WO2007145237A1 - 放熱配線基板とその製造方法 - Google Patents
放熱配線基板とその製造方法 Download PDFInfo
- Publication number
- WO2007145237A1 WO2007145237A1 PCT/JP2007/061874 JP2007061874W WO2007145237A1 WO 2007145237 A1 WO2007145237 A1 WO 2007145237A1 JP 2007061874 W JP2007061874 W JP 2007061874W WO 2007145237 A1 WO2007145237 A1 WO 2007145237A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- groove
- filler
- metal wiring
- resin layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Definitions
- the present invention relates to a heat dissipation wiring board including a metal wiring board, a thermally conductive resin layer, and a heat dissipation board, on which a heat generating element such as an LED element is mounted, and a method for manufacturing the same.
- FIG. 20A is a perspective view of a conventional heat dissipation wiring board
- FIG. 20B is a cross-sectional view thereof.
- a conventional heat radiation wiring board 101 includes a metal wiring board 103, a filler-containing resin layer 104, and a heat radiation board 105.
- the metal wiring board 103 forms a circuit pattern and has a through groove 102.
- the filler-containing resin layer 104 is embedded with the metal wiring board 103 so that the upper surface of the metal wiring board 103 is exposed.
- the heat sink 105 is disposed on the lower surface of the filler-containing resin layer 104.
- the through groove 102 is formed by punching from the upper surface to the lower surface of the metal wiring board 103 by pressing, and has a linear shape substantially perpendicular to the surface of the metal wiring board 103.
- Such a heat dissipation wiring substrate 101 can release heat of the mounted electronic component to the heat dissipation plate 105 via the filler-containing resin layer 104.
- the through-groove 102 has a linear shape substantially perpendicular to the metal wiring board 103, and therefore the surface force of the metal wiring board 103 is also directed toward the inside of the through-groove 102, so This is because the flow rate suddenly narrows and the flow resistance becomes large or it becomes easy to clog.
- FIG. 21 is an enlarged schematic cross-sectional view of a conventional through hole.
- the through groove 114 for the circuit pattern is formed by pressing, and therefore the through groove 114 has a linear shape substantially perpendicular to the surface of the metal wiring board 115.
- the flow path of the filler-filled resin from the surface of the metal wiring board 115 toward the inside of the through groove 114 is rapidly narrowed, and the fluidity is getting worse.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-152148
- the heat dissipation wiring board includes a metal wiring board on which a circuit pattern is formed, a filler-containing resin layer in which a metal wiring board is embedded so that an upper surface of the metal wiring board is exposed, and a filler-containing resin layer.
- the gap that divides a part of the circuit pattern is formed by a through groove provided in the metal wiring board, and the through groove is a fine groove that opens on the upper surface of the metal wiring board. And an extended groove extending from the lower end of the fine groove toward the metal wiring board.
- the heat dissipation wiring board includes a metal wiring board on which a circuit pattern is formed, a first filler-containing resin layer embedded with a metal wiring board so that an upper surface of the metal wiring board is exposed, and a first The circuit pattern is formed by a through groove provided in the metal wiring board, and the through groove is a fine groove opened on the upper surface of the metal wiring board. The force at the lower end of the fine groove is also formed by an extended groove extending toward the metal wiring board, and the fine groove is filled with the second filler-containing resin layer.
- a method of manufacturing a heat dissipation wiring board includes a step of forming an extension groove on a lower surface of a metal wiring board, and forming a fine groove from the upper surface or the lower surface side of the metal wiring board so as to partially overlap the extension groove.
- a method for manufacturing a heat dissipation wiring board includes a step of forming an extension groove on a lower surface of a metal wiring board, and a step of filling a resin containing a first filler in the downward force extension groove of the metal wiring board.
- FIG. 1 is a perspective view of a heat dissipation wiring board.
- FIG. 2A is a top view of the heat dissipation wiring board.
- FIG. 2B is a cross-sectional view of the heat dissipation wiring board.
- FIG. 3 is an enlarged schematic cross-sectional view of the vicinity of the through groove.
- FIG. 4 is a diagram showing the relationship between the pulse width of laser and the output.
- FIG. 5 is a schematic cross-sectional view showing a state where an oxide film is formed on the surface of a fine groove.
- FIG. 6 is a schematic cross-sectional view for explaining a state in which a groove is formed by both sides of a metal wiring board to form a through groove.
- FIG. 7 is a schematic cross-sectional view showing the process of producing a heat dissipation wiring board.
- FIG. 8 is a schematic cross-sectional view for explaining a state of filling a fine groove.
- Fig. 9 is a schematic cross-sectional view for explaining the state after the heat-generating component is mounted.
- FIG. 10A is a diagram for explaining a heat dissipation wiring board partially having an independent wiring pattern.
- FIG. 10B is a sectional view taken along line 10B-10B.
- FIG. 11 is a schematic cross-sectional view for explaining how an extended groove is formed in a part of a metal wiring board using a mold.
- FIG. 12 is a schematic cross-sectional view for explaining a state in which a wiring board having an extended groove and a heat sink are integrated using a first filler-containing resin layer.
- FIG. 13 is a schematic cross-sectional view showing a state in which various members are laminated and integrated.
- FIG. 14 is a schematic cross-sectional view for explaining how fine grooves are formed.
- FIG. 15 is a schematic cross-sectional view for explaining a state in which a hole generated during the formation of a fine hole is filled with a second filler-containing resin.
- FIG. 16 is a schematic cross-sectional view for explaining a state in which an extension groove is formed in a metal wiring board.
- FIG. 17 is a schematic cross-sectional view for explaining how fine grooves are formed.
- Fig. 18 is a cross-sectional view illustrating a state in which the fine groove is filled with the second filler-containing resin layer.
- FIG. 19A is a cross-sectional view showing an example of a heat dissipation wiring board compatible with high-density mounting.
- FIG. 19B is a cross-sectional view showing an example of a heat dissipation wiring board compatible with high-density mounting.
- FIG. 20A is a perspective view of a conventional heat dissipation wiring board.
- FIG. 20B is a sectional view of the same.
- FIG. 21 is an enlarged cross-sectional view of a conventional through groove.
- the heat generating components are power semiconductors (power transistors, power FETs, CPUs, etc.), ultra-small transformers, or electronic components such as LEDs.
- the electronic components become smaller, they can contribute to the miniaturization of equipment.
- heat generation becomes an important issue as these electronic components become smaller or the mounting form (for example, package form) of the electronic parts becomes smaller (further, when mounted on a bare chip). Therefore, in Embodiment 1, an LED is selected as an example of a heat-generating component and will be described in detail.
- a substrate for LED mounting which is a heat dissipation wiring substrate 10 for a large current of 100 A (ampere).
- FIG. 1 shows an LED 11, a control IC 12, and a chip component 13 as examples of heat generating components mounted on the heat dissipation wiring board 10 of the first embodiment. Note that some electronic components and wiring patterns are omitted. In FIG. 1, the through groove 14 is hidden behind the LED 11 and cannot be seen.
- FIG. 2A is a top view of heat dissipation wiring board 10 in Embodiment 1
- FIG. 2B is a cross-sectional view thereof.
- the heat dissipation wiring board 10 includes a metal wiring board 15 in which through grooves 14 for circuit patterns are formed, and the metal wiring.
- a filler-containing resin layer 16 disposed on the lower surface of the wire board 15 and a heat radiating plate 17 disposed on the lower surface of the filler-containing resin layer 16 are provided.
- the metal wiring board 15 is connected to the outer frame 19 through the connection terminals 18.
- the metal wiring board 15 is embedded and integrated in the filler-containing resin layer 16 so that the upper surface thereof is exposed. Further, the through groove 14 for circuit pattern formed in the metal wiring board 15 is obtained by connecting the fine groove 20 and the extended groove 21 to each other vertically. In this way, the fine groove 20 and the extended groove 21 are connected inside the metal wiring board 15 to form the through groove 14.
- an opening on the surface side (or upper surface) of the metal wiring board 15 of the fine groove 20 is an opening 20a
- an opening on the extended groove 21 side of the fine groove 20 is a lower end 20b.
- the fine groove 20 and the extended groove 21 are connected to each other at the lower end portion 20b of the fine groove 20 to form one through groove 14.
- the maximum groove width of the extended groove 21 (corresponding to the groove width of the lower surface of the metal wiring board 15 of the extended groove 21 or the groove width of the filler-containing resin layer 16 side) is the lower end of the fine groove 20. It is desirable to make it larger than the groove width at 20b or opening 20a.
- FIG. 3 is a schematic cross-sectional view in which the vicinity of the through groove 14 is enlarged.
- Figure 3 also shows filler 22.
- the fine groove 20 is formed so that the groove width gradually increases from the opening 20a (exposed portion of the upper surface of the metal wiring board 15) to the lower end 20b (connection portion with the extended groove 21).
- the groove width of the lower end 20b is wider than the groove width of the opening 20a.
- the lower end 20b of the fine groove 20 does not have a clear interface with the extended groove 21, and is gently connected.
- the extended groove 21 has a structure in which the groove width gradually increases from the lower end portion 20b of the fine groove 20 toward the lower surface of the metal wiring board 15. By not forming a clear interface, filling of the filler-containing resin layer 16 becomes easy and the filling quality is easy to control.
- an oxide film (not shown) is provided on the inner walls of the fine groove 20 and the extended groove 21, and the oxide film of the fine groove 20 is larger than the thickness of the oxide film of the extended groove 21. Is also small. Further, the surface roughness of the fine groove 20 is formed to be lower (smooth) than the surface roughness of the extended groove 21. In this way, filling of the filler-containing resin layer 16 is facilitated.
- a base plate made of a copper alloy cable having a thickness of 0.3 mm is used as the metal wiring board 15.
- the composition of the metal wiring board 15 is mainly composed of copper (hereinafter also referred to as Cu), tin (hereinafter also referred to as Sn) is added in an amount of 0.1 to 0.1 wt% and Cu and Cu When combined with Sn, it exceeds 99.96wt%.
- Cu copper
- Sn tin
- the coefficient of linear expansion as the 8 X 10- 6 / ° C ⁇ 20 X 10- 6 Z ° C is used.
- the thickness of the metal wiring board 15 is preferably 0.2 mm or more and 0.8 mm or less.
- the main component is Cu is that it has excellent thermal conductivity and conductivity, and Sn is added because the soft temperature can be increased to about 400 ° C. When the softening point is high, high reliability can be maintained during subsequent component mounting (soldering) and repeated heating and cooling of the LED11 after mounting.
- Zr zirconium
- Ni nickel
- Si silicon
- Zn also referred to as “Zn”
- P phosphorus
- Fe iron
- Cr chromium
- Zr it is 0.0015 wt% or more and less than 0.15 wt%
- Ni is 0.1 wt% or more and less than 5 wt%
- Si is 0.01 wt% or more and 2 wt% or less
- Zn is 0.1 wt% or more and 5 wt% or more.
- P is 0.005 wt% or more and less than 0.1 wt%
- Fe is 0.1 wt% or more and 5 wt% or less
- Cr is preferably 0.05 wt% or more and lwt% or less.
- Wt% represents the weight percentage.
- these elements can be used alone or in combination with a plurality of kinds within the range of the content.
- the tensile strength of the copper alloy is preferably 600 NZmm 2 or less. This is because this level of tensile strength (softness) is suitable for workability. Also, if the Cu content is high, the conductivity is high, making it suitable for high current applications such as LED11.
- tough pitch copper may be selected as the metal wiring board 15. This is tough pitch copper, which has excellent electrical and thermal conductivity, spreadability and drawability. Because it is good.
- oxygen free copper may be selected as the metal wiring board 15. This is because oxygen-free copper has excellent electrical and thermal conductivity and good weldability.
- the upper surface of the metal wiring board 15, that is, the filler-containing resin layer 16 in FIG. 1 is also exposed, and the surface on which the LED 11, the control IC 12, and the chip component 13 are mounted is preliminarily soldered. (Not shown) is formed. This improves solderability and makes it easier to mount components. In addition, wiring wrinkles can be suppressed.
- a tin layer may be formed. However, it is preferable not to form a solder layer or a tin layer on the lower surface of the metal wiring board 15, that is, the surface embedded in the filler-containing resin layer 16. This is because the solder layer or tin layer softens in the heat process during soldering and the like, and the adhesion between the metal wiring board 15 and the filler-containing resin layer 16 may decrease.
- the depth of the fine groove 20 is 0.05 mm.
- the depth of the fine groove 20 is preferably 0.03 mm or more and 0.15 mm or less in consideration of workability.
- the depth of the fine groove 20 It is technically difficult to control the depth of the fine groove 20 to be less than 0.03 mm. Further, when the thickness of the fine groove 20 is 0.15 mm or more, it is technically difficult to narrow the width of the fine groove 20.
- the width of the fine groove 20 is the minimum when the opening 20a is 0.03 mm, and the lower end 20b is the maximum when 0.05 mm. It is. It is desirable that the minimum width of the fine groove 20 is 0.01 mm or more and 0.10 mm or less, and the maximum width of the fine groove 20 is 0.015 mm or more and 0.15 mm or less.
- the tapered shape forming the side surface of the fine groove 20 may be a straight line (for example, a mortar type), or may be a curved line (for example, a bell jar type or a bell type). Further, by adopting such a tapered cross-sectional shape, the pressure injection property of the filler-containing resin layer 16 is enhanced.
- the difference between the width of the opening 20a of the fine groove 20 and the groove width of the lower end 20b of the fine groove 20 is preferably 5 microns or more. If the difference in groove width is 5 microns or less, it may not function as a taper (including a bell shape) and may affect the filling properties of the filler-containing resin layer 16.
- the maximum width of the extension groove 21 is 0.3 mm.
- the top of this expansion groove 21 In general, it should be 0.1 mm or more and 0.5 mm or less.
- the maximum width of the extended groove 21 (for example, the lower surface side of the metal wiring board 15 in FIG. 3 or the opposite side of the fine groove 20) is larger than the groove width in the opening 20a of the fine groove 20.
- the size is larger than 0.05mm! /
- the maximum width of the fine groove 20 (especially the groove width at the opening 20a of the fine groove 20) is larger than the maximum width of the extended groove 21. ) Should be small. By doing so, it is possible to absorb the mutual positional deviation (alignment deviation, dimensional deviation, etc.) when the extended groove 21 and the fine groove 20 are formed so as to overlap each other in different steps.
- the epoxy resin contains Al O force.
- the one filled with 2 3 ra 22 was used.
- the epoxy resin is used because of its excellent heat resistance and electrical insulation.
- thermosetting resin such as phenol resin or cyanate resin may be used.
- the filler 22 in addition to Al 2 O, at least what is MgO, SiO, BN, and A1N
- Electricity can be reduced, and insulation can be improved.
- the filler 22 having Al O force used in Embodiment 1 has an average particle diameter of 3 microns.
- Al 2 O It is a mixture of two types of Al 2 O with a diameter of 12 microns.
- Al O with two particle sizes Al O with two particle sizes
- Al O can be filled at a high concentration up to nearly 90 wt%.
- the thermal conductivity of is about 5WZmK.
- the filler 22 shown in FIG. 3 shows only one type of filler 22 and is simplified. [0050] Further, by using a material having high thermal conductivity for the inorganic filler or epoxy resin, the thermal conductivity of the filler-containing resin layer 16 can be about 10 to 20 WZmK.
- this filler 22 is as small as possible in the range of 0.1-100 ⁇ m in diameter and is filled to a high concentration of about 70 to 95 wt%, the thermal conductivity can be increased. .
- the filling rate of the filler 22 exceeds 95 wt%, it becomes difficult to mold, and the adhesiveness between the filler-containing resin layer 16 and the metal wiring board 15 also decreases.
- the optimum thickness may be set in consideration of the withstand voltage and thermal resistance.
- a pregel material made of a thermoplastic resin powder powder is added to the filler-containing resin layer 16 made of a thermosetting resin in advance. Since this pregel material absorbs the liquid component of the uncured thermosetting resin and expands and quickly gels, the filler-containing resin layer 16 can be removed from the mold in a semi-cured state.
- the pregel material is, for example, a thermoplastic resin such as an acrylic resin, a vinyl resin, a polyamide resin, and the like, and easily applied to a thermosetting resin such as a liquid epoxy resin. It is desirable to use a compatible resin material that dissolves.
- the pregel material is powdered in order to increase the absorbability of the liquid component, and the particle size is preferably 2 to 50 m, more preferably 1 to 10 m.
- the filler-containing resin layer 16 in the gely state (or semi-cured state) is before the main curing (or before the heat curing), so that a part of it adheres to the surface of the mold or the like as dirt. However, it can be easily removed and the workability is improved.
- This pregel material is subjected to addition of 0.1 wt% force to the filler-containing resin layer 16 at a rate of 3. Owt%. It is desirable to add the pregel material at a ratio of 0.5 wt% to 1.5 wt% with respect to the filler-containing resin layer 16. If the pregel addition ratio is less than 0.1 lwt%, the addition effect cannot be obtained. On the other hand, if the pregel addition ratio exceeds 3. Owt%, the moldability will be affected.
- the mold force can be hardened by taking out the semi-cured sample taken out with a separately prepared curing equipment, and the productivity can be increased.
- a copper substrate having a thickness of 1 mm was used as the heat radiating plate 17.
- a metal with good thermal conductivity such as aluminum, copper or an alloy containing aluminum as a main component.
- FIG. 3 the force of the LEDs 11 mounted on the surface of the metal wiring board 15 is shown so that one LED is mounted on each of the left and right sides of one through groove 14, for example, on one through groove 14. It is possible to mount so that one LED11 straddles. LED11 is mounted on the metal wiring board 15 electrically insulated by one through-groove 14 in this way so as to straddle the through-groove 14 with bumps or wire bonds (both shown in the figure).
- the heat generated in LED 11 can be dissipated efficiently. This is because the heat generated in the LED 11 can be radiated in the plane direction of the metal wiring board 15 just by radiating the heat in the thickness direction of the metal wiring board 15. This is also called a planar heat spread effect.
- the lower surface 15 of the metal wiring board shown in FIG. 2B is irradiated with a YAG laser or a CO laser as the first laser to form the extended groove 21.
- the deepest portion of the extended groove 21 is irradiated with a green laser using a YAG having a wavelength of 1. m as a second laser and a pulse width of 30 ns, so that a fine groove 20 is formed.
- the top surface of the plate 15 can be penetrated.
- this green laser (for example, wavelength 532 nm) is emitted from the optical finer to realize fine processing.
- this second laser a laser having a wavelength of 600 nm or less, a green laser, or a shorter wavelength may be used.
- the laser irradiation is performed before the heat generated by the laser irradiation diffuses near the laser irradiation portion of the workpiece, for example, the metal wiring board 15. Will end. Therefore, heat damage, such as thermal deformation of metal wiring board Will occur. As a result, fine grooves can be formed with high accuracy.
- the laser irradiation part of the metal wiring board 15 that has a high energy absorption effect on the metal material (especially copper) that constitutes the wiring can be locally and rapidly heated, and thermal diffusion to the vicinity of the laser irradiation part is also possible. Few. Therefore, thermal damage is less likely to occur
- fine grooves can be formed with high accuracy.
- the thermal deterioration of the processed surface can be suppressed, and the fine through groove 14 can be formed with high accuracy and high aspect ratio.
- the fine groove 20 has a smaller film thickness than the extended groove 21.
- the second laser that forms the fine groove 20 has a shorter wavelength and a smaller pulse width than the first laser that forms the extended groove 21.
- FIG. Figure 4 shows the relationship between laser pulse width and output.
- the horizontal axis is time (unit: sec), and the vertical axis is laser output (unit: W).
- first laser 41 and the second laser 42 in Fig. 4 represent the envelopes of the irradiated laser, respectively.
- the first laser 41 two types of envelopes are described. That is, a rectangular envelope and a stepped envelope.
- the envelope of the first laser 41 may have a normally distributed shape.
- the energy of the second laser 42 is larger than that of the first laser 41, and the substrate, that is, the metal wiring board 15 can be instantaneously evaporated. It is thought that processing proceeds with minimal energy and the thermal oxidation reaction can be suppressed.
- the acid-containing film also includes an altered portion or a damaged portion caused by laser irradiation. Therefore, the occurrence of such an altered portion may affect the electrical resistance and thermal conductivity of the metal wiring board 15. Therefore, by positively thinning the oxide film in the fine groove 20, the influence of the oxide film or the altered portion on the electrical resistance and thermal conductivity in the vicinity of the fine groove 20 can be suppressed.
- the surface layer in the fine groove 20 can be a metal oxide, for example, an aluminum oxide film.
- the film 23 is attached to the upper surface of the metal wiring board 15, and the metal wiring board 15 is placed in the mold.
- the filler-filled lumps of resin are collected into a round shape, a bowl shape, a trapezoidal shape, a cylindrical shape, or a spherical shape so that the center is convex, and placed on the lower surface side of the metal wiring board 15.
- the filler-filled resin is filled with a hot press, such as a vacuum heat press, so that no gaps are formed in the expansion grooves 21 and the fine grooves 20, and the filler-containing resin layer 16 is formed.
- the finolem 23 is for suppressing the filler-containing resin from wrapping around the circuit pattern during the pressing. In addition, if air remains during pressing, the thermal conductivity and insulation properties decrease, so a large number of holes are formed in the film 23 to improve air permeability.
- the film 23 is made of polypropylene with a plurality of holes formed by laser, but other non-woven fabrics with a thin adhesive can also be used.
- the heat radiating plate 17 is disposed on the lower surface of the above-described filler-containing resin layer 16, and is released from being pressed by a mold.
- the heat dissipation wiring board 10 is heated at 200 ° C. for 1 minute.
- the filler-containing resin layer 16 can be semi-cured and the mold force can be removed.
- this heat radiation wiring board 10 is placed in an oven at 200 ° C, and a filler-containing resin layer 1
- a laser is used in the process of forming the fine groove 20 and the extended groove 21.
- a relatively rough pattern portion having a groove width of 0.2 mm or more is subjected to a technique such as a punching press. It may be used.
- the metal wiring board 15 is formed into a relatively rough pattern having a groove width of 0.2 mm or more. Is batch-formed with a press. By forming the through groove 14 including the fine groove 20 and the extended groove 21 in a portion where the fine groove 20 is required, productivity can be improved. In this manner, by forming a necessary portion of the metal wiring board 15 or a fine groove locally, the productivity of the heat dissipation wiring board 10 is increased and the cost is reduced.
- filling of the filler-containing resin can be facilitated, and the reliability with respect to electrical insulation caused by dust or the like can be improved.
- the fine groove 20 and the extended groove 21 are connected by a smooth surface without a clear interface, and the groove width from the opening 20a of the fine groove 20 toward the lower surface of the metal wiring board 15 Is formed to spread. Therefore, if the lower surface force of the metal wiring board 15 is filled with the filler-containing resin, the flow path of the resin containing the filler 22 can be gradually narrowed, and the fluidity is improved. As a result, the fine groove 20 can be filled with the filler 22 so that there is no gap, and the reliability of electrical insulation due to dust and the like can be improved.
- This structure increases the content of the filler 22 in order to reduce the groove width of the fine groove 20 to improve the fine pitch of the circuit pattern in recent years or to improve the thermal conductivity. Also in this case, the filler-containing cocoon resin layer 16 can be easily filled, which is useful.
- the interface with the extended groove 21 can be made smooth, and the lower end portion 20b can be formed to have a larger groove width than the opening portion 20a.
- the opening 20a can be formed more smoothly than the lower end 20b. Therefore, it is possible to reduce the occurrence of dust and dross on the upper surface of the metal wiring board 15 that is the mounting surface of the electronic component such as the LED 11. Further, the inner wall of the fine groove 20 can be smoothly smoothed, and the filling rate of the resin containing the filler 22 containing the filler 22 at a high concentration (70 to 95 wt%) can be further improved.
- the YAG laser or CO laser that forms the extended groove 21 is formed.
- the second laser for forming the fine groove 20 a green laser using a 30-ns YAG having a pulse width of about 1/10 of that of a conventional general laser is used. As a result, the inner wall of the fine groove 20 can be made smoother.
- the fine groove 20 can be processed with high accuracy, and as a result, the inner wall shape of the fine groove 20 can be made smoother.
- the inner wall of the fine groove 20 is formed so that the surface roughness is lower (smooth) than the inner wall of the extension groove 21.
- the fine groove 20 can be formed with a finer pitch. .
- the extension groove 21 is once formed. Therefore, the depth of the fine groove 20 can be reduced by adjusting the depth of the extended groove 21.
- the depth of the fine groove 20 can be reduced to 0.15 mm or less, the fine groove 20 having a minimum width of 0.03 mm can be easily formed by using the manufacturing method in the first embodiment. It is out.
- the thickness of the entire metal wiring board 15 can be 0.3 mm or more, the thermal conductivity can be improved.
- the extended groove 21 in this manner, the aspect ratio of the fine groove 20 can be reduced, and the processing time can be shortened. Therefore, dross generated during laser caking (spattered melt is generated). Can be reduced, and the processed surface becomes smoother.
- the filling rate of the filler 22 can be increased by making the particle size of the filler 22 different in size.
- the filler 22 having a large particle size has a problem that it is difficult to fill the narrow gap.
- the through groove 14 from the expansion groove 21 and the fine groove 20 the narrow gap can be easily filled even if the filler 22 has a large particle size. Fillability in fine gaps can be improved when inexpensive alumina and expensive BN are combined.
- the oxide film is formed on the inner walls of the fine groove 20 and the extended groove 21, the insulation can be improved.
- this oxide film can be formed by heat during laser processing, if the fine groove 20 and the extended groove 21 are processed by laser as in the first embodiment, the through groove 14 is formed on each inner wall. An oxide film can be formed simultaneously with the formation, and the productivity is excellent.
- the oxide film of the fine groove 20 is thin. This is because the opening 20a of the fine groove 20 is exposed on the mounting surface of the component, so that the influence due to cleavage of the highly brittle oxide film is suppressed.
- the effects of cleavage include that the surface of the metal wiring board 15 is roughened by cleavage, and that it is difficult to mount electronic components, and that reliability is impaired by residues. It is.
- the wettability of the filler-containing resin layer 16 with respect to each inner wall can be adjusted.
- the oxide film of the fine groove 20 is made thinner and thinner than the oxide film of the extended groove 21 depending on the conditions of the laser wavelength and the pulse width. Therefore, it is possible to reduce cleavage and improve reliability while ensuring insulation.
- the shape of the expansion groove 21 is an arch shape, the stress at the time of thermal expansion or curing shrinkage at the time of filling the filler-containing resin can be effectively dispersed and released. Thermal deformation of the thermal wiring board 10 can be suppressed.
- Embodiment 2 will be described with reference to FIG.
- the same reference numerals are assigned to the same portions as those used in the description of the first embodiment.
- the second embodiment corresponds to the case where, for example, the extended groove 21 is formed by etching or machining, and the fine groove 20 is formed by a laser.
- FIG. 5 is a schematic cross-sectional view showing a state in which the oxide film 24 is formed on the surface of the fine groove 20.
- the insulating film is formed by forming the oxide film 24 on the surface of the fine groove 20, and the insulating effect can be enhanced by using the insulating film together.
- the oxide film 24 a metal oxide film formed by oxidizing the surface of the metal wiring board 15 can be used.
- a part of the through groove 14 is a fine groove 20 having an opening 20a on the upper surface of the metal wiring board 15, and a lower end portion 20b of the fine groove 20 toward the lower surface of the metal wiring board 15. It is formed of a wide force and an expansion groove 21.
- an insulating film 24 having a thickness larger than that of an oxide film (not shown) formed on the inner wall of the extension groove 21 is formed on the inner wall of the fine groove 20.
- the inner wall of the extension groove 21 is formed so that the surface roughness is smaller (smooth) than the inner wall of the fine groove 20.
- the extension groove 21 as shown in FIG. 5 is formed from the back side of the metal wiring board 15, for example, by chemical ethtin. It can be formed with the pressing force of the mold. Then, the fine groove 20 is formed by a laser or the like so as to overlap the extended groove 21 from the back surface side of the metal wiring board 15 and the through groove 14 is formed. In this way, a groove having a two-stage structure in which the groove width becomes narrower from the bottom to the top or a groove in which large and small grooves overlap is formed.
- the lower end 20b of the fine groove 20 does not have a clear interface with the extended groove 21 and is gently connected.
- the extended groove 21 has a structure in which the groove width gradually increases from the lower end 20b of the fine groove 20 toward the lower surface of the metal wiring board 15.
- an oxide film 24 having a larger film thickness than an oxide film (not shown) formed on the inner wall of the extension groove 21 is formed on the inner wall of the fine groove 20.
- the inner wall of the extended groove 21 is formed to have a surface roughness smaller (smooth) than the inner wall of the fine groove 20.
- an oxide film 24 having a larger film thickness than the inner wall of the extension groove 21 can be formed on the inner wall of the fine groove 20 by laser processing or the like. It can. This is because the carved surface is thermally oxidized by laser scanning. The oxide film 24 can further improve the electrical insulation in the fine groove 20. The oxide film 24 is useful for enhancing electrical insulation in the minute groove 20 that is difficult to fill with resin.
- the thickness of the oxide film 24 in the fine groove 20 is uniform. This is because the highly brittle acid oxide film 24 is easily cleaved when the film thickness is uneven. If the surface of the metal wiring board 15 is roughened by this cleavage, the electronic components are difficult to mount, and the reliability is impaired by the residue.
- the oxide film 24 of the fine groove 20 is made to be larger than the oxide film of the extended groove 21 depending on the conditions of the laser wavelength and the pulse width.
- the film thickness is small (thin). Therefore, cleavage can be reduced and reliability can be improved while ensuring insulation.
- an aluminum oxide film can be formed as the oxide film 24 on the surface of the fine groove 20.
- the oxide film 24 can be used as an insulating layer.
- the adhesive strength between the metal wiring board 15 and the filler-containing resin layer 16, such as peel strength, can be increased.
- the adhesive strength of the filler-containing resin layer 16 and the metal wiring board 15, such as copper, aluminum, or a clad alloy thereof is low, the formation of the oxide film 24 is positively performed. Can increase the adhesive strength.
- the bonding strength between the metal wiring board 15 and the filler-containing resin layer 16 may be reduced depending on the combination.
- the adhesive force with the filler-containing resin layer 16 can be increased.
- the adhesive strength with the filler-containing resin layer 16 may be affected.
- the oxide film 24 shown in FIG. 5 may be a layer having a roughened surface, a roughened layer, or an adhesion improving layer that is different from the oxide film 24.
- the fine groove 20 is formed by a short wavelength laser
- the surface roughness of the processed surface tends to be small as described above, but the laser irradiation pulse and the laser feed rate are adjusted, for example, high speed processing is performed.
- irregularities can be positively formed on the processed or cut surface.
- the uneven surface thus formed can be formed as an interface portion between the fine groove 20 and the filler-containing resin layer 16 instead of the oxide film 24.
- this uneven surface (which may be used in combination with the oxide film 24) as a kind of anchor layer, the bonding strength between the fine groove 20 and the filler-containing resin layer 16 can be increased.
- Embodiment 3 will be described with reference to FIGS.
- FIG. 6 is a schematic cross-sectional view for explaining a state in which a groove is formed by both sides of the metal wiring board 15 to form the through groove 14.
- the same parts as those used in the description of the first to second embodiments are denoted by the same reference numerals.
- a copper plate, an aluminum plate, a laminated plate of these, or a clad plate may be prepared. In addition, you may use what punched the required part with the press. And this Metal wiring board 15
- the extended groove 21 is formed by etching or laser processing.
- the fine groove 20 is formed so as to overlap the extended groove 21 by etching or laser as shown by an arrow 25b, and the through groove 14 is formed.
- the productivity can be increased.
- the through groove 14 is formed by etching
- the etching cost can be suppressed by forming the fine groove 20 and the extended groove 21 at the same time.
- the maximum width of the extended groove 21 (groove width on the heat sink 17 side) larger than the maximum width of the fine groove 20, that is, the groove width of the opening 20a in FIG.
- the gap can be absorbed and the product yield can be improved.
- FIG. 7 is a schematic cross-sectional view showing the process of producing the heat dissipation wiring board 10. As shown in FIG. As shown in FIG. 7, the heat radiating plate 17 is fixed to the back surface side of the metal wiring board 15 or the side where the extended grooves 21 are formed via the first filler-containing resin layer 26. At this time, since the groove width of the fine groove 20 is wider at the opening 20a than at the lower end 20b, the first filler-containing resin layer 26 may not be filled into the fine groove 20 in some cases. .
- FIG. 8 is a schematic cross-sectional view illustrating how the fine groove 20 is filled.
- the same parts as those used in the description of the first to second embodiments are denoted by the same reference numerals.
- the fine groove 20 is filled with the second filler-containing resin layer 27.
- the second filler-filled resin layer 27 is positively overflowed on the surface of the fine groove 20 or covered with the opening 20a of the fine groove 20, so that the first groove to the fine groove 20 is covered. 2 fila Filling of the filled resin layer 27 can be ensured.
- the filling property of the second filler-containing resin layer 27 can be improved by devising the pattern of the fine groove 20, for example, by forming a pattern hole for air venting (not shown). It is also effective to devise a method for filling the second filler-containing resin layer 27, for example, by imprinting with a rubber plate such as a squeegee or filling in a vacuum. At this time, it is important to prevent air from remaining in the inside as bubbles.
- the first filler-containing resin layer 26 and the second filler-containing resin layer 27 may be the same, for example, the filler-containing resin layer 16 may be used. Or it can be separate.
- FIG. 9 is a schematic cross-sectional view for explaining the state after the LED 11 is mounted.
- the through groove 14 is formed of a fine groove 20 and an extended groove 21.
- the expanded groove 21 is filled with the first filler-containing resin layer 26 containing the first filler 28, and the fine groove 20 is filled with the second filler 29 containing the second filter 29. Filled with a filler-containing resin layer 27. In this way, the filling performance is enhanced by filling the resin containing filler with a wide opening side force from both sides of the through groove 14.
- the cross-sectional shape of the fine groove 20 is a trapezoid with a wide upper part and a lower lower part by widening the groove width of the opening 20a from the lower end part 20b.
- the metal wiring board 15 that forms the lower part of the fine groove 20 is in a state where the applied force overhangs the first filler-containing resin layer 26 and the second filler-containing resin layer 27 side, or in a wedge shape. It will be in the state of protruding.
- the metal wiring board 15 can be used as the first filler-containing resin layer 26 or the second filler. It becomes a structural part that is physically peeled from the entering resin layer 27. This structure also has the effect of increasing the insulation distance or creepage distance.
- FIG. 10A is a perspective view for explaining the heat dissipation wiring board 10 partially having an independent wiring pattern
- FIG. 10B is a sectional view taken along line 10B-10B.
- the independent wiring pattern 30 corresponds to a wiring pattern portion that is electrically insulated from the other metal wiring board 15.
- the degree of freedom in pattern design can be increased.
- the outer frame 19 of the metal wiring board 15 or the peripheral portion corresponding to the so-called frame portion is cut off so that it is connected by the outer frame 19 until then.
- the metal wiring boards 15 can be separated or can be electrically insulated from each other.
- one end of the metal wiring board 15 needs to be connected to the outer frame 19 via the connection terminal 18.
- the stand-alone wiring pattern 30 described in the fourth embodiment corresponds to one having no connection terminal 18 connected to the outer frame 19.
- the independent wiring pattern 30 is, for example, a portion that is integrated with the metal wiring board 15 in a portion indicated by Y—Y, and this Y—Y portion is cut with a laser or the like to make it independent.
- the mold wiring pattern 30 is electrically insulated, and the vicinity of the cut portion is protected by a second filler-containing resin layer 27.
- FIG. 10B corresponds to a cross-sectional view taken along the line 10B-10B in FIG. 10A.
- a through-groove 14 having an extended groove 21 is formed in a part of the stand-alone wiring pattern 30.
- the independent wiring pattern 30 is originally a part of the metal wiring board 15, and is integrated with the metal wiring board 15 via the extension groove 21 or as a kind of connecting beam. is there. Then, by forming the fine groove 20 so as to overlap the extended groove 21, a part of the metal wiring board 15 is made independent and separated to form the independent wiring pattern 30.
- FIG. 11 is a schematic cross-sectional view illustrating an embodiment in which an extended groove (not shown) is formed in a part of the metal wiring board 15 using a mold.
- a mold 33 having concave portions 31 and convex portions 32 on the surface is pressed against the metal wiring board 15 in the direction indicated by the arrow 25, and a part of the metal wiring board 15 is recessed.
- a raised portion or the like generated on the opposite side is removed by polishing or the like. By doing so, the workability of the metal wiring board 15 can be improved.
- a metal wiring board 15 having an extension groove 21 in a part as shown in FIG. 12 is prepared.
- FIG. 12 is a schematic cross-sectional view for explaining how the metal wiring board 15 having the extended groove 21 and the heat radiating plate 17 are integrated together using the first filler-containing resin layer 26.
- FIG. 13 is a schematic cross-sectional view showing a state in which various members are laminated and integrated. As shown in FIG. 13, the heat radiating plate 17 and the metal wiring board 15 having the extended groove 21 in a part thereof are fixed via the first filler-containing resin layer 26.
- a laser is irradiated in the direction indicated by the arrow 25 in FIG. 13 so as to overlap the extended groove 21 portion of the metal wiring board 15 to form a fine groove (not shown).
- FIG. 14 is a schematic cross-sectional view for explaining a state in which the fine groove 20 is formed.
- the laser is irradiated to the extended groove 21 portion of the metal wiring board 15, and a part of the metal wiring board 15 is electrically or mechanically separated as a stand-alone wiring pattern 30.
- a part of the first filler-containing resin layer 26 immediately below the fine groove 20 is also separated by a laser. It may be understood. Even if a part of the first filler-containing resin layer 26 is decomposed by laser, the first filler 28 may remain without being decomposed. Alternatively, a part of the first filler 28 may be partially sintered or agglomerated by the laser.
- the size of the holes formed in the first filler-containing resin layer 26 can be reduced.
- the content of the first filler 28 is desirably 70 to 95 wt%.
- FIG. 15 is a schematic cross-sectional view for explaining a state in which the holes generated when the fine grooves 20 are formed are filled with the second filler-containing resin layer 27.
- the bumps 34 are formed of gold, solder, or the like, and correspond to, for example, a connection portion between the LED 11 and the metal wiring board 15 or the independent wiring pattern 30, or an external electrode portion.
- the second filler-containing resin layer 27 is filled up to the fine groove 20 and the extended groove 21. Residues generated during the processing of the fine grooves 20, for example, a part of the first filler-containing resin layer 26 can be removed by cleaning, cleaning with compressed air, etc., but the second residue is left as it is. It may be a part of the filler-containing cocoon resin layer 27. Alternatively, this residue may be used as the filler component of the second filler-containing resin layer 27.
- the second filler 29 may be acceptable. The second filler 29 is illustrated in FIG.
- the first filler-containing resin layer 27 is filled into the holes formed in the first filler-containing resin layer 26 with the second filler-containing resin layer 27. It has the effect of expanding the joint area with layer 26.
- the fine groove 20 in FIG. 15 is formed from the surface side of the heat dissipation wiring board 10, and therefore the width of the opening 20a is wider than the width of the lower end 20b. is doing. As a result, the filling properties of the second filler-containing resin layer 27 can be improved.
- force etching using a laser or the like may be used for forming the fine groove 20.
- the lower end 20b of the fine groove 20 is made into the first filler-containing resin layer 26 and the second filler-containing resin layer 27. Can be bitten (or anchored).
- an effect of preventing peeling of the thin metal wiring board 15 near the opening 20a is obtained.
- the second filler is included.
- the insulation distance between the metal wiring board 15 and the stand-alone wiring pattern 30 (creepage distance) by covering a part of the resin layer 27 also on the thin metal wiring board 15 near the opening 20a. The effect of increasing calorie is obtained.
- the LED 11 is mounted on the metal wiring board 15 or the independent wiring pattern 30.
- FIG. 16 and FIG. 17 are schematic cross-sectional views for explaining how the extension groove 21 is formed in the metal wiring board 15.
- the expansion groove 21 is formed by pressing a metal mold 33 having a convex portion 32 in part on both sides of the metal wiring board 15 in the direction indicated by the arrow 25a.
- the angle of the side surface of the expansion groove 21 shown by the arrow 25d in Fig. 16 is 1 to 30 degrees, preferably 2 to 10 degrees. If it is less than 1 degree, it may affect the "pull out" nature of the mold 33. If it is greater than 30 degrees, the press pressure must be increased.
- the groove width of the ceiling portion of the extended groove 21 indicated by the arrow 25c is preferably 0.1 mm or more and 0.5 mm or less. By doing so, it is possible to absorb the positional deviation when the fine groove 20 is formed in this portion. Fine grooves 20 are formed in the ceiling portion. In FIG. 16, the fine groove 20 is not shown.
- FIG. 17 is a schematic cross-sectional view illustrating how the fine groove 20 is formed.
- the heat sink 17 and the like are not shown.
- An arrow 25 in FIG. 17 indicates a direction in which the fine groove 20 is formed by laser or etching.
- FIG. 18 is a cross-sectional view for explaining a state in which the fine groove 20 is filled with the second filler-containing resin layer 27.
- the second filler-containing resin layer 27 containing the second filler 29 is filled so that a part of the second filler-containing resin layer 27 protrudes into the fine groove 20. Is done. By protruding in this manner, an effect of increasing the insulation distance (creeping distance) between the metal wiring board 15 and the independent wiring pattern 30 can be obtained.
- the second filler-containing resin layer 27 may be, for example, a solder resist. Then, by forming the solder resist as the second filler-containing resin layer 27 on the surface of the metal wiring board 15 by printing or the like, it is possible to prevent the solder from spreading too much when soldered to the metal wiring board 15.
- the pattern of the extended groove 21 and the fine groove 20, for example, the state viewed from the component mounting surface of the heat dissipation wiring board 10, is straight, curved, L-shaped, or zigzag. It may be. This is because the extended groove 21 and fine groove 20 are created by laser or etching, etc., and can handle fine, complicated, or small quantities of various types of turns that cannot be handled by stamping using a die. it can. As a result, the wiring pattern of the metal wiring board 15 on the heat dissipation wiring board 10 can be designed with the same degree of design freedom as a printed wiring board using a general glass epoxy resin.
- the fine groove 20 is illustrated as being shifted from the central portion of the extended groove 21. This means that the structural displacement of the fine groove 20 and the extended groove 21 in FIG. 18 can be absorbed.
- the extended grooves 21 and the fine grooves 20 are formed by chemical etching.
- the process of etching the extended groove 21 is as follows.
- a resist mask in which an etching hole is provided in the opening 20 a of the extension groove 21 is formed on the lower surface side of the metal wiring board 15.
- the metal wiring board 15 is immersed in an aqueous solution that also has salty ferric or salty cupric power, and is heated until the desired extended groove 21 is formed.
- the heat dissipation wiring board 10 proposed in the first to sixth embodiments can be adapted to high-density mounting.
- it can be used as a printed wiring board that supports bare chips, a substitute for a heat dissipation wiring board, or a product that supports high heat dissipation.
- the metal wiring board 15 has a large thickness, for example, 100 microns or more, preferably 200 microns or more, and high heat dissipation or low resistance of wiring resistance.
- heat dissipation wiring board 10 can be created using a copper plate of 300 microns or more
- the application field of the heat dissipation wiring board 10 can be expanded by facilitating the formation of the independent wiring pattern 30.
- a power transistor, a power semiconductor, or a semiconductor such as a CPU can be mounted in addition to the LED 11. It is also possible to mount these semiconductors in a bare chip. For example, dozens to hundreds of bumps formed around a semiconductor bare chip are mounted on a high-thickness metal wiring board 15 with a wall thickness of 100 to 500 microns at a high density of 50 to: LOO micron pitch. can do.
- FIG. 19A and FIG. 19B are cross-sectional views showing an example of the heat dissipation wiring board 10 corresponding to high-density mounting.
- FIG. 19A corresponds to a cross section before mounting
- FIG. 19B corresponds to a cross section after mounting.
- the same parts as those used in the description of the first to fifth embodiments are denoted by the same reference numerals.
- FIG. 19A a state in which a plurality of metal wiring boards 15 having a high thickness such as a lead frame, preferably 100 ⁇ m or more, are insulated from each other through a filler-containing resin layer 16 at a narrow pitch. And fixed on the heat sink 17.
- the metal wiring board 15 is divided from each other by a through groove 14 in which a fine groove 20 and an extended groove 21 are formed at least partially. In this way, the filling property of the filler-containing resin layer 16 is enhanced in the gap between the metal wiring boards 15 such as a high-thickness lead frame.
- FIG. 19A instead of LED 11, for example, a power semiconductor, for example, a CPU having external connection terminals of a plurality of bumps 34 or an electronic component accompanied by heat generation of a microtransformer can be used.
- the method of mounting an electronic component having a plurality of terminals with heat generation may be wire connection using an aluminum wire, metal bonding, etc., which need not be limited to the bump 34. Further, gold gold interconnection may be used.
- the arrow 25e in FIG. 19A indicates the mounting direction.
- FIG. 19B corresponds to a cross-sectional view after mounting.
- the independent wiring pattern 30 formed on a part of the metal wiring board 15 at a fine pitch in this way, a CPU or the like can be mounted with high density.
- the independent wiring pattern 30 can be formed locally at a necessary portion which is not necessary to be formed on the front surface of the metal wiring board 15, so that the yield can be increased and the heat radiation wiring board 10 can be realized at low cost.
- the wiring pattern described above is a wiring pattern such as an interposer, for example.
- various semiconductors such as semiconductor lasers and power semiconductors, heat generating electronic components such as ultra-small transformers, etc. are applied to the fine pattern described in the fifth embodiment and further to the heat dissipation wiring board 10 that also supports fine pitches. Since it can be mounted at high density, power circuits such as PDP TVs and liquid crystal TVs can be made very compact.
- light-emitting modules of projection-type televisions that use semiconductor light-emitting elements such as laser light sources and ultra-compact and high-intensity projectors. It is possible to cope with the higher density and higher heat dissipation of the engine (so-called engine part) and its peripheral circuits, and these electronic devices can be made smaller.
- the heat dissipating wiring board of the present invention shown in the first to sixth embodiments can improve the filling property of the filler-containing resin layer 16 into the through groove 14, and the heat dissipating wiring board. 10 reliability can be improved.
- the width of the opening 20a of the fine groove 20 and the width of the lower end 20b are 5 microns or more, preferably 10 microns or more and 100 microns or less, so that the following effects can be obtained. can get. That is, when filling the fine groove 20 with the filler-containing resin layer 16, the width of the opening 20 a and the lower end 20 b is wider, and the filler can also be filled with the filler-containing resin layer 16. It is possible to efficiently fill the filler-containing resin layer 16 up to the fine part.
- the width is less than 5 microns, the taper or inclination of the fine groove 20 becomes small, so that filling of the filler-containing resin layer 16 may be difficult.
- the length is 100 m or more, it is difficult to add the fine groove 20.
- the surface roughness of the inner wall of the fine groove 20 and that of the extended groove 21 is Ra, which is 0.01 microns or more different from each other.
- the adhesion strength with the filler-containing resin layer can be increased.
- the difference in surface roughness is preferably 0.1 micron or more and 10 microns or less in Ra. If it is less than 1 micron, it may fall within the range of surface roughness. If it exceeds 10 microns, the fin pattern of the heat dissipation wiring board 10 may be difficult.
- an oxide film 24 is formed on the inner wall of either the fine groove 20 or the extended groove 21 by 0.01 micron or more! (There is a difference in thickness of the oxide film of 0.01 micron.
- the bonding strength with the filler-containing resin layer 16 can be improved according to the shape of the fine groove 20 and the extended groove 21. If the difference in thickness of the oxide film is less than 0.01 microns, the difference may not occur. Also, if the thickness difference of the oxide film exceeds 10 microns, the heat dissipation characteristics may be affected.
- the width of the fine groove 20 on the upper surface of the metal wiring board 15 is 5 microns or more (preferably 10 microns or more) smaller than the width of the extension groove 21 on the lower surface of the metal wiring board 10. By doing so, it is possible to absorb the positional deviation between the fine groove 20 and the extended groove 21. for that reason, The processing yield can be increased. If the difference in groove width is less than 10 microns, machining is difficult and may increase costs.
- the groove width itself is preferably 200 microns or less (preferably 100 microns or less). If the groove width exceeds 200 microns, the fiber turn of the heat dissipation wiring board 10 may not be supported.
- the extended groove 21 and the fine groove 20 are both the extended groove 21 and the extended groove 21 by using the heat dissipating wiring board 10 filled with the filler-containing resin layer 16 that is the same or different in part or more. It is possible to prevent dust and the like from being mixed into the through groove 14 formed by laminating the fine grooves 20, and to improve the reliability.
- the width of the fine groove 20 on the upper surface of the metal wiring board 15 is 5 microns or more (preferably 10 microns or more) smaller than the width of the extension groove 21 on the lower surface of the metal wiring board 15 10 By doing so, the positional deviation between the fine groove 20 and the extended groove 21 can be absorbed, so that the processing yield can be increased. If the difference in groove width is less than 5 microns, processing is difficult and may increase costs.
- the groove width itself is preferably 200 microns or less (preferably 100 microns or less). If the groove width exceeds 200 microns, the heat sink wiring board 10 may not be compatible with fiber turning.
- the second filler-containing resin layer 26 may be a heat dissipation wiring board 10 having a reflectance of 30% or more and 99.5% or less in a visible light region of 400 nm or more and 800 nm or less. It is. In this way, when a light-emitting element such as LED11 is mounted on the surface of the heat dissipation wiring board 10, the light reflectance at the second filler-containing resin layer 27 can be increased, and the luminous efficiency can be improved. Is obtained. Note that the wavelength may be less than 400 nm or longer than 800 nm, and the wavelength does not increase the efficiency of the light emitting device. If the reflectance is less than 30%, the luminous efficiency may not be improved. Also, to increase the reflectivity above 99.5%, it is necessary to use an expensive member, which may not be practical.
- the second filler-containing resin layer 27 has a lower content of filler 22 than the first filler-containing resin layer 26 (preferably 10% by weight or less than the first filler-containing resin layer 26.
- the filling property of the second filler-containing resin layer 27 into the fine groove 20 can be enhanced.
- the difference in the amount of addition of less than 10% by weight of the filler 22 may not provide the effect of properly using the first filler-containing resin layer 26 and the second filler-containing resin layer 27. It may be cost-effective to use the same filler-containing resin layer 26 and the second filler-containing resin layer 27.
- the heat dissipating wiring board 10 in which the elastic modulus of the second filler-containing resin layer 27 is smaller than that of the first filler-containing resin layer 26, Thermal expansion can be absorbed, and an effect of preventing peeling of the end portion of the metal wiring board 15 can be obtained.
- the elastic modulus can be measured with a Myrobitskas (for example, JIS-Z2251), dimeter (for example, ISO-868), TMA (Thermal Mechanical Analysis), or the like.
- the difference in glass transition temperature (Tg) may be used as the difference in elastic modulus.
- the Tg of the second filler-containing resin layer 27 is 10 ° C. or more (preferably 20 ° C. or more) lower than the Tg of the first filler-containing resin layer 26. If the difference in Tg is less than 10 ° C, the stress due to thermal expansion of the metal wiring board 15 may not be alleviated.
- the Tg of the first filler-containing resin layer 26 is 100 ° C or higher, more preferably 130 ° C or higher, and more preferably 150 ° C or higher. If it is less than 100 ° C, the mechanical strength during operation may be affected.
- the filler 22 may be positively filled in the groove of the expansion groove 21.
- the thermal conductivity in the extended groove 21 can be increased.
- the thermal conductivity can be increased by sintering (or agglomerating) a part of the filler or the like.
- a laser-resistant material such as ceramic powder or ceramic sintered body in advance in the groove of the expansion groove 21, for example, FIG. 13 to FIG. In this case, the effect of laser irradiation on the filler-containing resin layer 16 during laser processing of the fine groove 20 can be reduced.
- a step of forming the extended groove 21 on the lower surface of the metal wiring board 15, and a fine groove 20 is formed from the upper surface or the lower surface side of the metal wiring board 15 so as to partially overlap the extended groove 21.
- the manufacturing method of the heat radiation wiring board 10 including the step of forming the through-groove 14 and the step of filling the filler 16 with the filler 16 in the lower part of the metal wiring board 15 has been shown. It can be produced efficiently by this manufacturing method. The work order of these processes may be changed according to the capacity of the equipment.
- a method for manufacturing the heat dissipation wiring board 10 including the steps of: According to this manufacturing method, as shown in FIG. 9, the heat radiation wiring board 10 having the independent wiring pattern 30 in a part thereof can be stably manufactured.
- the first laser forming the extended groove 21 uses a laser with a pulse width of 100 ns or more and continuous oscillation (C W), a YAG laser, or a CO laser.
- the lead time can be shortened and a small number of products can be handled.
- inexpensive or general-purpose lasers such as a laser using a general Q switch, a laser with a long pulse width of 100 ns or more, and a CW laser (Continuous Wave Laser)
- the extended groove 21 can be formed at a low cost.
- the pulse width of less than 100ns is short and the laser is expensive.
- the second laser forming the fine groove 20 uses a laser having a pulse width of 50 ns or less or a Z and wavelength of 600 nm or less, so that the lead time in the manufacturing process of the heat dissipation wiring board 10 can be reduced. Can be shortened and small quantities can be handled.
- the pulse width to Ins or more and 50 ns or less, laser irradiation can be instantaneously terminated, and thermal damage to the filler-containing resin layer 16 and the like is difficult to spread. If it is 50 ns or more, thermal damage may spread to the filler-containing resin layer 16 and the like. In addition, it may be difficult in terms of technology and cost to make the noise width less than Ins.
- the fine groove 20 can be finely processed.
- a short wavelength laser with a short pulse width of 50 ns or less, it is easy to suppress the occurrence of thermal effects on the filler-containing resin layer 16 and the like.
- an extended groove 21 is formed on the lower surface of the metal wiring board 15 by etching.
- a laser is applied to a part of the extended groove 21 to form a fine groove 20, and then from below the metal wiring board 15.
- the heat dissipating wiring board of the present invention can be filled with insulating filler-filled grease without any gaps even between fine pitch circuit patterns, and is useful for improving the reliability of electrical insulation caused by dust and the like. .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/300,184 US8008756B2 (en) | 2006-06-14 | 2007-06-13 | Heat dissipating wiring board and method for manufacturing same |
EP07745152.4A EP2006909B1 (en) | 2006-06-14 | 2007-06-13 | Heat dissipating wiring board and method for manufacturing same |
JP2008521228A JP4821854B2 (ja) | 2006-06-14 | 2007-06-13 | 放熱配線基板 |
CN200780021857XA CN101467248B (zh) | 2006-06-14 | 2007-06-13 | 散热布线板及其制造方法 |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-164298 | 2006-06-14 | ||
JP2006164298 | 2006-06-14 | ||
JP2006-164297 | 2006-06-14 | ||
JP2006164297 | 2006-06-14 | ||
JP2006245208 | 2006-09-11 | ||
JP2006245207 | 2006-09-11 | ||
JP2006-245208 | 2006-09-11 | ||
JP2006-245207 | 2006-09-11 | ||
JP2006-252066 | 2006-09-19 | ||
JP2006252066 | 2006-09-19 | ||
JP2006-252067 | 2006-09-19 | ||
JP2006252067 | 2006-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007145237A1 true WO2007145237A1 (ja) | 2007-12-21 |
Family
ID=38831751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/061874 WO2007145237A1 (ja) | 2006-06-14 | 2007-06-13 | 放熱配線基板とその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8008756B2 (ja) |
EP (1) | EP2006909B1 (ja) |
JP (1) | JP4821854B2 (ja) |
CN (1) | CN101467248B (ja) |
WO (1) | WO2007145237A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2266139A1 (de) * | 2008-04-17 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
JP2011198910A (ja) * | 2010-03-18 | 2011-10-06 | Panasonic Corp | 絶縁放熱基板およびその製造方法 |
JPWO2013153771A1 (ja) * | 2012-04-13 | 2015-12-17 | 日本発條株式会社 | 銅ベース回路基板 |
JP2016039321A (ja) * | 2014-08-08 | 2016-03-22 | 株式会社カネカ | リードフレーム、樹脂成型体、表面実装型電子部品、表面実装型発光装置、及びリードフレーム製造方法 |
WO2017110539A1 (ja) * | 2015-12-24 | 2017-06-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2024095811A1 (ja) * | 2022-10-31 | 2024-05-10 | 日本発條株式会社 | 回路基板の製造方法 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7969005B2 (en) * | 2007-04-27 | 2011-06-28 | Sanyo Electric Co., Ltd. | Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor |
CN102171815B (zh) * | 2008-11-21 | 2014-11-05 | 先进封装技术私人有限公司 | 半导体封装件及其制造方法 |
KR101015735B1 (ko) * | 2009-07-02 | 2011-02-22 | 삼성전기주식회사 | 세라믹 적층체 모듈 및 그 제조방법 |
JP5339092B2 (ja) * | 2010-07-22 | 2013-11-13 | Tdk株式会社 | バンドパスフィルタモジュール及びモジュール基板 |
DE102011076273A1 (de) * | 2011-05-23 | 2012-11-29 | Continental Automotive Gmbh | Leiterplatte für elektrische Bauelemente und Leiterplattensystem |
JP2013149947A (ja) * | 2011-12-19 | 2013-08-01 | Shinko Electric Ind Co Ltd | 発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法 |
JP5848976B2 (ja) | 2012-01-25 | 2016-01-27 | 新光電気工業株式会社 | 配線基板、発光装置及び配線基板の製造方法 |
JP2013153068A (ja) * | 2012-01-25 | 2013-08-08 | Shinko Electric Ind Co Ltd | 配線基板、発光装置及び配線基板の製造方法 |
JP6096413B2 (ja) | 2012-01-25 | 2017-03-15 | 新光電気工業株式会社 | 配線基板、発光装置及び配線基板の製造方法 |
CN103794574B (zh) * | 2012-10-31 | 2018-06-01 | 三垦电气株式会社 | 半导体装置及其制造方法 |
TWI462658B (zh) * | 2012-11-08 | 2014-11-21 | Wistron Neweb Corp | 電子元件及其製作方法 |
US9666557B2 (en) * | 2013-05-30 | 2017-05-30 | Infineon Technologies Ag | Small footprint semiconductor package |
JP7353794B2 (ja) * | 2019-05-13 | 2023-10-02 | ローム株式会社 | 半導体装置、その製造方法、及びモジュール |
US20210175155A1 (en) * | 2019-12-06 | 2021-06-10 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power module having interconnected base plate with molded metal and method of making the same |
EP4057338A1 (en) * | 2021-03-10 | 2022-09-14 | Hitachi Energy Switzerland AG | Metal substrate structure and method of manufacturing a metal substrate structure for a semiconductor power module and semiconductor power module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04364770A (ja) * | 1991-06-12 | 1992-12-17 | Shinko Electric Ind Co Ltd | 低融点ガラス封止型半導体パッケージの製造方法 |
JPH10173097A (ja) * | 1996-10-09 | 1998-06-26 | Matsushita Electric Ind Co Ltd | 熱伝導基板用シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法 |
JP2001210764A (ja) * | 2000-01-26 | 2001-08-03 | Matsushita Electric Works Ltd | 熱伝導基板及びその製造方法 |
JP2003152148A (ja) | 2001-03-19 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 熱伝導性基板の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115151A (ja) * | 1987-10-28 | 1989-05-08 | Shinko Electric Ind Co Ltd | 半導体装置用リードフレーム |
JP3083321B2 (ja) * | 1992-11-24 | 2000-09-04 | 日立建機株式会社 | リードフレームの加工方法 |
TW398163B (en) | 1996-10-09 | 2000-07-11 | Matsushita Electric Ind Co Ltd | The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof |
US6143981A (en) * | 1998-06-24 | 2000-11-07 | Amkor Technology, Inc. | Plastic integrated circuit package and method and leadframe for making the package |
JP3835949B2 (ja) * | 1999-06-11 | 2006-10-18 | 松下電器産業株式会社 | 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 |
US6384472B1 (en) * | 2000-03-24 | 2002-05-07 | Siliconware Precision Industries Co., Ltd | Leadless image sensor package structure and method for making the same |
US6483178B1 (en) * | 2000-07-14 | 2002-11-19 | Siliconware Precision Industries Co., Ltd. | Semiconductor device package structure |
JP3833938B2 (ja) * | 2000-12-27 | 2006-10-18 | 松下電器産業株式会社 | リードフレームおよびその製造方法、ならびに熱伝導性基板の製造方法 |
US7049683B1 (en) * | 2003-07-19 | 2006-05-23 | Ns Electronics Bangkok (1993) Ltd. | Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound |
-
2007
- 2007-06-13 CN CN200780021857XA patent/CN101467248B/zh not_active Expired - Fee Related
- 2007-06-13 EP EP07745152.4A patent/EP2006909B1/en not_active Expired - Fee Related
- 2007-06-13 JP JP2008521228A patent/JP4821854B2/ja not_active Expired - Fee Related
- 2007-06-13 WO PCT/JP2007/061874 patent/WO2007145237A1/ja active Application Filing
- 2007-06-13 US US12/300,184 patent/US8008756B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04364770A (ja) * | 1991-06-12 | 1992-12-17 | Shinko Electric Ind Co Ltd | 低融点ガラス封止型半導体パッケージの製造方法 |
JPH10173097A (ja) * | 1996-10-09 | 1998-06-26 | Matsushita Electric Ind Co Ltd | 熱伝導基板用シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法 |
JP2001210764A (ja) * | 2000-01-26 | 2001-08-03 | Matsushita Electric Works Ltd | 熱伝導基板及びその製造方法 |
JP2003152148A (ja) | 2001-03-19 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 熱伝導性基板の製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2006909A4 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2266139A1 (de) * | 2008-04-17 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
US9698282B2 (en) | 2008-04-17 | 2017-07-04 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
EP2266139B1 (de) * | 2008-04-17 | 2017-08-23 | OSRAM Opto Semiconductors GmbH | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
JP2011198910A (ja) * | 2010-03-18 | 2011-10-06 | Panasonic Corp | 絶縁放熱基板およびその製造方法 |
JPWO2013153771A1 (ja) * | 2012-04-13 | 2015-12-17 | 日本発條株式会社 | 銅ベース回路基板 |
JP2016039321A (ja) * | 2014-08-08 | 2016-03-22 | 株式会社カネカ | リードフレーム、樹脂成型体、表面実装型電子部品、表面実装型発光装置、及びリードフレーム製造方法 |
WO2017110539A1 (ja) * | 2015-12-24 | 2017-06-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2024095811A1 (ja) * | 2022-10-31 | 2024-05-10 | 日本発條株式会社 | 回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007145237A1 (ja) | 2009-11-05 |
EP2006909B1 (en) | 2013-06-05 |
US8008756B2 (en) | 2011-08-30 |
CN101467248B (zh) | 2012-09-05 |
EP2006909A4 (en) | 2011-08-10 |
EP2006909A2 (en) | 2008-12-24 |
EP2006909A9 (en) | 2009-08-05 |
US20090178828A1 (en) | 2009-07-16 |
JP4821854B2 (ja) | 2011-11-24 |
CN101467248A (zh) | 2009-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4821854B2 (ja) | 放熱配線基板 | |
US8263870B2 (en) | Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board | |
JP5100081B2 (ja) | 電子部品搭載多層配線基板及びその製造方法 | |
JP2005039100A (ja) | 高熱伝導性発光素子用回路部品及び高放熱モジュール | |
JP4882562B2 (ja) | 熱伝導基板とその製造方法及び電源ユニット及び電子機器 | |
JP2007318113A (ja) | 放熱基板及びその製造方法 | |
JP2007214246A (ja) | 放熱配線基板とその製造方法 | |
JP2008251671A (ja) | 放熱基板およびその製造方法および電子部品モジュール | |
JP2008098493A (ja) | 熱伝導基板とその製造方法及び回路モジュール | |
JP2008218617A (ja) | 放熱基板及びこれを用いた回路モジュール | |
JP2008124243A (ja) | 熱伝導基板とその製造方法及び回路モジュール | |
US10477692B2 (en) | Printed board, light source device, semiconductor device, and methods of manufacturing same | |
JP2005072382A (ja) | 放熱用リードフレーム基板及びその製造方法並びに半導体装置 | |
JP4635977B2 (ja) | 放熱性配線基板 | |
JP2008227334A (ja) | 放熱配線基板 | |
JP4862601B2 (ja) | 熱伝導基板とその製造方法及び回路モジュール | |
JP2009043881A (ja) | 放熱配線板とその製造方法 | |
JP2008098488A (ja) | 熱伝導基板とその製造方法 | |
JP2008218616A (ja) | 回路モジュール | |
JP5061669B2 (ja) | 放熱配線基板 | |
JP2008098489A (ja) | 熱伝導基板とその製造方法 | |
JP2008021817A (ja) | 熱伝導基板とその製造方法及び電源ユニット及び電子機器 | |
JP2008124242A (ja) | 熱伝導基板とその製造方法及び回路モジュール | |
JP4978235B2 (ja) | 混成実装用熱伝導基板とその製造方法及び回路モジュール | |
JP2008098492A (ja) | 熱伝導基板とその製造方法及び回路モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780021857.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07745152 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2008521228 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007745152 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12300184 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |