WO2008108128A1 - 誘電体、誘電体を用いたキャパシタ、誘電体を用いた半導体装置、及び誘電体の製造方法 - Google Patents
誘電体、誘電体を用いたキャパシタ、誘電体を用いた半導体装置、及び誘電体の製造方法 Download PDFInfo
- Publication number
- WO2008108128A1 WO2008108128A1 PCT/JP2008/051738 JP2008051738W WO2008108128A1 WO 2008108128 A1 WO2008108128 A1 WO 2008108128A1 JP 2008051738 W JP2008051738 W JP 2008051738W WO 2008108128 A1 WO2008108128 A1 WO 2008108128A1
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- WIPO (PCT)
- Prior art keywords
- dielectric material
- semiconductor device
- capacitor
- dielectric
- producing
- Prior art date
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- 239000003989 dielectric material Substances 0.000 title abstract 9
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000003990 capacitor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000013078 crystal Substances 0.000 abstract 1
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- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
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- C01G25/00—Compounds of zirconium
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US12/526,238 US8203176B2 (en) | 2007-03-08 | 2008-02-04 | Dielectric, capacitor using dielectric, semiconductor device using dielectric, and manufacturing method of dielectric |
JP2009502482A JPWO2008108128A1 (ja) | 2007-03-08 | 2008-02-04 | 誘電体、誘電体を用いたキャパシタ、誘電体を用いた半導体装置、及び誘電体の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007058316 | 2007-03-08 | ||
JP2007-058316 | 2007-03-08 |
Publications (1)
Publication Number | Publication Date |
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WO2008108128A1 true WO2008108128A1 (ja) | 2008-09-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2008/051738 WO2008108128A1 (ja) | 2007-03-08 | 2008-02-04 | 誘電体、誘電体を用いたキャパシタ、誘電体を用いた半導体装置、及び誘電体の製造方法 |
Country Status (3)
Country | Link |
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US (1) | US8203176B2 (ja) |
JP (1) | JPWO2008108128A1 (ja) |
WO (1) | WO2008108128A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009119803A1 (ja) * | 2008-03-28 | 2009-10-01 | 日本電気株式会社 | キャパシタとそれを有する半導体装置並びにそれらの製造方法 |
WO2010098121A1 (ja) * | 2009-02-27 | 2010-09-02 | キヤノンアネルバ株式会社 | 誘電体ならびに半導体装置の製造方法、プログラム、および、記録媒体 |
JP2011049531A (ja) * | 2009-07-31 | 2011-03-10 | Hitachi Kokusai Electric Inc | 半導体デバイスの製造方法、半導体デバイス及び基板処理装置 |
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US9455259B2 (en) | 2014-09-16 | 2016-09-27 | Samsung Electronics Co., Ltd. | Semiconductor devices including diffusion barriers with high electronegativity metals |
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US8203176B2 (en) | 2012-06-19 |
JPWO2008108128A1 (ja) | 2010-06-10 |
US20100320520A1 (en) | 2010-12-23 |
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