 |
US20100285404A1 (en) | 2010-11-11 |
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