WO2009008383A1 - 導電性微粒子、異方性導電材料及び接続構造体 - Google Patents

導電性微粒子、異方性導電材料及び接続構造体 Download PDF

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Publication number
WO2009008383A1
WO2009008383A1 PCT/JP2008/062221 JP2008062221W WO2009008383A1 WO 2009008383 A1 WO2009008383 A1 WO 2009008383A1 JP 2008062221 W JP2008062221 W JP 2008062221W WO 2009008383 A1 WO2009008383 A1 WO 2009008383A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroconductive
fine particles
connection structure
melting point
group
Prior art date
Application number
PCT/JP2008/062221
Other languages
English (en)
French (fr)
Inventor
Shinya Uenoyama
Taku Sasaki
Ren-De Sun
Takashi Kubota
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to JP2008532517A priority Critical patent/JP4413267B2/ja
Priority to CN2008800226481A priority patent/CN101689413B/zh
Publication of WO2009008383A1 publication Critical patent/WO2009008383A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)

Abstract

本発明は、接続抵抗値を低減させることができ、高い接続信頼性を実現することができる、導電性微粒子を提供することを目的とする。また、本発明は、該導電性微粒子を用いてなる、異方性導電材料及び接続構造体を提供することを目的とする。 本発明は、樹脂微粒子の表面に、ニッケル又はパラジウムを含有する金属層と、低融点金属とタリウム、インジウム及びガリウムからなる群より選択される少なくとも１種の第１３族元素とを含有する低融点金属層とが順次積層されている導電性微粒子であって、前記低融点金属層中に含有される金属の合計に占める前記第１３族元素の含有量は、０．０１～６重量％である導電性微粒子である。
PCT/JP2008/062221 2007-07-06 2008-07-04 導電性微粒子、異方性導電材料及び接続構造体 WO2009008383A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008532517A JP4413267B2 (ja) 2007-07-06 2008-07-04 導電性微粒子、異方性導電材料及び接続構造体
CN2008800226481A CN101689413B (zh) 2007-07-06 2008-07-04 导电性微粒、各向异性导电材料及连接结构体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007178876 2007-07-06
JP2007-178876 2007-07-06
JP2008044460 2008-02-26
JP2008-044460 2008-02-26

Publications (1)

Publication Number Publication Date
WO2009008383A1 true WO2009008383A1 (ja) 2009-01-15

Family

ID=40228554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062221 WO2009008383A1 (ja) 2007-07-06 2008-07-04 導電性微粒子、異方性導電材料及び接続構造体

Country Status (4)

Country Link
JP (2) JP4413267B2 (ja)
KR (1) KR101475100B1 (ja)
CN (1) CN101689413B (ja)
WO (1) WO2009008383A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040301A (ja) * 2009-08-12 2011-02-24 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2011070943A (ja) * 2009-09-25 2011-04-07 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
KR101138519B1 (ko) * 2009-09-30 2012-04-25 삼성전기주식회사 도전성 페이스트 및 이를 이용한 인쇄회로기판의 제조방법
JP2015118932A (ja) * 2013-11-18 2015-06-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2017138521A1 (ja) * 2016-02-08 2017-08-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583572B2 (ja) * 2010-12-28 2014-09-03 株式会社日本触媒 導電性微粒子
JP5536634B2 (ja) * 2010-12-28 2014-07-02 株式会社日本触媒 導電性微粒子
JP2012142247A (ja) * 2011-01-06 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP5902717B2 (ja) * 2011-12-08 2016-04-13 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料
CN103066475B (zh) * 2013-01-07 2014-09-10 郭瑞 基于低熔点金属及其氧化物降低接触电阻的方法
JP6777380B2 (ja) * 2014-05-27 2020-10-28 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6641118B2 (ja) * 2014-08-18 2020-02-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188184A (ja) * 1986-02-14 1987-08-17 日立化成工業株式会社 異方導電性を有する回路接続用接着剤組成物および接着フイルム並びにこれらを用いた回路の接続方法
JPH0536306A (ja) * 1991-07-26 1993-02-12 Sekisui Fine Chem Kk 導電性微粒子、電極接続構造体及びその製造方法
WO2006025485A1 (ja) * 2004-09-02 2006-03-09 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4902857A (en) * 1988-12-27 1990-02-20 American Telephone And Telegraph Company, At&T Bell Laboratories Polymer interconnect structure
JPH07157720A (ja) * 1993-12-03 1995-06-20 Sumitomo Bakelite Co Ltd 異方導電フィルム
JP4347974B2 (ja) * 2000-01-05 2009-10-21 積水化学工業株式会社 導電性微粒子の製造方法、異方性導電接着剤及び導電接続構造体
JP2002076606A (ja) * 2000-06-12 2002-03-15 Hitachi Ltd 電子機器および半導体装置
JP2004103935A (ja) * 2002-09-11 2004-04-02 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004095561A (ja) * 2003-11-17 2004-03-25 Sekisui Chem Co Ltd 導電性微粒子、電極接続構造体及びその製造方法
JP2006049246A (ja) * 2004-08-09 2006-02-16 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188184A (ja) * 1986-02-14 1987-08-17 日立化成工業株式会社 異方導電性を有する回路接続用接着剤組成物および接着フイルム並びにこれらを用いた回路の接続方法
JPH0536306A (ja) * 1991-07-26 1993-02-12 Sekisui Fine Chem Kk 導電性微粒子、電極接続構造体及びその製造方法
WO2006025485A1 (ja) * 2004-09-02 2006-03-09 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040301A (ja) * 2009-08-12 2011-02-24 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2011070943A (ja) * 2009-09-25 2011-04-07 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
KR101138519B1 (ko) * 2009-09-30 2012-04-25 삼성전기주식회사 도전성 페이스트 및 이를 이용한 인쇄회로기판의 제조방법
JP2015118932A (ja) * 2013-11-18 2015-06-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2017138521A1 (ja) * 2016-02-08 2017-08-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JPWO2017138521A1 (ja) * 2016-02-08 2018-02-15 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2019012692A (ja) * 2016-02-08 2019-01-24 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
TWI703584B (zh) * 2016-02-08 2020-09-01 日商積水化學工業股份有限公司 導電性粒子、導電材料及連接構造體

Also Published As

Publication number Publication date
CN101689413B (zh) 2012-01-04
KR101475100B1 (ko) 2014-12-22
KR20100031103A (ko) 2010-03-19
JP4413267B2 (ja) 2010-02-10
JP2009231266A (ja) 2009-10-08
JPWO2009008383A1 (ja) 2010-09-09
CN101689413A (zh) 2010-03-31

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