WO2008120278A1 - コネクタ、電子装置、及び、電子装置の製造方法 - Google Patents

コネクタ、電子装置、及び、電子装置の製造方法 Download PDF

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Publication number
WO2008120278A1
WO2008120278A1 PCT/JP2007/000335 JP2007000335W WO2008120278A1 WO 2008120278 A1 WO2008120278 A1 WO 2008120278A1 JP 2007000335 W JP2007000335 W JP 2007000335W WO 2008120278 A1 WO2008120278 A1 WO 2008120278A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
connector
manufacturing
electrode
bent parts
Prior art date
Application number
PCT/JP2007/000335
Other languages
English (en)
French (fr)
Inventor
Makoto Sakairi
Nobutaka Itoh
Yoshiteru Ochi
Yoko Kobayashi
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/000335 priority Critical patent/WO2008120278A1/ja
Priority to JP2009507273A priority patent/JP4957792B2/ja
Publication of WO2008120278A1 publication Critical patent/WO2008120278A1/ja
Priority to US12/553,610 priority patent/US8083528B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)

Abstract

　支持部材から突設された自由端が第１対象物の電極及び第２対象物の電極に接触し、上記第１対象物及び上記第２対象物に対し傾きを有するように基端部に曲がり部を設けたコンタクトピンを備えるコネクタであって、上記曲がり部の剛性を選択的に高くしてなる。
PCT/JP2007/000335 2007-03-29 2007-03-29 コネクタ、電子装置、及び、電子装置の製造方法 WO2008120278A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/000335 WO2008120278A1 (ja) 2007-03-29 2007-03-29 コネクタ、電子装置、及び、電子装置の製造方法
JP2009507273A JP4957792B2 (ja) 2007-03-29 2007-03-29 コネクタ、電子装置、及び、電子装置の製造方法
US12/553,610 US8083528B2 (en) 2007-03-29 2009-09-03 Connector, electronic device, and method of manufacturing electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/000335 WO2008120278A1 (ja) 2007-03-29 2007-03-29 コネクタ、電子装置、及び、電子装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/553,610 Continuation US8083528B2 (en) 2007-03-29 2009-09-03 Connector, electronic device, and method of manufacturing electronic device

Publications (1)

Publication Number Publication Date
WO2008120278A1 true WO2008120278A1 (ja) 2008-10-09

Family

ID=39807871

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/000335 WO2008120278A1 (ja) 2007-03-29 2007-03-29 コネクタ、電子装置、及び、電子装置の製造方法

Country Status (3)

Country Link
US (1) US8083528B2 (ja)
JP (1) JP4957792B2 (ja)
WO (1) WO2008120278A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016503946A (ja) * 2012-12-12 2016-02-08 アンフェノール インターコン システムズ、インコーポレイテッド インピーダンスが制御されるｌｇａインターポーザ・アセンブリ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5152099B2 (ja) * 2009-05-18 2013-02-27 富士通株式会社 基板構造
US7918685B1 (en) 2010-04-01 2011-04-05 CableJive LLC Cable assembly for mobile media devices
US10027061B2 (en) * 2011-03-02 2018-07-17 Molex, Llc Socket with insert-molded terminal
US10729000B2 (en) * 2016-09-28 2020-07-28 Intel Corporation Thermal conductivity for integrated circuit packaging
US9947634B1 (en) * 2017-06-13 2018-04-17 Northrop Grumman Systems Corporation Robust mezzanine BGA connector
US10313766B1 (en) * 2017-07-01 2019-06-04 Juniper Networks, Inc. Apparatus for mating a field-replaceable unit to a backplane of a telecommunications system
CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304806A (ja) * 1999-04-20 2000-11-02 Mitsubishi Electric Corp 半導体機器のテスト用ソケット
JP2002527868A (ja) * 1998-10-10 2002-08-27 ウンヨン・チュン テスト・ソケット
JP2006049260A (ja) * 2004-08-02 2006-02-16 Hon Hai Precision Industry Co Ltd ランドグリッドアレイ電気コネクタ
JP3128351U (ja) * 2005-12-29 2007-01-11 鴻海精密工業股▲ふん▼有限公司 コネクタ用コンタクト
JP2007503103A (ja) * 2003-06-11 2007-02-15 シンチ コネクターズ インコーポレーテッド 電気コネクタ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6111284U (ja) * 1984-06-26 1986-01-23 沖電線株式会社 基板接続コネクタ
JPH0982747A (ja) 1995-09-12 1997-03-28 Seiko Epson Corp 半導体装置のパッド電極構造及びその製造方法
US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
JP3287464B2 (ja) * 1999-06-15 2002-06-04 タイコエレクトロニクスアンプ株式会社 Ｚｉｆ型ソケット
US6264476B1 (en) * 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
US6585527B2 (en) * 2001-05-31 2003-07-01 Samtec, Inc. Compliant connector for land grid array

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002527868A (ja) * 1998-10-10 2002-08-27 ウンヨン・チュン テスト・ソケット
JP2000304806A (ja) * 1999-04-20 2000-11-02 Mitsubishi Electric Corp 半導体機器のテスト用ソケット
JP2007503103A (ja) * 2003-06-11 2007-02-15 シンチ コネクターズ インコーポレーテッド 電気コネクタ
JP2006049260A (ja) * 2004-08-02 2006-02-16 Hon Hai Precision Industry Co Ltd ランドグリッドアレイ電気コネクタ
JP3128351U (ja) * 2005-12-29 2007-01-11 鴻海精密工業股▲ふん▼有限公司 コネクタ用コンタクト

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016503946A (ja) * 2012-12-12 2016-02-08 アンフェノール インターコン システムズ、インコーポレイテッド インピーダンスが制御されるｌｇａインターポーザ・アセンブリ
KR101746315B1 (ko) * 2012-12-12 2017-06-12 암페놀 인터콘 시스템즈, 아이엔씨. 임피던스 제어형 랜드 그리드 배열 인터포저 조립체

Also Published As

Publication number Publication date
JPWO2008120278A1 (ja) 2010-07-15
US20090325401A1 (en) 2009-12-31
JP4957792B2 (ja) 2012-06-20
US8083528B2 (en) 2011-12-27

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