WO2009022619A1 - ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法 - Google Patents

ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法 Download PDF

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Publication number
WO2009022619A1
WO2009022619A1 PCT/JP2008/064190 JP2008064190W WO2009022619A1 WO 2009022619 A1 WO2009022619 A1 WO 2009022619A1 JP 2008064190 W JP2008064190 W JP 2008064190W WO 2009022619 A1 WO2009022619 A1 WO 2009022619A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
polyimide
film
precursor resin
polyimide precursor
Prior art date
Application number
PCT/JP2008/064190
Other languages
English (en)
French (fr)
Inventor
Takeshi Yoshida
Akira Shigeta
Yoshiaki Echigo
Original Assignee
Unitika Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd. filed Critical Unitika Ltd.
Priority to JP2009528101A priority Critical patent/JP5473601B2/ja
Priority to US12/310,288 priority patent/US8492506B2/en
Publication of WO2009022619A1 publication Critical patent/WO2009022619A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

　本発明は、より安価なポリアミドイミドを用いても、成形時の残留揮発分率を低減可能で、しかも機械的特性および透明性に優れたポリイミド樹脂組成物（例えばポリイミドフィルム）を形成可能で、透明性に優れたポリイミド前駆体樹脂組成物を提供することを目的とする。本発明は、下記式（１）で示されるジアミンモノマー単位を含有するポリアミドイミド（Ａ）および下記式（２ｐ）～（２ｒ）で示されるテトラカルボン酸モノマー単位から選択される少なくとも１種類のモノマー単位を含有するポリアミック酸（Ｂ）を含むポリイミド前駆体樹脂組成物であって、該ポリイミド前駆体樹脂組成物をイミド化して厚み４０μｍのフィルムとしたときのヘーズが４％以下であるポリイミド前駆体樹脂組成物に関する。 （式（１）中、Ｒは炭素数１～５のアルキレン基である）
PCT/JP2008/064190 2007-08-14 2008-08-07 ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法 WO2009022619A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009528101A JP5473601B2 (ja) 2007-08-14 2008-08-07 ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法
US12/310,288 US8492506B2 (en) 2007-08-14 2008-08-07 Polyimide resin composition, polyimide precursor resin composition for the same, production method thereof, and polyimide film and production method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-211577 2007-08-14
JP2007211577 2007-08-14
JP2008053859 2008-03-04
JPPCT/JP2008/053859 2008-03-04

Publications (1)

Publication Number Publication Date
WO2009022619A1 true WO2009022619A1 (ja) 2009-02-19

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PCT/JP2008/064190 WO2009022619A1 (ja) 2007-08-14 2008-08-07 ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法

Country Status (3)

Country Link
US (1) US8492506B2 (ja)
JP (1) JP5473601B2 (ja)
WO (1) WO2009022619A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254935A (ja) * 2009-04-22 2010-11-11 Skckolonpi Inc ポリイミド含有ポリアミドイミド混和フィルムの製造方法
JP2011162733A (ja) * 2010-02-15 2011-08-25 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた塗料
WO2012132154A1 (ja) * 2011-03-28 2012-10-04 日本電気株式会社 二次電池
WO2012132152A1 (ja) * 2011-03-28 2012-10-04 日本電気株式会社 二次電池およびその製造方法
JP6060897B2 (ja) * 2011-03-28 2017-01-18 日本電気株式会社 二次電池
KR101906393B1 (ko) 2017-11-03 2018-10-11 에스케이씨코오롱피아이 주식회사 초박막 블랙 폴리이미드 필름 및 이의 제조방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
JP2013001872A (ja) * 2011-06-20 2013-01-07 Hitachi Cable Ltd ポリアミドイミド樹脂絶縁塗料、絶縁電線、及びコイル
CN104470981A (zh) * 2012-05-16 2015-03-25 索尔维特殊聚合物美国有限责任公司 摩擦聚合物组合物
KR101995916B1 (ko) 2012-07-19 2019-07-03 삼성전자주식회사 폴리이미드 전구체 조성물, 이를 사용하여 제조된 성형품 및 상기 성형품을 포함하는 디스플레이 장치
KR20210123308A (ko) * 2019-02-04 2021-10-13 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 무색투명 폴리이미드 필름

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JPS63305166A (ja) * 1987-06-05 1988-12-13 Mitsui Toatsu Chem Inc ポリイミド系樹脂組成物
JPH02115265A (ja) * 1988-10-24 1990-04-27 Toyobo Co Ltd 耐熱性フイルムおよびその積層物
JPH0411656A (ja) * 1990-04-27 1992-01-16 Toho Rayon Co Ltd ポリアミック酸複合体及びその製法
JPH04189827A (ja) * 1990-11-22 1992-07-08 Toho Rayon Co Ltd 高性能ポリイミド成形体及びその製造方法
JPH0632901A (ja) * 1992-07-13 1994-02-08 Toyobo Co Ltd 自己補強性ポリマー複合体、その製造法およびその成形物
JP2000191908A (ja) * 1998-12-25 2000-07-11 Mitsui Chemicals Inc 熱安定性の良好な溶融成形用ポリイミド樹脂組成物

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US5288843A (en) * 1987-05-20 1994-02-22 Mitsui Toatsu Chemicals, Inc. Polyimides, process for the preparation thereof and polyimide resin compositions
US5438105A (en) * 1990-04-27 1995-08-01 Toho Rayon Co., Ltd. Polyamic acid composite, polyimide composite and processes for producing the same
JP4543314B2 (ja) 2003-09-01 2010-09-15 東洋紡績株式会社 ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
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Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JPS63305166A (ja) * 1987-06-05 1988-12-13 Mitsui Toatsu Chem Inc ポリイミド系樹脂組成物
JPH02115265A (ja) * 1988-10-24 1990-04-27 Toyobo Co Ltd 耐熱性フイルムおよびその積層物
JPH0411656A (ja) * 1990-04-27 1992-01-16 Toho Rayon Co Ltd ポリアミック酸複合体及びその製法
JPH04189827A (ja) * 1990-11-22 1992-07-08 Toho Rayon Co Ltd 高性能ポリイミド成形体及びその製造方法
JPH0632901A (ja) * 1992-07-13 1994-02-08 Toyobo Co Ltd 自己補強性ポリマー複合体、その製造法およびその成形物
JP2000191908A (ja) * 1998-12-25 2000-07-11 Mitsui Chemicals Inc 熱安定性の良好な溶融成形用ポリイミド樹脂組成物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254935A (ja) * 2009-04-22 2010-11-11 Skckolonpi Inc ポリイミド含有ポリアミドイミド混和フィルムの製造方法
JP2011162733A (ja) * 2010-02-15 2011-08-25 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた塗料
WO2012132154A1 (ja) * 2011-03-28 2012-10-04 日本電気株式会社 二次電池
WO2012132152A1 (ja) * 2011-03-28 2012-10-04 日本電気株式会社 二次電池およびその製造方法
JP6060896B2 (ja) * 2011-03-28 2017-01-18 日本電気株式会社 二次電池およびその製造方法
JP6060897B2 (ja) * 2011-03-28 2017-01-18 日本電気株式会社 二次電池
KR101906393B1 (ko) 2017-11-03 2018-10-11 에스케이씨코오롱피아이 주식회사 초박막 블랙 폴리이미드 필름 및 이의 제조방법
WO2019088454A1 (ko) * 2017-11-03 2019-05-09 에스케이씨코오롱피아이 주식회사 초박막 블랙 폴리이미드 필름 및 이의 제조방법

Also Published As

Publication number Publication date
JPWO2009022619A1 (ja) 2010-11-11
US20100273974A1 (en) 2010-10-28
JP5473601B2 (ja) 2014-04-16
US8492506B2 (en) 2013-07-23

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