WO2008081593A1 - 発光素子用積層体、及び発光素子 - Google Patents

発光素子用積層体、及び発光素子 Download PDF

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Publication number
WO2008081593A1
WO2008081593A1 PCT/JP2007/001484 JP2007001484W WO2008081593A1 WO 2008081593 A1 WO2008081593 A1 WO 2008081593A1 JP 2007001484 W JP2007001484 W JP 2007001484W WO 2008081593 A1 WO2008081593 A1 WO 2008081593A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting element
laminated body
emitting elements
layer
Prior art date
Application number
PCT/JP2007/001484
Other languages
English (en)
French (fr)
Inventor
Akira Tanaka
Original Assignee
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to JP2008552027A priority Critical patent/JPWO2008081593A1/ja
Publication of WO2008081593A1 publication Critical patent/WO2008081593A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

　本発明の課題は、有機ＥＬ素子等の発光素子用の封止層、封止容器及び発光素子形成用の素材等として好適に使用可能な発光素子用積層体及び発光素子を提供することである。 　この発光素子用積層体は、金属で形成された酸素透過率が０．０１ｃｃ／ｃｍ２・日以下である金属薄膜層と、酸素吸収性樹脂を含有する樹脂層とを有することを特徴とし、この発光素子は、前記発光素子用積層体と、発光層と、透明基板とをこの順に積層して成る。
PCT/JP2007/001484 2006-12-28 2007-12-27 発光素子用積層体、及び発光素子 WO2008081593A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552027A JPWO2008081593A1 (ja) 2006-12-28 2007-12-27 発光素子用積層体、及び発光素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006355494 2006-12-28
JP2006-355494 2006-12-28

Publications (1)

Publication Number Publication Date
WO2008081593A1 true WO2008081593A1 (ja) 2008-07-10

Family

ID=39588282

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001484 WO2008081593A1 (ja) 2006-12-28 2007-12-27 発光素子用積層体、及び発光素子

Country Status (3)

Country Link
JP (1) JPWO2008081593A1 (ja)
TW (1) TW200847838A (ja)
WO (1) WO2008081593A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010023899A1 (ja) * 2008-08-26 2010-03-04 三菱瓦斯化学株式会社 脱酸素性多層体
WO2010134137A1 (ja) * 2009-05-18 2010-11-25 三菱瓦斯化学株式会社 脱酸素性多層体
JP2011171287A (ja) * 2010-01-20 2011-09-01 Semiconductor Energy Lab Co Ltd フレキシブル発光装置、電子機器、及びフレキシブル発光装置の作製方法
JP2011222334A (ja) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 熱伝導性封止部材および素子
JP2013069480A (ja) * 2011-09-21 2013-04-18 Semiconductor Energy Lab Co Ltd 発光装置、電子機器、及び照明装置
JP2015033856A (ja) * 2010-07-16 2015-02-19 住友ベークライト株式会社 積層フィルムおよび包装体
JP2016066607A (ja) * 2014-09-18 2016-04-28 株式会社半導体エネルギー研究所 剥離方法、発光装置、モジュール、及び電子機器
WO2017130600A1 (ja) * 2016-01-26 2017-08-03 住友化学株式会社 発光装置
CN111952484A (zh) * 2020-06-29 2020-11-17 南京冠石科技股份有限公司 一种柔性oled器件的加工工艺
JP7444309B2 (ja) 2022-04-26 2024-03-06 大日本印刷株式会社 自発光型表示体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004781A (ja) * 2004-06-17 2006-01-05 Tohoku Pioneer Corp 有機ｅｌ素子および有機ｅｌ表示パネル
JP2006004650A (ja) * 2004-06-15 2006-01-05 Toshiba Matsushita Display Technology Co Ltd 表示素子及び光学デバイス
WO2006080526A1 (ja) * 2005-01-31 2006-08-03 Zeon Corporation 発光素子用封止容器及び発光体
WO2006080393A1 (ja) * 2005-01-28 2006-08-03 Zeon Corporation 発光素子用積層体および発光素子
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004650A (ja) * 2004-06-15 2006-01-05 Toshiba Matsushita Display Technology Co Ltd 表示素子及び光学デバイス
JP2006004781A (ja) * 2004-06-17 2006-01-05 Tohoku Pioneer Corp 有機ｅｌ素子および有機ｅｌ表示パネル
WO2006080393A1 (ja) * 2005-01-28 2006-08-03 Zeon Corporation 発光素子用積層体および発光素子
WO2006080526A1 (ja) * 2005-01-31 2006-08-03 Zeon Corporation 発光素子用封止容器及び発光体
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472109B2 (ja) * 2008-08-26 2014-04-16 三菱瓦斯化学株式会社 脱酸素性多層体
US8679468B2 (en) 2008-08-26 2014-03-25 Mitsubishi Gas Chemical Company, Inc. Deoxidizing multilayered body
WO2010023899A1 (ja) * 2008-08-26 2010-03-04 三菱瓦斯化学株式会社 脱酸素性多層体
JPWO2010023899A1 (ja) * 2008-08-26 2012-01-26 三菱瓦斯化学株式会社 脱酸素性多層体
US8889238B2 (en) 2009-05-18 2014-11-18 Mitsubishi Gas Chemical Company, Inc. Deoxidizing multilayered body
JP5152705B2 (ja) * 2009-05-18 2013-02-27 三菱瓦斯化学株式会社 脱酸素性多層体
WO2010134137A1 (ja) * 2009-05-18 2010-11-25 三菱瓦斯化学株式会社 脱酸素性多層体
JP2011171287A (ja) * 2010-01-20 2011-09-01 Semiconductor Energy Lab Co Ltd フレキシブル発光装置、電子機器、及びフレキシブル発光装置の作製方法
US9000442B2 (en) 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
JP2011222334A (ja) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 熱伝導性封止部材および素子
JP2015033856A (ja) * 2010-07-16 2015-02-19 住友ベークライト株式会社 積層フィルムおよび包装体
JP2013069480A (ja) * 2011-09-21 2013-04-18 Semiconductor Energy Lab Co Ltd 発光装置、電子機器、及び照明装置
JP2016066607A (ja) * 2014-09-18 2016-04-28 株式会社半導体エネルギー研究所 剥離方法、発光装置、モジュール、及び電子機器
WO2017130600A1 (ja) * 2016-01-26 2017-08-03 住友化学株式会社 発光装置
JP2017134942A (ja) * 2016-01-26 2017-08-03 住友化学株式会社 発光装置
CN111952484A (zh) * 2020-06-29 2020-11-17 南京冠石科技股份有限公司 一种柔性oled器件的加工工艺
CN111952484B (zh) * 2020-06-29 2022-06-28 南京冠石科技股份有限公司 一种柔性oled器件的加工工艺
JP7444309B2 (ja) 2022-04-26 2024-03-06 大日本印刷株式会社 自発光型表示体

Also Published As

Publication number Publication date
TW200847838A (en) 2008-12-01
JPWO2008081593A1 (ja) 2010-04-30

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