WO2009019787A1 - 有機半導体装置用樹脂基板 - Google Patents

有機半導体装置用樹脂基板 Download PDF

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Publication number
WO2009019787A1
WO2009019787A1 PCT/JP2007/065631 JP2007065631W WO2009019787A1 WO 2009019787 A1 WO2009019787 A1 WO 2009019787A1 JP 2007065631 W JP2007065631 W JP 2007065631W WO 2009019787 A1 WO2009019787 A1 WO 2009019787A1
Authority
WO
WIPO (PCT)
Prior art keywords
main face
resin substrate
semiconductor device
organic semiconductor
resin material
Prior art date
Application number
PCT/JP2007/065631
Other languages
English (en)
French (fr)
Inventor
Youhei Tanaka
Original Assignee
Pioneer Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corporation filed Critical Pioneer Corporation
Priority to PCT/JP2007/065631 priority Critical patent/WO2009019787A1/ja
Publication of WO2009019787A1 publication Critical patent/WO2009019787A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Thin Film Transistor (AREA)

Abstract

　本発明の高い形状保存性を有する有機半導体装置用樹脂基板は、単一の樹脂材料からなり第１主面と第２主面とで画定され、第１主面と第２主面で樹脂材料の線膨張係数が異なる樹脂基板を有し、樹脂材料の線膨張係数が第１主面から第２主面までの厚さに対応して連続的に変化している。
PCT/JP2007/065631 2007-08-09 2007-08-09 有機半導体装置用樹脂基板 WO2009019787A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065631 WO2009019787A1 (ja) 2007-08-09 2007-08-09 有機半導体装置用樹脂基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065631 WO2009019787A1 (ja) 2007-08-09 2007-08-09 有機半導体装置用樹脂基板

Publications (1)

Publication Number Publication Date
WO2009019787A1 true WO2009019787A1 (ja) 2009-02-12

Family

ID=40341035

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065631 WO2009019787A1 (ja) 2007-08-09 2007-08-09 有機半導体装置用樹脂基板

Country Status (1)

Country Link
WO (1) WO2009019787A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013003538A (ja) * 2011-06-21 2013-01-07 Japan Display Central Co Ltd 基板、基板を備えた表示装置及び基板の製造方法
CN111403351A (zh) * 2018-12-26 2020-07-10 三菱电机株式会社 半导体模块、其制造方法以及电力变换装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07214723A (ja) * 1994-02-04 1995-08-15 Kawasaki Heavy Ind Ltd 熱遮蔽材料
JP2001230558A (ja) * 2000-02-14 2001-08-24 Mitsubishi Electric Corp 炭素繊維を含むアルミニウム筐体
JP2002359341A (ja) * 2001-05-31 2002-12-13 Hitachi Ltd 半導体モジュールおよびその製造方法
JP2005140818A (ja) * 2003-11-04 2005-06-02 Sharp Corp 表示装置およびその製造方法
JP2005153273A (ja) * 2003-11-25 2005-06-16 Nitto Denko Corp 樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板
JP2006323373A (ja) * 2005-04-18 2006-11-30 Sumitomo Chemical Co Ltd 表示素子用基板
JP2007065644A (ja) * 2005-08-03 2007-03-15 Asahi Kasei Corp ディスプレイ用基板及びディスプレイ並びにそれらの製造方法
JP2007116087A (ja) * 2005-09-26 2007-05-10 Tdk Corp 熱電素子
JP2007190844A (ja) * 2006-01-20 2007-08-02 Konica Minolta Holdings Inc ガスバリア性樹脂基材および有機エレクトロルミネッセンスデバイス

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07214723A (ja) * 1994-02-04 1995-08-15 Kawasaki Heavy Ind Ltd 熱遮蔽材料
JP2001230558A (ja) * 2000-02-14 2001-08-24 Mitsubishi Electric Corp 炭素繊維を含むアルミニウム筐体
JP2002359341A (ja) * 2001-05-31 2002-12-13 Hitachi Ltd 半導体モジュールおよびその製造方法
JP2005140818A (ja) * 2003-11-04 2005-06-02 Sharp Corp 表示装置およびその製造方法
JP2005153273A (ja) * 2003-11-25 2005-06-16 Nitto Denko Corp 樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板
JP2006323373A (ja) * 2005-04-18 2006-11-30 Sumitomo Chemical Co Ltd 表示素子用基板
JP2007065644A (ja) * 2005-08-03 2007-03-15 Asahi Kasei Corp ディスプレイ用基板及びディスプレイ並びにそれらの製造方法
JP2007116087A (ja) * 2005-09-26 2007-05-10 Tdk Corp 熱電素子
JP2007190844A (ja) * 2006-01-20 2007-08-02 Konica Minolta Holdings Inc ガスバリア性樹脂基材および有機エレクトロルミネッセンスデバイス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013003538A (ja) * 2011-06-21 2013-01-07 Japan Display Central Co Ltd 基板、基板を備えた表示装置及び基板の製造方法
CN111403351A (zh) * 2018-12-26 2020-07-10 三菱电机株式会社 半导体模块、其制造方法以及电力变换装置

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