WO2008000551A3 - Cooling member - Google Patents
Cooling member Download PDFInfo
- Publication number
- WO2008000551A3 WO2008000551A3 PCT/EP2007/054881 EP2007054881W WO2008000551A3 WO 2008000551 A3 WO2008000551 A3 WO 2008000551A3 EP 2007054881 W EP2007054881 W EP 2007054881W WO 2008000551 A3 WO2008000551 A3 WO 2008000551A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- cooling member
- conducting
- recess
- electronic subassembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a cooling member (30) for dissipating heat from an electronic subassembly (12, 28). Said cooling member (30) comprises a heat-conducting base (14) that is provided with a recess (18), and a heat-conducting medium (16) which is disposed in the recess (18) and is in heat-conducting contact with the base (14). The heat-conducting medium (16) is configured and arranged such that the electronic subassembly (12, 28) protrudes at least in part into the recess (18) and is in heat-conducting contact with the heat-conducting medium (16) when the electronic subassembly (12, 28) is properly coupled to the cooling member (30).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006029463 | 2006-06-27 | ||
DE102006029463.7 | 2006-06-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008000551A2 WO2008000551A2 (en) | 2008-01-03 |
WO2008000551A3 true WO2008000551A3 (en) | 2008-04-17 |
Family
ID=38434061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/054881 WO2008000551A2 (en) | 2006-06-27 | 2007-05-21 | Cooling member |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008000551A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011006632A1 (en) | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | electronic module |
JP2015018971A (en) * | 2013-07-11 | 2015-01-29 | 富士通株式会社 | Heat radiation plate, and submarine apparatus |
DE102017200556A1 (en) * | 2017-01-16 | 2018-07-19 | Zf Friedrichshafen Ag | Electromechanically adjustable roll stabilizer and method for its production |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6011696A (en) * | 1998-05-28 | 2000-01-04 | Intel Corporation | Cartridge and an enclosure for a semiconductor package |
WO2003034489A1 (en) * | 2001-10-18 | 2003-04-24 | Intel Corporation | Thermal interface material and electronic assembly having such a thermal interface material |
US20030227959A1 (en) * | 2002-06-11 | 2003-12-11 | Charles Balian | Thermal interface material with low melting alloy |
US20050224220A1 (en) * | 2003-03-11 | 2005-10-13 | Jun Li | Nanoengineered thermal materials based on carbon nanotube array composites |
-
2007
- 2007-05-21 WO PCT/EP2007/054881 patent/WO2008000551A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6011696A (en) * | 1998-05-28 | 2000-01-04 | Intel Corporation | Cartridge and an enclosure for a semiconductor package |
WO2003034489A1 (en) * | 2001-10-18 | 2003-04-24 | Intel Corporation | Thermal interface material and electronic assembly having such a thermal interface material |
US20030227959A1 (en) * | 2002-06-11 | 2003-12-11 | Charles Balian | Thermal interface material with low melting alloy |
US20050224220A1 (en) * | 2003-03-11 | 2005-10-13 | Jun Li | Nanoengineered thermal materials based on carbon nanotube array composites |
Also Published As
Publication number | Publication date |
---|---|
WO2008000551A2 (en) | 2008-01-03 |
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Legal Events
Date | Code | Title | Description |
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NENP | Non-entry into the national phase |
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NENP | Non-entry into the national phase |
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122 | Ep: pct application non-entry in european phase |
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