WO2008133209A1 - 導電性接触子および導電性接触子ユニット - Google Patents

導電性接触子および導電性接触子ユニット Download PDF

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Publication number
WO2008133209A1
WO2008133209A1 PCT/JP2008/057615 JP2008057615W WO2008133209A1 WO 2008133209 A1 WO2008133209 A1 WO 2008133209A1 JP 2008057615 W JP2008057615 W JP 2008057615W WO 2008133209 A1 WO2008133209 A1 WO 2008133209A1
Authority
WO
WIPO (PCT)
Prior art keywords
plunger
conductive contact
end portion
leading end
longitudinal direction
Prior art date
Application number
PCT/JP2008/057615
Other languages
English (en)
French (fr)
Inventor
Toshio Kazama
Kohei Hironaka
Shigeki Ishikawa
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to JP2009511860A priority Critical patent/JP5361710B2/ja
Priority to TW097114449A priority patent/TWI383153B/zh
Publication of WO2008133209A1 publication Critical patent/WO2008133209A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

　細径化に起因する許容電流の低下を抑制することが可能な導電性接触子および導電性接触子ユニットを提供する。この目的のため、略針状の導電性材料からなる第１プランジャと、略針状の導電性材料からなり、先端部が第１プランジャの先端部と相反する方向を指向する第２プランジャと、導電性材料からなり、一端が第１プランジャに取り付けられるとともに他端が第２プランジャに取り付けられ、長手方向に伸縮自在な弾性部材と、を備え、第１プランジャの先端部の長手方向の中心軸と第２プランジャの先端部の長手方向の中心軸は異なりかつ互いに平行であるとする。
PCT/JP2008/057615 2007-04-19 2008-04-18 導電性接触子および導電性接触子ユニット WO2008133209A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009511860A JP5361710B2 (ja) 2007-04-19 2008-04-18 導電性接触子および導電性接触子ユニット
TW097114449A TWI383153B (zh) 2007-04-19 2008-04-21 導電性觸頭及導電性觸頭單元

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007110942 2007-04-19
JP2007-110942 2007-04-19

Publications (1)

Publication Number Publication Date
WO2008133209A1 true WO2008133209A1 (ja) 2008-11-06

Family

ID=39925663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057615 WO2008133209A1 (ja) 2007-04-19 2008-04-18 導電性接触子および導電性接触子ユニット

Country Status (3)

Country Link
JP (1) JP5361710B2 (ja)
TW (1) TWI383153B (ja)
WO (1) WO2008133209A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011048890A1 (ja) * 2009-10-23 2011-04-28 株式会社ヨコオ コンタクトプローブ及びソケット
WO2014017157A1 (ja) * 2012-07-23 2014-01-30 山一電機株式会社 コンタクトプローブ及びそれを備えた半導体素子用ソケット
KR20160096968A (ko) * 2015-02-06 2016-08-17 리노공업주식회사 검사장치용 프로브
WO2017141564A1 (ja) * 2016-02-15 2017-08-24 オムロン株式会社 プローブピンおよびこれを用いた検査装置
KR102162476B1 (ko) * 2019-07-18 2020-10-06 박상량 단일 몸체의 하우징으로 구성되는 고성능 반도체 테스트 소켓
WO2023181906A1 (ja) * 2022-03-25 2023-09-28 株式会社ヨコオ スプリングコネクタ
WO2023228844A1 (ja) * 2022-05-26 2023-11-30 株式会社ヨコオ プローブ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180060565A (ko) * 2016-11-29 2018-06-07 주식회사 파인디앤씨 계측용 프로브핀

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06201725A (ja) * 1992-11-09 1994-07-22 Nhk Spring Co Ltd 導電性接触子及び導電性接触子ユニット
JPH0743419A (ja) * 1993-06-29 1995-02-14 Matsushita Electric Ind Co Ltd プリント配線板検査治具
JPH095356A (ja) * 1995-06-23 1997-01-10 Matsushita Electric Ind Co Ltd 電子部品の検査装置
JP2000028638A (ja) * 1998-07-10 2000-01-28 Nhk Spring Co Ltd 導電性接触子
JP2002350487A (ja) * 2001-03-19 2002-12-04 Inoue Shoji Kk プリント配線板の検査治具
JP2003021658A (ja) * 2001-07-06 2003-01-24 Murata Mfg Co Ltd 電子部品の電気特性検査装置
JP2006170633A (ja) * 2004-12-13 2006-06-29 Inoue Shoji Kk プリント配線板の検査治具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
JP4614434B2 (ja) * 2004-09-30 2011-01-19 株式会社ヨコオ プローブ
JP4757531B2 (ja) * 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06201725A (ja) * 1992-11-09 1994-07-22 Nhk Spring Co Ltd 導電性接触子及び導電性接触子ユニット
JPH0743419A (ja) * 1993-06-29 1995-02-14 Matsushita Electric Ind Co Ltd プリント配線板検査治具
JPH095356A (ja) * 1995-06-23 1997-01-10 Matsushita Electric Ind Co Ltd 電子部品の検査装置
JP2000028638A (ja) * 1998-07-10 2000-01-28 Nhk Spring Co Ltd 導電性接触子
JP2002350487A (ja) * 2001-03-19 2002-12-04 Inoue Shoji Kk プリント配線板の検査治具
JP2003021658A (ja) * 2001-07-06 2003-01-24 Murata Mfg Co Ltd 電子部品の電気特性検査装置
JP2006170633A (ja) * 2004-12-13 2006-06-29 Inoue Shoji Kk プリント配線板の検査治具

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011048890A1 (ja) * 2009-10-23 2011-04-28 株式会社ヨコオ コンタクトプローブ及びソケット
JP2011089930A (ja) * 2009-10-23 2011-05-06 Yokowo Co Ltd コンタクトプローブ及びソケット
WO2014017157A1 (ja) * 2012-07-23 2014-01-30 山一電機株式会社 コンタクトプローブ及びそれを備えた半導体素子用ソケット
JP2014021054A (ja) * 2012-07-23 2014-02-03 Yamaichi Electronics Co Ltd コンタクトプローブ及びそれを備えた半導体素子用ソケット
US9684031B2 (en) 2012-07-23 2017-06-20 Yamaichi Electronics Co., Ltd. Contact probe and semiconductor element socket provided with same
KR20160096968A (ko) * 2015-02-06 2016-08-17 리노공업주식회사 검사장치용 프로브
KR101704710B1 (ko) 2015-02-06 2017-02-08 리노공업주식회사 검사장치용 프로브
WO2017141564A1 (ja) * 2016-02-15 2017-08-24 オムロン株式会社 プローブピンおよびこれを用いた検査装置
JP2017146119A (ja) * 2016-02-15 2017-08-24 オムロン株式会社 プローブピンおよびこれを用いた検査装置
KR102162476B1 (ko) * 2019-07-18 2020-10-06 박상량 단일 몸체의 하우징으로 구성되는 고성능 반도체 테스트 소켓
WO2023181906A1 (ja) * 2022-03-25 2023-09-28 株式会社ヨコオ スプリングコネクタ
WO2023228844A1 (ja) * 2022-05-26 2023-11-30 株式会社ヨコオ プローブ

Also Published As

Publication number Publication date
TWI383153B (zh) 2013-01-21
JP5361710B2 (ja) 2013-12-04
JPWO2008133209A1 (ja) 2010-07-22
TW200902983A (en) 2009-01-16

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