WO2009016795A1 - 貼り合わせウエーハの製造方法 - Google Patents
貼り合わせウエーハの製造方法 Download PDFInfo
- Publication number
- WO2009016795A1 WO2009016795A1 PCT/JP2008/001754 JP2008001754W WO2009016795A1 WO 2009016795 A1 WO2009016795 A1 WO 2009016795A1 JP 2008001754 W JP2008001754 W JP 2008001754W WO 2009016795 A1 WO2009016795 A1 WO 2009016795A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- ion implantation
- bonded wafer
- bonded
- bonding
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 238000005468 ion implantation Methods 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 4
- 239000007789 gas Substances 0.000 abstract 3
- 239000010408 film Substances 0.000 abstract 2
- 230000001590 oxidative effect Effects 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08776766.1A EP2175477B1 (en) | 2007-07-27 | 2008-07-03 | Bonded wafer manufacturing method |
KR1020107001557A KR101462397B1 (ko) | 2007-07-27 | 2008-07-03 | 접합 웨이퍼의 제조 방법 |
CN2008801006440A CN101765901B (zh) | 2007-07-27 | 2008-07-03 | 贴合晶片的制造方法 |
US12/452,085 US8173521B2 (en) | 2007-07-27 | 2008-07-03 | Method for manufacturing bonded wafer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007196467A JP5135935B2 (ja) | 2007-07-27 | 2007-07-27 | 貼り合わせウエーハの製造方法 |
JP2007-196467 | 2007-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009016795A1 true WO2009016795A1 (ja) | 2009-02-05 |
Family
ID=40304039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001754 WO2009016795A1 (ja) | 2007-07-27 | 2008-07-03 | 貼り合わせウエーハの製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8173521B2 (ja) |
EP (1) | EP2175477B1 (ja) |
JP (1) | JP5135935B2 (ja) |
KR (1) | KR101462397B1 (ja) |
CN (1) | CN101765901B (ja) |
WO (1) | WO2009016795A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012520579A (ja) * | 2009-03-18 | 2012-09-06 | ソイテック | 「シリコン−オン−インシュレーター」soi型の基板のための表面処理方法 |
WO2013111242A1 (ja) * | 2012-01-24 | 2013-08-01 | 信越半導体株式会社 | 貼り合わせsoiウェーハの製造方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8252700B2 (en) * | 2009-01-30 | 2012-08-28 | Covalent Materials Corporation | Method of heat treating silicon wafer |
JP5387450B2 (ja) * | 2010-03-04 | 2014-01-15 | 信越半導体株式会社 | Soiウェーハの設計方法及び製造方法 |
JP5387451B2 (ja) * | 2010-03-04 | 2014-01-15 | 信越半導体株式会社 | Soiウェーハの設計方法及び製造方法 |
JP5703920B2 (ja) * | 2011-04-13 | 2015-04-22 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
CN102280387B (zh) * | 2011-08-31 | 2016-05-04 | 上海华虹宏力半导体制造有限公司 | Sonos结构和sonos存储器的形成方法 |
CN102280378B (zh) * | 2011-08-31 | 2016-06-29 | 上海华虹宏力半导体制造有限公司 | Sonos结构的形成方法 |
JP5704039B2 (ja) * | 2011-10-06 | 2015-04-22 | 信越半導体株式会社 | 貼り合わせsoiウェーハの製造方法 |
JP5927894B2 (ja) * | 2011-12-15 | 2016-06-01 | 信越半導体株式会社 | Soiウェーハの製造方法 |
JP2013143407A (ja) | 2012-01-06 | 2013-07-22 | Shin Etsu Handotai Co Ltd | 貼り合わせsoiウェーハの製造方法 |
JP6086031B2 (ja) * | 2013-05-29 | 2017-03-01 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
JP6200273B2 (ja) * | 2013-10-17 | 2017-09-20 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
JP6107709B2 (ja) * | 2014-03-10 | 2017-04-05 | 信越半導体株式会社 | 貼り合わせsoiウェーハの製造方法 |
JP6036732B2 (ja) | 2014-03-18 | 2016-11-30 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
JP6344271B2 (ja) * | 2015-03-06 | 2018-06-20 | 信越半導体株式会社 | 貼り合わせ半導体ウェーハ及び貼り合わせ半導体ウェーハの製造方法 |
JP6380245B2 (ja) * | 2015-06-15 | 2018-08-29 | 信越半導体株式会社 | Soiウェーハの製造方法 |
JP6473970B2 (ja) * | 2015-10-28 | 2019-02-27 | 信越半導体株式会社 | 貼り合わせsoiウェーハの製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05211128A (ja) | 1991-09-18 | 1993-08-20 | Commiss Energ Atom | 薄い半導体材料フィルムの製造方法 |
JP2000150905A (ja) * | 1998-09-04 | 2000-05-30 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2000294754A (ja) * | 1999-04-07 | 2000-10-20 | Denso Corp | 半導体基板及び半導体基板の製造方法並びに半導体基板製造装置 |
WO2006070220A1 (en) * | 2004-12-28 | 2006-07-06 | S.O.I.Tec Silicon On Insulator Technologies | Method for obtaining a thin layer having a low density of holes |
WO2006109614A1 (ja) * | 2005-04-06 | 2006-10-19 | Shin-Etsu Handotai Co., Ltd. | Soiウェーハの製造方法およびこの方法により製造されたsoiウェーハ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124092A (ja) * | 1998-10-16 | 2000-04-28 | Shin Etsu Handotai Co Ltd | 水素イオン注入剥離法によってsoiウエーハを製造する方法およびこの方法で製造されたsoiウエーハ |
FR2797713B1 (fr) | 1999-08-20 | 2002-08-02 | Soitec Silicon On Insulator | Procede de traitement de substrats pour la microelectronique et substrats obtenus par ce procede |
EP1408551B1 (en) * | 2001-07-17 | 2014-07-02 | Shin-Etsu Handotai Co., Ltd. | Method for producing bonding wafer |
JP4407127B2 (ja) | 2003-01-10 | 2010-02-03 | 信越半導体株式会社 | Soiウエーハの製造方法 |
US7256104B2 (en) * | 2003-05-21 | 2007-08-14 | Canon Kabushiki Kaisha | Substrate manufacturing method and substrate processing apparatus |
KR101142138B1 (ko) * | 2003-09-10 | 2012-05-10 | 신에쯔 한도타이 가부시키가이샤 | 적층기판의 세척방법, 기판의 접합방법 및 접합 웨이퍼의제조방법 |
JP4661784B2 (ja) * | 2004-09-30 | 2011-03-30 | 信越半導体株式会社 | Soiウエーハの洗浄方法 |
JP2006216826A (ja) * | 2005-02-04 | 2006-08-17 | Sumco Corp | Soiウェーハの製造方法 |
JP4977999B2 (ja) * | 2005-11-21 | 2012-07-18 | 株式会社Sumco | 貼合せ基板の製造方法及びその方法で製造された貼合せ基板 |
-
2007
- 2007-07-27 JP JP2007196467A patent/JP5135935B2/ja active Active
-
2008
- 2008-07-03 WO PCT/JP2008/001754 patent/WO2009016795A1/ja active Application Filing
- 2008-07-03 CN CN2008801006440A patent/CN101765901B/zh active Active
- 2008-07-03 US US12/452,085 patent/US8173521B2/en active Active
- 2008-07-03 EP EP08776766.1A patent/EP2175477B1/en active Active
- 2008-07-03 KR KR1020107001557A patent/KR101462397B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05211128A (ja) | 1991-09-18 | 1993-08-20 | Commiss Energ Atom | 薄い半導体材料フィルムの製造方法 |
JP2000150905A (ja) * | 1998-09-04 | 2000-05-30 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2000294754A (ja) * | 1999-04-07 | 2000-10-20 | Denso Corp | 半導体基板及び半導体基板の製造方法並びに半導体基板製造装置 |
WO2006070220A1 (en) * | 2004-12-28 | 2006-07-06 | S.O.I.Tec Silicon On Insulator Technologies | Method for obtaining a thin layer having a low density of holes |
WO2006109614A1 (ja) * | 2005-04-06 | 2006-10-19 | Shin-Etsu Handotai Co., Ltd. | Soiウェーハの製造方法およびこの方法により製造されたsoiウェーハ |
Non-Patent Citations (1)
Title |
---|
See also references of EP2175477A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012520579A (ja) * | 2009-03-18 | 2012-09-06 | ソイテック | 「シリコン−オン−インシュレーター」soi型の基板のための表面処理方法 |
WO2013111242A1 (ja) * | 2012-01-24 | 2013-08-01 | 信越半導体株式会社 | 貼り合わせsoiウェーハの製造方法 |
US9093497B2 (en) | 2012-01-24 | 2015-07-28 | Shin-Etsu Handotai Co., Ltd. | Method for manufacturing bonded SOI wafer |
Also Published As
Publication number | Publication date |
---|---|
CN101765901B (zh) | 2012-06-13 |
EP2175477B1 (en) | 2017-01-04 |
KR101462397B1 (ko) | 2014-11-17 |
EP2175477A1 (en) | 2010-04-14 |
US20100120223A1 (en) | 2010-05-13 |
JP5135935B2 (ja) | 2013-02-06 |
EP2175477A4 (en) | 2010-10-20 |
KR20100033414A (ko) | 2010-03-29 |
US8173521B2 (en) | 2012-05-08 |
CN101765901A (zh) | 2010-06-30 |
JP2009032972A (ja) | 2009-02-12 |
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