MXPA05006555A - Dispositivo de disipacion termica de aletas de persianas devanadas. - Google Patents

Dispositivo de disipacion termica de aletas de persianas devanadas.

Info

Publication number
MXPA05006555A
MXPA05006555A MXPA05006555A MXPA05006555A MXPA05006555A MX PA05006555 A MXPA05006555 A MX PA05006555A MX PA05006555 A MXPA05006555 A MX PA05006555A MX PA05006555 A MXPA05006555 A MX PA05006555A MX PA05006555 A MXPA05006555 A MX PA05006555A
Authority
MX
Mexico
Prior art keywords
heat sink
sink device
wound
fin heat
louvered fin
Prior art date
Application number
MXPA05006555A
Other languages
English (en)
Inventor
Donald Ernst
Original Assignee
Modine Mfg Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Modine Mfg Co filed Critical Modine Mfg Co
Publication of MXPA05006555A publication Critical patent/MXPA05006555A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Un dispositivo (10,60) de disipacion termica se proporciona para enfriar un componente (12) electronico que tiene una superficie (14) que rechaza el calor. Un ventilador (22) subyace a la superficie (14) para dirigir un flujo (24) de aire hacia la superficie (14), el ventilador tiene un eje (29) de rotacion. El dispositivo de disipacion termica incluye una aleta (26,64,66) devanada sobre un eje (40) central que se extiende en paralelo al eje (29) de rotacion. La aleta (26,64,66) incluye superficies de persianas que se extienden en paralelo al eje (40) central.
MXPA05006555A 2004-07-13 2005-06-17 Dispositivo de disipacion termica de aletas de persianas devanadas. MXPA05006555A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/889,702 US20060011324A1 (en) 2004-07-13 2004-07-13 Wound, louvered fin heat sink device

Publications (1)

Publication Number Publication Date
MXPA05006555A true MXPA05006555A (es) 2006-01-17

Family

ID=35598206

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05006555A MXPA05006555A (es) 2004-07-13 2005-06-17 Dispositivo de disipacion termica de aletas de persianas devanadas.

Country Status (4)

Country Link
US (1) US20060011324A1 (es)
CN (1) CN1722416A (es)
DE (1) DE102005031262B4 (es)
MX (1) MXPA05006555A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837139B2 (en) * 2007-09-29 2014-09-16 Biao Qin Flat heat pipe radiator and application thereof
US20100038056A1 (en) * 2008-08-15 2010-02-18 Ellsworth Joseph R High performance compact heat exchanger
EP2412597B1 (en) * 2009-03-24 2016-01-06 Sumitomo Precision Products Co., Ltd. Heat sink
US20120132400A1 (en) * 2009-08-07 2012-05-31 Furukawa-Sky Aluminum Corp. Heat Sink
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN102438425A (zh) * 2010-09-29 2012-05-02 华广光电股份有限公司 适用电子设备发热元件的挠折性散热条
DE102010060261B3 (de) 2010-10-29 2011-11-10 Institut für Luft- und Kältetechnik gemeinnützige Gesellschaft mbH CPU-Kühler
CN103256852B (zh) * 2012-02-20 2015-09-30 昆山新力精密五金有限公司 环形散热片组
US10115571B2 (en) 2014-06-04 2018-10-30 Applied Materials, Inc. Reagent delivery system freeze prevention heat exchanger
US11421945B1 (en) * 2020-06-25 2022-08-23 Softronics, Ltd. Heat dissipation system with cross-connected heatsink

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2419233A (en) * 1944-03-11 1947-04-22 Scovill Manufacturing Co Cooling unit
US2745895A (en) * 1951-06-09 1956-05-15 Ernest J Lideen Vacuum tube shield and heat radiator
US2680009A (en) * 1953-02-25 1954-06-01 Rca Corp Cooling unit
US2917286A (en) * 1956-11-13 1959-12-15 Siemens Edison Swan Ltd Electronic equipment
NL251457A (es) * 1959-05-18
US3185756A (en) * 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3187082A (en) * 1961-02-01 1965-06-01 Cool Fin Electronics Corp Heat dissipating electrical shield
US3260787A (en) * 1962-12-20 1966-07-12 Birtcher Corp Transistor heat dissipators
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
JP2873765B2 (ja) * 1992-04-13 1999-03-24 アクトロニクス 株式会社 ▲ｌ▼字形状ピン群を有する剣山型ヒートシンク
US5251101A (en) * 1992-11-05 1993-10-05 Liu Te Chang Dissipating structure for central processing unit chip
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
JPH06244328A (ja) * 1993-02-19 1994-09-02 Fujitsu Ltd ヒートシンク
IL108860A (en) * 1994-03-04 1998-10-30 Elisra Gan Ltd Heat radiating element
US5494098A (en) * 1994-06-17 1996-02-27 Wakefield Engineering, Inc. Fan driven heat sink
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
US6223813B1 (en) * 1996-01-11 2001-05-01 International Business Machines Corporation Ultra high-density, high-performance heat sink
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
JP3352362B2 (ja) * 1997-07-14 2002-12-03 三菱電機株式会社 放熱板
IT1294293B1 (it) * 1997-07-31 1999-03-24 Maurizio Checchetti Dissipatore di calore
US6018459A (en) * 1997-11-17 2000-01-25 Cray Research, Inc. Porous metal heat sink
JP3552559B2 (ja) * 1998-03-11 2004-08-11 株式会社デンソー 発熱体冷却装置
JP3240408B2 (ja) * 1998-04-09 2001-12-17 雅多有限公司 ヒートシンク
US6109341A (en) * 1998-04-30 2000-08-29 Sanyo Denki Co., Ltd. Electronic component cooling apparatus including elongated heat sink
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6157539A (en) * 1999-08-13 2000-12-05 Agilent Technologies Cooling apparatus for electronic devices
US6110306A (en) * 1999-11-18 2000-08-29 The United States Of America As Represented By The Secretary Of The Navy Complexed liquid fuel compositions
US6360816B1 (en) * 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6557626B1 (en) * 2000-01-11 2003-05-06 Molex Incorporated Heat sink retainer and Heat sink assembly using same
US6404637B2 (en) * 2000-02-14 2002-06-11 Special Product Company Concentrical slot telecommunications equipment enclosure
TW539393U (en) * 2000-03-15 2003-06-21 Tw 089204149
US6315033B1 (en) * 2000-05-22 2001-11-13 Jia Hao Li Heat dissipating conduit
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
US6336497B1 (en) * 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
US6390188B1 (en) * 2000-12-22 2002-05-21 Chung-Ping Chen CPU heat exchanger
US6826050B2 (en) * 2000-12-27 2004-11-30 Fujitsu Limited Heat sink and electronic device with heat sink
TW532738U (en) * 2001-03-27 2003-05-11 Foxconn Prec Components Co Ltd Heat sink assembly
US6336499B1 (en) * 2001-05-31 2002-01-08 Hong Tsai Liu CPU heat sink mounting structure
US6827130B2 (en) * 2001-06-05 2004-12-07 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US6386274B1 (en) * 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6386275B1 (en) * 2001-08-16 2002-05-14 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6830097B2 (en) * 2002-09-27 2004-12-14 Modine Manufacturing Company Combination tower and serpentine fin heat sink device

Also Published As

Publication number Publication date
DE102005031262B4 (de) 2007-06-06
US20060011324A1 (en) 2006-01-19
CN1722416A (zh) 2006-01-18
DE102005031262A1 (de) 2006-03-16

Similar Documents

Publication Publication Date Title
MXPA05006555A (es) Dispositivo de disipacion termica de aletas de persianas devanadas.
GB2404792B (en) Heat sink fan management based on performance requirements
TW200701871A (en) Heat dissipation device
WO2007008342A3 (en) Thermal solution for portable electronic devices
EP1638143A3 (en) Heat-transfer devices
EP1650799A3 (en) Heat radiating apparatus
WO2006036362A3 (en) Integral heat spreader
TW200702615A (en) Heat sink structure
ATE476864T1 (de) Kühlbaugruppe
MY169630A (en) Electrical component box and air conditioner having same
EP1357592A3 (en) Side flow cooling device
TW200638764A (en) Water-cooled projector
FR2856195B1 (fr) Dissipateur de chaleur pour la dissipation thermique sur des composantes electroniques
TW200618722A (en) Electronic device having heat-dissipating structure for socket
EP1253638A3 (en) A heat sink for electronic components
TW200710634A (en) Portable video adapting device
EP1715732A3 (en) Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection
CN109476009A (zh) 电动作业机
TW200721952A (en) Heat dissipation device
GB0412614D0 (en) Heat dissipating device with fins inclinedly connected to base
WO2008000551A3 (de) Kühlkörper
TW200725233A (en) Heat dissipation device
AU2003303824A1 (en) Heat dissipating arrangement for an electronic appliance
WO2002103505A3 (en) Cooling element and method for pc cpu and/or hot side of thermo electric cooler heat sink
TW200618724A (en) Electronic apparatus with heat-dissipation structure

Legal Events

Date Code Title Description
FA Abandonment or withdrawal