WO2007089114A1 - Composition antistatique pouvant être lavée avec une solution basique et produits polymères fabriqués au moyen de cette dernière - Google Patents
Composition antistatique pouvant être lavée avec une solution basique et produits polymères fabriqués au moyen de cette dernière Download PDFInfo
- Publication number
- WO2007089114A1 WO2007089114A1 PCT/KR2007/000562 KR2007000562W WO2007089114A1 WO 2007089114 A1 WO2007089114 A1 WO 2007089114A1 KR 2007000562 W KR2007000562 W KR 2007000562W WO 2007089114 A1 WO2007089114 A1 WO 2007089114A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antistatic
- polymer
- film
- weight
- carbon nanotubes
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 229920000642 polymer Polymers 0.000 title claims abstract description 31
- 239000003637 basic solution Substances 0.000 title description 2
- 239000007864 aqueous solution Substances 0.000 claims abstract description 45
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 37
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 37
- 238000005406 washing Methods 0.000 claims abstract description 30
- 239000000243 solution Substances 0.000 claims abstract description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 24
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 24
- 229920005601 base polymer Polymers 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 32
- -1 acryl Chemical group 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 229920006254 polymer film Polymers 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 11
- 239000007822 coupling agent Substances 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- 229910001887 tin oxide Inorganic materials 0.000 claims description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 229920002678 cellulose Polymers 0.000 claims description 4
- 239000001913 cellulose Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002134 carbon nanofiber Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 229910003437 indium oxide Inorganic materials 0.000 claims description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002048 multi walled nanotube Substances 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000002109 single walled nanotube Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 51
- 229920001721 polyimide Polymers 0.000 description 23
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 15
- 229920006267 polyester film Polymers 0.000 description 13
- 125000006850 spacer group Chemical group 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 229920001940 conductive polymer Polymers 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 230000005611 electricity Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 5
- 239000002216 antistatic agent Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- MWGMEGAYPPQWFG-UHFFFAOYSA-N [SiH4].OC(=O)C=C Chemical compound [SiH4].OC(=O)C=C MWGMEGAYPPQWFG-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 229940093476 ethylene glycol Drugs 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- MBDUIEKYVPVZJH-UHFFFAOYSA-N 1-ethylsulfonylethane Chemical compound CCS(=O)(=O)CC MBDUIEKYVPVZJH-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 229960001760 dimethyl sulfoxide Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940117927 ethylene oxide Drugs 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D11/00—Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
- B21D11/06—Bending into helical or spiral form; Forming a succession of return bends, e.g. serpentine form
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/16—Anti-static materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D11/00—Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
- B21D11/10—Bending specially adapted to produce specific articles, e.g. leaf springs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D11/00—Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
- B21D11/20—Bending sheet metal, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
Definitions
- the present invention relates to an antistatic composition which can be washed using an alkaline aqueous solution, such as an sodium hydroxide aqueous solution, an potassium hydroxide aqueous solution, or the like, and, more particularly, to an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, that is, can be used to manufacture antistatic polymer products which can resist basic solvents, and to antistatic polymer products manufactured using the same.
- an alkaline aqueous solution such as an sodium hydroxide aqueous solution, an potassium hydroxide aqueous solution, or the like
- an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, that is, can be used to manufacture antistatic polymer products which can resist basic solvents, and to antistatic polymer products manufactured using the same.
- Polymer films used for electric and electronic parts or polymer products manufactured using the same are used in a state of being formed with an antistatic layer on the surface thereof in order to prevent problems in that atmospheric dust is adsorbed thereon and circuits break down due to the generation of static electricity during manufacturing processes.
- Various technologies for forming an antistatic layer on a surface are used. Examples thereof include a technology for forming an antistatic layer using a surfactant type antistatic agent and a technology for forming an antistatic layer composed of a conductive polymer, which is an active component.
- a spacer tape for a flexible printed circuit board is manufactured in such a way that an antistatic layer composed of a conductive polymer, which is an active component, is formed on the surface of a polyester film, and then protrusions having a predetermined height are formed on both edges of the antistatic layer coated polyester film. Subsequently, the spacer is wounded together with a flexible printed circuit board to a reel, and is then transported. As such, a spacer used for shipping can very effectively obtain the effect of preventing static electricity when an antistatic layer composed of a conductive polymer, which is an active component, is formed.
- an antistatic spacer for processing when this spacer is used for processing after an antistatic layer composed of a conductive polymer, which is an active component, is formed, while the spacer is put into a 2-10% aqueous sodium hydroxide or potassium hydroxide solution and is washed, an antistatic layer composed of a conductive polymer is completely peeled off, thereby causing a phenomenon in which antistatic performance is deteriorated.
- a triacetate cellulose film which is the main component of a polarizing film, has a major problem in that dust is adsorbed thereon due to the generation of static electricity during processing. Therefore, in order to prevent this problem, an antistatic layer must be formed on the surface of the film.
- the antistatic layer composed of a conductive polymer, which is an active component is not effective in preventing the problem.
- a polyimide film used for a flexible printed circuit board is used in a state of being laminated with a copper film, but generates a large amount of static electricity on the surface of the polyimide film while it is passed through various rolling processes. Therefore, in order to prevent the generation of the static electricity, it is preferred that the surface of the polyimide film be antistatic-treated. However, the surface of the polyimide film cannot be antistatic-treated for the above reason.
- An object of the present invention is to provide an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, and antistatic polymer products manufactured by applying the antistatic composition on the surface of a polymer and then forming an antistatic layer on the surface thereof.
- the present invention relates to an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, that is, can be used to manufacture antistatic polymer products which can resist basic solvents, and to antistatic polymer products manufactured using the same.
- the present invention uses a method of preparing an antistatic composition, in which an antistatic agent, which is not damaged by a basic solvent such as an sodium hydroxide aqueous solution, a potassium hydroxide aqueous solution or the like, is used, and a thermosetting resin, which is cured at a temperature of 20 ⁇ 250°C and thus can form a three-dimensional network, and an antistatic component, which is an active component, are used as a binder component, and then the binder component is mixed with a suitable solvent, thereby preparing an antistatic composition, uses a method of producing antistatic polymer products by applying the prepared antistatic composition on the surface of a polymer, and uses a method of manufacturing polymer products for various electronic parts by additionally processing the produced antistatic polymer products.
- a basic solvent such as an sodium hydroxide aqueous solution, a potassium hydroxide aqueous solution or the like
- the antistatic composition of the present invention is an antistatic coating solution prepared by mixing 0.1-20 parts by weight of metal oxides or carbon nanotubes, 0.5-20 parts by weight of a thermosetting epoxy or phenolic resin, 0.02-5 parts by weight of a curing agent and 55-99.38 parts by weight of a solvent.
- An antistatic layer having a thickness of 0.05-10 D is formed by applying the antistatic coating solution on the surface of a base film.
- the antistatic coating solution may be used by mixing 0.05-5 parts by weight of release agent based on 100 parts by weight of the antistatic coating solution in order to increase releasability.
- a coupling agent may be used such that the amount thereof is 0.01-5 parts by weight based on 100 parts by weight of metal oxides or carbon nanotubes in order to increase the effect of dispersing the metal oxides or carbon nanotubes.
- the polymer film, prepared through the above method, is then formed by heat or pressure to final polymer products having antistatic characteristics.
- metal oxides or carbon nanotubes are used as an antistatic component, thereby keeping electrical conductivity and antistatic characteristics unchanged, even after a washing process using an alkaline aqueous solution.
- the metal oxides include tin oxide, indium oxide, zinc oxide, titanium oxide and the like, and may be used in the form of particles which are doped with arsenic, indium, antimony or other Group 5 elements and thus exhibit electrical conductivity. Further, single- walled carbon nanotubes or multi- walled carbon nanotubes may be used, or carbon nanofibers or graphite may be used in place thereof.
- the metal oxides or the carbon nanotubes can be used without limiting the form and size thereof, it is preferred that the particle size thereof be 0.002-5 D. This is because the metal oxides or the carbon nanotubes have an identical antistatic effect even if only a small amount thereof is used, and transparency is improved because the scattering of visible light is suppressed.
- the metal oxides are materials having electrical conductivity of 10 ⁇ 10 S/ cm.
- metal oxides themselves, or metal oxides doped with other components, such as arsenic, indium, antimony and the like, can be used.
- metal oxides which are spherical shape or flaked or fibrous metal oxides having a aspect ratio (long dimension/ short dimension) of 1 or more may also be used. According to the circumstances, metal oxides may be sold in the form of being dispersed in a solvent. In this case, since a process of modifying the surface of the metal oxides and then dispersing the modified metal oxides in a solvent is not required, the metal oxides can be effectively used for the purpose of the present invention.
- any resins having a three-dimensional network structure achieved through a curing process may be used.
- an epoxy resin or a phenolic resin can be used.
- the epoxy resin includes a glycidyl ether type epoxy resin, such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin or the like, a glycidyl ester type epoxy resin, and a glycidyl amine type epoxy resin.
- These epoxy resins can be used independently or in a state in which two or more epoxy resins are mixed.
- the epoxy resins serve to increase the chemical stability and durability of an antistatic layer by forming a three-dimensional network structure when a curing reaction is induced due to the addition of a curing agent. Accordingly, as described above, even if a washing process using an alkaline aqueous solution is performed, a phenomenon, in which the antistatic layer is peeled off, does not occur.
- One or more selected from the group consisting of amines, polyamides, acid anhydrides, imidazole, melamine, mercaptan and isocyanate may be used as a curing agent, which is added to the epoxy resin, depending on the kind of epoxy resin and the curing conditions.
- a predetermined amount of the epoxy resin and the curing agent is mixed with metal oxides or carbon nanotubes to form a mixture, the mixture is applied on a base film, and then a curing reaction is induced, so that an antistatic layer having excellent durability and chemical resistance is formed, thereby maintaining antistatic characteristics unchanged even after a washing process using an alkaline aqueous solution.
- the coupling agent is mixed with metal oxides or carbon nanotubes to form a mixture, the mixture is put into a suitable solvent and then stirred for 24 hours to form a mixed solution, and then the solvent is removed from the mixed solution at a temperature of 50- 15O 0 C, thereby obtaining metal oxides surface- treated with the coupling agent.
- the obtained metal oxides can effectively be used by re-dispersing them in a suitable solvent and then mixing them with a binder resin.
- the coupling agent is added such that the amount thereof is 0.01-5 parts by weight based on 100 parts by weight of metal oxides or carbon nanotubes. More preferably, the coupling agent may be added in the range of 0.02 - 1 parts by weight.
- the surface treatment thereof can be more effectively performed by applying ultrasonic waves or using a dispersion apparatus, such as a sand grinder, a ball mill or the like.
- a release agent used in the present invention may be one or more selected from among a fluorine type release agent, a silicone type release agent and an ethyleneoxide type release agent, or a combination type thereof.
- a fluorine type release agent When the release agent is excessively used, there is a problem in that the molecules of the release agent excessively come out onto the surface thereof, and thus serve rather as impurities. Therefore, it is important to maintain the amount of release agent at a suitable level.
- a solvent for mixing the components may be any one selected from among water; alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol and the like; ketones such as acetone, methylethyl ketone, methylisobutyl ketone, cy- clohexanone and the like; ethers such as diethyl ether, dipropyl ether, dibutyl ether and the like; alcohol ether such as ethylene glycol, propylene glycol, ethyleneglycol monomethyl ether, ethyleneglycol monoethyl ether, ethyleneglycol monobutyl ether and the like; amides such as N-methyl-2-pyrrolidinone, 2- pyrrolidinone, N- methylformamide, N,N-dimethylformamide and the like; sulfoxides such as dimethyl- sulfoxide, diethyl sulfoxide and the like; sulfones
- Most of the coating methods such as spray methods, electrodeposition coating methods, dipping methods, roll coating methods, bar coating methods, gravure methods and reverse gravure methods, may be used as a method of applying the antistatic coating solution.
- the coating solution is applied, and then dried and cured at a temperature of 20 ⁇ 250°C for 0.5-30 minutes, thereby forming an antistatic layer having excellent coating properties.
- the thickness of the antistatic layer be 0.02-10 D after the drying and curing processes.
- the antistatic layer is thinner than 0.02 D, it is difficult to obtain a uniform antistatic effect, thus being inconvenient.
- the antistatic layer is thicker than 10 D, the increase in the antistatic property is slight, and the antistatic layer becomes opaque, thus being undesirable.
- the surface of the base polymer is corona-treated, so that the surface tension of the base polymer is 35 dyne/cm or more, thereby increasing the wettability and adhesion of the coating solution, thus being effective.
- base polymer is primer-treated with urethane compounds, acryl compounds, amide compounds, imide compounds, amic acid compounds, ester compounds, silane compounds, epoxy compounds or silicate compounds in order to increase the adhesion between the antistatic layer and the base polymer, the wettability and adhesion between the antistatic layer and the base polymer can be increased, thus being effective.
- these primer components are primer-treated on the surface of a polymer film, these components are more effectively used by mixing them with a solvent which can be used in the present invention such that the weight ratio of the primer component to the solvent is 0.01-30.
- a base polymer which can be used in the present invention may be any one selected from the group consisting of an ester film, an imide film, an etherimide film, carbonate polymer film, an olefin polymer film including cyclic olefin polymer, polypropylene and etc., a film composed of polyvinylchloride resin, a film composed of styrene resin or acryl resin, an oxide polymer film including polyphenyleneoxide and a high heat resistance polymer film including polyethersulfone. All kinds of polymer film including above polymers and multilayer films are applicable.
- the polyimide film since the polyimide film has high heat resistance, it can be used without changing a spacer from a washing process to a curing process of an integrated circuit chip when a spacer for process is manufactured using the present invention, thus being more effective. Further, when an antistatic layer is formed on the surface of triacetate cellulose, which is a base film for a polarizing film, which is the most important film of display products using a liquid crystal polymer, the generation of static electricity can be prevented through several processes, and the antistatic layer formed on the surface of triacetate cellulose is not damaged even if a washing process is performed using an alkaline aqueous solution, thus being very effective.
- edges of an antistatic film manufactured using the method of present invention, are required to be embossed, it can be achieved by forming protrusions on the edges through application of heat and pressure.
- the related details are the same as in commonly known technologies.
- an antistatic layer containing metal oxides, a curing binder and a curing agent as an active component according to the present invention
- the antistatic layer formed on the surface of the base polymer is not damaged even if a washing process is performed using an alkaline aqueous solution, and thus can be used for a polymer film for a washing process.
- an antistatic polymer film, surface-treated using the same method maintains its antistatic property even if a washing process is performed using an alkaline aqueous solution.
- polymer products, embossed or processed in other forms by applying heat or pressure also have constant surface resistance even if a washing process is performed using an alkaline aqueous solution, and thus have the effect of maintaining an antistatic property.
- the surface resistance of a polyester film was 10 ohm/Sq.. However, it was found that, after the ultrasonic washing of the polyester film in a 5% sodium hydroxide aqueous solution, the surface resistance thereof was 10 ohm/Sq or more, and thus the polyester film was found to exhibit an insulating property.
- the surface resistance of the polyester film produced through the above method was 10 ohm/Sq. However, it was observed that, after the ultrasonic washing of the polyester film in a 5% sodium hydroxide aqueous solution, the surface resistance
- the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
- This film the same as in Comparative Example 1, was put into a 5% sodium hydroxide aqueous solution, washed using ultrasonic waves, and then the surface resistance thereof was observed.
- the surface resistance thereof did not change for 40 minutes of ultrasonic washing, but it was observed that the surface resistance thereof was 10 ohm/Sq or more when ultrasonic washing of the polyimide film was performed for 90 minutes or more, thereby changing a polyimide film to have insulation properties.
- Example 1 tin oxide particles, having a particle size of 3 D and doped with antimony, were surface-treated with an acrylate silane coupling agent.
- 5 g of the tin oxide was surface-treated using 0.1 g of silane having methacrylate functional groups, and was then mixed with 30 g of methylcellosolve, 2.5 g of an epoxy resin and 0.75 g of a curing agent to prepare an antistatic coating solution.
- the antistatic coating solution was applied to a thickness of 1.0 D on the surface of a polyimide film having a thickness of 125 D to form an antistatic layer, thereby producing an antistatic polyimide film.
- the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
- This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured to be 10 ohm/Sq without change of resistance.
- Example 2 carbon nanotubes were used as an antistatic agent instead of tin oxides.
- Example 2 was the same as Example 1, except that the carbon nanotubes were acid-treated, and were then surface-treated using an epoxy silane coupling agent, and 0.7 g of the treated carbon nanotubes were mixed and used.
- the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
- This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed not to have changed, and to be 10 ohm/Sq.
- Example 3 is the same as Example 1, except that glycidoxypropyltrimethoxysilane, which is an epoxy silane coupling agent, was used as a coupling agent.
- the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
- This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed not to have changed, and to be 10 ohm/Sq. Further, this film was cut to predetermined sizes, put into a 10% potassium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed to be 10 ohm/Sq. Accordingly, it was found that the surface resistance of the polyimide film had not greatly changed, and thus that the polyimide film can endure an alkaline aqueous solution of high concentration.
- Example 4 was the same as Example 1, except that a polyethyleneterephthalate film having a thickness of 125 D was used as a base polymer film.
- the surface resistance of the film produced through the above method was observed to be 10 ohm/Sq.
- This film was cut to predetermined sizes, put into a 5 mol% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed not to have changed, and to be 10 ohm/Sq.
- Example 5 was the same as Example 3, except that a mixed solution, in which 0.5 g of an epoxy silane coupling agent (glycidoxypropyltrimethoxysilane) was mixed with 67 g of isopropyl alcohol, was first applied on the surface of a polyimide film as a primer, and then the antistatic solution of Example 3 was applied on the coated surface thereof.
- an epoxy silane coupling agent glycidoxypropyltrimethoxysilane
- the surface resistance of the polyimide film produced through the above method was observed to be 10 ohm/Sq.
- This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed to be 10 ohm/Sq. Accordingly, it was found that the polyimide film could endure the sodium hydroxide aqueous solution. Further, this film was cut to predetermined sizes, put into a 10% potassium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured.
- Example 6 was the same as Example 4, except that an antistatic polyester film, like that produced in Example 4, was cut to a width of 35.1 mm, and then embossments having a height of 1.2 mm were formed thereon, thereby manufacturing a spacer tape.
- the surface resistance of the center portion of the embossed spacer produced through the above method was 10 ohm/Sq.
- the surface resistance of the embossed portion thereof was somewhat increased, to about 10 ohm/Sq., but the antistatic properties were maintained.
- This embossed spacer was cut to predetermined sizes, put into a 5 mol% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, it was found that the surface resistances of the center portion and the embossed portion thereof were not changed.
- An antistatic composition according to the present invention and polymer products manufactured using the same can be used in a washing process using an alkaline aqueous solution, and the antistatic performance thereof can be maintained even if a washing process is performed using an alkaline aqueous solution by applying the antistatic composition on the surface of a polymer and thus forming an antistatic layer.
- the antistatic composition can be used in the field of an antistatic spacer, for example, a spacer for a flexible printed circuit board, specifically, for a washing process thereof using an alkaline aqueous solution.
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Abstract
La présente invention concerne une composition antistatique qui peut être utilisée dans des processus de lavage effectués avec une solution aqueuse alcaline, c'est-à-dire qu'elle peut être utilisée pour fabriquer des produits polymères antistatiques qui peuvent résister aux solvants basiques, cette invention portant également sur les produits polymères antistatiques produits avec cette dernière. La composition antistatique renferme de 0,1 à 20 parties en poids d'oxydes métalliques ou de nanotubes de carbone, de 0,5 à 20 parties en poids d'une résine thermodurcissable, de 0,02 à 5 parties en poids d'un agent de durcissement, et de 55 à 99,38 parties en poids d'un solvant. Cette composition antistatique est appliquée sur une surface d'un polymère de base au moyen d'une solution et peut être réutilisée sans modifier la résistance de la surface suite à un processus de lavage effectué avec une solution aqueuse alcaline.
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JP2008553167A JP2009525379A (ja) | 2006-02-01 | 2007-02-01 | 塩基性洗浄液で洗浄可能な帯電防止組成物およびこれを用いて製造された高分子製品 |
CN2007800043679A CN101379161B (zh) | 2006-02-01 | 2007-02-01 | 碱性溶液可清洗的抗静电组合物和使用其而制得的聚合物产品 |
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KR10-2006-0009878 | 2006-02-01 | ||
KR1020060009878A KR100856148B1 (ko) | 2006-02-01 | 2006-02-01 | 염기성 세척액으로 세척 가능한 대전방지 조성물 및 이를이용해 제조된 고분자 제품 |
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JP (1) | JP2009525379A (fr) |
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JP4900892B2 (ja) * | 2004-05-31 | 2012-03-21 | 富士フイルム株式会社 | 光学フィルムの作製方法 |
CN1286931C (zh) * | 2005-02-22 | 2006-11-29 | 大庆石油管理局 | 一种碳纤维导静电涂料及其制备方法 |
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2006
- 2006-02-01 KR KR1020060009878A patent/KR100856148B1/ko not_active IP Right Cessation
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2007
- 2007-02-01 JP JP2008553167A patent/JP2009525379A/ja active Pending
- 2007-02-01 CN CN2007800043679A patent/CN101379161B/zh not_active Expired - Fee Related
- 2007-02-01 WO PCT/KR2007/000562 patent/WO2007089114A1/fr active Application Filing
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JP2000026760A (ja) * | 1998-07-14 | 2000-01-25 | Suzuki Sogyo Co Ltd | 機能性コーティング剤組成物 |
US20040213989A1 (en) * | 2001-06-20 | 2004-10-28 | Thomas Hasskerl | Method for producing moulded bodies comprising an electroconductive coating and moulded bodies having one such coating |
JP2004290287A (ja) * | 2003-03-26 | 2004-10-21 | Topcon Corp | 角膜内皮細胞像撮影装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2048116A1 (fr) * | 2007-10-09 | 2009-04-15 | ChemIP B.V. | Dispersion de nanoparticules dans des solvants organiques |
WO2009047302A1 (fr) * | 2007-10-09 | 2009-04-16 | Chemip B.V. | Dispersion de nanoparticules dans des solvants organiques |
US8333831B2 (en) | 2007-10-09 | 2012-12-18 | Chemip B.V. | Dispersion of nanoparticles in organic solvents |
WO2009083562A1 (fr) * | 2007-12-27 | 2009-07-09 | Essilor International (Compagnie Generale D'optique) | Composition de revêtement durcissable à base de nanotube de carbone produisant des articles revêtus résistant à l'abrasion et antistatiques |
US9791597B2 (en) | 2007-12-27 | 2017-10-17 | Essilor International (Compagie Generale D'optique) | Carbon nanotube-based curable coating composition providing antistatic abrasion-resistant coated articles |
EP2960310A1 (fr) * | 2014-06-27 | 2015-12-30 | Henkel AG&Co. KGAA | Revêtement conducteur transparent pour substrats rigides et flexibles |
WO2015197693A1 (fr) * | 2014-06-27 | 2015-12-30 | Henkel Ag & Co. Kgaa | Revêtement transparent conducteur pour des substrats rigides et souples |
US10487222B2 (en) | 2014-06-27 | 2019-11-26 | Henkel Ag & Co. Kgaa | Conductive transparent coating for rigid and flexible substrates |
Also Published As
Publication number | Publication date |
---|---|
KR100856148B1 (ko) | 2008-09-03 |
JP2009525379A (ja) | 2009-07-09 |
CN101379161B (zh) | 2013-04-17 |
CN101379161A (zh) | 2009-03-04 |
KR20070079279A (ko) | 2007-08-06 |
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