WO2008139996A1 - フィルム状回路接続材料及び回路部材の接続構造 - Google Patents
フィルム状回路接続材料及び回路部材の接続構造 Download PDFInfo
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- WO2008139996A1 WO2008139996A1 PCT/JP2008/058489 JP2008058489W WO2008139996A1 WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1 JP 2008058489 W JP2008058489 W JP 2008058489W WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1
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- circuit
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- circuit connecting
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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- Medicinal Chemistry (AREA)
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009514131A JP4941554B2 (ja) | 2007-05-09 | 2008-05-07 | フィルム状回路接続材料及び回路部材の接続構造 |
KR1020097013931A KR101100507B1 (ko) | 2007-05-09 | 2008-05-07 | 필름상 회로 접속 재료 및 회로 부재의 접속 구조 |
CN2008800141483A CN101675715B (zh) | 2007-05-09 | 2008-05-07 | 膜状电路连接材料及电路部件的连接结构 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-124436 | 2007-05-09 | ||
JP2007124436 | 2007-05-09 |
Publications (1)
Publication Number | Publication Date |
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WO2008139996A1 true WO2008139996A1 (ja) | 2008-11-20 |
Family
ID=40002196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058489 WO2008139996A1 (ja) | 2007-05-09 | 2008-05-07 | フィルム状回路接続材料及び回路部材の接続構造 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4941554B2 (ja) |
KR (1) | KR101100507B1 (ja) |
CN (3) | CN102199404B (ja) |
TW (2) | TW200913808A (ja) |
WO (1) | WO2008139996A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012014562A1 (ja) * | 2010-07-26 | 2012-02-02 | 日立化成工業株式会社 | 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用 |
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JP2020521852A (ja) * | 2017-05-31 | 2020-07-27 | ダウ グローバル テクノロジーズ エルエルシー | 溶剤系接着剤組成物 |
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- 2008-05-07 CN CN2008800141483A patent/CN101675715B/zh active Active
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CN102449095B (zh) * | 2010-07-26 | 2016-06-01 | 日立化成株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用 |
CN105860910A (zh) * | 2010-07-26 | 2016-08-17 | 日立化成株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用 |
CN105176471A (zh) * | 2010-07-26 | 2015-12-23 | 日立化成工业株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用 |
CN102449095A (zh) * | 2010-07-26 | 2012-05-09 | 日立化成工业株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用 |
CN103589384A (zh) * | 2010-07-26 | 2014-02-19 | 日立化成工业株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用 |
JP5454578B2 (ja) * | 2010-07-26 | 2014-03-26 | 日立化成株式会社 | 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用 |
WO2012014563A1 (ja) * | 2010-07-26 | 2012-02-02 | 日立化成工業株式会社 | 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用 |
WO2012014562A1 (ja) * | 2010-07-26 | 2012-02-02 | 日立化成工業株式会社 | 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用 |
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JP5855459B2 (ja) * | 2010-07-26 | 2016-02-09 | 日立化成株式会社 | 回路部材の接続構造体 |
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CN104559902A (zh) * | 2013-10-09 | 2015-04-29 | 日立化成株式会社 | 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法 |
CN104559898A (zh) * | 2013-10-16 | 2015-04-29 | 日立化成株式会社 | 粘接剂组合物和连接体 |
JP2015166406A (ja) * | 2014-03-03 | 2015-09-24 | 日立化成株式会社 | 接着剤組成物及び接続体 |
JPWO2016199252A1 (ja) * | 2015-06-10 | 2018-03-29 | 日立化成株式会社 | 接着剤組成物及び接続体 |
US11773303B2 (en) | 2017-05-31 | 2023-10-03 | Dow Global Technologies Llc | Solvent-based adhesive compositions |
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JP7149292B2 (ja) | 2017-05-31 | 2022-10-06 | ダウ グローバル テクノロジーズ エルエルシー | 溶剤系接着剤組成物 |
JP2018184607A (ja) * | 2018-06-27 | 2018-11-22 | 日立化成株式会社 | 接着剤組成物及び接続体 |
Also Published As
Publication number | Publication date |
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JPWO2008139996A1 (ja) | 2010-08-05 |
TW201130940A (en) | 2011-09-16 |
TW200913808A (en) | 2009-03-16 |
CN101675715A (zh) | 2010-03-17 |
CN102199404A (zh) | 2011-09-28 |
TWI378751B (ja) | 2012-12-01 |
TWI378745B (ja) | 2012-12-01 |
JP4941554B2 (ja) | 2012-05-30 |
CN102199404B (zh) | 2013-12-04 |
KR20090086465A (ko) | 2009-08-12 |
CN101982515B (zh) | 2013-07-03 |
KR101100507B1 (ko) | 2011-12-29 |
CN101675715B (zh) | 2011-06-08 |
CN101982515A (zh) | 2011-03-02 |
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