WO2008153043A1 - 半導体発光装置 - Google Patents

半導体発光装置 Download PDF

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Publication number
WO2008153043A1
WO2008153043A1 PCT/JP2008/060652 JP2008060652W WO2008153043A1 WO 2008153043 A1 WO2008153043 A1 WO 2008153043A1 JP 2008060652 W JP2008060652 W JP 2008060652W WO 2008153043 A1 WO2008153043 A1 WO 2008153043A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
semiconductor light
resin package
lead
emitting element
Prior art date
Application number
PCT/JP2008/060652
Other languages
English (en)
French (fr)
Inventor
Junichi Itai
Original Assignee
Rohm Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co., Ltd. filed Critical Rohm Co., Ltd.
Priority to US12/663,990 priority Critical patent/US20100163920A1/en
Priority to JP2009519270A priority patent/JP5368982B2/ja
Publication of WO2008153043A1 publication Critical patent/WO2008153043A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

　半導体発光装置（Ａ）は、樹脂パッケージ（５）、半導体発光素子（４）、第１のリード（１Ａ）および第２のリード（１Ｂ）を含む。樹脂パッケージ（５）は、上面および底面を有し且つ透光性を有している。半導体発光素子（４）は、樹脂パッケージ（５）の上面に対向した状態で、樹脂パッケージ（５）に覆われている。第１のリード（１Ａ）は、半導体発光素子（４）を支持するボンディングパッド（１１Ａ）を含む。第２のリード（１Ｂ）は、第１のリード（１Ａ）から離間するとともに、半導体発光素子（４）にワイヤ（６）を介して電気的に接続されている。各リード（１Ａ，１Ｂ）は、樹脂パッケージ（５）の底面から露出する実装端子（１３Ａ，１３Ｂ）を有している。各実装端子（１３Ａ，１３Ｂ）は、樹脂パッケージの厚さ方向に直交する面内方向において、樹脂パッケージ（５）によって囲まれた状態とされている。
PCT/JP2008/060652 2007-06-14 2008-06-11 半導体発光装置 WO2008153043A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/663,990 US20100163920A1 (en) 2007-06-14 2008-06-11 Semiconductor light emitting device
JP2009519270A JP5368982B2 (ja) 2007-06-14 2008-06-11 半導体発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-157296 2007-06-14
JP2007157296 2007-06-14

Publications (1)

Publication Number Publication Date
WO2008153043A1 true WO2008153043A1 (ja) 2008-12-18

Family

ID=40129648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060652 WO2008153043A1 (ja) 2007-06-14 2008-06-11 半導体発光装置

Country Status (4)

Country Link
US (1) US20100163920A1 (ja)
JP (1) JP5368982B2 (ja)
TW (1) TWI384648B (ja)
WO (1) WO2008153043A1 (ja)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010272565A (ja) * 2009-05-19 2010-12-02 Toppan Printing Co Ltd リードフレーム及びその製造方法及びそれを用いた半導体発光装置
CN102148224A (zh) * 2010-02-08 2011-08-10 株式会社东芝 Led模块
JP2011159767A (ja) * 2010-01-29 2011-08-18 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2011176306A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージ
JP2011176271A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2011181603A (ja) * 2010-02-26 2011-09-15 Toshiba Corp Ｌｅｄパッケージ
US20110284882A1 (en) * 2010-05-20 2011-11-24 An Joongin Light emitting device package
WO2012029912A1 (ja) * 2010-09-03 2012-03-08 日亜化学工業株式会社 発光装置、及び発光装置用パッケージアレイ
WO2012036281A1 (ja) * 2010-09-17 2012-03-22 ローム株式会社 半導体発光装置、その製造方法、および表示装置
JP2012094906A (ja) * 2010-01-29 2012-05-17 Toshiba Corp Ｌｅｄパッケージ
JP2012114107A (ja) * 2010-11-19 2012-06-14 Toshiba Corp Ｌｅｄパッケージ
JP2012114286A (ja) * 2010-11-25 2012-06-14 Toshiba Corp Ｌｅｄパッケージ
JP2012119376A (ja) * 2010-11-29 2012-06-21 Toshiba Corp Ｌｅｄパッケージ
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2013008979A (ja) * 2012-08-02 2013-01-10 Toshiba Corp 半導体パッケージ
JP2013135226A (ja) * 2011-12-24 2013-07-08 Advanced Optoelectronic Technology Inc 発光ダイオード
US8487418B2 (en) 2010-01-29 2013-07-16 Kabushiki Kaisha Toshiba LED package
JP2013153004A (ja) * 2012-01-24 2013-08-08 Toshiba Corp テレビジョン受像機、及び電子機器
US8525202B2 (en) 2010-01-29 2013-09-03 Kabushiki Kaisha Toshiba LED package, method for manufacturing LED package, and packing member for LED package
US8686464B2 (en) 2010-11-26 2014-04-01 Kabushiki Kaisha Toshiba LED module
JP2017123492A (ja) * 2017-03-30 2017-07-13 大日本印刷株式会社 半導体装置およびその製造方法ならびに照明装置
JP2019012854A (ja) * 2018-10-16 2019-01-24 大日本印刷株式会社 半導体装置およびその製造方法ならびに照明装置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100888236B1 (ko) * 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
JP4951090B2 (ja) * 2010-01-29 2012-06-13 株式会社東芝 Ｌｅｄパッケージ
JP4764519B1 (ja) * 2010-01-29 2011-09-07 株式会社東芝 Ｌｅｄパッケージ
KR101851818B1 (ko) 2010-11-11 2018-06-04 니치아 카가쿠 고교 가부시키가이샤 발광 장치와 회로 기판의 제조 방법
JP2012113919A (ja) 2010-11-24 2012-06-14 Toshiba Corp 照明装置
JP2012142426A (ja) * 2010-12-28 2012-07-26 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2012234955A (ja) * 2011-04-28 2012-11-29 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP5753446B2 (ja) 2011-06-17 2015-07-22 株式会社東芝 半導体発光装置の製造方法
US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
KR102033928B1 (ko) 2012-09-13 2019-10-18 엘지이노텍 주식회사 발광 소자 및 조명 시스템
JP6535509B2 (ja) * 2014-05-12 2019-06-26 ローム株式会社 半導体装置
USD780134S1 (en) * 2014-06-30 2017-02-28 Citizen Electronics Co., Ltd. Light-emitting diode
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108640A (ja) * 2004-09-09 2006-04-20 Toyoda Gosei Co Ltd 発光装置
JP2006294821A (ja) * 2005-04-08 2006-10-26 Nichia Chem Ind Ltd 耐熱性及び耐光性に優れる発光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977613A (en) * 1996-03-07 1999-11-02 Matsushita Electronics Corporation Electronic component, method for making the same, and lead frame and mold assembly for use therein
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
KR100378917B1 (ko) * 1998-05-20 2003-04-07 로무 가부시키가이샤 반도체장치
JP2001326295A (ja) * 2000-05-15 2001-11-22 Rohm Co Ltd 半導体装置および半導体装置製造用フレーム
JP2002176202A (ja) * 2000-12-11 2002-06-21 Rohm Co Ltd 光学装置、それを備えたフォトインタラプタ、および光学装置の製造方法
US6740906B2 (en) * 2001-07-23 2004-05-25 Cree, Inc. Light emitting diodes including modifications for submount bonding
JP2003086750A (ja) * 2001-09-11 2003-03-20 Rohm Co Ltd 電子部品の製造方法
JP2005039088A (ja) * 2003-07-16 2005-02-10 Sanyo Electric Co Ltd 切削方法、切削装置及び半導体装置の製造方法
JP2006344925A (ja) * 2005-05-11 2006-12-21 Sharp Corp 発光素子搭載用フレームおよび発光装置
US7408204B2 (en) * 2006-08-08 2008-08-05 Huga Optotech Inc. Flip-chip packaging structure for light emitting diode and method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108640A (ja) * 2004-09-09 2006-04-20 Toyoda Gosei Co Ltd 発光装置
JP2006294821A (ja) * 2005-04-08 2006-10-26 Nichia Chem Ind Ltd 耐熱性及び耐光性に優れる発光装置

Cited By (40)

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Publication number Priority date Publication date Assignee Title
JP2010272565A (ja) * 2009-05-19 2010-12-02 Toppan Printing Co Ltd リードフレーム及びその製造方法及びそれを用いた半導体発光装置
US8525202B2 (en) 2010-01-29 2013-09-03 Kabushiki Kaisha Toshiba LED package, method for manufacturing LED package, and packing member for LED package
US8637892B2 (en) 2010-01-29 2014-01-28 Kabushiki Kaisha Toshiba LED package and method for manufacturing same
US8338845B2 (en) 2010-01-29 2012-12-25 Kabushiki Kaisha Toshiba LED package and method for manufacturing the same
JP2011176306A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージ
US8378347B2 (en) 2010-01-29 2013-02-19 Kabushiki Kaisha Toshiba LED package
JP2011176265A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージの製造方法
JP2011159767A (ja) * 2010-01-29 2011-08-18 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2011176271A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2011176277A (ja) * 2010-01-29 2011-09-08 Toshiba Corp Ｌｅｄパッケージ
US8487418B2 (en) 2010-01-29 2013-07-16 Kabushiki Kaisha Toshiba LED package
JP2012094906A (ja) * 2010-01-29 2012-05-17 Toshiba Corp Ｌｅｄパッケージ
US8319320B2 (en) 2010-02-08 2012-11-27 Kabushiki Kaisha Toshiba LED module
CN102148224A (zh) * 2010-02-08 2011-08-10 株式会社东芝 Led模块
EP2354630A3 (en) * 2010-02-08 2015-12-23 Kabushiki Kaisha Toshiba LED module
JP2011165833A (ja) * 2010-02-08 2011-08-25 Toshiba Corp Ｌｅｄモジュール
JP2011181603A (ja) * 2010-02-26 2011-09-15 Toshiba Corp Ｌｅｄパッケージ
KR20110128006A (ko) * 2010-05-20 2011-11-28 엘지이노텍 주식회사 발광 소자
US20110284882A1 (en) * 2010-05-20 2011-11-24 An Joongin Light emitting device package
KR101676669B1 (ko) * 2010-05-20 2016-11-16 엘지이노텍 주식회사 발광 소자
US9461207B2 (en) 2010-09-03 2016-10-04 Nichia Corporation Light emitting device, and package array for light emitting device
WO2012029912A1 (ja) * 2010-09-03 2012-03-08 日亜化学工業株式会社 発光装置、及び発光装置用パッケージアレイ
JP5803926B2 (ja) * 2010-09-03 2015-11-04 日亜化学工業株式会社 発光装置、及び発光装置用パッケージアレイ
US10593846B2 (en) 2010-09-17 2020-03-17 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
JP2018160677A (ja) * 2010-09-17 2018-10-11 ローム株式会社 半導体発光装置
JP2017063214A (ja) * 2010-09-17 2017-03-30 ローム株式会社 半導体発光装置
US9608187B2 (en) 2010-09-17 2017-03-28 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
WO2012036281A1 (ja) * 2010-09-17 2012-03-22 ローム株式会社 半導体発光装置、その製造方法、および表示装置
JPWO2012036281A1 (ja) * 2010-09-17 2014-02-03 ローム株式会社 半導体発光装置、その製造方法、および表示装置
US9224915B2 (en) 2010-09-17 2015-12-29 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
JP2012114107A (ja) * 2010-11-19 2012-06-14 Toshiba Corp Ｌｅｄパッケージ
JP2012114286A (ja) * 2010-11-25 2012-06-14 Toshiba Corp Ｌｅｄパッケージ
US8686464B2 (en) 2010-11-26 2014-04-01 Kabushiki Kaisha Toshiba LED module
JP2012119376A (ja) * 2010-11-29 2012-06-21 Toshiba Corp Ｌｅｄパッケージ
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
JP2013135226A (ja) * 2011-12-24 2013-07-08 Advanced Optoelectronic Technology Inc 発光ダイオード
JP2013153004A (ja) * 2012-01-24 2013-08-08 Toshiba Corp テレビジョン受像機、及び電子機器
JP2013008979A (ja) * 2012-08-02 2013-01-10 Toshiba Corp 半導体パッケージ
JP2017123492A (ja) * 2017-03-30 2017-07-13 大日本印刷株式会社 半導体装置およびその製造方法ならびに照明装置
JP2019012854A (ja) * 2018-10-16 2019-01-24 大日本印刷株式会社 半導体装置およびその製造方法ならびに照明装置

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TW200913323A (en) 2009-03-16

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