WO2008084512A1 - 放熱材料及び放熱材料で成形した放熱シート - Google Patents

放熱材料及び放熱材料で成形した放熱シート Download PDF

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Publication number
WO2008084512A1
WO2008084512A1 PCT/JP2006/325846 JP2006325846W WO2008084512A1 WO 2008084512 A1 WO2008084512 A1 WO 2008084512A1 JP 2006325846 W JP2006325846 W JP 2006325846W WO 2008084512 A1 WO2008084512 A1 WO 2008084512A1
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WIPO (PCT)
Prior art keywords
radiating
radiating material
zinc oxide
core part
hydrogenated copolymer
Prior art date
Application number
PCT/JP2006/325846
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English (en)
French (fr)
Inventor
Motonori Nakamichi
Yasuaki Konomi
Takeshi Yasui
Katsumi Suzuki
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to TW095148995A priority Critical patent/TW200827377A/zh
Priority to US12/520,000 priority patent/US8653176B2/en
Priority to PCT/JP2006/325846 priority patent/WO2008084512A1/ja
Publication of WO2008084512A1 publication Critical patent/WO2008084512A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C08F297/04—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/02—Hydrogenation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　優れた熱伝導性と絶縁性を有し、かつ柔軟性と靭性を保持しながら、難燃性を有することを特徴とする放熱材料及び放熱材料で成形した放熱シートに関する。 　具体的には、特定の構造と配合量を有する水添共重合体（１）および／または又は変性水添共重合体（２）、および核部とこの核部から４軸方向に伸びた針状結晶部を有する酸化亜鉛（３）からなる放熱材料が、さらに必要に応じて、パラフィンオイル（４）、難燃剤（５）、または熱伝導率が１０～４００Ｗ／ｍ・Ｋの充填剤（６）（酸化亜鉛（３）を除く）からなる放熱材料及び放熱材料で成形した放熱シートである。
PCT/JP2006/325846 2006-12-26 2006-12-26 放熱材料及び放熱材料で成形した放熱シート WO2008084512A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095148995A TW200827377A (en) 2006-12-26 2006-12-26 Radiating material and radiating sheet molded from radiating material
US12/520,000 US8653176B2 (en) 2006-12-26 2006-12-26 Thermally conductive material and thermally conductive sheet molded from the thermally conductive material
PCT/JP2006/325846 WO2008084512A1 (ja) 2006-12-26 2006-12-26 放熱材料及び放熱材料で成形した放熱シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/325846 WO2008084512A1 (ja) 2006-12-26 2006-12-26 放熱材料及び放熱材料で成形した放熱シート

Publications (1)

Publication Number Publication Date
WO2008084512A1 true WO2008084512A1 (ja) 2008-07-17

Family

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Family Applications (1)

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PCT/JP2006/325846 WO2008084512A1 (ja) 2006-12-26 2006-12-26 放熱材料及び放熱材料で成形した放熱シート

Country Status (3)

Country Link
US (1) US8653176B2 (ja)
TW (1) TW200827377A (ja)
WO (1) WO2008084512A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010055878A1 (ja) * 2008-11-12 2010-05-20 日東電工株式会社 絶縁性熱伝導シートの製造方法、絶縁性熱伝導シート及び放熱部材
JP2010533220A (ja) * 2007-07-10 2010-10-21 ビーエーエスエフ ソシエタス・ヨーロピア 難燃性を有する弾性共重合体
US9017817B2 (en) 2008-04-30 2015-04-28 Nitto Denko Corporation Method for producing laminated porous sheet comprising polytetrafluoroethylene and carbon particles
WO2018092593A1 (ja) * 2016-11-15 2018-05-24 北川工業株式会社 熱伝導エラストマー組成物、及び熱伝導成形体
WO2018180319A1 (ja) * 2017-03-30 2018-10-04 積水化学工業株式会社 熱伝導性発泡体シート

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US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
WO2012148219A2 (ko) * 2011-04-28 2012-11-01 ㈜솔루에타 전도성 섬유를 이용한 방열테이프 및 그 제조방법
CN103563505B (zh) * 2011-04-28 2017-03-08 索略得 水平热电胶带及其制备方法
CN103073924B (zh) * 2013-01-23 2014-09-17 苏州大学 一种含磷腈结构的六方氮化硼及其制备方法
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
TWI464213B (zh) * 2013-03-07 2014-12-11 Taiwan Union Technology Corp 樹脂組合物及其應用
KR101692757B1 (ko) * 2013-04-18 2017-01-04 제일모직 주식회사 절연막용 린스액 및 절연막의 린스 방법
US10976120B2 (en) * 2017-10-13 2021-04-13 Hamilton Sundstrand Corporation Net shape moldable thermally conductive materials
CN111040310A (zh) * 2018-10-15 2020-04-21 伊利诺斯工具制品有限公司 导热绝缘片材及其制备方法

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Publication number Priority date Publication date Assignee Title
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WO2018092593A1 (ja) * 2016-11-15 2018-05-24 北川工業株式会社 熱伝導エラストマー組成物、及び熱伝導成形体
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Also Published As

Publication number Publication date
TWI308915B (ja) 2009-04-21
US8653176B2 (en) 2014-02-18
TW200827377A (en) 2008-07-01
US20100012884A1 (en) 2010-01-21

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