WO2008143187A1 - 半導体デバイス用基板洗浄液、及び半導体デバイス用基板の製造方法 - Google Patents
半導体デバイス用基板洗浄液、及び半導体デバイス用基板の製造方法 Download PDFInfo
- Publication number
- WO2008143187A1 WO2008143187A1 PCT/JP2008/059072 JP2008059072W WO2008143187A1 WO 2008143187 A1 WO2008143187 A1 WO 2008143187A1 JP 2008059072 W JP2008059072 W JP 2008059072W WO 2008143187 A1 WO2008143187 A1 WO 2008143187A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor device
- cleaning solution
- solution
- cleaning
- substrate
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000011109 contamination Methods 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 239000011368 organic material Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 239000002131 composite material Substances 0.000 abstract 1
- 230000002209 hydrophobic effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002736 nonionic surfactant Substances 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Emergency Medicine (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Liquid Crystal (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800155081A CN101681824B (zh) | 2007-05-18 | 2008-05-16 | 半导体器件用基板清洗液以及半导体器件用基板的制造方法 |
US12/600,545 US8110534B2 (en) | 2007-05-18 | 2008-05-16 | Cleaning solution for substrate for semiconductor device and process for producing substrate for semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007133083 | 2007-05-18 | ||
JP2007-133083 | 2007-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008143187A1 true WO2008143187A1 (ja) | 2008-11-27 |
Family
ID=40031888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059072 WO2008143187A1 (ja) | 2007-05-18 | 2008-05-16 | 半導体デバイス用基板洗浄液、及び半導体デバイス用基板の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8110534B2 (ja) |
JP (1) | JP5428200B2 (ja) |
KR (1) | KR101097073B1 (ja) |
CN (1) | CN101681824B (ja) |
TW (1) | TWI449091B (ja) |
WO (1) | WO2008143187A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102449745A (zh) * | 2009-04-30 | 2012-05-09 | 狮王株式会社 | 半导体用基板的清洗方法以及酸性溶液 |
Families Citing this family (26)
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---|---|---|---|---|
JP2010226089A (ja) * | 2009-01-14 | 2010-10-07 | Rohm & Haas Electronic Materials Llc | 半導体ウェハをクリーニングする方法 |
US8877640B2 (en) * | 2010-07-06 | 2014-11-04 | United Microelectronics Corporation | Cleaning solution and damascene process using the same |
CN101935160B (zh) * | 2010-07-28 | 2011-11-30 | 东旭集团有限公司 | 显示器用平板玻璃工艺中使用的原配料湿润剂及制备方法 |
JP5948758B2 (ja) | 2010-08-31 | 2016-07-06 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び洗浄方法 |
DE112011103185T5 (de) * | 2010-09-24 | 2013-07-18 | Fujimi Incorporated | Polierzusammensetzung und Spülzusammensetzung |
JP5817139B2 (ja) | 2011-02-18 | 2015-11-18 | 富士通株式会社 | 化合物半導体装置の製造方法及び洗浄剤 |
EP2688688A4 (en) * | 2011-03-21 | 2014-12-31 | Basf Se | AQUEOUS CLEANING COMPOSITION WITHOUT NITROGEN, PREPARATION AND USE THEREOF |
US8940104B2 (en) * | 2011-08-02 | 2015-01-27 | Brewer Science Inc. | Cleaning composition for temporary wafer bonding materials |
JP2013151677A (ja) * | 2011-12-28 | 2013-08-08 | Sanyo Chem Ind Ltd | 電子材料用洗浄剤 |
KR101997950B1 (ko) | 2012-02-17 | 2019-07-08 | 미쯔비시 케미컬 주식회사 | 반도체 디바이스용 세정액 및 반도체 디바이스용 기판의 세정 방법 |
JP2016125128A (ja) * | 2015-01-08 | 2016-07-11 | 三浦工業株式会社 | 表面処理剤及び表面処理方法 |
KR102326028B1 (ko) * | 2015-01-26 | 2021-11-16 | 삼성디스플레이 주식회사 | 반도체 및 디스플레이 제조공정용 세정제 조성물 |
WO2017188296A1 (ja) * | 2016-04-28 | 2017-11-02 | 富士フイルム株式会社 | 処理液及び処理液収容体 |
KR102051346B1 (ko) | 2016-06-03 | 2019-12-03 | 후지필름 가부시키가이샤 | 처리액, 기판 세정 방법 및 레지스트의 제거 방법 |
TWI673357B (zh) | 2016-12-14 | 2019-10-01 | 美商卡博特微電子公司 | 自化學機械平坦化基板移除殘留物之組合物及方法 |
CN109037025A (zh) * | 2017-06-08 | 2018-12-18 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
JP7330668B2 (ja) * | 2018-03-08 | 2023-08-22 | 株式会社フジミインコーポレーテッド | 表面処理組成物、表面処理組成物の製造方法、表面処理方法および半導体基板の製造方法 |
KR101957876B1 (ko) * | 2018-06-14 | 2019-03-13 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
WO2020096760A1 (en) * | 2018-11-08 | 2020-05-14 | Entegris, Inc. | Post cmp cleaning composition |
KR20210129049A (ko) * | 2019-02-19 | 2021-10-27 | 미쯔비시 케미컬 주식회사 | 세륨 화합물 제거용 세정액, 세정 방법 및 반도체 웨이퍼의 제조 방법 |
KR20200114472A (ko) | 2019-03-28 | 2020-10-07 | 동우 화인켐 주식회사 | 세정액 예비 조성물, 이를 포함하는 세정액 조성물 및 세정액 조성물의 제조방법 |
CN112255362A (zh) * | 2020-07-28 | 2021-01-22 | 安徽富乐德科技发展股份有限公司 | 一种应用于半导体领域的石英罩离子污染的检测工艺 |
CN116325085A (zh) * | 2020-08-28 | 2023-06-23 | 富士胶片电子材料美国有限公司 | 清洁组合物及其使用方法 |
CN112961740A (zh) * | 2021-02-22 | 2021-06-15 | 上海赛夫特半导体材料有限公司 | 一种线路板镀铜用清洗剂及其制备方法 |
KR102518902B1 (ko) * | 2021-06-17 | 2023-04-25 | 주식회사 케이씨텍 | Cmp 후 세정액 조성물 |
CN115093903A (zh) * | 2022-07-19 | 2022-09-23 | 广州天极电子科技股份有限公司 | 一种清洗剂及其应用、一种薄膜电路板基板的清洗方法及一种薄膜电路板的制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08109397A (ja) * | 1994-10-13 | 1996-04-30 | Hitachi Chem Co Ltd | 洗浄剤及び洗浄方法 |
JP2005260213A (ja) * | 2004-02-09 | 2005-09-22 | Mitsubishi Chemicals Corp | 半導体デバイス用基板洗浄液及び洗浄方法 |
JP2006199939A (ja) * | 2004-12-20 | 2006-08-03 | Sanyo Chem Ind Ltd | エレクトロニクス用洗浄剤 |
Family Cites Families (15)
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DE69412801T2 (de) * | 1993-03-19 | 1999-04-22 | The Procter & Gamble Co., Cincinnati, Ohio | Säures, flüssiges reinigungsmittel für badezimmer |
JPH07216392A (ja) | 1994-01-26 | 1995-08-15 | Daikin Ind Ltd | 洗浄剤及び洗浄方法 |
JP2914555B2 (ja) | 1994-08-30 | 1999-07-05 | 信越半導体株式会社 | 半導体シリコンウェーハの洗浄方法 |
JP3003684B1 (ja) * | 1998-09-07 | 2000-01-31 | 日本電気株式会社 | 基板洗浄方法および基板洗浄液 |
JP4516176B2 (ja) | 1999-04-20 | 2010-08-04 | 関東化学株式会社 | 電子材料用基板洗浄液 |
US6387874B1 (en) * | 2001-06-27 | 2002-05-14 | Spartan Chemical Company, Inc. | Cleaning composition containing an organic acid and a spore forming microbial composition |
TWI302950B (en) * | 2002-01-28 | 2008-11-11 | Mitsubishi Chem Corp | Cleaning solution and method of cleanimg board of semiconductor device |
US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
JP4232002B2 (ja) * | 2003-01-16 | 2009-03-04 | 日本電気株式会社 | デバイス基板用の洗浄組成物及び該洗浄組成物を用いた洗浄方法並びに洗浄装置 |
US20050056810A1 (en) * | 2003-09-17 | 2005-03-17 | Jinru Bian | Polishing composition for semiconductor wafers |
US20050118132A1 (en) * | 2003-12-01 | 2005-06-02 | Erning Xia | Nonionic surfactant containing compositions for cleaning contact lenses |
KR101166002B1 (ko) * | 2004-02-09 | 2012-07-18 | 미쓰비시 가가꾸 가부시키가이샤 | 반도체 디바이스용 기판 세정액 및 세정방법 |
US7276109B2 (en) * | 2004-03-30 | 2007-10-02 | Stockel Richard F | Fountain solutions containing antipiling macromolecules |
JP4912791B2 (ja) * | 2006-08-21 | 2012-04-11 | Jsr株式会社 | 洗浄用組成物、洗浄方法及び半導体装置の製造方法 |
JP2008210990A (ja) * | 2007-02-26 | 2008-09-11 | Fujifilm Corp | 半導体デバイス用洗浄剤及びそれを用いた半導体デバイスの洗浄方法 |
-
2008
- 2008-05-15 JP JP2008128555A patent/JP5428200B2/ja not_active Expired - Fee Related
- 2008-05-16 CN CN2008800155081A patent/CN101681824B/zh not_active Expired - Fee Related
- 2008-05-16 KR KR1020097023592A patent/KR101097073B1/ko active IP Right Grant
- 2008-05-16 TW TW097118326A patent/TWI449091B/zh not_active IP Right Cessation
- 2008-05-16 WO PCT/JP2008/059072 patent/WO2008143187A1/ja active Application Filing
- 2008-05-16 US US12/600,545 patent/US8110534B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08109397A (ja) * | 1994-10-13 | 1996-04-30 | Hitachi Chem Co Ltd | 洗浄剤及び洗浄方法 |
JP2005260213A (ja) * | 2004-02-09 | 2005-09-22 | Mitsubishi Chemicals Corp | 半導体デバイス用基板洗浄液及び洗浄方法 |
JP2006199939A (ja) * | 2004-12-20 | 2006-08-03 | Sanyo Chem Ind Ltd | エレクトロニクス用洗浄剤 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102449745A (zh) * | 2009-04-30 | 2012-05-09 | 狮王株式会社 | 半导体用基板的清洗方法以及酸性溶液 |
Also Published As
Publication number | Publication date |
---|---|
US20100167972A1 (en) | 2010-07-01 |
TW200903605A (en) | 2009-01-16 |
CN101681824A (zh) | 2010-03-24 |
JP5428200B2 (ja) | 2014-02-26 |
TWI449091B (zh) | 2014-08-11 |
CN101681824B (zh) | 2012-05-30 |
US8110534B2 (en) | 2012-02-07 |
KR20100016470A (ko) | 2010-02-12 |
KR101097073B1 (ko) | 2011-12-22 |
JP2009004759A (ja) | 2009-01-08 |
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