WO2008000551A3 - Dissipateur de chaleur - Google Patents
Dissipateur de chaleur Download PDFInfo
- Publication number
- WO2008000551A3 WO2008000551A3 PCT/EP2007/054881 EP2007054881W WO2008000551A3 WO 2008000551 A3 WO2008000551 A3 WO 2008000551A3 EP 2007054881 W EP2007054881 W EP 2007054881W WO 2008000551 A3 WO2008000551 A3 WO 2008000551A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- cooling member
- conducting
- recess
- electronic subassembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Dissipateur de chaleur (30) pour la dissipation de chaleur d'un composant électronique (12, 28), comprenant un corps de base thermoconducteur (14) qui présente un évidement (18), et un agent thermoconducteur (16) qui est placé dans un évidement (18) et est en contact thermoconducteur avec le corps de base (14), l'agent thermoconducteur (16) étant conçu et disposé de telle façon que le composant électronique (12, 28) pénètre au moins partiellement dans l'évidement (18) lorsque le composant électronique est couplé, comme prévu, au dissipateur de chaleur (30) et est en contact thermoconducteur avec l'agent thermoconducteur (16).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006029463 | 2006-06-27 | ||
DE102006029463.7 | 2006-06-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008000551A2 WO2008000551A2 (fr) | 2008-01-03 |
WO2008000551A3 true WO2008000551A3 (fr) | 2008-04-17 |
Family
ID=38434061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/054881 WO2008000551A2 (fr) | 2006-06-27 | 2007-05-21 | Dissipateur de chaleur |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008000551A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011006632A1 (de) | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | Elektronikmodul |
JP2015018971A (ja) * | 2013-07-11 | 2015-01-29 | 富士通株式会社 | 放熱板、及び海中機器 |
DE102017200556A1 (de) * | 2017-01-16 | 2018-07-19 | Zf Friedrichshafen Ag | Elektromechanisch verstellbarer Wankstabilisator sowie Verfahren zu dessen Herstellung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6011696A (en) * | 1998-05-28 | 2000-01-04 | Intel Corporation | Cartridge and an enclosure for a semiconductor package |
WO2003034489A1 (fr) * | 2001-10-18 | 2003-04-24 | Intel Corporation | Materiau d'interface thermique et ensemble electronique possedant un tel materiau d'interface thermique |
US20030227959A1 (en) * | 2002-06-11 | 2003-12-11 | Charles Balian | Thermal interface material with low melting alloy |
US20050224220A1 (en) * | 2003-03-11 | 2005-10-13 | Jun Li | Nanoengineered thermal materials based on carbon nanotube array composites |
-
2007
- 2007-05-21 WO PCT/EP2007/054881 patent/WO2008000551A2/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6011696A (en) * | 1998-05-28 | 2000-01-04 | Intel Corporation | Cartridge and an enclosure for a semiconductor package |
WO2003034489A1 (fr) * | 2001-10-18 | 2003-04-24 | Intel Corporation | Materiau d'interface thermique et ensemble electronique possedant un tel materiau d'interface thermique |
US20030227959A1 (en) * | 2002-06-11 | 2003-12-11 | Charles Balian | Thermal interface material with low melting alloy |
US20050224220A1 (en) * | 2003-03-11 | 2005-10-13 | Jun Li | Nanoengineered thermal materials based on carbon nanotube array composites |
Also Published As
Publication number | Publication date |
---|---|
WO2008000551A2 (fr) | 2008-01-03 |
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