WO2008001462A1 - structure de montage pour carte à circuit imprimé - Google Patents

structure de montage pour carte à circuit imprimé Download PDF

Info

Publication number
WO2008001462A1
WO2008001462A1 PCT/JP2006/313108 JP2006313108W WO2008001462A1 WO 2008001462 A1 WO2008001462 A1 WO 2008001462A1 JP 2006313108 W JP2006313108 W JP 2006313108W WO 2008001462 A1 WO2008001462 A1 WO 2008001462A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
mounting structure
fixing hole
printed
Prior art date
Application number
PCT/JP2006/313108
Other languages
English (en)
Japanese (ja)
Inventor
Yoshikazu Hirano
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to TW095123877A priority Critical patent/TW200803636A/zh
Priority to PCT/JP2006/313108 priority patent/WO2008001462A1/fr
Publication of WO2008001462A1 publication Critical patent/WO2008001462A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the present invention absorbs stress generated between a printed circuit board and a housing in a printed circuit board mounting structure, in particular, a structure in which the printed circuit board is fixed to a structure such as a housing with screws or the like.
  • the present invention also relates to a printed circuit board mounting structure that can be relaxed.
  • a printed circuit board is usually fixed by reflow soldering or the like when various electronic components are mounted on the printed circuit board.
  • soldering the temperature reaches the temperature at which the solder melts, so there is a difference in the coefficient of thermal expansion between the components and the printed circuit board itself, or between the resin and metal parts of the printed circuit board. Thermal stress is applied to the entire printed circuit board. As a result, the completed component mounting printed circuit board is often warped.
  • mechanical stress is applied to the soldered portion of the printed circuit board in order to correct the warpage of the printed circuit board. May be applied and the solder joint may be destroyed. This problem is particularly important for printed circuit boards used for portable terminals and the like that must be lightweight and downsized because the solder joints are fine.
  • FIG. 1 and FIG. 2 show a conventional general printed circuit board mounting structure.
  • Fig. 1 (a) is a plan view of a printed circuit board on which electronic components are mounted
  • Fig. 1 (b) is a side view thereof.
  • the printed circuit board 1 is made of a resin such as glass epoxy.
  • the necessary electronic component 2 is fixedly mounted on the printed circuit board 1 with the solder 3 as described above, but the printed circuit board 1 on which the electronic component 2 is mounted is warped as shown in Fig. 1 (b). There are many cases.
  • Japanese Utility Model Laid-Open No. 5-41169 is a prior art for preventing the above-described stress from occurring when a printed circuit board is fixed to a fixed structure such as a housing with screws.
  • the purpose of this is to control the stress generated in the electronic components mounted on the board body, to prevent deterioration and destruction of the characteristics of the electronic parts, and to improve the reliability at low cost. If there is a slit extending around the screw hole from the top of the board, and the entire board is warped or the mounting part is misaligned, stresses due to deformation may occur in the part of the board body where the electronic components are mounted. It is preventing.
  • the stress due to deformation of the printed circuit board is absorbed by the slit.
  • the slit extends from the peripheral edge of the circuit board body to the periphery of the screwing hole, and is a screw hole for fixing the printed circuit board. If the position is near the peripheral edge of the printed circuit board, there is no particular problem. However, if it is inside the peripheral edge of the printed circuit board, such a slit cannot be provided, or the peripheral edge of the circuit board is not provided. There is a problem in the layout design of the printed circuit board because a long slit extending from the inside to the inside must be provided.
  • Patent Document 1 Japanese Patent Laid-Open No. 5-041169
  • the printed circuit board on which components are mounted is fixed to a fixed structure such as a housing by screwing or the like.
  • a fixed structure such as a housing by screwing or the like.
  • solder joints of soldered parts on printed circuit boards It is an object of the present invention to provide a printed circuit board mounting structure that can relieve mechanical stress and that can effectively use the space of the printed circuit board and is suitable for high-density mounting.
  • the stress associated with the fixing is absorbed in the vicinity of the periphery of the fixing hole for fixing the printed circuit board to the fixed structure.
  • a printed circuit board mounting structure provided with a buffer portion.
  • the buffer portion is characterized by comprising one or both of a slit penetrating the printed circuit board and a non-penetrating groove.
  • the buffer portion is well-known by mechanical processing such as cutting of the printed circuit board iJ, drill, or chemical processing such as etching. Can be easily formed by the method
  • the buffer portion includes a slit, and a plurality of the slits are provided in an arc shape on a circle concentric with the fixing hole.
  • the buffer portion includes grooves provided on both sides or one side of the printed circuit board, and the grooves are provided along a circle concentric with the fixing hole. In this case, a plurality of the grooves are provided in an arc shape. By making the buffer portion into a plurality of arc-shaped grooves, the peripheral region in the vicinity of the fixing hole can be made a uniform stress absorbing portion.
  • the printed circuit board has one or more glass epoxy resins on both sides of the polyimide resin layer.
  • the buffer portion may be a non-penetrating groove provided along a circle concentric with the fixing hole on one or both surfaces of the printed circuit board, and one or more provided in a part of the groove. It consists of a plurality of through slits. As described above, by configuring the buffer portion by combining the non-penetrating groove and the penetrating slit, the peripheral region in the vicinity of the fixing hole can be made a uniform and flexible stress absorbing portion.
  • FIG. 1 shows a state before mounting of a conventional general printed circuit board mounting structure, where (a) is a plan view and (b) is a side view.
  • FIG. 2 is a side view showing a state after mounting of the printed circuit board mounting structure of the conventional example.
  • FIG. 3 is a plan view showing a first embodiment of a printed circuit board mounting structure according to the present invention.
  • FIG. 4 shows a second embodiment of the printed circuit board mounting structure of the present invention, in which (a) is a plan view and (b) is an A_A cross-sectional view of (a).
  • FIG. 5 shows a third embodiment of the printed circuit board mounting structure of the present invention, in which (a) is a plan view.
  • (B) is a BB sectional view of (a).
  • FIG. 6 is an enlarged sectional view of a portion indicated by C in FIG. 5 (b).
  • FIGS. 3 to 5 show the embodiments of the printed circuit board mounting structure of the present invention.
  • the printed circuit board 10 is made of a resin such as glass epoxy.
  • the necessary electronic components 12 are fixedly mounted on the printed circuit board 1 with solder (not shown) as described above.
  • the printed circuit board 10 is provided with a fixing hole 14 for fixing the printed circuit board 10 to a fixed structure (not shown) such as a housing.
  • a plurality of slits 20 penetrating the printed circuit board 10 are provided as buffer portions near the periphery of the fixing hole 14 of the printed circuit board 10.
  • the through slits 20 are formed as arc-shaped slits that are concentric with the fixing hole 14 and are arranged at three equal intervals along a circumference in the vicinity of the circumference.
  • these Three arcuate slits 20 serve as buffer portions, and can absorb mechanical stress accompanying the warping of the printed circuit board 10.
  • the buffer part By making the buffer part a plurality of slits, the surrounding area in the vicinity of the fixing hole can be made a uniform stress absorbing portion.
  • FIG. 4 (a) is a plan view showing a second embodiment of the printed circuit board mounting structure of the present invention
  • FIG. 4 (b) is a cross-sectional view taken along A_A in FIG. 4 (a).
  • a groove 22 that does not penetrate the printed circuit board 10 is provided as a buffering part near the periphery of the fixing hole 14 on the mounting surface side of the electronic component 12 of the printed circuit board 10.
  • These non-through grooves 22 are concentric with the fixing hole 14 and are arranged in an arc shape arranged at three equal intervals along the circumference in the vicinity of the circumference.
  • the printed circuit board 1 is fixed to a fixed structure such as a housing by screwing using the fixing holes 14. However, a uniform buffering action can be produced around the fixing hole 14.
  • FIG. 5 (a) is a plan view showing a third embodiment of the printed circuit board mounting structure of the present invention
  • FIG. 5 (b) is a sectional view taken along line BB in FIG. 5 (a).
  • FIG. 6 is an enlarged cross-sectional view of a portion indicated by C in FIG. 5 (b).
  • the printed circuit board 10 is configured as a multilayer printed circuit board in which a plurality of glass epoxy resin layers 10b are laminated on both surfaces of the middle polyimide resin layer 10a.
  • the A conductive layer 10c made of a copper pattern is formed between both surfaces of the middle polyimide resin layer 10a and the upper surface of each glass epoxy resin layer 10b, that is, between the layers.
  • the non-penetrating grooves 24 are formed on both surfaces of the printed circuit board 10 and concentrically with the fixing hole 14 and along the circumference in the vicinity thereof.
  • the glass epoxy resin layer 10b is removed, leaving only the middle polyimide resin layer 10a.
  • the flexible polyimide resin layer 10a which is the middle layer of the printed circuit board 10 is exposed to the non-penetrating groove 24, and this portion effectively acts as a buffer layer for absorbing stress.
  • non-penetrating groove 24 in the third embodiment can be formed during the process of manufacturing the multilayer rigid flexible printed circuit board 10 itself.
  • the buffer part for absorbing the stress accompanying the fixing is provided near the periphery of the fixing hole for fixing the printed board to the fixed structure. Since it is installed, it can be mounted on a printed circuit board, avoiding damage and damage to the solder joints of the soldered parts, and this buffer is only near the periphery of the fixing hole. The main space of the board is not affected, and the entire component mounting area of the printed circuit board can be used effectively, resulting in a structure suitable for high-density mounting.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de montage pour carte à circuit imprimé caractérisée en ce que, lorsque la carte à circuit imprimé sur laquelle des composants sont montés est fixée à une structure fixe comme un logement, la contrainte mécanique dans les joints de brasage de composants brasés sur le substrat imprimé est limitée et l'espace de la carte à circuit imprimé peut être utilisé de manière efficace pour adapter la carte à un châssis-support de densité élevée. La structure de montage possède des sections d'amortissement (20, 22, 24) au voisinage de trous de fixation (14) permettant de fixer la carte à circuit imprimé (10) à la structure fixe. Les sections d'amortissement sont en forme de fentes ou de rainures et absorbent la contrainte provoquée par la fixation.
PCT/JP2006/313108 2006-06-30 2006-06-30 structure de montage pour carte à circuit imprimé WO2008001462A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095123877A TW200803636A (en) 2006-06-30 2006-06-30 Mound structure of printed board
PCT/JP2006/313108 WO2008001462A1 (fr) 2006-06-30 2006-06-30 structure de montage pour carte à circuit imprimé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/313108 WO2008001462A1 (fr) 2006-06-30 2006-06-30 structure de montage pour carte à circuit imprimé

Publications (1)

Publication Number Publication Date
WO2008001462A1 true WO2008001462A1 (fr) 2008-01-03

Family

ID=38845237

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/313108 WO2008001462A1 (fr) 2006-06-30 2006-06-30 structure de montage pour carte à circuit imprimé

Country Status (2)

Country Link
TW (1) TW200803636A (fr)
WO (1) WO2008001462A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510147B (zh) * 2012-05-02 2015-11-21 Taidoc Technology Corp 電子裝置與印刷電路板的形成方法
CN104735911B (zh) * 2015-01-01 2017-11-10 深圳市兴达线路板有限公司 一种线路板板孔的正位方法
TWI743182B (zh) * 2017-08-25 2021-10-21 易鼎股份有限公司 軟性電路板適應性接觸壓力的接觸結構

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53115251U (fr) * 1977-02-23 1978-09-13
JPH08172247A (ja) * 1994-12-16 1996-07-02 Kansei Corp 回路基板
JP2004266238A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 複合配線板、基板素片
JP2005243968A (ja) * 2004-02-26 2005-09-08 Kyocera Corp フレキシブルリジッド基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53115251U (fr) * 1977-02-23 1978-09-13
JPH08172247A (ja) * 1994-12-16 1996-07-02 Kansei Corp 回路基板
JP2004266238A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 複合配線板、基板素片
JP2005243968A (ja) * 2004-02-26 2005-09-08 Kyocera Corp フレキシブルリジッド基板

Also Published As

Publication number Publication date
TW200803636A (en) 2008-01-01

Similar Documents

Publication Publication Date Title
US7937828B2 (en) Method of manufacturing wiring board
KR101719822B1 (ko) 솔더링 연결핀, 상기 솔더링 연결핀을 이용한 반도체 패키지 기판 및 반도체칩의 실장방법
JP2007207781A (ja) 多層構造のプリント配線基板およびプリント配線基板の製造方法
JP2007324207A (ja) プリント配線板、プリント配線板の屈曲加工方法および電子機器
JP2009277784A (ja) 部品内蔵プリント配線板、同配線板の製造方法および電子機器
JP2006013455A (ja) 多層プリント配線板及び多層プリント回路板
US7234965B2 (en) Wiring structure using flexible printed circuit board and optical module using the same
JP2007214230A (ja) プリント配線板
WO2008001462A1 (fr) structure de montage pour carte à circuit imprimé
JPH11289167A (ja) 多層配線板
JP2006332247A (ja) 電源装置および電気装置の放熱構造
JP2009231635A (ja) 配線基板及びその製造方法、及び半導体装置及びその製造方法
JP2010118581A (ja) 電子部品内蔵基板
JP2015126182A (ja) プリント配線板
JP2002344092A (ja) プリント基板
JP2007250609A (ja) 配線板
JP2015026835A (ja) 印刷回路基板
JP2012156195A (ja) 電子装置
JP3456145B2 (ja) 実装基板
JP2008047605A (ja) プリント基板
JPH098444A (ja) 電子回路装置
JP2001168503A (ja) プリント配線板
JP2004014606A (ja) 回路基板のランド及びその形成法
JP2007273583A (ja) 部品内蔵プリント配線板、部品内蔵プリント配線板の製造方法および電子機器
JP2003332754A (ja) 多層プリント配線板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06767716

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06767716

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP