WO2007089114A1 - Composition antistatique pouvant être lavée avec une solution basique et produits polymères fabriqués au moyen de cette dernière - Google Patents

Composition antistatique pouvant être lavée avec une solution basique et produits polymères fabriqués au moyen de cette dernière Download PDF

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Publication number
WO2007089114A1
WO2007089114A1 PCT/KR2007/000562 KR2007000562W WO2007089114A1 WO 2007089114 A1 WO2007089114 A1 WO 2007089114A1 KR 2007000562 W KR2007000562 W KR 2007000562W WO 2007089114 A1 WO2007089114 A1 WO 2007089114A1
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WIPO (PCT)
Prior art keywords
antistatic
polymer
film
weight
carbon nanotubes
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PCT/KR2007/000562
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English (en)
Inventor
Kwang Suck Suh
Jong Eun Kim
Tae Young Kim
Won Jung Kim
Tae Hee Lee
Original Assignee
Kwang Suck Suh
Jong Eun Kim
Tae Young Kim
Won Jung Kim
Tae Hee Lee
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Application filed by Kwang Suck Suh, Jong Eun Kim, Tae Young Kim, Won Jung Kim, Tae Hee Lee filed Critical Kwang Suck Suh
Priority to JP2008553167A priority Critical patent/JP2009525379A/ja
Priority to CN2007800043679A priority patent/CN101379161B/zh
Publication of WO2007089114A1 publication Critical patent/WO2007089114A1/fr

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D11/00Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
    • B21D11/06Bending into helical or spiral form; Forming a succession of return bends, e.g. serpentine form
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/16Anti-static materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D11/00Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
    • B21D11/10Bending specially adapted to produce specific articles, e.g. leaf springs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D11/00Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
    • B21D11/20Bending sheet metal, not otherwise provided for
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • C09D7/62Additives non-macromolecular inorganic modified by treatment with other compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/70Additives characterised by shape, e.g. fibres, flakes or microspheres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals

Definitions

  • the present invention relates to an antistatic composition which can be washed using an alkaline aqueous solution, such as an sodium hydroxide aqueous solution, an potassium hydroxide aqueous solution, or the like, and, more particularly, to an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, that is, can be used to manufacture antistatic polymer products which can resist basic solvents, and to antistatic polymer products manufactured using the same.
  • an alkaline aqueous solution such as an sodium hydroxide aqueous solution, an potassium hydroxide aqueous solution, or the like
  • an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, that is, can be used to manufacture antistatic polymer products which can resist basic solvents, and to antistatic polymer products manufactured using the same.
  • Polymer films used for electric and electronic parts or polymer products manufactured using the same are used in a state of being formed with an antistatic layer on the surface thereof in order to prevent problems in that atmospheric dust is adsorbed thereon and circuits break down due to the generation of static electricity during manufacturing processes.
  • Various technologies for forming an antistatic layer on a surface are used. Examples thereof include a technology for forming an antistatic layer using a surfactant type antistatic agent and a technology for forming an antistatic layer composed of a conductive polymer, which is an active component.
  • a spacer tape for a flexible printed circuit board is manufactured in such a way that an antistatic layer composed of a conductive polymer, which is an active component, is formed on the surface of a polyester film, and then protrusions having a predetermined height are formed on both edges of the antistatic layer coated polyester film. Subsequently, the spacer is wounded together with a flexible printed circuit board to a reel, and is then transported. As such, a spacer used for shipping can very effectively obtain the effect of preventing static electricity when an antistatic layer composed of a conductive polymer, which is an active component, is formed.
  • an antistatic spacer for processing when this spacer is used for processing after an antistatic layer composed of a conductive polymer, which is an active component, is formed, while the spacer is put into a 2-10% aqueous sodium hydroxide or potassium hydroxide solution and is washed, an antistatic layer composed of a conductive polymer is completely peeled off, thereby causing a phenomenon in which antistatic performance is deteriorated.
  • a triacetate cellulose film which is the main component of a polarizing film, has a major problem in that dust is adsorbed thereon due to the generation of static electricity during processing. Therefore, in order to prevent this problem, an antistatic layer must be formed on the surface of the film.
  • the antistatic layer composed of a conductive polymer, which is an active component is not effective in preventing the problem.
  • a polyimide film used for a flexible printed circuit board is used in a state of being laminated with a copper film, but generates a large amount of static electricity on the surface of the polyimide film while it is passed through various rolling processes. Therefore, in order to prevent the generation of the static electricity, it is preferred that the surface of the polyimide film be antistatic-treated. However, the surface of the polyimide film cannot be antistatic-treated for the above reason.
  • An object of the present invention is to provide an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, and antistatic polymer products manufactured by applying the antistatic composition on the surface of a polymer and then forming an antistatic layer on the surface thereof.
  • the present invention relates to an antistatic composition which can be used in washing processes that use an alkaline aqueous solution, that is, can be used to manufacture antistatic polymer products which can resist basic solvents, and to antistatic polymer products manufactured using the same.
  • the present invention uses a method of preparing an antistatic composition, in which an antistatic agent, which is not damaged by a basic solvent such as an sodium hydroxide aqueous solution, a potassium hydroxide aqueous solution or the like, is used, and a thermosetting resin, which is cured at a temperature of 20 ⁇ 250°C and thus can form a three-dimensional network, and an antistatic component, which is an active component, are used as a binder component, and then the binder component is mixed with a suitable solvent, thereby preparing an antistatic composition, uses a method of producing antistatic polymer products by applying the prepared antistatic composition on the surface of a polymer, and uses a method of manufacturing polymer products for various electronic parts by additionally processing the produced antistatic polymer products.
  • a basic solvent such as an sodium hydroxide aqueous solution, a potassium hydroxide aqueous solution or the like
  • the antistatic composition of the present invention is an antistatic coating solution prepared by mixing 0.1-20 parts by weight of metal oxides or carbon nanotubes, 0.5-20 parts by weight of a thermosetting epoxy or phenolic resin, 0.02-5 parts by weight of a curing agent and 55-99.38 parts by weight of a solvent.
  • An antistatic layer having a thickness of 0.05-10 D is formed by applying the antistatic coating solution on the surface of a base film.
  • the antistatic coating solution may be used by mixing 0.05-5 parts by weight of release agent based on 100 parts by weight of the antistatic coating solution in order to increase releasability.
  • a coupling agent may be used such that the amount thereof is 0.01-5 parts by weight based on 100 parts by weight of metal oxides or carbon nanotubes in order to increase the effect of dispersing the metal oxides or carbon nanotubes.
  • the polymer film, prepared through the above method, is then formed by heat or pressure to final polymer products having antistatic characteristics.
  • metal oxides or carbon nanotubes are used as an antistatic component, thereby keeping electrical conductivity and antistatic characteristics unchanged, even after a washing process using an alkaline aqueous solution.
  • the metal oxides include tin oxide, indium oxide, zinc oxide, titanium oxide and the like, and may be used in the form of particles which are doped with arsenic, indium, antimony or other Group 5 elements and thus exhibit electrical conductivity. Further, single- walled carbon nanotubes or multi- walled carbon nanotubes may be used, or carbon nanofibers or graphite may be used in place thereof.
  • the metal oxides or the carbon nanotubes can be used without limiting the form and size thereof, it is preferred that the particle size thereof be 0.002-5 D. This is because the metal oxides or the carbon nanotubes have an identical antistatic effect even if only a small amount thereof is used, and transparency is improved because the scattering of visible light is suppressed.
  • the metal oxides are materials having electrical conductivity of 10 ⁇ 10 S/ cm.
  • metal oxides themselves, or metal oxides doped with other components, such as arsenic, indium, antimony and the like, can be used.
  • metal oxides which are spherical shape or flaked or fibrous metal oxides having a aspect ratio (long dimension/ short dimension) of 1 or more may also be used. According to the circumstances, metal oxides may be sold in the form of being dispersed in a solvent. In this case, since a process of modifying the surface of the metal oxides and then dispersing the modified metal oxides in a solvent is not required, the metal oxides can be effectively used for the purpose of the present invention.
  • any resins having a three-dimensional network structure achieved through a curing process may be used.
  • an epoxy resin or a phenolic resin can be used.
  • the epoxy resin includes a glycidyl ether type epoxy resin, such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin or the like, a glycidyl ester type epoxy resin, and a glycidyl amine type epoxy resin.
  • These epoxy resins can be used independently or in a state in which two or more epoxy resins are mixed.
  • the epoxy resins serve to increase the chemical stability and durability of an antistatic layer by forming a three-dimensional network structure when a curing reaction is induced due to the addition of a curing agent. Accordingly, as described above, even if a washing process using an alkaline aqueous solution is performed, a phenomenon, in which the antistatic layer is peeled off, does not occur.
  • One or more selected from the group consisting of amines, polyamides, acid anhydrides, imidazole, melamine, mercaptan and isocyanate may be used as a curing agent, which is added to the epoxy resin, depending on the kind of epoxy resin and the curing conditions.
  • a predetermined amount of the epoxy resin and the curing agent is mixed with metal oxides or carbon nanotubes to form a mixture, the mixture is applied on a base film, and then a curing reaction is induced, so that an antistatic layer having excellent durability and chemical resistance is formed, thereby maintaining antistatic characteristics unchanged even after a washing process using an alkaline aqueous solution.
  • the coupling agent is mixed with metal oxides or carbon nanotubes to form a mixture, the mixture is put into a suitable solvent and then stirred for 24 hours to form a mixed solution, and then the solvent is removed from the mixed solution at a temperature of 50- 15O 0 C, thereby obtaining metal oxides surface- treated with the coupling agent.
  • the obtained metal oxides can effectively be used by re-dispersing them in a suitable solvent and then mixing them with a binder resin.
  • the coupling agent is added such that the amount thereof is 0.01-5 parts by weight based on 100 parts by weight of metal oxides or carbon nanotubes. More preferably, the coupling agent may be added in the range of 0.02 - 1 parts by weight.
  • the surface treatment thereof can be more effectively performed by applying ultrasonic waves or using a dispersion apparatus, such as a sand grinder, a ball mill or the like.
  • a release agent used in the present invention may be one or more selected from among a fluorine type release agent, a silicone type release agent and an ethyleneoxide type release agent, or a combination type thereof.
  • a fluorine type release agent When the release agent is excessively used, there is a problem in that the molecules of the release agent excessively come out onto the surface thereof, and thus serve rather as impurities. Therefore, it is important to maintain the amount of release agent at a suitable level.
  • a solvent for mixing the components may be any one selected from among water; alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol and the like; ketones such as acetone, methylethyl ketone, methylisobutyl ketone, cy- clohexanone and the like; ethers such as diethyl ether, dipropyl ether, dibutyl ether and the like; alcohol ether such as ethylene glycol, propylene glycol, ethyleneglycol monomethyl ether, ethyleneglycol monoethyl ether, ethyleneglycol monobutyl ether and the like; amides such as N-methyl-2-pyrrolidinone, 2- pyrrolidinone, N- methylformamide, N,N-dimethylformamide and the like; sulfoxides such as dimethyl- sulfoxide, diethyl sulfoxide and the like; sulfones
  • Most of the coating methods such as spray methods, electrodeposition coating methods, dipping methods, roll coating methods, bar coating methods, gravure methods and reverse gravure methods, may be used as a method of applying the antistatic coating solution.
  • the coating solution is applied, and then dried and cured at a temperature of 20 ⁇ 250°C for 0.5-30 minutes, thereby forming an antistatic layer having excellent coating properties.
  • the thickness of the antistatic layer be 0.02-10 D after the drying and curing processes.
  • the antistatic layer is thinner than 0.02 D, it is difficult to obtain a uniform antistatic effect, thus being inconvenient.
  • the antistatic layer is thicker than 10 D, the increase in the antistatic property is slight, and the antistatic layer becomes opaque, thus being undesirable.
  • the surface of the base polymer is corona-treated, so that the surface tension of the base polymer is 35 dyne/cm or more, thereby increasing the wettability and adhesion of the coating solution, thus being effective.
  • base polymer is primer-treated with urethane compounds, acryl compounds, amide compounds, imide compounds, amic acid compounds, ester compounds, silane compounds, epoxy compounds or silicate compounds in order to increase the adhesion between the antistatic layer and the base polymer, the wettability and adhesion between the antistatic layer and the base polymer can be increased, thus being effective.
  • these primer components are primer-treated on the surface of a polymer film, these components are more effectively used by mixing them with a solvent which can be used in the present invention such that the weight ratio of the primer component to the solvent is 0.01-30.
  • a base polymer which can be used in the present invention may be any one selected from the group consisting of an ester film, an imide film, an etherimide film, carbonate polymer film, an olefin polymer film including cyclic olefin polymer, polypropylene and etc., a film composed of polyvinylchloride resin, a film composed of styrene resin or acryl resin, an oxide polymer film including polyphenyleneoxide and a high heat resistance polymer film including polyethersulfone. All kinds of polymer film including above polymers and multilayer films are applicable.
  • the polyimide film since the polyimide film has high heat resistance, it can be used without changing a spacer from a washing process to a curing process of an integrated circuit chip when a spacer for process is manufactured using the present invention, thus being more effective. Further, when an antistatic layer is formed on the surface of triacetate cellulose, which is a base film for a polarizing film, which is the most important film of display products using a liquid crystal polymer, the generation of static electricity can be prevented through several processes, and the antistatic layer formed on the surface of triacetate cellulose is not damaged even if a washing process is performed using an alkaline aqueous solution, thus being very effective.
  • edges of an antistatic film manufactured using the method of present invention, are required to be embossed, it can be achieved by forming protrusions on the edges through application of heat and pressure.
  • the related details are the same as in commonly known technologies.
  • an antistatic layer containing metal oxides, a curing binder and a curing agent as an active component according to the present invention
  • the antistatic layer formed on the surface of the base polymer is not damaged even if a washing process is performed using an alkaline aqueous solution, and thus can be used for a polymer film for a washing process.
  • an antistatic polymer film, surface-treated using the same method maintains its antistatic property even if a washing process is performed using an alkaline aqueous solution.
  • polymer products, embossed or processed in other forms by applying heat or pressure also have constant surface resistance even if a washing process is performed using an alkaline aqueous solution, and thus have the effect of maintaining an antistatic property.
  • the surface resistance of a polyester film was 10 ohm/Sq.. However, it was found that, after the ultrasonic washing of the polyester film in a 5% sodium hydroxide aqueous solution, the surface resistance thereof was 10 ohm/Sq or more, and thus the polyester film was found to exhibit an insulating property.
  • the surface resistance of the polyester film produced through the above method was 10 ohm/Sq. However, it was observed that, after the ultrasonic washing of the polyester film in a 5% sodium hydroxide aqueous solution, the surface resistance
  • the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
  • This film the same as in Comparative Example 1, was put into a 5% sodium hydroxide aqueous solution, washed using ultrasonic waves, and then the surface resistance thereof was observed.
  • the surface resistance thereof did not change for 40 minutes of ultrasonic washing, but it was observed that the surface resistance thereof was 10 ohm/Sq or more when ultrasonic washing of the polyimide film was performed for 90 minutes or more, thereby changing a polyimide film to have insulation properties.
  • Example 1 tin oxide particles, having a particle size of 3 D and doped with antimony, were surface-treated with an acrylate silane coupling agent.
  • 5 g of the tin oxide was surface-treated using 0.1 g of silane having methacrylate functional groups, and was then mixed with 30 g of methylcellosolve, 2.5 g of an epoxy resin and 0.75 g of a curing agent to prepare an antistatic coating solution.
  • the antistatic coating solution was applied to a thickness of 1.0 D on the surface of a polyimide film having a thickness of 125 D to form an antistatic layer, thereby producing an antistatic polyimide film.
  • the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
  • This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured to be 10 ohm/Sq without change of resistance.
  • Example 2 carbon nanotubes were used as an antistatic agent instead of tin oxides.
  • Example 2 was the same as Example 1, except that the carbon nanotubes were acid-treated, and were then surface-treated using an epoxy silane coupling agent, and 0.7 g of the treated carbon nanotubes were mixed and used.
  • the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
  • This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed not to have changed, and to be 10 ohm/Sq.
  • Example 3 is the same as Example 1, except that glycidoxypropyltrimethoxysilane, which is an epoxy silane coupling agent, was used as a coupling agent.
  • the surface resistance of the polyimide film produced through the above method was measured to be 10 ohm/Sq.
  • This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed not to have changed, and to be 10 ohm/Sq. Further, this film was cut to predetermined sizes, put into a 10% potassium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed to be 10 ohm/Sq. Accordingly, it was found that the surface resistance of the polyimide film had not greatly changed, and thus that the polyimide film can endure an alkaline aqueous solution of high concentration.
  • Example 4 was the same as Example 1, except that a polyethyleneterephthalate film having a thickness of 125 D was used as a base polymer film.
  • the surface resistance of the film produced through the above method was observed to be 10 ohm/Sq.
  • This film was cut to predetermined sizes, put into a 5 mol% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed not to have changed, and to be 10 ohm/Sq.
  • Example 5 was the same as Example 3, except that a mixed solution, in which 0.5 g of an epoxy silane coupling agent (glycidoxypropyltrimethoxysilane) was mixed with 67 g of isopropyl alcohol, was first applied on the surface of a polyimide film as a primer, and then the antistatic solution of Example 3 was applied on the coated surface thereof.
  • an epoxy silane coupling agent glycidoxypropyltrimethoxysilane
  • the surface resistance of the polyimide film produced through the above method was observed to be 10 ohm/Sq.
  • This film was cut to predetermined sizes, put into a 5% sodium hydroxide aqueous solution, ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, the surface resistance thereof was observed to be 10 ohm/Sq. Accordingly, it was found that the polyimide film could endure the sodium hydroxide aqueous solution. Further, this film was cut to predetermined sizes, put into a 10% potassium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured.
  • Example 6 was the same as Example 4, except that an antistatic polyester film, like that produced in Example 4, was cut to a width of 35.1 mm, and then embossments having a height of 1.2 mm were formed thereon, thereby manufacturing a spacer tape.
  • the surface resistance of the center portion of the embossed spacer produced through the above method was 10 ohm/Sq.
  • the surface resistance of the embossed portion thereof was somewhat increased, to about 10 ohm/Sq., but the antistatic properties were maintained.
  • This embossed spacer was cut to predetermined sizes, put into a 5 mol% sodium hydroxide aqueous solution, and ultrasonically treated for 90 minutes, and then the surface resistance thereof was measured. As a result, it was found that the surface resistances of the center portion and the embossed portion thereof were not changed.
  • An antistatic composition according to the present invention and polymer products manufactured using the same can be used in a washing process using an alkaline aqueous solution, and the antistatic performance thereof can be maintained even if a washing process is performed using an alkaline aqueous solution by applying the antistatic composition on the surface of a polymer and thus forming an antistatic layer.
  • the antistatic composition can be used in the field of an antistatic spacer, for example, a spacer for a flexible printed circuit board, specifically, for a washing process thereof using an alkaline aqueous solution.

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  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
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  • Paints Or Removers (AREA)
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Abstract

La présente invention concerne une composition antistatique qui peut être utilisée dans des processus de lavage effectués avec une solution aqueuse alcaline, c'est-à-dire qu'elle peut être utilisée pour fabriquer des produits polymères antistatiques qui peuvent résister aux solvants basiques, cette invention portant également sur les produits polymères antistatiques produits avec cette dernière. La composition antistatique renferme de 0,1 à 20 parties en poids d'oxydes métalliques ou de nanotubes de carbone, de 0,5 à 20 parties en poids d'une résine thermodurcissable, de 0,02 à 5 parties en poids d'un agent de durcissement, et de 55 à 99,38 parties en poids d'un solvant. Cette composition antistatique est appliquée sur une surface d'un polymère de base au moyen d'une solution et peut être réutilisée sans modifier la résistance de la surface suite à un processus de lavage effectué avec une solution aqueuse alcaline.
PCT/KR2007/000562 2006-02-01 2007-02-01 Composition antistatique pouvant être lavée avec une solution basique et produits polymères fabriqués au moyen de cette dernière WO2007089114A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008553167A JP2009525379A (ja) 2006-02-01 2007-02-01 塩基性洗浄液で洗浄可能な帯電防止組成物およびこれを用いて製造された高分子製品
CN2007800043679A CN101379161B (zh) 2006-02-01 2007-02-01 碱性溶液可清洗的抗静电组合物和使用其而制得的聚合物产品

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KR10-2006-0009878 2006-02-01
KR1020060009878A KR100856148B1 (ko) 2006-02-01 2006-02-01 염기성 세척액으로 세척 가능한 대전방지 조성물 및 이를이용해 제조된 고분자 제품

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WO2007089114A1 true WO2007089114A1 (fr) 2007-08-09

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KR (1) KR100856148B1 (fr)
CN (1) CN101379161B (fr)
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EP2048116A1 (fr) * 2007-10-09 2009-04-15 ChemIP B.V. Dispersion de nanoparticules dans des solvants organiques
WO2009083562A1 (fr) * 2007-12-27 2009-07-09 Essilor International (Compagnie Generale D'optique) Composition de revêtement durcissable à base de nanotube de carbone produisant des articles revêtus résistant à l'abrasion et antistatiques
EP2960310A1 (fr) * 2014-06-27 2015-12-30 Henkel AG&Co. KGAA Revêtement conducteur transparent pour substrats rigides et flexibles

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