WO2008001997A1 - Apparatus for marking and vision inspection of the semiconductor device - Google Patents

Apparatus for marking and vision inspection of the semiconductor device Download PDF

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Publication number
WO2008001997A1
WO2008001997A1 PCT/KR2007/000275 KR2007000275W WO2008001997A1 WO 2008001997 A1 WO2008001997 A1 WO 2008001997A1 KR 2007000275 W KR2007000275 W KR 2007000275W WO 2008001997 A1 WO2008001997 A1 WO 2008001997A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
tray
marking
sorting
vision inspection
Prior art date
Application number
PCT/KR2007/000275
Other languages
French (fr)
Inventor
Hong Jun You
Original Assignee
Jt Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jt Corporation filed Critical Jt Corporation
Publication of WO2008001997A1 publication Critical patent/WO2008001997A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Definitions

  • the present invention relates to an apparatus for marking and vision inspection of the semiconductor device, more particularly, to an apparatus for marking and vision inspection of the semiconductor device which marks company logo, etc. on a surface of a semiconductor device and performs an inspection of an external appearance of a semiconductor device.
  • Test process, etc. are loaded in a client tray so as to be distributed to the market.
  • Another object of the present invention to provide an apparatus for marking and vision inspection of the semiconductor device which is capable of solving accumulation in performing semiconductor processes due to the difference in process speeds of the marking process and the vision inspection process.
  • an apparatus which includes a marking unit for performing a marking process in which a mark is formed on a surface of a semiconductor device; one or more vision inspection units for performing a vision inspection process in which an external appearance of a semiconductor device is examined, the vision inspection unit being installed together with the marking unit; and a sorting unit for sorting and loading semiconductor devices in accordance with inspection result for the external appearance of the vision inspection unit.
  • the semiconductor devices may be transferred by being loaded in a tray.
  • the marking unit may include a pair of guide rails guiding a tray which is loaded with a plurality of semiconductor devices and is movable along the guide rails; a driving unit for moving the tray along the guide rails; and a mark unit for marking a mark on a surface of the semiconductor loaded in the tray.
  • the vision inspection unit may include one or more loading unit, the loading unit having a pair of guide rails guiding a tray which is loaded with a plurality of semiconductor devices and is movable along the guide rails, and a driving unit for moving the tray along the guide rails; and an inspection unit for examining an external appearance of the semiconductor device loaded in the tray, the inspection unit being installed at a side of the guide rails.
  • the loading unit may be comprised of in a pair, and the inspection unit may be installed between the pair of the loading units, and the loading unit may further include a foreign body removing unit for removing foreign body from the semiconductor device before the inspection unit examines an external appearance.
  • the semiconductor device formed with a mark by the marking unit may be transferred to the vision inspection unit, or the semiconductor device examined by the vision inspection unit may be transferred to the marking unit.
  • the apparatus in accordance with the present invention may perform one of the marking process and the vision inspection process and then perform the other process thereafter.
  • the sorting unit may include a plurality of sorting tray units respectively having sorting class in accordance with inspection result of the vision inspection unit.
  • the sorting unit may include one or more first sorting tray units to which a tray is transferred from the vision inspection unit, and one or more second sorting tray units respectively having sorting class and the first sorting tray unit is comprised of in a pair.
  • the sorting unit may include a device transferring unit which moves and transfers the semiconductor devices between the first sorting tray unit and the second sorting tray unit, and the device transferring unit may further be installed with a marking examining unit for examining a mark formed on a surface of the semiconductor device.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has an advantage in that the apparatus may perform a marking process and a vision inspection process at the same time.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has an advantage in that the apparatus may solve accumulation in performing semiconductor processes due to the difference in process speeds of the marking process and the vision inspection process.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has an advantage in that the apparatus may rapidly sort the semiconductor device after the marking process and the vision inspection process.
  • FIG. 1 is a plane view showing the first embodiment of the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention.
  • FIG. 2 is a plane view showing the second embodiment of the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has a marking unit 100 and a vision inspection unit 200 in one apparatus in order to perform a marking process and a vision inspection process at the same time for a semiconductor device 1.
  • the semiconductor device 1 is in a state of having undergone through packaging process, and is comprised of a semiconductor chip, lead frames and molding materials enclosing these chip and lead frames. And it is preferable that the semiconductor 1 is transferred by being loaded in a tray 3 for loading a plurality of semiconductor devices 1 for enhancing the efficiency of the marking process and the vision inspection process.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention may be embodied in various constructions and various layouts in accordance with the order of the marking process and the vision inspection process, and some embodiments are explained hereafter.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the first embodiment of the present invention has a technical feature in that the apparatus performs one of the marking process and the vision inspection process and then perform the other process thereafter. And as shown in Fig. 1, the apparatus includes marking unit 100, vision inspection unit 200 and sorting unit 300.
  • the marking unit 100 performing marking process for forming a mark 2 on a surface of the semiconductor device, may be embodied in various constructions.
  • the marking unit 100 may be comprised of a pair of guide rails 110 guiding a tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 110; a driving unit (not shown) for moving the tray 3 along the guide rails 110; and a mark unit 120 for marking a mark 2 on a surface of the semiconductor 1 loaded in the tray 3, the mark unit 120 being installed at the moving path of the tray 3.
  • the tray 3 moves along the guide rails 110 in various directions, or as shown in Fig. 1, may move in -y direction referring to the drawing sheet.
  • the mark unit 120 is a device for forming a mark 2 such as company logo, serial number, identification sign, etc. on a surface of the molding materials of the semiconductor device 1.
  • the mark unit 120 using laser as the mark unit has been widely known, so the detailed explanation for the mark unit is omitted.
  • a reference number 4 i.e. Lot Number
  • a number recognition device 130 for recognizing the reference number 4 of the semiconductor device 1 may be provided with at the moving path of the tray 3.
  • the number recognition device 130 may be installed before the mark unit 120 with the reference of the movement of the tray 3 in order to recognize the semiconductor device 1 before the marking process for forming a mark 2.
  • a foreign body removing unit 140 for removing foreign body from the surface of the semiconductor device 1 by using air injection, brush or etc. may be further provided with at the moving path of the tray 3 so that the mark unit 120 may easily form the mark 2 on the surface of the semiconductor device 1.
  • the foreign body removing unit 140 is installed before the mark unit 120 with the reference of the movement of the tray 3.
  • a marking examining unit such as a camera for examining a state of the mark 2 (whether the mark 2 is properly formed) formed on a surface of the semiconductor device 1 after the mark 2 is formed may be further provided with at the moving path of the tray 3.
  • the marking examining unit is installed behind the mark unit 120 with the reference of the movement of the tray 3.
  • an additional foreign body removing unit 140 may be provided with behind the mark unit 120 so that the vision inspection unit 200 may easily examine the external appearance of a semiconductor device 1.
  • the one or more vision inspection unit 200 together with the marking unit 100 are a device which performs the vision inspection process for examining the external appearance of a semiconductor device 1, and may be embodied in various constructions.
  • the vision inspection unit 200 may be comprised of one or more loading unit 210, the loading unit 210 having a pair of guide rails 211 guiding the tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 211, a driving unit (not shown) for moving the tray 3 along the guide rails 211; an inspection unit 220 for examining the external appearance of the transferred semiconductor device 1 loaded in the tray 3, the inspection unit 220 being installed at a side of the guide rails 211; and a device transferring unit 230 for transferring the semiconductor device 3 between the tray 3 moving along the guide rails 211 of the loading unit 210 and the inspection unit 220.
  • the loading unit 220 transfers the tray 3 loading the semiconductor devices 1 finishing the marking process in the marking unit 100 to the position where the inspection unit 220 performs the vision inspection process.
  • the tray 3 may move in +y direction, or the transferring direction to the inspection unit 220 for the vision insepction process may be in ⁇ x direction (vision inspection line) referring to the drawing sheet.
  • the loading unit 220 is comprised of in plural, or in a pair as one example, and the inspection unit 220 may be installed between the pair of the loading units 210.
  • the inspection unit 220 is a device for performing the vision inspection process, and may be embodied in various constrictions. And the inspection unit 220 may include a device such as camera, scanner, etc. for acquiring image of the semiconductor device 1, particularly image of the bottom of the semiconductor device 1, and performs the vision inspection process in which defect of leads, size of ball grid, damage, scratch, marking defect (a mark is not formed), etc. is examined according to an image of the semiconductor device 1.
  • a separate device since the upper surface of the semiconductor device 1 should be examined in case of marking defect, it is preferable that the marking defect is examined by a separate device.
  • the inspection result of the inspection unit 220 is transferred to and saved in a control unit (not shown) in order to sort the semiconductor devices 1 according to the inspection result.
  • the device transferring unit 230 is a device which moves between the tray 3 and the inspection unit 220 and transfers the semiconductor devices 1 from the tray 3 moving along the guide rails 211 of the loading unit 210 to the inspection unit 220 and transfers the semiconductor devices 1 which finishes the vision inspection process from the inspection unit 220 to the tray 3.
  • the device transferring unit 230 may be comprised of one or more transfer tools having an end absorbing the semiconductor device 1 by forming vacuum pressure so as to transfer the semiconductor device 1, which move between the loading unit 210 and the inspection unit 220 and upward- and-downward.
  • the number of the transfer tools may be determined as 1, 2, 4, 8, etc. in accordance with the number of the semiconductor devices 1 to be transferred.
  • a pair of the device transferring units 230 may be installed in case that a pair of the loading units 210 are installed.
  • the device transferring unit 230 may directly transfer the semiconductor device 1 to the sorting unit according to the inspection result of the inspection unit 220.
  • a foreign body removing unit 240 for removing foreign body from the surface of the semiconductor device 1 by using air injection, brush or etc. may be further provided with at the loading unit 210 so that the inspection unit 220 may easily perform the vision inspection process.
  • the sorting unit 300 sorts and loads the semiconductor devices 1 according to the inspection result of the inspection unit 200, and may be embodied in various constructions and various layouts according to the sorting method.
  • the sorting unit 300 may be comprised of a plurality of sorting tray units 310 and one or more device transferring unit 340 for transferring the semiconductor devices 1 between the plurality of the sorting tray units 310 in order to sort and load the semiconductor devices 1 in accordance with the inspection result such as Good, Bad Leads, Abnormal Size of Ball Grid, Damaged, etc.
  • the number of the sorting tray units 310 may be determined by the number of the sorting classes, and may be comprised of a pair of guide rails 311 guiding the tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 311, and a driving unit (not shown) for moving the tray 3 along the guide rails 311.
  • the trays 3 of the sorting tray units 310 may move along the guide rails 311 in -y direction referring to the drawing sheet, and the device transferring unit 340 for sorting the semiconductor device 1 may move ⁇ x direction (sorting line) referring to the drawing sheet.
  • the semiconductor devices 1 may be transferred directly to the tray 3 of the sorting tray units 310 in accordance with the inspection result by the device transferring unit (in ⁇ x direction (sorting line) referring to the drawing sheet), or the tray 3 loading the semiconductor devices 1 may be transferred to the sorting tray units 310 from the vision inspection unit 200.
  • Th sorting unit 300 may be comprised of one or more sorting tray units 310 (first sorting tray unit) to which a tray 3 is transferred from the vision inspection unit 200, and one or more sorting tray units 310 (second sorting tray unit) respectively having the sorting class.
  • the semiconductor devices 1 loaded in the tray 3 which is transferred from the vision inspection unit 200 may be transferred to the tray 3 of the sorting tray units 310 respectively having the sorting class in accordance with the inspection result of the vision inspection unit 200 by the device transferring unit 340.
  • a pair of the sorting tray units 310 to which the tray 3 is transferred from each loading unit 210 of the vision inspection unit 200 may be provided with in case that a pair of the loading units 210 of the vision inspection unit 200 are provided, and the semiconductor devices 1 loaded in the tray 3 of the sorting tray units 310 to which the tray 3 is transferred from each loading unit 210 is transferred to the tray 3 of the sorting tray units 310 respectively having the sorting class.
  • one of the pair of the sorting tray units 310 to which the tray 3 is transferred from each loading unit 210 may be a sorting tray unit having Good Class, and the tray 3 in which the good semiconductor devices 1 are remained, and the other sorting tray unit 310 may be a sorting tray unit having a different sorting class, or the semiconductor devices 1 in the tray 3 of other sorting tray unit 310 may be removed.
  • the sorting unit 300 may be comprised of sorting tray units 310 respectively having sorting class, and the semiconductor devices 1 loaded in at least a portion of the sorting tray units 310 (first sorting tray unit) after the tray 3 is transferred from the vision inspection unit 200, may be transferred to the tray 3 of other sorting tray units 310 (second sorting tray unit) respectively having the sorting class.
  • the sorting unit 300 may be further provided with an empty tray unit
  • the empty tray unit 380 for providing at least a part of the sorting tray units 310 with empty tray 3, and the empty tray unit 380 may be comprised of a pair of guide rails 311 guiding the tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 311, and a driving unit (not shown) for moving the tray 3 along the guide rails 311.
  • the device transferring unit 340 is a device which transfers the semiconductor devices 1 loaded in the tray 3 of each sorting tray unit 310, and may be comprised of one or more transfer tools having an end absorbing the semiconductor device 1 by forming vacuum pressure so as to transfer the semiconductor device 1 and being movable upward-and-downward.
  • the number of the transfer tools is determined by the corresponding transfer number (1, 2, 8, etc) of the semiconductor devices 1 to be transferred.
  • a marking examining unit such as a camera for examining a state of the mark 2 formed on a surface of the semiconductor device 1 may be further provided with at the device transferring unit 340.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention may be further provided with a buffer tray unit to which a tray 3 is temporarily transferred from the vision inspection unit 200 or a tray loading unit (not shown) in which trays are loaded.
  • the layout and constructions of the marking unit 100 and the vision inspection unit 200 may be variously embodied.
  • the semiconductor devices 1 examined in the vision inspection unit 200 are transferred to the marking unit 100 differing the first embodiment in which the semiconductor devices 1 formed with a mark 2 in the marking unit 100 are transferred to the vision inspection unit 200.
  • the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention may have the same layout as in Fig. 1, or the positions of the marking unit 100 and the vision inspection unit 200 may be changed with each other.
  • the semiconductor devices 1 to be processed are transferred to the vision inspection unit 200 so as to perform the vision inspection process beforehand, and then the semiconductor devices 1 examined in the vision inspection unit 200 are transferred to the marking unit 100.
  • the marking unit 100 without guide rails 110 may be used, the marking process may be performed when the tray 3 loading the semiconductor devices 1, and the tray 3 which go through the marking process, may be transferred to the sorting unit 300.

Abstract

An apparatus for marking and vision inspection of the semiconductor device, more particularly, to an apparatus for marking and vision inspection of the semiconductor device which marks company logo, etc. on a surface of a semiconductor device and performs an inspection of an external appearance of a semiconductor device, the apparatus which includes a marking unit for performing a marking process in which a mark is formed on a surface of a semiconductor device; one or more vision inspection units for performing a vision inspection process in which an external appearance of a semiconductor device is examined, the vision inspection unit being installed together with the marking unit; and a sorting unit for sorting and loading semiconductor devices in accordance with inspection result for the external appearance of the vision inspection unit, is disclosed.

Description

Description
APPARATUS FOR MARKING AND VISION INSPECTION OF THE SEMICONDUCTOR DEVICE
Technical Field
[1] The present invention relates to an apparatus for marking and vision inspection of the semiconductor device, more particularly, to an apparatus for marking and vision inspection of the semiconductor device which marks company logo, etc. on a surface of a semiconductor device and performs an inspection of an external appearance of a semiconductor device. Background Art
[2] The semiconductor devices after packaging process, are examined through Burn-In
Test process, etc. and are loaded in a client tray so as to be distributed to the market.
[3] And a mark such as serial number, manufacturer's logo, etc. is marked on the surface of the semiconductor devices to be distributed though the marking process.
[4] In addition, a vision inspection process for inspecting an external appearance of the semiconductor in order to examine whether there is damage on leads or ball grids, crack, scratch, etc., is performed.
[5] Meanwhile, there is a problem that because the marking process and the vision inspection process are performed by separate apparatuses, an additional installation space for the apparatus for performing the marking process and the apparatus for performing the vision inspection process is required.
[6] In addition, there is a problem that time for the whole process is increased because the marking process and the vision inspection process are separately performed in general.
[7] In particular, there is a problem that because the number of the semiconductor devices to be processed per hour in the marking process are much larger than that in the vision inspection process, accumulation of semiconductor devices in the vision inspection process lower overall working efficiency, thereby lowering productivity. Disclosure of Invention
Technical Problem
[8] Therefore, it is an object of the present invention to provide an apparatus for marking and vision inspection of the semiconductor device which is capable of performing a marking process and a vision inspection process at the same time.
[9] Another object of the present invention to provide an apparatus for marking and vision inspection of the semiconductor device which is capable of solving accumulation in performing semiconductor processes due to the difference in process speeds of the marking process and the vision inspection process. Technical Solution
[10] To achieve these objects, there is provided an apparatus which includes a marking unit for performing a marking process in which a mark is formed on a surface of a semiconductor device; one or more vision inspection units for performing a vision inspection process in which an external appearance of a semiconductor device is examined, the vision inspection unit being installed together with the marking unit; and a sorting unit for sorting and loading semiconductor devices in accordance with inspection result for the external appearance of the vision inspection unit.
[11] The semiconductor devices may be transferred by being loaded in a tray.
[12] The marking unit may include a pair of guide rails guiding a tray which is loaded with a plurality of semiconductor devices and is movable along the guide rails; a driving unit for moving the tray along the guide rails; and a mark unit for marking a mark on a surface of the semiconductor loaded in the tray.
[13] The vision inspection unit may include one or more loading unit, the loading unit having a pair of guide rails guiding a tray which is loaded with a plurality of semiconductor devices and is movable along the guide rails, and a driving unit for moving the tray along the guide rails; and an inspection unit for examining an external appearance of the semiconductor device loaded in the tray, the inspection unit being installed at a side of the guide rails.
[14] The loading unit may be comprised of in a pair, and the inspection unit may be installed between the pair of the loading units, and the loading unit may further include a foreign body removing unit for removing foreign body from the semiconductor device before the inspection unit examines an external appearance.
[15] The semiconductor device formed with a mark by the marking unit may be transferred to the vision inspection unit, or the semiconductor device examined by the vision inspection unit may be transferred to the marking unit. The apparatus in accordance with the present invention may perform one of the marking process and the vision inspection process and then perform the other process thereafter.
[16] The sorting unit may include a plurality of sorting tray units respectively having sorting class in accordance with inspection result of the vision inspection unit.
[17] In addition, the sorting unit may include one or more first sorting tray units to which a tray is transferred from the vision inspection unit, and one or more second sorting tray units respectively having sorting class and the first sorting tray unit is comprised of in a pair.
[18] The sorting unit may include a device transferring unit which moves and transfers the semiconductor devices between the first sorting tray unit and the second sorting tray unit, and the device transferring unit may further be installed with a marking examining unit for examining a mark formed on a surface of the semiconductor device.
Advantageous Effects
[19] The apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has an advantage in that the apparatus may perform a marking process and a vision inspection process at the same time.
[20] In addition, the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has an advantage in that the apparatus may solve accumulation in performing semiconductor processes due to the difference in process speeds of the marking process and the vision inspection process.
[21] In addition, the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention has an advantage in that the apparatus may rapidly sort the semiconductor device after the marking process and the vision inspection process. Brief Description of the Drawings
[22] Fig. 1 is a plane view showing the first embodiment of the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention; and
[23] Fig. 2 is a plane view showing the second embodiment of the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention. Mode for the Invention
[24] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
[25] The apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention, has a marking unit 100 and a vision inspection unit 200 in one apparatus in order to perform a marking process and a vision inspection process at the same time for a semiconductor device 1.
[26] Herein the semiconductor device 1 is in a state of having undergone through packaging process, and is comprised of a semiconductor chip, lead frames and molding materials enclosing these chip and lead frames. And it is preferable that the semiconductor 1 is transferred by being loaded in a tray 3 for loading a plurality of semiconductor devices 1 for enhancing the efficiency of the marking process and the vision inspection process.
[27] In particular, the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention may be embodied in various constructions and various layouts in accordance with the order of the marking process and the vision inspection process, and some embodiments are explained hereafter.
[28] The apparatus for marking and vision inspection of the semiconductor device in accordance with the first embodiment of the present invention has a technical feature in that the apparatus performs one of the marking process and the vision inspection process and then perform the other process thereafter. And as shown in Fig. 1, the apparatus includes marking unit 100, vision inspection unit 200 and sorting unit 300.
[29] The marking unit 100 performing marking process for forming a mark 2 on a surface of the semiconductor device, may be embodied in various constructions. The marking unit 100 may be comprised of a pair of guide rails 110 guiding a tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 110; a driving unit (not shown) for moving the tray 3 along the guide rails 110; and a mark unit 120 for marking a mark 2 on a surface of the semiconductor 1 loaded in the tray 3, the mark unit 120 being installed at the moving path of the tray 3. Herein the tray 3 moves along the guide rails 110 in various directions, or as shown in Fig. 1, may move in -y direction referring to the drawing sheet.
[30] The tray 3 loaded with the semiconductor devices 1 to be marked continuously provided to the guide rails 110 by a worker or a tray supplying unit (not shown).
[31] The mark unit 120 is a device for forming a mark 2 such as company logo, serial number, identification sign, etc. on a surface of the molding materials of the semiconductor device 1. The mark unit 120 using laser as the mark unit has been widely known, so the detailed explanation for the mark unit is omitted.
[32] Meanwhile, on a surface of the semiconductor device 1 may be formed with a reference number 4 i.e. Lot Number, for recognizing the semiconductor device 1 itself, and a number recognition device 130 for recognizing the reference number 4 of the semiconductor device 1 may be provided with at the moving path of the tray 3.
[33] Herein as shown in Fig. 1, the number recognition device 130 may be installed before the mark unit 120 with the reference of the movement of the tray 3 in order to recognize the semiconductor device 1 before the marking process for forming a mark 2.
[34] In addition, a foreign body removing unit 140 for removing foreign body from the surface of the semiconductor device 1 by using air injection, brush or etc. may be further provided with at the moving path of the tray 3 so that the mark unit 120 may easily form the mark 2 on the surface of the semiconductor device 1. Herein the foreign body removing unit 140 is installed before the mark unit 120 with the reference of the movement of the tray 3.
[35] In addition, a marking examining unit such as a camera for examining a state of the mark 2 (whether the mark 2 is properly formed) formed on a surface of the semiconductor device 1 after the mark 2 is formed may be further provided with at the moving path of the tray 3. Herein the marking examining unit is installed behind the mark unit 120 with the reference of the movement of the tray 3.
[36] In addition, an additional foreign body removing unit 140 may be provided with behind the mark unit 120 so that the vision inspection unit 200 may easily examine the external appearance of a semiconductor device 1.
[37] The one or more vision inspection unit 200 together with the marking unit 100, are a device which performs the vision inspection process for examining the external appearance of a semiconductor device 1, and may be embodied in various constructions.
[38] The vision inspection unit 200 may be comprised of one or more loading unit 210, the loading unit 210 having a pair of guide rails 211 guiding the tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 211, a driving unit (not shown) for moving the tray 3 along the guide rails 211; an inspection unit 220 for examining the external appearance of the transferred semiconductor device 1 loaded in the tray 3, the inspection unit 220 being installed at a side of the guide rails 211; and a device transferring unit 230 for transferring the semiconductor device 3 between the tray 3 moving along the guide rails 211 of the loading unit 210 and the inspection unit 220.
[39] The loading unit 220 transfers the tray 3 loading the semiconductor devices 1 finishing the marking process in the marking unit 100 to the position where the inspection unit 220 performs the vision inspection process. Herein the tray 3 may move in +y direction, or the transferring direction to the inspection unit 220 for the vision insepction process may be in ±x direction (vision inspection line) referring to the drawing sheet.
[40] And considering that the marking process is shorter than the vision inspection process, it is preferable that the loading unit 220 is comprised of in plural, or in a pair as one example, and the inspection unit 220 may be installed between the pair of the loading units 210.
[41] The inspection unit 220 is a device for performing the vision inspection process, and may be embodied in various constrictions. And the inspection unit 220 may include a device such as camera, scanner, etc. for acquiring image of the semiconductor device 1, particularly image of the bottom of the semiconductor device 1, and performs the vision inspection process in which defect of leads, size of ball grid, damage, scratch, marking defect (a mark is not formed), etc. is examined according to an image of the semiconductor device 1. Herein since the upper surface of the semiconductor device 1 should be examined in case of marking defect, it is preferable that the marking defect is examined by a separate device.
[42] In addition, the inspection result of the inspection unit 220 is transferred to and saved in a control unit (not shown) in order to sort the semiconductor devices 1 according to the inspection result.
[43] The device transferring unit 230 is a device which moves between the tray 3 and the inspection unit 220 and transfers the semiconductor devices 1 from the tray 3 moving along the guide rails 211 of the loading unit 210 to the inspection unit 220 and transfers the semiconductor devices 1 which finishes the vision inspection process from the inspection unit 220 to the tray 3. The device transferring unit 230 may be comprised of one or more transfer tools having an end absorbing the semiconductor device 1 by forming vacuum pressure so as to transfer the semiconductor device 1, which move between the loading unit 210 and the inspection unit 220 and upward- and-downward. The number of the transfer tools may be determined as 1, 2, 4, 8, etc. in accordance with the number of the semiconductor devices 1 to be transferred.
[44] Herein a pair of the device transferring units 230 may be installed in case that a pair of the loading units 210 are installed. In addition, the device transferring unit 230 may directly transfer the semiconductor device 1 to the sorting unit according to the inspection result of the inspection unit 220.
[45] Meanwhile, a foreign body removing unit 240 for removing foreign body from the surface of the semiconductor device 1 by using air injection, brush or etc. may be further provided with at the loading unit 210 so that the inspection unit 220 may easily perform the vision inspection process.
[46] The sorting unit 300 sorts and loads the semiconductor devices 1 according to the inspection result of the inspection unit 200, and may be embodied in various constructions and various layouts according to the sorting method.
[47] And as shown in Fig. 1, the sorting unit 300 may be comprised of a plurality of sorting tray units 310 and one or more device transferring unit 340 for transferring the semiconductor devices 1 between the plurality of the sorting tray units 310 in order to sort and load the semiconductor devices 1 in accordance with the inspection result such as Good, Bad Leads, Abnormal Size of Ball Grid, Damaged, etc.
[48] The number of the sorting tray units 310 may be determined by the number of the sorting classes, and may be comprised of a pair of guide rails 311 guiding the tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 311, and a driving unit (not shown) for moving the tray 3 along the guide rails 311. Herein the trays 3 of the sorting tray units 310 may move along the guide rails 311 in -y direction referring to the drawing sheet, and the device transferring unit 340 for sorting the semiconductor device 1 may move ±x direction (sorting line) referring to the drawing sheet.
[49] Meanwhile, the semiconductor devices 1 may be transferred directly to the tray 3 of the sorting tray units 310 in accordance with the inspection result by the device transferring unit (in ±x direction (sorting line) referring to the drawing sheet), or the tray 3 loading the semiconductor devices 1 may be transferred to the sorting tray units 310 from the vision inspection unit 200.
[50] Th sorting unit 300 may be comprised of one or more sorting tray units 310 (first sorting tray unit) to which a tray 3 is transferred from the vision inspection unit 200, and one or more sorting tray units 310 (second sorting tray unit) respectively having the sorting class.
[51] Herein the semiconductor devices 1 loaded in the tray 3 which is transferred from the vision inspection unit 200 may be transferred to the tray 3 of the sorting tray units 310 respectively having the sorting class in accordance with the inspection result of the vision inspection unit 200 by the device transferring unit 340.
[52] Herein a pair of the sorting tray units 310 to which the tray 3 is transferred from each loading unit 210 of the vision inspection unit 200 may be provided with in case that a pair of the loading units 210 of the vision inspection unit 200 are provided, and the semiconductor devices 1 loaded in the tray 3 of the sorting tray units 310 to which the tray 3 is transferred from each loading unit 210 is transferred to the tray 3 of the sorting tray units 310 respectively having the sorting class.
[53] Herein one of the pair of the sorting tray units 310 to which the tray 3 is transferred from each loading unit 210 may be a sorting tray unit having Good Class, and the tray 3 in which the good semiconductor devices 1 are remained, and the other sorting tray unit 310 may be a sorting tray unit having a different sorting class, or the semiconductor devices 1 in the tray 3 of other sorting tray unit 310 may be removed.
[54] The sorting unit 300 may be comprised of sorting tray units 310 respectively having sorting class, and the the semiconductor devices 1 loaded in at least a portion of the sorting tray units 310 (first sorting tray unit) after the tray 3 is transferred from the vision inspection unit 200, may be transferred to the tray 3 of other sorting tray units 310 (second sorting tray unit) respectively having the sorting class.
[55] Meanwhile, the sorting unit 300 may be further provided with an empty tray unit
380 for providing at least a part of the sorting tray units 310 with empty tray 3, and the empty tray unit 380 may be comprised of a pair of guide rails 311 guiding the tray 3 which is loaded with a plurality of semiconductor devices 1 and is movable along the guide rails 311, and a driving unit (not shown) for moving the tray 3 along the guide rails 311.
[56] The device transferring unit 340 is a device which transfers the semiconductor devices 1 loaded in the tray 3 of each sorting tray unit 310, and may be comprised of one or more transfer tools having an end absorbing the semiconductor device 1 by forming vacuum pressure so as to transfer the semiconductor device 1 and being movable upward-and-downward. The number of the transfer tools is determined by the corresponding transfer number (1, 2, 8, etc) of the semiconductor devices 1 to be transferred.
[57] In addition, a marking examining unit such as a camera for examining a state of the mark 2 formed on a surface of the semiconductor device 1 may be further provided with at the device transferring unit 340.
[58] The apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention may be further provided with a buffer tray unit to which a tray 3 is temporarily transferred from the vision inspection unit 200 or a tray loading unit (not shown) in which trays are loaded.
[59] Meanwhile, since the order of the marking process and the vision inspection process may be changed, the layout and constructions of the marking unit 100 and the vision inspection unit 200 may be variously embodied.
[60] Hereinafter the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention will be explained. Herein, the same and the similar constructions as in the first embodiment will be omitted for convenience's sake.
[61] That is to say, in the apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention, the semiconductor devices 1 examined in the vision inspection unit 200 are transferred to the marking unit 100 differing the first embodiment in which the semiconductor devices 1 formed with a mark 2 in the marking unit 100 are transferred to the vision inspection unit 200.
[62] The apparatus for marking and vision inspection of the semiconductor device in accordance with the present invention may have the same layout as in Fig. 1, or the positions of the marking unit 100 and the vision inspection unit 200 may be changed with each other.
[63] The semiconductor devices 1 to be processed are transferred to the vision inspection unit 200 so as to perform the vision inspection process beforehand, and then the semiconductor devices 1 examined in the vision inspection unit 200 are transferred to the marking unit 100.
[64] In addition, as in Fig. 2, the marking unit 100 without guide rails 110 may be used, the marking process may be performed when the tray 3 loading the semiconductor devices 1, and the tray 3 which go through the marking process, may be transferred to the sorting unit 300.

Claims

Claims
[1] An apparatus for marking and vision inspection of the semiconductor device, comprising: a marking unit for performing a marking process in which a mark is formed on a surface of a semiconductor device; one or more vision inspection units for performing a vision inspection process in which an external appearance of a semiconductor device is examined, the vision inspection unit being installed together with the marking unit; and a sorting unit for sorting and loading semiconductor devices in accordance with inspection result for the external appearance of the vision inspection unit.
[2] The apparatus of claim 1, wherein the semiconductor devices are transferred by being loaded in a tray.
[3] The apparatus of claim 1, wherein the marking unit comprises: a pair of guide rails guiding a tray which is loaded with a plurality of semiconductor devices and is movable along the guide rails; a driving unit for moving the tray along the guide rails; and a mark unit for marking a mark on a surface of the semiconductor loaded in the tray.
[4] The apparatus of claim 1, wherein the vision inspection unit comprises: one or more loading unit, the loading unit having a pair of guide rails guiding a tray which is loaded with a plurality of semiconductor devices and is movable along the guide rails, and a driving unit for moving the tray along the guide rails; and an inspection unit for examining an external appearance of the semiconductor device loaded in the tray, the inspection unit being installed at a side of the guide rails.
[5] The apparatus of claim 4, wherein the loading unit is comprised of in a pair, and the inspection unit is installed between the pair of the loading units.
[6] The apparatus of claim 4, wherein the loading unit further includes a foreign body removing unit for removing foreign body from the semiconductor device before the inspection unit examines an external appearance.
[7] The apparatus of claim 1, wherein the semiconductor device formed with a mark by the marking unit is transferred to the vision inspection unit.
[8] The apparatus of claim 1, wherein the semiconductor device examined by the vision inspection unit is transferred to the marking unit.
[9] The apparatus of claim 1, wherein the sorting unit comprises a plurality of sorting trays respectively having the sorting class in accordance with inspection result of the vision inspection unit. [10] The apparatus of claim 1, wherein the sorting unit comprises one or more first sorting tray units to which a tray is transferred from the vision inspection unit, and one or more second sorting tray units respectively having the sorting class. [11] The apparatus of claim 10, wherein the first sorting tray unit is comprised of in a pair. [12] The apparatus of claim 10, wherein the sorting unit comprises a device tra nsferring unit which transfers the semiconductor devices between the first sorting tray unit and the second sorting tray unit.
PCT/KR2007/000275 2006-06-28 2007-01-17 Apparatus for marking and vision inspection of the semiconductor device WO2008001997A1 (en)

Applications Claiming Priority (2)

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KR10-2006-0058851 2006-06-28
KR20060058851 2006-06-28

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KR101155635B1 (en) * 2011-06-29 2012-06-13 (주) 에스엔에프 Complex device having the function for testing, marking and removing of BM film

Citations (3)

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JPS61193464A (en) * 1985-02-21 1986-08-27 New Japan Radio Co Ltd Marking method in inspection of semiconductor device
US5226361A (en) * 1992-05-19 1993-07-13 Micron Technology, Inc. Integrated circuit marking and inspecting system
KR20020004313A (en) * 2000-07-04 2002-01-16 이재영 System and method for inspecting marks on semiconductor device using optical character recognition

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS61193464A (en) * 1985-02-21 1986-08-27 New Japan Radio Co Ltd Marking method in inspection of semiconductor device
US5226361A (en) * 1992-05-19 1993-07-13 Micron Technology, Inc. Integrated circuit marking and inspecting system
KR20020004313A (en) * 2000-07-04 2002-01-16 이재영 System and method for inspecting marks on semiconductor device using optical character recognition

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