WO2007036456A3 - Sic-pn-leistungsdiode - Google Patents
Sic-pn-leistungsdiode Download PDFInfo
- Publication number
- WO2007036456A3 WO2007036456A3 PCT/EP2006/066482 EP2006066482W WO2007036456A3 WO 2007036456 A3 WO2007036456 A3 WO 2007036456A3 EP 2006066482 W EP2006066482 W EP 2006066482W WO 2007036456 A3 WO2007036456 A3 WO 2007036456A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- drift zone
- sic
- conductivity type
- zone
- layer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Abstract
Die Erfindung betrifft eine integrierte vertikale SiC-PN-Leistungsdiode, mit einem hochdotierten ausgebildeten SiC-Halbleiterkörper eines ersten Leitfähigkeitstyps, mit einer niedrig dotierten Driftzone des ersten Leitfähigkeitstyps, die emitterseitig über dem Halbleiterkörper angeordnet ist, mit einer Emitterzone eines zweiten Leitfähigkeitstyps, die auf der Driftzone aufgebracht ist, und mit zumindest einer innerhalb der Driftzone angeordneten dünnen Zwischenschicht des ersten Leitfähigkeitstyps, die eine gegenüber der Driftzone höhere Dotierungskonzentration aufweist und die die Driftzone zumindest in eine erste anodenseitige Driftzonenschicht und zumindest in eine zweite katodenseitige Driftzonenschicht unterteilt. Die Erfindung betrifft ferner eine Schaltungsanordnung mit solchen SiC-PN-Leistungsdioden.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06793619A EP1946377A2 (de) | 2005-09-29 | 2006-09-19 | Sic-pn-leistungsdiode |
US12/088,298 US7646026B2 (en) | 2005-09-29 | 2006-09-19 | SiC-PN power diode |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005046707A DE102005046707B3 (de) | 2005-09-29 | 2005-09-29 | SiC-PN-Leistungsdiode |
DE102005046707.5 | 2005-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007036456A2 WO2007036456A2 (de) | 2007-04-05 |
WO2007036456A3 true WO2007036456A3 (de) | 2007-06-21 |
Family
ID=37900115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/066482 WO2007036456A2 (de) | 2005-09-29 | 2006-09-19 | Sic-pn-leistungsdiode |
Country Status (5)
Country | Link |
---|---|
US (1) | US7646026B2 (de) |
EP (1) | EP1946377A2 (de) |
KR (1) | KR20080070638A (de) |
DE (1) | DE102005046707B3 (de) |
WO (1) | WO2007036456A2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7671409B2 (en) * | 2004-06-11 | 2010-03-02 | Panasonic Corporation | Wide gap semiconductor power device with temperature independent resistivity due to channel region resistivity having negative temperature dependence |
SE532625C2 (sv) | 2007-04-11 | 2010-03-09 | Transic Ab | Halvledarkomponent i kiselkarbid |
US7687891B2 (en) * | 2007-05-14 | 2010-03-30 | Infineon Technologies Ag | Diode having one or more zones of a first conductivity type and one or more zones of a second conductivity type each located within a layer of the second conductivity type |
EP2073274A1 (de) * | 2007-12-19 | 2009-06-24 | ABB Technology AG | Diode |
DE102008036554A1 (de) | 2008-08-06 | 2010-02-11 | Endress + Hauser Process Solutions Ag | Autarkes Feldgerät oder autarker Funkadapter für ein Feldgerät der Automatisierungstechnik |
EP2437287A4 (de) * | 2009-05-28 | 2014-03-19 | Toyota Motor Co Ltd | Verfahren zur herstellung einer diode und diode |
JP5506938B2 (ja) | 2010-08-24 | 2014-05-28 | 三菱電機株式会社 | エピタキシャルウエハ及び半導体装置 |
CN103222056B (zh) * | 2010-09-27 | 2016-08-10 | Abb技术有限公司 | 双极非穿通功率半导体装置 |
JP5872327B2 (ja) * | 2011-03-10 | 2016-03-01 | 株式会社東芝 | 半導体整流素子 |
US8860040B2 (en) | 2012-09-11 | 2014-10-14 | Dow Corning Corporation | High voltage power semiconductor devices on SiC |
US9018639B2 (en) | 2012-10-26 | 2015-04-28 | Dow Corning Corporation | Flat SiC semiconductor substrate |
US9738991B2 (en) | 2013-02-05 | 2017-08-22 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion |
US9017804B2 (en) * | 2013-02-05 | 2015-04-28 | Dow Corning Corporation | Method to reduce dislocations in SiC crystal growth |
US9797064B2 (en) | 2013-02-05 | 2017-10-24 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion |
US11721547B2 (en) * | 2013-03-14 | 2023-08-08 | Infineon Technologies Ag | Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device |
US8940614B2 (en) | 2013-03-15 | 2015-01-27 | Dow Corning Corporation | SiC substrate with SiC epitaxial film |
US20140284659A1 (en) * | 2013-03-21 | 2014-09-25 | Bourns, Inc. | Transient Voltage Suppressor, Design and Process |
US9279192B2 (en) | 2014-07-29 | 2016-03-08 | Dow Corning Corporation | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology |
US10415154B2 (en) | 2015-12-02 | 2019-09-17 | Mitsubishi Electric Corporation | Silicon carbide epitaxial substrate and silicon carbide semiconductor device |
DE102016111844A1 (de) * | 2016-06-28 | 2017-12-28 | Infineon Technologies Ag | Leistungshalbleitervorrichtung |
DE102017131354A1 (de) * | 2017-12-27 | 2019-06-27 | Infineon Technologies Ag | Ein Halbleiterbauelement mit breitem Bandabstand und ein Verfahren zum Bilden eines Halbleiterbauelements mit breitem Bandabstand |
DE102018100296A1 (de) * | 2018-01-09 | 2019-07-11 | TenneT TSO GmbH | Gleichspannungs-Netzanbindungssystem |
JP7319501B2 (ja) | 2019-10-09 | 2023-08-02 | 株式会社東芝 | 基板の製造方法、半導体装置の製造方法、基板及び半導体装置 |
JP7292175B2 (ja) | 2019-10-16 | 2023-06-16 | 株式会社東芝 | 半導体装置 |
CN110854208B (zh) * | 2019-11-28 | 2021-04-02 | 电子科技大学 | 一种含埋层结构的碳化硅PiN二极管 |
JP7319502B2 (ja) | 2020-01-09 | 2023-08-02 | 株式会社東芝 | 炭化珪素基体の製造方法、半導体装置の製造方法、炭化珪素基体、及び、半導体装置 |
JP7187620B1 (ja) * | 2021-07-13 | 2022-12-12 | 昭和電工株式会社 | SiCエピタキシャルウェハ及びSiCエピタキシャルウェハの製造方法 |
CN115472668A (zh) * | 2022-05-05 | 2022-12-13 | 安世半导体科技(上海)有限公司 | 半导体器件及其制造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997029518A1 (de) * | 1996-02-05 | 1997-08-14 | Siemens Aktiengesellschaft | Durch feldeffekt steuerbares halbleiterbauelement |
WO1998016951A1 (en) * | 1996-10-14 | 1998-04-23 | Abb Research Ltd. | A method for producing a silicon carbide bipolar device and a silicon carbide bipolar device |
WO1999053549A1 (de) * | 1998-04-14 | 1999-10-21 | Infineon Technologies Ag | Universal-halbleiterscheibe für hochvolt-halbleiterbauelemente |
WO2002099869A1 (en) * | 2001-05-25 | 2002-12-12 | Abb Research Limited | A method concerning a junction barrier schottky diode, such a diode and use thereof |
US6611021B1 (en) * | 1999-10-20 | 2003-08-26 | Fuji Electric Co., Ltd. | Semiconductor device and the method of manufacturing the same |
US20050048701A1 (en) * | 2001-02-21 | 2005-03-03 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method for the same |
WO2005088729A2 (de) * | 2004-03-11 | 2005-09-22 | Siemens Aktiengesellschaft | Halbleiterbauelement, insbesondere diode, und zugehöriges herstellungsverfahren |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10207522B4 (de) * | 2001-02-23 | 2018-08-02 | Fuji Electric Co., Ltd. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
US6849874B2 (en) * | 2001-10-26 | 2005-02-01 | Cree, Inc. | Minimizing degradation of SiC bipolar semiconductor devices |
JP4539011B2 (ja) * | 2002-02-20 | 2010-09-08 | 富士電機システムズ株式会社 | 半導体装置 |
-
2005
- 2005-09-29 DE DE102005046707A patent/DE102005046707B3/de not_active Expired - Fee Related
-
2006
- 2006-09-19 US US12/088,298 patent/US7646026B2/en not_active Expired - Fee Related
- 2006-09-19 WO PCT/EP2006/066482 patent/WO2007036456A2/de active Application Filing
- 2006-09-19 EP EP06793619A patent/EP1946377A2/de not_active Withdrawn
- 2006-09-19 KR KR1020087010300A patent/KR20080070638A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997029518A1 (de) * | 1996-02-05 | 1997-08-14 | Siemens Aktiengesellschaft | Durch feldeffekt steuerbares halbleiterbauelement |
WO1998016951A1 (en) * | 1996-10-14 | 1998-04-23 | Abb Research Ltd. | A method for producing a silicon carbide bipolar device and a silicon carbide bipolar device |
WO1999053549A1 (de) * | 1998-04-14 | 1999-10-21 | Infineon Technologies Ag | Universal-halbleiterscheibe für hochvolt-halbleiterbauelemente |
US6611021B1 (en) * | 1999-10-20 | 2003-08-26 | Fuji Electric Co., Ltd. | Semiconductor device and the method of manufacturing the same |
US20050048701A1 (en) * | 2001-02-21 | 2005-03-03 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method for the same |
WO2002099869A1 (en) * | 2001-05-25 | 2002-12-12 | Abb Research Limited | A method concerning a junction barrier schottky diode, such a diode and use thereof |
WO2005088729A2 (de) * | 2004-03-11 | 2005-09-22 | Siemens Aktiengesellschaft | Halbleiterbauelement, insbesondere diode, und zugehöriges herstellungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
US7646026B2 (en) | 2010-01-12 |
KR20080070638A (ko) | 2008-07-30 |
WO2007036456A2 (de) | 2007-04-05 |
US20080217627A1 (en) | 2008-09-11 |
DE102005046707B3 (de) | 2007-05-03 |
EP1946377A2 (de) | 2008-07-23 |
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