CN100539305C - 复合导电性薄板及其制造方法 - Google Patents
复合导电性薄板及其制造方法 Download PDFInfo
- Publication number
- CN100539305C CN100539305C CNB2006800051399A CN200680005139A CN100539305C CN 100539305 C CN100539305 C CN 100539305C CN B2006800051399 A CNB2006800051399 A CN B2006800051399A CN 200680005139 A CN200680005139 A CN 200680005139A CN 100539305 C CN100539305 C CN 100539305C
- Authority
- CN
- China
- Prior art keywords
- electrode
- insulating properties
- anisotropic conductive
- thin plate
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP038668/2005 | 2005-02-16 | ||
JP2005038668 | 2005-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101120484A CN101120484A (zh) | 2008-02-06 |
CN100539305C true CN100539305C (zh) | 2009-09-09 |
Family
ID=36916288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006800051399A Expired - Fee Related CN100539305C (zh) | 2005-02-16 | 2006-01-11 | 复合导电性薄板及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7705618B2 (zh) |
EP (1) | EP1850419B1 (zh) |
KR (1) | KR101240761B1 (zh) |
CN (1) | CN100539305C (zh) |
TW (1) | TWI406449B (zh) |
WO (1) | WO2006087877A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7922497B2 (en) * | 2005-10-11 | 2011-04-12 | Jsr Corporation | Anisotropic conductive connector and inspection equipment of circuit device |
KR20080079670A (ko) * | 2005-12-22 | 2008-09-01 | 제이에스알 가부시끼가이샤 | 웨이퍼 검사용 회로 기판 장치, 프로브 카드 및 웨이퍼검사 장치 |
US20100321908A1 (en) * | 2007-02-22 | 2010-12-23 | Motoji Shiota | Electronic circuit device, production method thereof, and display device |
JP5081533B2 (ja) * | 2007-08-21 | 2012-11-28 | ポリマテック株式会社 | 異方導電性コネクタおよび異方導電性コネクタの接続構造 |
KR100891531B1 (ko) * | 2007-09-10 | 2009-04-03 | 주식회사 하이닉스반도체 | 패턴 정렬 불량 검출 장치 |
KR101038269B1 (ko) * | 2009-07-24 | 2011-05-31 | (주)케미텍 | 이방 도전성 커넥터 및 그 제조 방법 |
KR101038270B1 (ko) * | 2009-07-24 | 2011-05-31 | (주)케미텍 | 이방 도전성 커넥터 및 그 제조 방법 |
US8740653B2 (en) * | 2012-05-30 | 2014-06-03 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Socket having an insulating housing with a conductive silicone rubber insert for holding and electrically connecting a light tube |
KR102161173B1 (ko) | 2013-08-29 | 2020-09-29 | 삼성전자주식회사 | 패키지 온 패키지 장치 및 이의 제조 방법 |
JP2018073577A (ja) * | 2016-10-27 | 2018-05-10 | 株式会社エンプラス | 異方導電性シート及びその製造方法 |
IT201700100522A1 (it) * | 2017-09-07 | 2019-03-07 | Technoprobe Spa | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
WO2020075810A1 (ja) * | 2018-10-11 | 2020-04-16 | 積水ポリマテック株式会社 | 電気接続シート、及び端子付きガラス板構造 |
KR102280651B1 (ko) * | 2018-12-26 | 2021-07-23 | 주식회사 아이에스시 | 전기접속용 커넥터 및 그 제조 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5193393A (en) | 1975-02-12 | 1976-08-16 | Erasuteitsuku kontakutoshiitonoseizohoho | |
JPS6032285B2 (ja) | 1977-05-31 | 1985-07-27 | ジェイエスアール株式会社 | 加圧導電性エラストマ−の製造方法 |
US4322682A (en) * | 1979-05-21 | 1982-03-30 | Everett/Charles Inc. | Vacuum actuated test head having programming plate |
DE3147141A1 (de) * | 1981-11-27 | 1983-09-29 | Franz Kaiser KG, 8949 Salgen | Verfahren zur gewinnung von pyrolysegas zu brennbaren abfallstoffen und vorrichtung zur durchfuehrung des verfahrens |
JPS61250906A (ja) | 1985-04-26 | 1986-11-08 | ジェイエスアール株式会社 | 導電性エラストマ−シ−ト |
US5379515A (en) * | 1989-12-11 | 1995-01-10 | Canon Kabushiki Kaisha | Process for preparing electrical connecting member |
DE69233684D1 (de) * | 1991-02-22 | 2007-04-12 | Canon Kk | Elektrischer Verbindungskörper und Herstellungsverfahren dafür |
JPH0639961A (ja) | 1992-02-10 | 1994-02-15 | Nitto Denko Corp | 複層基材およびそれを用いた異方導電フィルムの製造方法 |
JPH06231818A (ja) * | 1993-02-01 | 1994-08-19 | Nitto Denko Corp | 弾性を有する異方導電コネクター |
US5599193A (en) * | 1994-08-23 | 1997-02-04 | Augat Inc. | Resilient electrical interconnect |
DE19654404A1 (de) * | 1996-12-24 | 1998-06-25 | Hewlett Packard Co | Adaptationsvorrichtung zum elektrischen Test von Leiterplatten |
US6854985B1 (en) * | 1998-12-16 | 2005-02-15 | Paricon Technologies Corporation | Elastomeric interconnection device and methods for making same |
JP3613130B2 (ja) * | 2000-04-25 | 2005-01-26 | 松下電工株式会社 | 遠隔監視制御システムの操作用端末器 |
JP4385498B2 (ja) | 2000-06-09 | 2009-12-16 | Jsr株式会社 | シート状コネクターおよびその製造方法並びに電気的検査装置 |
US7059874B2 (en) * | 2002-03-19 | 2006-06-13 | Paricon Technologies, Inc. | Anisotropic conductive elastomer based electrical interconnect with enhanced dynamic range |
US7063542B2 (en) * | 2002-06-13 | 2006-06-20 | Paricon Technologies Corporation | Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits |
JP4380373B2 (ja) * | 2003-03-26 | 2009-12-09 | Jsr株式会社 | 電気抵抗測定用コネクター、電気抵抗測定用コネクター装置およびその製造方法並びに回路基板の電気抵抗測定装置および測定方法 |
-
2006
- 2006-01-11 CN CNB2006800051399A patent/CN100539305C/zh not_active Expired - Fee Related
- 2006-01-11 EP EP06711519.6A patent/EP1850419B1/en not_active Not-in-force
- 2006-01-11 KR KR1020077019069A patent/KR101240761B1/ko active IP Right Grant
- 2006-01-11 TW TW095101063A patent/TWI406449B/zh not_active IP Right Cessation
- 2006-01-11 US US11/815,506 patent/US7705618B2/en active Active
- 2006-01-11 WO PCT/JP2006/300170 patent/WO2006087877A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101120484A (zh) | 2008-02-06 |
US7705618B2 (en) | 2010-04-27 |
US20090039905A1 (en) | 2009-02-12 |
KR101240761B1 (ko) | 2013-03-07 |
EP1850419A4 (en) | 2010-12-22 |
WO2006087877A1 (ja) | 2006-08-24 |
EP1850419A1 (en) | 2007-10-31 |
EP1850419B1 (en) | 2013-06-19 |
TW200640080A (en) | 2006-11-16 |
TWI406449B (zh) | 2013-08-21 |
KR20070102716A (ko) | 2007-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KYOWA MACHINERY CO., LTD. ISC Free format text: FORMER OWNER: JSR CORP. Effective date: 20140904 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140904 Address after: Gyeonggi Do, South Korea Patentee after: ISC Corporation Address before: Tokyo, Japan Patentee before: JSR Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20170111 |