WO2008120787A1 - 芳香族ポリイミドおよびその製造方法 - Google Patents

芳香族ポリイミドおよびその製造方法 Download PDF

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Publication number
WO2008120787A1
WO2008120787A1 PCT/JP2008/056423 JP2008056423W WO2008120787A1 WO 2008120787 A1 WO2008120787 A1 WO 2008120787A1 JP 2008056423 W JP2008056423 W JP 2008056423W WO 2008120787 A1 WO2008120787 A1 WO 2008120787A1
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WIPO (PCT)
Prior art keywords
mol
aromatic polyimide
production
acid
extremely high
Prior art date
Application number
PCT/JP2008/056423
Other languages
English (en)
French (fr)
Inventor
Hiroaki Yamaguchi
Seiichirou Takabayashi
Tooru Murakami
Takeshige Nakayama
Original Assignee
Ube Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries, Ltd. filed Critical Ube Industries, Ltd.
Priority to EP08739536A priority Critical patent/EP2141187A4/en
Priority to CN200880018243A priority patent/CN101679632A/zh
Priority to US12/593,861 priority patent/US20100130628A1/en
Priority to KR1020097022417A priority patent/KR101312995B1/ko
Publication of WO2008120787A1 publication Critical patent/WO2008120787A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30—Belts or like endless load-carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
    • G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
    • G03G15/1605—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support
    • G03G15/162—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support details of the the intermediate support, e.g. chemical composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/20—Details of the fixing device or porcess
    • G03G2215/2003—Structural features of the fixing device
    • G03G2215/2016—Heating belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Sealing Material Composition (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Belt Conveyors (AREA)

Abstract

　本発明は、テトラカルボン酸成分が全テトラカルボン酸成分１００モル％中２５～９７モル％の３，３’，４，４’－ビフェニルテトラカルボン酸類、及び７５～３モル％の４，４’－オキシジフタル酸類からなり、ジアミン成分がパラフェニレンジアミン類からなる、極めて高い強靭性と極めて高いガスバリア性とを有する芳香族ポリイミドに関する。
PCT/JP2008/056423 2007-03-29 2008-03-31 芳香族ポリイミドおよびその製造方法 WO2008120787A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08739536A EP2141187A4 (en) 2007-03-29 2008-03-31 AROMATIC POLYIMIDE AND METHOD FOR PRODUCING THE SAME
CN200880018243A CN101679632A (zh) 2007-03-29 2008-03-31 芳族聚酰亚胺及其制造方法
US12/593,861 US20100130628A1 (en) 2007-03-29 2008-03-31 Aromatic polyimide and process for production thereof
KR1020097022417A KR101312995B1 (ko) 2007-03-29 2008-03-31 방향족 폴리이미드 및 그 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-088563 2007-03-29
JP2007088563 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120787A1 true WO2008120787A1 (ja) 2008-10-09

Family

ID=39808367

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056423 WO2008120787A1 (ja) 2007-03-29 2008-03-31 芳香族ポリイミドおよびその製造方法

Country Status (6)

Country Link
US (1) US20100130628A1 (ja)
EP (1) EP2141187A4 (ja)
JP (1) JP5347306B2 (ja)
KR (1) KR101312995B1 (ja)
CN (1) CN101679632A (ja)
WO (1) WO2008120787A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010050491A1 (ja) * 2008-10-31 2010-05-06 宇部興産株式会社 ポリイミド前駆体溶液組成物
JP2010106207A (ja) * 2008-10-31 2010-05-13 Ube Ind Ltd ポリイミド前駆体溶液組成物
JP2010106206A (ja) * 2008-10-31 2010-05-13 Ube Ind Ltd ポリイミド前駆体溶液組成物
JP2010235773A (ja) * 2009-03-31 2010-10-21 Ube Ind Ltd ポリイミド前駆体溶液組成物
EP2309338A1 (en) * 2009-09-30 2011-04-13 Xerox Corporation Fast and low temperature cured polyimide fuser belt
US8105655B2 (en) 2008-06-30 2012-01-31 Xerox Corporation Fast and low temperature cured polyimide fuser belt
CN102484254A (zh) * 2009-09-30 2012-05-30 宇部兴产株式会社 电极用粘合剂树脂组合物、电极合剂糊剂及电极
WO2012081644A1 (ja) 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
JP5534012B2 (ja) * 2010-08-02 2014-06-25 日産自動車株式会社 リチウムイオン二次電池用負極およびその製造方法
JP2018146835A (ja) * 2017-03-07 2018-09-20 キヤノン株式会社 電子写真用回転体、定着装置、電子写真画像形成装置および回転体の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9187676B2 (en) 2010-07-22 2015-11-17 Ube Industries, Ltd. Production process of polyimide film laminate, and polyimide film laminate
US20130068469A1 (en) * 2011-09-15 2013-03-21 Baojiu Lin Pressurized Polymer Beads As Proppants
KR102140174B1 (ko) * 2013-01-31 2020-07-31 솔브레인 주식회사 투명 박막 봉지용 조성물
CN103242657B (zh) * 2013-05-23 2015-11-25 江苏亚宝绝缘材料股份有限公司 一种聚酰亚胺薄膜制备方法
KR20170102527A (ko) * 2015-01-06 2017-09-11 도판 인사츠 가부시키가이샤 축전 디바이스용 외장재
CN108845396A (zh) * 2018-06-01 2018-11-20 江苏亨通海洋光网***有限公司 一种超长距离极细径制导光缆
CN113219802B (zh) * 2021-04-30 2022-06-03 龙南格林园艺制品有限公司 彩卡式自动识别生产线
KR20240042970A (ko) * 2022-09-26 2024-04-02 코오롱인더스트리 주식회사 강성이 개선된 광학 필름 및 이를 포함하는 표시장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228715A (ja) * 1998-02-19 1999-08-24 Kanegafuchi Chem Ind Co Ltd 接着性が改善されたポリイミドフィルム及びその製造方法
JP2001228301A (ja) * 2000-02-14 2001-08-24 Hitachi Chem Co Ltd ポリイミド光部材及び光デバイス
JP2002503288A (ja) * 1999-05-21 2002-01-29 アメリカ合衆国 微小中空球状ポリイミド
JP2004255845A (ja) * 2003-02-28 2004-09-16 Du Pont Toray Co Ltd ガスバリアー性ポリイミドフィルムおよびそれを用いた金属積層体
JP2006301196A (ja) * 2005-04-19 2006-11-02 Nitto Denko Corp シームレスベルト
JP2006321219A (ja) * 2005-04-19 2006-11-30 Toyobo Co Ltd 薄膜積層ポリイミドフィルム薄膜積層ポリイミドフィルムロール及びその利用
JP2006323081A (ja) * 2005-05-18 2006-11-30 Nitto Denko Corp カラー画像用定着ベルト
JP2007069818A (ja) * 2005-09-08 2007-03-22 Bridgestone Corp 中空粒子の内圧調整方法と中空粒子およびタイヤとリムの組立体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171828A (en) * 1989-10-26 1992-12-15 Occidental Chemical Corporation Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA
JPH06157905A (ja) * 1992-11-24 1994-06-07 Matsushita Electric Works Ltd 熱硬化型ポリイミド樹脂組成物と熱硬化品およびその製造方法
US6325803B1 (en) * 1998-02-18 2001-12-04 Walter Lorenz Surgical, Inc. Method and apparatus for mandibular osteosynthesis
JP4673584B2 (ja) * 2004-07-29 2011-04-20 富士通株式会社 キャッシュメモリ装置、演算処理装置及びキャッシュメモリ装置の制御方法
JP2006175784A (ja) * 2004-12-24 2006-07-06 Toppan Printing Co Ltd 無機酸化物蒸着層及び保護層を有するガスバリアフィルム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228715A (ja) * 1998-02-19 1999-08-24 Kanegafuchi Chem Ind Co Ltd 接着性が改善されたポリイミドフィルム及びその製造方法
JP2002503288A (ja) * 1999-05-21 2002-01-29 アメリカ合衆国 微小中空球状ポリイミド
JP2001228301A (ja) * 2000-02-14 2001-08-24 Hitachi Chem Co Ltd ポリイミド光部材及び光デバイス
JP2004255845A (ja) * 2003-02-28 2004-09-16 Du Pont Toray Co Ltd ガスバリアー性ポリイミドフィルムおよびそれを用いた金属積層体
JP2006301196A (ja) * 2005-04-19 2006-11-02 Nitto Denko Corp シームレスベルト
JP2006321219A (ja) * 2005-04-19 2006-11-30 Toyobo Co Ltd 薄膜積層ポリイミドフィルム薄膜積層ポリイミドフィルムロール及びその利用
JP2006323081A (ja) * 2005-05-18 2006-11-30 Nitto Denko Corp カラー画像用定着ベルト
JP2007069818A (ja) * 2005-09-08 2007-03-22 Bridgestone Corp 中空粒子の内圧調整方法と中空粒子およびタイヤとリムの組立体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2141187A4 *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105655B2 (en) 2008-06-30 2012-01-31 Xerox Corporation Fast and low temperature cured polyimide fuser belt
CN102197091B (zh) * 2008-10-31 2013-11-06 宇部兴产株式会社 聚酰亚胺前体溶液组合物
JP2010106207A (ja) * 2008-10-31 2010-05-13 Ube Ind Ltd ポリイミド前駆体溶液組成物
JP2010106206A (ja) * 2008-10-31 2010-05-13 Ube Ind Ltd ポリイミド前駆体溶液組成物
KR101657113B1 (ko) 2008-10-31 2016-09-13 우베 고산 가부시키가이샤 폴리이미드 전구체 용액 조성물
KR20110079810A (ko) * 2008-10-31 2011-07-08 우베 고산 가부시키가이샤 폴리이미드 전구체 용액 조성물
CN102197091A (zh) * 2008-10-31 2011-09-21 宇部兴产株式会社 聚酰亚胺前体溶液组合物
WO2010050491A1 (ja) * 2008-10-31 2010-05-06 宇部興産株式会社 ポリイミド前駆体溶液組成物
US9334368B2 (en) 2008-10-31 2016-05-10 Ube Industries, Ltd. Polyimide precursor solution composition
JP2010235773A (ja) * 2009-03-31 2010-10-21 Ube Ind Ltd ポリイミド前駆体溶液組成物
CN102484254A (zh) * 2009-09-30 2012-05-30 宇部兴产株式会社 电极用粘合剂树脂组合物、电极合剂糊剂及电极
US20120168688A1 (en) * 2009-09-30 2012-07-05 Ube Industries, Ltd. Binder resin composition for electrode, electrode mixture paste, and electrode
US9418772B2 (en) 2009-09-30 2016-08-16 Ube Industries, Ltd. Binder resin composition for electrode, electrode mixture paste, and electrode
EP2309338A1 (en) * 2009-09-30 2011-04-13 Xerox Corporation Fast and low temperature cured polyimide fuser belt
JP5534012B2 (ja) * 2010-08-02 2014-06-25 日産自動車株式会社 リチウムイオン二次電池用負極およびその製造方法
WO2012081644A1 (ja) 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
JP2018146835A (ja) * 2017-03-07 2018-09-20 キヤノン株式会社 電子写真用回転体、定着装置、電子写真画像形成装置および回転体の製造方法

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CN101679632A (zh) 2010-03-24
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EP2141187A4 (en) 2012-06-20
EP2141187A1 (en) 2010-01-06
JP5347306B2 (ja) 2013-11-20
KR20090122495A (ko) 2009-11-30
US20100130628A1 (en) 2010-05-27

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