WO2009011304A1 - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物 Download PDF

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Publication number
WO2009011304A1
WO2009011304A1 PCT/JP2008/062572 JP2008062572W WO2009011304A1 WO 2009011304 A1 WO2009011304 A1 WO 2009011304A1 JP 2008062572 W JP2008062572 W JP 2008062572W WO 2009011304 A1 WO2009011304 A1 WO 2009011304A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable resin
heat curable
properties
resin composition
insulating protective
Prior art date
Application number
PCT/JP2008/062572
Other languages
English (en)
French (fr)
Inventor
Tomokazu Umezawa
Tetsuo Wada
Hirofumi Inoue
Original Assignee
Showa Denko K. K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K. K. filed Critical Showa Denko K. K.
Priority to EP08778087.0A priority Critical patent/EP2182019B1/en
Priority to US12/669,416 priority patent/US8420216B2/en
Priority to JP2009523631A priority patent/JP5506382B2/ja
Priority to CN2008800215114A priority patent/CN101687980B/zh
Publication of WO2009011304A1 publication Critical patent/WO2009011304A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31605—Next to free metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

　[解決手段]本願発明に係る熱硬化性樹脂組成物は、２個以上のカルボキシル基を含有し、ポリウレタン構造を有する樹脂（Ａ）と、硬化促進剤（Ｂ）としてｐＫaが１０．０～１４．０である強塩基性窒素含有複素環化合物、および硬化剤（Ｃ）とを含有する。熱硬化性樹脂組成物の硬化物はプリント配線板、フレキシブルプリント配線板、チップオンフィルム等の絶縁保護皮膜として用いられる。本発明の熱硬化性樹脂組成物によれば、低温硬化性、即硬化性が改良され、タックフリーが実現でき、低反り性および電気絶縁性をも同時達成でき、加熱時のアウトガスで硬化炉等を汚染せず、十分な可使時間を有し、優れた硬化物、絶縁保護皮膜を形成でき、ソルダーレジストや絶縁保護皮膜を低コストで生産性よく形成できる。また、この組成物を利用して、優れた特性を付与した電子部品を供給することができる。
PCT/JP2008/062572 2007-07-18 2008-07-11 熱硬化性樹脂組成物 WO2009011304A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08778087.0A EP2182019B1 (en) 2007-07-18 2008-07-11 Heat curable resin compositon
US12/669,416 US8420216B2 (en) 2007-07-18 2008-07-11 Thermosetting resin composition
JP2009523631A JP5506382B2 (ja) 2007-07-18 2008-07-11 熱硬化性樹脂組成物
CN2008800215114A CN101687980B (zh) 2007-07-18 2008-07-11 热固性树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007187123 2007-07-18
JP2007-187123 2007-07-18

Publications (1)

Publication Number Publication Date
WO2009011304A1 true WO2009011304A1 (ja) 2009-01-22

Family

ID=40259637

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062572 WO2009011304A1 (ja) 2007-07-18 2008-07-11 熱硬化性樹脂組成物

Country Status (7)

Country Link
US (1) US8420216B2 (ja)
EP (1) EP2182019B1 (ja)
JP (1) JP5506382B2 (ja)
KR (1) KR101151196B1 (ja)
CN (2) CN101687980B (ja)
TW (1) TWI439483B (ja)
WO (1) WO2009011304A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011096295A1 (ja) * 2010-02-03 2011-08-11 昭和電工株式会社 熱硬化性組成物
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
JP2017524582A (ja) * 2014-06-04 2017-08-31 ブライト ライト ストラクチャーズ エルエルシー 多要素ポリマ樹脂、その塗布方法、およびそれを含む複合材積層構造
WO2018198921A1 (ja) * 2017-04-28 2018-11-01 Dic株式会社 組成物、硬化物、および硬化物の製造方法
US10967583B2 (en) 2015-04-03 2021-04-06 Bright Lite Structures Llc Apparatus for controllably cutting fibers and related methods

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2400825A1 (de) * 2010-06-23 2011-12-28 Bayer MaterialScience AG Isolationszusammensetzung für gedruckte Elektronik in einem Leiterkreuzungspunkt
FR2987367B1 (fr) * 2012-02-28 2015-03-06 Commissariat Energie Atomique Materiau de protection au feu, reservoir de stockage haute pression revetu d'un tel materiau, leurs procedes de preparation et leurs utilisations
KR102235392B1 (ko) * 2014-01-22 2021-04-01 제이엔씨 주식회사 열경화성 수지 조성물 및 그 경화막
KR101893353B1 (ko) 2017-10-13 2018-09-03 이국성 카본섬유와 열가소성 중합체가 혼합되어 제조되는 수지 조성물 및 그의 제조방법
CN109266284B (zh) * 2018-09-05 2021-06-04 广东生益科技股份有限公司 一种无卤树脂组合物、由其制备的覆盖膜和覆铜板以及印制电路板

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JPH10226745A (ja) * 1997-02-14 1998-08-25 Somar Corp 含浸用エポキシ樹脂組成物及びそれを用いたフィルムコンデンサ
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JPH10330460A (ja) * 1997-06-03 1998-12-15 Toshiba Chem Corp 注形用エポキシ樹脂組成物
JPH11349666A (ja) * 1998-06-05 1999-12-21 Kanagawa University エポキシ樹脂組成物
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JP2003183401A (ja) * 2001-12-20 2003-07-03 Showa Denko Kk 硬化性樹脂組成物およびその硬化物
JP2004045792A (ja) * 2002-07-12 2004-02-12 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2004359729A (ja) * 2003-06-02 2004-12-24 Taiyo Ink Mfg Ltd カルボキシル基含有感光性樹脂を含有する硬化性組成物
JP2005298613A (ja) 2004-04-09 2005-10-27 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、及びその硬化塗膜
JP2006117922A (ja) 2004-09-21 2006-05-11 Showa Denko Kk ウレタン樹脂を用いた熱硬化性樹脂組成物
JP2006124681A (ja) * 2004-09-30 2006-05-18 Showa Denko Kk 末端カルボキシウレタン樹脂を用いる熱硬化性樹脂組成物
JP2006274258A (ja) * 2005-03-04 2006-10-12 Showa Denko Kk 熱硬化性樹脂組成物
JP2007100038A (ja) * 2005-10-07 2007-04-19 Showa Denko Kk シリコーンパウダーを含む熱硬化性樹脂組成物

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011096295A1 (ja) * 2010-02-03 2011-08-11 昭和電工株式会社 熱硬化性組成物
CN102741351A (zh) * 2010-02-03 2012-10-17 昭和电工株式会社 热固性组合物
JP5726094B2 (ja) * 2010-02-03 2015-05-27 昭和電工株式会社 熱硬化性組成物
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
JP2017524582A (ja) * 2014-06-04 2017-08-31 ブライト ライト ストラクチャーズ エルエルシー 多要素ポリマ樹脂、その塗布方法、およびそれを含む複合材積層構造
US10399307B2 (en) 2014-06-04 2019-09-03 Bright Lite Structures Llc Reinforced composite structure
US10406789B2 (en) 2014-06-04 2019-09-10 Bright Lite Structures Llc Multicomponent polymer resin, methods for applying the same, and composite laminate structure including the same
US10780677B2 (en) 2014-06-04 2020-09-22 Bright Lite Structures Llc Composite structure exhibiting energy absorption and/or including a defect free surface
US10786977B2 (en) 2014-06-04 2020-09-29 Bright Lite Structures Llc Composite sandwich having a high bending stiffness
US11241867B2 (en) 2014-06-04 2022-02-08 Bright Lite Structures Llc Multicomponent polymer resin, methods for applying the same, and composite laminate structure including the same
US10967583B2 (en) 2015-04-03 2021-04-06 Bright Lite Structures Llc Apparatus for controllably cutting fibers and related methods
WO2018198921A1 (ja) * 2017-04-28 2018-11-01 Dic株式会社 組成物、硬化物、および硬化物の製造方法

Also Published As

Publication number Publication date
JP5506382B2 (ja) 2014-05-28
US20100186996A1 (en) 2010-07-29
US8420216B2 (en) 2013-04-16
JPWO2009011304A1 (ja) 2010-09-24
KR101151196B1 (ko) 2012-06-08
CN101687980A (zh) 2010-03-31
CN101687980B (zh) 2013-03-27
EP2182019A4 (en) 2012-01-04
TW200918571A (en) 2009-05-01
KR20100040932A (ko) 2010-04-21
TWI439483B (zh) 2014-06-01
EP2182019A1 (en) 2010-05-05
EP2182019B1 (en) 2018-02-21
CN102924998A (zh) 2013-02-13

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