WO2009025078A1 - Structure de connexion et procédé de connexion - Google Patents
Structure de connexion et procédé de connexion Download PDFInfo
- Publication number
- WO2009025078A1 WO2009025078A1 PCT/JP2008/002207 JP2008002207W WO2009025078A1 WO 2009025078 A1 WO2009025078 A1 WO 2009025078A1 JP 2008002207 W JP2008002207 W JP 2008002207W WO 2009025078 A1 WO2009025078 A1 WO 2009025078A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- connection
- connection structure
- resistor
- diode
- led chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Led Device Packages (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
L'invention concerne une structure de connexion qui facilite une connexion d'une puce DEL (31), d'une diode (32) et d'une résistance (33) à un câble plat (100). La structure de connexion a un boîtier de dispositif (11) pour contenir la puce DEL (31), la diode (32) et la résistance (33) et a aussi un boîtier de borne (12) pour contenir des bornes plates (21) et des bornes (22, 23) avec des pattes.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-217031 | 2007-08-23 | ||
JP2007217031A JP4934545B2 (ja) | 2007-01-10 | 2007-08-23 | 接続構造及び接続方法 |
JP2007-217030 | 2007-08-23 | ||
JP2007217030A JP4934544B2 (ja) | 2007-01-10 | 2007-08-23 | 接続構造及び接続方法 |
JP2007-217033 | 2007-08-23 | ||
JP2007-217032 | 2007-08-23 | ||
JP2007217032A JP4934546B2 (ja) | 2007-01-10 | 2007-08-23 | 接続構造及び接続方法 |
JP2007217029A JP4934543B2 (ja) | 2007-01-10 | 2007-08-23 | 接続構造及び接続方法 |
JP2007217033A JP4823987B2 (ja) | 2007-01-10 | 2007-08-23 | 接続構造及び接続方法 |
JP2007-217029 | 2007-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009025078A1 true WO2009025078A1 (fr) | 2009-02-26 |
Family
ID=40379713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002207 WO2009025078A1 (fr) | 2007-08-23 | 2008-08-13 | Structure de connexion et procédé de connexion |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009025078A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016001395A1 (fr) * | 2014-07-04 | 2016-01-07 | Idz Concept | Embase de support pour composant electrique cable, module d'eclairage correspondant, procede de realisation d'un module associe et vetement correspondant |
EP3091275A1 (fr) * | 2015-05-08 | 2016-11-09 | OSRAM GmbH | Procédé d'assemblage de dispositifs d'éclairage et dispositif correspondant |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5961051A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | Icソケツト |
JPH0745346A (ja) * | 1993-07-30 | 1995-02-14 | Nec Corp | チップ部品用ソケット |
JPH0951070A (ja) * | 1995-08-08 | 1997-02-18 | Fujitsu Ltd | パッケージ |
WO2005088191A1 (fr) * | 2004-03-11 | 2005-09-22 | Moriyama Sangyo Kabushiki Kaisha | Dispositif de prise femelle |
JP2006128652A (ja) * | 2004-09-29 | 2006-05-18 | Furukawa Electric Co Ltd:The | 発光部品搭載フラットケーブルの固定構造 |
JP2006210537A (ja) * | 2005-01-26 | 2006-08-10 | Furukawa Electric Co Ltd:The | Led発光構造体の放熱構造 |
-
2008
- 2008-08-13 WO PCT/JP2008/002207 patent/WO2009025078A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5961051A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | Icソケツト |
JPH0745346A (ja) * | 1993-07-30 | 1995-02-14 | Nec Corp | チップ部品用ソケット |
JPH0951070A (ja) * | 1995-08-08 | 1997-02-18 | Fujitsu Ltd | パッケージ |
WO2005088191A1 (fr) * | 2004-03-11 | 2005-09-22 | Moriyama Sangyo Kabushiki Kaisha | Dispositif de prise femelle |
JP2006128652A (ja) * | 2004-09-29 | 2006-05-18 | Furukawa Electric Co Ltd:The | 発光部品搭載フラットケーブルの固定構造 |
JP2006210537A (ja) * | 2005-01-26 | 2006-08-10 | Furukawa Electric Co Ltd:The | Led発光構造体の放熱構造 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016001395A1 (fr) * | 2014-07-04 | 2016-01-07 | Idz Concept | Embase de support pour composant electrique cable, module d'eclairage correspondant, procede de realisation d'un module associe et vetement correspondant |
FR3023421A1 (fr) * | 2014-07-04 | 2016-01-08 | Idz Concept | Embase de support pour composant electrique cable |
US10012373B2 (en) | 2014-07-04 | 2018-07-03 | Idz Concept | Mounting base for an electrical component having a housing with a groove with a convergent bottom for crimping an electrical wire |
EP3091275A1 (fr) * | 2015-05-08 | 2016-11-09 | OSRAM GmbH | Procédé d'assemblage de dispositifs d'éclairage et dispositif correspondant |
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