WO2006038563A1 - リニアモータ、ステージ装置、及び露光装置 - Google Patents
リニアモータ、ステージ装置、及び露光装置 Download PDFInfo
- Publication number
- WO2006038563A1 WO2006038563A1 PCT/JP2005/018167 JP2005018167W WO2006038563A1 WO 2006038563 A1 WO2006038563 A1 WO 2006038563A1 JP 2005018167 W JP2005018167 W JP 2005018167W WO 2006038563 A1 WO2006038563 A1 WO 2006038563A1
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- WIPO (PCT)
- Prior art keywords
- linear motor
- reticle
- liquid
- coil
- stage
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K16/00—Machines with more than one rotor or stator
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/18—Machines moving with multiple degrees of freedom
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/46—Fastening of windings on the stator or rotor structure
- H02K3/47—Air-gap windings, i.e. iron-free windings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
- H02K9/197—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil in which the rotor or stator space is fluid-tight, e.g. to provide for different cooling media for rotor and stator
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
- H02K9/227—Heat sinks
Definitions
- the present invention relates to a linear motor having a refrigerant coil unit, a stage device including the linear motor as a drive device, and an exposure apparatus that exposes a mask pattern onto a substrate using a stage that is moved by driving the linear motor. Is.
- Patent Document 1 discloses a technique using pure water as a refrigerant.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-86486
- thermosetting resin such as polyurethane that is difficult to hydrolyze
- the molding temperature by the thermosetting resin maintains the shape of the coil body. Therefore, there is a problem that the fusion layer is destroyed because it is higher than the heat-resistant temperature of the fusion layer.
- an inert refrigerant must be used in the past. If the heat recovery efficiency when the motor is driven is not sufficient, the surface temperature may rise, leading to the measurement error of the above-mentioned length meter and the thermal deformation of surrounding members and devices.
- the present invention has been made in consideration of the above points, and includes a linear motor with high heat recovery efficiency and capable of suppressing a rise in surface temperature, a stage apparatus including the linear motor, and an exposure apparatus.
- the purpose is to provide.
- the present invention employs the following configuration corresponding to FIGS. 1 to 12 showing the embodiment.
- the linear motor of the present invention includes a coil unit (141) that is disposed in the surrounding member (142) so as to face the temperature adjusting liquid channel (142a), and at least a part of which is in contact with the liquid.
- the coil unit (141) has a coil body (144), a molding layer (143) that covers the coil body (144) and holds it in a predetermined shape, and has a liquidproof property against the liquid. And a liquid-proof layer (150) covering the layer (143).
- the linear motor of the present invention even when an active refrigerant such as water having a large heat capacity is used as the temperature adjusting liquid, for example, water is waterproofed by the liquid-proof layer (150). (144) insulation can be secured.
- the coil body (144) is covered with the molding layer (143) and held in a predetermined shape, even when the liquid-proof layer (150) is formed by thermosetting resin, the coil body (144) is melted. It is possible to cover with a liquid-proof layer (150) without destroying the adhesion layer. Therefore, the heat generated in the coil unit (141) By collecting with a threshold liquid, it is possible to suppress the rise in surface temperature, and to prevent measurement errors of the length meter and thermal deformation of surrounding members and devices.
- the stage device of the present invention is characterized in that the linear motor (79) is used as a driving device.
- the stage apparatus of the present invention even when the stage (RST) is driven by the linear motor (79), the heat generated by driving the motor can be absorbed effectively, and the surrounding members In addition, it is possible to suppress changes in ambient air temperature.
- the exposure apparatus of the present invention exposes the pattern of the mask (R) held on the mask stage (RST) onto the substrate (W) held on the substrate stage (WST).
- the stage device (12) is used for at least one of the mask stage (RST) and the substrate stage (WST).
- the exposure apparatus of the present invention even when the mask (R) and the substrate (W) are moved through the mask stage (RST) and the substrate stage (WST), the ambient due to the heat generated by the motor drive It is possible to improve the pattern transfer accuracy to the substrate (W) by suppressing thermal deformation of the device and changes in ambient air temperature.
- the present invention it is possible to use a highly active refrigerant having endothermic characteristics while maintaining electrical insulation, and even when the motor is driven with high thrust, an increase in the surface temperature of the coil unit is suppressed. It becomes possible to control. As a result, in the present invention, it is possible to prevent the measurement error of the measuring device and the thermal deformation of the surrounding member's device.
- FIG. 1 is a partially cutaway view showing a schematic configuration of a projection exposure apparatus according to the present invention.
- FIG. 2 is a perspective view showing the configuration of the frame-like member and reticle stage of FIG. 1.
- FIG. 3 is an exploded perspective view showing the configuration of the reticle stage, frame member, and reticle base in FIG. 1.
- FIG. 4A is a perspective view showing the reticle stage of FIG. 1.
- FIG. 4B is a cross-sectional view of the reticle stage as viewed in the Y direction.
- FIG. 5 is a cross-sectional view of the illumination system side plate, reticle stage, and reticle base of FIG. 1 as viewed in the Y direction.
- FIG. 6 is a cross-sectional view of the main part of the illumination system side plate, reticle stage, and reticle base of FIG. 1 as viewed in the X direction.
- FIG. 7A is a plan view of a coil unit.
- FIG. 7B is a front sectional view of the coil unit.
- FIG. 8A is a plan view of a coil unit according to a second embodiment.
- FIG. 8B is a front sectional view of the coil unit according to the second embodiment.
- FIG. 9 is a cross-sectional view of a coil unit according to a third embodiment.
- FIG. 10 is a cross-sectional view of a coil unit according to a fourth embodiment.
- FIG. 11 is an enlarged view of the main part of the derivation unit in FIG.
- FIG. 12 is a flowchart showing an example of a semiconductor device manufacturing process.
- R reticle (mask), RST: reticle stage (mask stage), W: Ueno (substrate), WST: wafer stage (substrate stage), 10 ... projection exposure apparatus (exposure apparatus), 12 ... Reticle stage device (stage device), 79 ⁇ ⁇ axis voice coil motor (linear motor), 140 ⁇ , 140 ⁇ ⁇ coil unit, 141 ⁇ coil body, 142 ⁇ frame (enclosure member), 142a... Internal space (flow path), 143 ... mold layer (molded layer), 150 ... waterproof layer (liquid-proof layer), 151 ... thin plate body (molded layer), 170 ... lead-out part, 171 ... wiring Best form for
- the present invention is applied to a stage apparatus provided in a scanning exposure type projection exposure apparatus (scanning stepper) having a step-and-scan method.
- FIG. 1 shows a schematic configuration of a projection exposure apparatus (exposure apparatus) 10 of this example.
- the projection optical system 10 provided in the projection exposure apparatus 10 takes the Z axis parallel to the optical axis AX of the PL, and Y in the scanning direction of the reticle and wafer (details will be described later) during scanning exposure in a plane perpendicular to the Z axis.
- An explanation will be given by taking the axis and taking the X axis in the non-scanning direction orthogonal to the scanning direction.
- the projection exposure apparatus 10 in this example drives the illumination optical system unit IOP and the reticle R on which a circuit pattern as a mask is formed with a predetermined stroke in the Y direction, and also in the X direction, the Y direction, and the ⁇ z direction (Z axis).
- a reticle stage device 12 as a stage device that is finely driven in a rotational direction around (W), projection optical system PL, wafer stage W as a substrate, wafer stage (substrate stage) WST that drives the wafer W in the XY plane in the XY two-dimensional direction, and These control systems are provided.
- the illumination optical system unit IOP includes an exposure light source and an illumination optical system, and has a rectangular or arcuate illumination area IAR of the pattern surface of the reticle R defined by a field stop (reticle blind) arranged therein. Is illuminated with exposure light IL as an exposure beam with a uniform illuminance distribution.
- An illumination system similar to the illumination optical system is disclosed in, for example, Japanese Patent Laid-Open No. 6-349701.
- vacuum ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or F laser light (wavelength 157 nm) is used.
- exposure light IL vacuum ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or F laser light (wavelength 157 nm) is used.
- exposure light IL vacuum ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or F laser light (wavelength 157 nm) is used.
- exposure light IL vacuum ultraviolet light such as ArF excimer laser light
- far-ultraviolet light such as KrF excimer laser light (wavelength 248 nm), ultraviolet emission line (g-line, i-line, etc.) of ultra-high pressure mercury lamp power, etc.
- illumination system side plate (cap plate) 14 is arranged below illumination system side plate (cap plate) 14 as a plate having annular mounting portion 101 connected to the lower end of illumination optical system unit IOP in FIG. Has been.
- the illumination system side plate 14 is supported substantially horizontally by a support member (not shown), and a rectangular opening 14a serving as an optical path (passage) for the exposure light IL is formed at a substantially central portion thereof.
- the reticle stage device 12 is a surface plate disposed substantially in parallel at a predetermined interval below the illumination system side plate 14.
- the reticle base 16 is supported substantially horizontally by a support member (not shown).
- the reticle base 16 is composed of a substantially plate-like member, and a convex guide portion 16a is formed at substantially the center thereof.
- the upper surface (guide surface) of this guide part 16a is finished with extremely high flatness, and a rectangular opening with the X direction as the longitudinal direction for allowing the exposure light IL to pass in the Z direction is provided at the approximate center of the guide part 16a.
- 16b is formed.
- the projection optical system PL is arranged on the lower surface side of the reticle base 16 so as to correspond to the rectangular opening 16b.
- the reticle stage RST includes a reticle stage body 22 having a special shape as shown in FIG. 4A, various magnet units (details will be described later) fixed to the reticle stage body 22, and the like.
- Reticle stage body 22 includes a substantially rectangular plate-like portion 24A as viewed from above, a mirror portion 24B provided at the X-direction end of plate-like portion 24A, and one side of plate-like portion 24A in the Y direction. And a pair of extending portions 24C1, 24C2, 24D1, and 24D2 that project from the other end in the Y direction.
- a stepped opening 22a having an opening for allowing the exposure light IL to pass therethrough is formed at a substantially central portion of the plate-like portion 24A, and a stepped portion of the stepped opening 22a (
- a plurality of (for example, three) reticle support members 34 that support the reticle R at a plurality of points (for example, three points) on the lower side force are provided in the portion dug down by one step.
- a plurality of (for example, three) reticle fixing mechanisms 34P are provided on the plate-like portion 24A so as to sandwich and fix the reticle R in correspondence with the reticle support members 34, respectively.
- Reticle R is in a state where its pattern surface (lower surface) force substantially matches the neutral surface CT (surface that does not expand and contract when subjected to bending moment) of reticle stage body 22 (reticular stage RST). These are supported by a plurality of support members 34 (see FIG. 4B). Note that various chucks such as a vacuum chuck or an electrostatic chuck can be used in place of or together with the reticle support member 34 and the reticle fixing mechanism 34P.
- the mirror portion 24B has a substantially prismatic shape with the Y direction as the longitudinal direction, and a circular cross section for reducing the weight at the center.
- the cavity CH is formed.
- the end surface of the mirror part 24B in the -X direction is mirror-finished
- the reflective surface is 124m (see Fig. 5).
- the reticle stage body 22 including the plate-like portion 24A and the mirror portion 24B is integrally formed (for example, formed by cutting out one member), but in this example, it is necessary to make the explanation easy to understand. Accordingly, the expression as if each part is a separate member is also used. Of course, any one of the above-described parts may be configured as a separate member from the other, or all may be configured as a separate member.
- FIG. 4A two concave portions 24gl and 24g2 force are formed at the Y-direction end of the plate-like portion 24A of the reticle stage body 22, and each of the concave portions 24gl and 24g2 has a moving mirror.
- Retro reflectors 32A and 32B are provided.
- the four extending portions 24C1, 24C2, 24D1, 24D2 have a substantially plate shape, and each extending portion is provided with a reinforcing portion having a triangular cross section for improving the strength.
- the bottom surface of the reticle stage body 22 is formed with a first differential exhaust type static gas pressure bearing that extends from the extended portion 24C1 to the extended portion 24D1, and extends from the extended portion 24C2.
- a second differential exhaust type static gas bearing is formed over the entire area in the Y direction leading to section 24D2.
- FIG. 6 which is a partial cross-sectional view of the reticle stage apparatus 12 of FIG. 1, the first and second differential exhaust type static gas bearing forces on the bottom surface of the reticle stage main body 22
- a clearance of about several zm above the upper surface of the guide portion 16a Reticle stage RST is lifted and supported without contact.
- substantially annular concave grooves 83, 85 are formed on the upper surface of the frame-shaped member 18 in a double manner.
- the inner groove (hereinafter referred to as “air supply groove”) 83 has a plurality of air supply ports (not shown) formed therein, and the outer groove (hereinafter referred to as “exhaust groove”). 85 is formed with a plurality of exhaust ports (not shown).
- An air supply port formed in the air supply groove 83 is connected to a gas supply device (not shown) via an air supply line (not shown) and an air supply pipe.
- the exhaust port formed in the exhaust groove 85 is connected to a vacuum pump (not shown) through an exhaust pipe and an exhaust pipe (not shown).
- an air supply groove and an exhaust groove (not shown) each having a substantially annular concave groove are formed on the bottom surface of the frame-shaped member 18 so as to correspond to the air supply groove 83 and the exhaust groove 85 on the upper surface.
- the exhaust groove is also connected to a gas supply device and a vacuum pump (not shown).
- a differential exhaust type gas static pressure bearing that floats and supports the frame-like member 18 on the upper surface of the reticle base 16 is configured including the air supply groove and the exhaust groove.
- pressurized gas is sprayed from the air supply groove (not shown) on the bottom surface of the frame-shaped member 18 to the upper surface of the reticle base 16.
- the dead weight of the frame-shaped member 18 is supported by the static pressure of the injected pressurized gas, and the frame-shaped member 18 is levitated and supported on the upper surface of the reticle base 16 through a clearance of about several ⁇ m.
- the differential exhaust including the air supply groove 83 and the exhaust groove 85 on the upper surface of the frame-shaped member 18 to substantially maintain the clearance between the frame-shaped member 18 and the illumination system side plate 14.
- a gas hydrostatic bearing of the type is configured.
- pressurized gas is sprayed from the air supply groove 83 formed on the upper surface of the frame-shaped member 18 to the lower surface of the illumination system side plate 14, A predetermined clearance is maintained between the frame-shaped member 18 and the illumination system side plate 14 by the tolerance between the static pressure of the applied pressurized gas and the vacuum suction force.
- the reticle stage drive system drives the reticle stage RST in the Y direction and the first drive mechanism that finely drives in the ⁇ z direction (rotation direction around the Z axis). And a second drive mechanism that finely drives reticle stage RST in the X direction.
- the former first drive mechanism includes a pair of Y-axis drive units 36 and 38 installed in the Y direction inside the frame-shaped member 18, and the latter second drive mechanism includes the frame-shaped member.
- 18 is configured to include an X drive unit 40 installed in the Y direction on the ⁇ X direction side of the Y axis drive unit 38 on the + X direction side inside 18.
- the one Y-axis drive unit 36 includes stator units 136A and 136B in which a pair of coil units each having the Y direction as a longitudinal direction are arranged. And a pair of fixing members 152 for holding the stator units 136A and 136B at one end and the other end in the Y direction (longitudinal direction).
- the stator units 136A and 136B are held by the pair of fixing members 152 so as to face each other at a predetermined interval in the Z direction (vertical direction) and to be parallel to the XY plane.
- Each of the pair of fixing members 152 is fixed to the inner wall surface of the frame-shaped member 18 described above.
- the stator units 136A and 136B are formed of a non-magnetic material having a rectangular cross section (rectangular shape) as shown in FIG. 5 which is a cross sectional view of the vicinity of the reticle stage main body 22 in FIGS.
- a plurality of coils are arranged at predetermined intervals in the Y direction.
- a refrigerant for cooling the coil flows in the frame. Details of the refrigerant will be described later.
- the Y-axis drive unit 38 on the + X direction side is configured similarly to the one Y-axis drive unit 36. That is, the Y-axis drive unit 38 includes a stator unit 138A, 138B in which a pair of upper and lower coil units each having a longitudinal direction in the Y direction are disposed, and these stator units 138A
- 138B is fixed at both ends while maintaining a predetermined distance in the Z direction.
- Each of the pair of fixing members 154 is fixed to the inner wall surface of the frame-shaped member 18 described above.
- the stator units 138A and 138B are the same as the stator unit 136 described above.
- the configuration is the same as A and 136B (see Figure 5).
- reticle stage RST is interposed between upper stator units 136A and 138A and lower stator units 136B and 138B via predetermined clearances, respectively. It is arranged.
- mover units 26A and 26B each having a pair of magnet units (magnetic pole units) are embedded in the upper and lower surfaces of reticle stage RST so as to face stator units 136A and 136B, respectively.
- Unit 138
- a and 138B are opposed to each other, and mover units 28A and 28B each having a pair of magnet units are embedded in the upper and lower surfaces of reticle stage RST.
- the magnet units of the mover units 26A, 26B and 28A, 28B units in which a plurality of permanent magnets that generate magnetic fields in the Z direction are arranged in the Y direction while reversing the polarity at a predetermined pitch are used. Force You can use an electromagnet instead of the permanent magnet.
- each of the mover units 26A and 26B is provided on the reticle stage body 22 on the ⁇ X direction side of the stepped opening 22a of the plate-like portion 24A of the reticle stage body 22 described above. They are arranged in recesses 24el and 24e 2 formed on the upper and lower surface sides symmetrically with respect to the neutral plane CT.
- the stator units 136A and 136B in FIG. 5 are located at substantially symmetrical positions with respect to the neutral plane CT.
- Each of 6A and 26B includes a magnetic member and a plurality of magnets arranged on the surface of the magnetic member at predetermined intervals along the Y direction. The plurality of magnets have opposite polarities between adjacent magnets. Therefore, an alternating magnetic field is formed along the Y direction in the space above the mover unit 26A and the space below the mover unit 26B.
- each of the pair of mover units 28A, 28B has a reticle on the + X direction side of the stepped opening 22a of the plate-like portion 24A of the reticle stage body 22 described above.
- the neutral surface CT of the stage body 22 is arranged in the recesses 24fl and 24f2 formed on the upper and lower surfaces symmetrically with respect to the CT.
- the pair of mover units 28A and 28B has a mover unit with respect to a straight line parallel to the Z axis passing through the center position in the X direction of the stepped opening 22a (substantially coincident with the X direction position of the center of gravity of the reticle stage RST). 26A, 26B and left-right symmetrical arrangement.
- the first stator units 138A and 138B in FIG. 5 are located at substantially symmetrical positions with respect to the neutral plane CT.
- Each of the pair of mover units 28A and 28B includes a magnetic member and a plurality of magnets arranged on the surface of the magnetic member at predetermined intervals along the Y direction.
- the plurality of magnets have opposite polarities between adjacent magnets. Accordingly, an alternating magnetic field is also formed along the Y direction in the space above the mover unit 28A and the space below the mover unit 28B.
- the upper stator units 136A and 138A of the Y-axis drive units 36 and 38 described above, and the mover units 26A and 28A arranged to face the reticle stage main body 22 side As shown in FIG. 5, a first Y-axis linear motor 76A and a second Y-axis linear motor 78A are configured.
- the lower stator cue 136B and 138B on the lower side of the Y-axis drive units 36 and 38 and the corresponding mover unit 26B and 28B on the reticle stage main body 22 side are respectively shown in FIG.
- a third Y-axis linear motor 76B and a fourth Y-axis linear motor 78B are configured.
- first drive mechanism described above is composed of first, second, third, and fourth Y-axis linear motors 76A, 78A, 76B, and 78B, each serving as a single-axis drive device.
- the four-axis Y-axis linear motors 76A, 78A, 76B, and 78B in this example are moving magnet types, so there is no need to connect wires to the members that move with a wide stroke. , Can be enhanced.
- the current in the X direction is supplied to the coil in the stator unit 136A as the stator, so that the current flowing through the coil and the mover as the mover Magnet force in unit 26 ⁇
- Electromagnetic interaction with magnetic field generated in 3 ⁇ 4 direction generates electromagnetic force (Lorentz force) in the ⁇ direction in the coil in stator unit 136A according to Fleming's left-hand rule .
- the reaction (reaction force) of the electromagnetic force becomes a thrust for driving the mover unit 26 ⁇ ⁇ ⁇ ⁇ in the ⁇ direction relative to the stator unit 136A.
- the third and fourth spindle linear motors 76 ⁇ and 78 ⁇ generate thrust to drive the mover units 26 ⁇ and 28 ⁇ in the ⁇ direction relative to the stator units 136B and 138B, respectively.
- stator stator units 136A, 138A, 136B, 138B
- mover mover
- the stator moves slightly in the opposite direction to the mover due to the electromagnetic force (action). Therefore, in this specification, a member having a relatively large moving amount is called a mover or a mover unit, and a member having a relatively small moving amount is called a stator or a stator unit.
- stator shafts 136A, 138A, 136B, and 138B of the first, second, third, and fourth shaft linear motors 76 ⁇ , 78 ⁇ , 76 ⁇ , and 78 ⁇ are shown in FIG. It is connected to a frame-shaped member 18 as a first member via shaft drive parts 36, 38, and the mover units 26 ⁇ , 28 ⁇ , 26 ⁇ , 28 ⁇ are each a reticle stage RST (reticle stage main body as a second member in FIG. It is fixed to 22).
- reticle stage RST reticle stage main body as a second member in FIG. It is fixed to 22.
- the first and second shaft linear motors 76 ⁇ and 78 ⁇ ⁇ are arranged approximately symmetrically apart from each other in the X direction so that the reticle R is sandwiched therebetween, and the reticle stage RST Drive in the ⁇ direction.
- the third and fourth shaft linear motors 76 ⁇ and 78 ⁇ ⁇ are arranged so as to face the first and second shaft linear motors 76 ⁇ and 78 ⁇ , and are respectively relative to the frame-like member 18.
- the first and third Y-axis linear motors 76A and 76B on the X direction side are driven so as to generate the same thrust in the Y direction synchronously.
- the second and fourth Y-axis linear motors 78A and 78B on the + X direction side are also driven to generate the same thrust in the Y direction in synchronization.
- the first and third Y-axis linear motors 76A and 76B and the second and fourth Y-axis linear motors 78A , 78B are further synchronized with each other, and the reticle stage RST is driven in the Y direction with respect to the frame member 18 with substantially the same thrust.
- the thrust generated by the first and third Y-axis linear motors 76A and 76B and the second and fourth Y is controlled.
- the mover units 26A and 26B and the mover units 28A and 28B are symmetric with respect to the neutral plane CT of the reticle stage RST.
- the stator units 136A and 136B and the stator units 138A and 138B in FIG. 5 corresponding to these mover units are also arranged symmetrically with respect to the neutral plane CT.
- the reticle stage RST Y-direction driving force (the resultant force of the driving force of the mover unit 26A, 26B and the resultant force of the driving force of the mover unit 28A, 28B) can be applied to two locations on the neutral plane CT (see Fig. 4B).
- the pitching moment is prevented from acting on the reticle stage RST as much as possible.
- the mover units 26A, 26B and the mover units 28A, 28B are Also in the X direction, the positions near the center of gravity of reticle stage RST are arranged almost symmetrically. For this reason, the driving force in the Y direction acts at two locations equidistant in the X direction from the center of gravity of the reticle stage RST. By generating the same force at these two locations, the vicinity of the center of gravity position of the reticle stage RST It is possible to apply the resultant force of the driving force in the Y direction to the force S. Therefore, for example, when the reticle stage main body 22 is linearly driven in the Y direction, the rising moment is prevented from acting as much as possible on the reticle stage RST.
- the X drive unit 40 on the second drive mechanism side includes a stator unit 140A, 140B as a pair of stators whose longitudinal direction is the Y direction, and fixing these A pair of fixing members 156 holding the child units 14 OA and 140B at one end and the other end in the Y direction (longitudinal direction) are provided.
- the stator units 140A and 140B are held by the pair of fixing members 156 so as to face each other at a predetermined interval in the Z direction (vertical direction) and to be parallel to the XY plane.
- Each of the pair of fixing members 156 is fixed to the inner wall surface of the frame-shaped member 18 described above.
- stator units 140A and 140B have a frame made of nonmagnetic material force having a rectangular cross section (rectangular shape), and a coil unit 141 is disposed therein.
- FIG. 7A is a plan view of the stator units 140A and 140B, and FIG. 7B is a front sectional view.
- the coil unit 141 is accommodated in an internal space 142a of a frame 142 made of a nonmagnetic material.
- This internal space 142a is a flow path for temperature-adjusting refrigerant (liquid), and the coil unit 141 is arranged facing the flow path 142a, so that the heat generated by energization is recovered by the refrigerant. It has become.
- the refrigerant to be used water having a large specific heat and high cooling efficiency (particularly pure water) can be used.
- Hyde mouth fluoroether for example, “Novec HFE”: manufactured by Sumitomo 3EM Co., Ltd.
- fluorine-based inert liquid for example, “Fluorinert”: manufactured by Sumitomo 3EM Co., Ltd.
- pure water is used.
- flange portions 143a and 143b for joining to the frame 142 are provided to extend.
- the coil unit 141 has flange portions 143a, 143 In b, it is integrally fixed to the frame 142 by fastening means 148, 149 such as mounting bolts.
- the coil unit 141 mainly includes a coil body 144, a mold layer (molding layer) 143 that covers the coil body 144 and maintains its shape, and a waterproof layer (liquid-proof layer) 150 that covers the mold layer 143. It is configured.
- the coil body 144 is formed in a substantially 0-shape (oval shape) by winding a wire such as a copper wire.
- the shape of the coil body 144 is maintained by a fusion layer (not shown) formed by heat fusion or alcohol fusion, and is electrically insulated from the surroundings by an insulation layer (not shown) such as polyimide or polyamideimide. Holds sex.
- a core member 146 is provided at the core of the coil body 144 in order to maintain the shape of the coil body 144.
- the core member 146 is formed of PPS resin.
- the core member 146 may be used as a core for winding a wire when the coil body 144 is formed, or may be inserted after the coil body 144 is formed.
- the core member 146 can also be used for fixing the coil body 144 to the frame 142 and securing the refrigerant flow path 142a.
- the configuration in which the coil body 144 has the core member 146 is described.
- the force coil body 144 may be configured without the core member 146.
- the mold layer 143 is formed of a high heat-resistant epoxy resin which is a synthetic resin having high heat resistance and excellent moldability and compatibility with the waterproof layer 150.
- the mold layer 143 needs to have a function of suppressing the deformation of the coil body 144 that may be deformed by the thrust generated by the linear motor.
- a plurality of coil bodies 144 are arranged and connected to form one coil unit.
- High heat-resistant epoxy resin is also suitable as a mold layer in this respect.
- the waterproof layer 150 is formed of a material having a waterproof property against pure water as a refrigerant, and here, polyurethane resin is used to coat (cover) the surface of the mold layer 143. ing.
- polyurethane resin is used to coat (cover) the surface of the mold layer 143. ing.
- a permanent magnet 30 for generating a magnetic field is arranged in the plate-like Z direction.
- a magnet unit composed of a magnetic member and a pair of flat permanent magnets fixed to the upper and lower surfaces thereof may be used.
- the permanent magnet 30 and the stator units 140A and 140B have substantially symmetrical shapes and arrangements with respect to the neutral plane CT (see FIGS. 4B and 5). Therefore, the electromagnetic interaction between the Z-direction magnetic field formed by the permanent magnet 30 and the current flowing in the ⁇ -direction through the coils constituting the stator units 140A and 140B, respectively, according to Fleming's left-hand rule.
- An X-direction electromagnetic force (Lorentz force) is generated in the coil, and the reaction force of this electromagnetic force becomes the thrust that drives the permanent magnet 30 (reticle stage RST) in the X direction.
- the frame-shaped member 18 slightly moves in the reverse direction so as to cancel out the reaction force when driving the reticle stage RST in the X direction. Therefore, the generation of vibrations when driving the reticle stage RST in the X direction is also suppressed.
- the X-direction is positioned at the position on the neutral plane CT of the reticle stage RST (see FIG. 4B).
- a driving force can be applied, and as a result, the rolling moment does not act on the reticle stage RST as much as possible! /.
- stator units 140A and 140B and the permanent magnet 30 constitute a moving magnet type X-axis voice coil motor (linear motor) 79 capable of minutely driving the reticle stage RST in the X direction. Speak.
- the reticle stage RST of this example in FIG. 2 is supported so as to be relatively displaceable with three degrees of freedom in the X direction, the Y direction, and the 0 z direction in a guideless manner with respect to the frame member 18.
- thrust is generated in the Y direction.
- Four-axis Y-axis linear motors 76A, 78A, 76B, 78B generate thrust in the X direction.
- a 1-axis X-axis voice coil motor 79 and a 5-axis drive unit are provided.
- the side surface in the + X direction and the side surface in the + Y direction of the aforementioned frame-shaped member 18 further include a magnet unit that forms a magnetic field in the Z direction, as shown in FIG.
- Movers 60A, 60B, 60C are provided.
- the reticle base 16 includes stators 62A, 62B, and coils that pass current in the Y direction via support bases 64A, 64B, and 64C.
- a stator 62C including a coil to be flowed is provided.
- the mover 60A and the stator 62A, and the mover 60B and the stator 62B constitute an X-direction drive trim motor having a moving magnet type voice coil motor force.
- the mover 60C and the stator 62C constitute a trim motor for driving in the Y direction, which is a moving magnet type voice coil motor force.
- the frame member 18 slightly moves so as to cancel the action.
- the position in the XY plane may gradually shift. Therefore, for example, by periodically returning the position of the frame-shaped member 18 to the center using a trim motor including the mover 60A to 60C and the stator 62A to 62C, the position of the frame-shaped member 18 is removed from the reticle base 16. Can be prevented.
- a concave portion 18a is formed at substantially the center of the X-direction side wall of the frame-shaped member 18.
- a rectangular opening 18b that communicates the inside and the outside of the frame-like member 18 is formed in the concave portion 18a.
- a rectangular opening 18c that connects the inside and the outside of the frame-shaped member 18 is formed in the side wall on the ⁇ Y side of the frame-shaped member 18.
- an X-axis laser interferometer 69X is provided outside the rectangular opening 18b so as to face the reflecting surface 124m of the mirror portion 24B of the reticle stage RST.
- the measurement beam from the X-axis laser interferometer 69X is projected onto the reflecting surface 124m of the mirror section 24B through the rectangular aperture 18b.
- the reflected light returns into the X-axis laser interferometer 69X through the rectangular opening 18b.
- the position of the optical path of the measuring beam in the Z direction coincides with the position of the neutral plane CT
- the position of the neutral plane CT coincides with the pattern surface (reticle surface) of the reticle R.
- a fixed mirror Mrx is provided via a mounting member 92 in the vicinity of the upper end of the lens barrel of the projection optical system PL.
- the reference beam from the X-axis laser interferometer 69X is projected to the fixed mirror Mrx through the through hole (optical path) 71 formed in the reticle base 16, and the reflected light returns into the X-axis laser interferometer 69X.
- the reflected light of the length measurement beam and the reflected light of the reference beam are combined into light of the same polarization direction by the internal optical system, and the interference light of both reflected light is combined by the internal detector. Receive light.
- the X-axis laser interferometer 69X Based on the detection signal of the detector, the X-axis laser interferometer 69X always detects the position of the reticle stage body 22 in the X direction with a resolution of, for example, 0.5 to about Lnm with the fixed mirror Mrx as a reference. To do. Further, the velocity in the X direction of the reticle stage main body 22 (usually substantially 0) is also detected from the difference in position in the X direction.
- FIG. 6 which is a YZ sectional view near the reticle stage device 12 in FIG.
- Y-axis laser interferometers 69YA and 69YB are provided so as to face the reflecting surfaces of the retro reflectors 32A and 32B.
- the measurement beams from the Y-axis laser interferometers 69YA and 69YB are respectively projected onto the reflecting surfaces of the retroreflectors 32A and 32B through the rectangular aperture 18c, and the respective reflected lights are transmitted through the window glass g2.
- the position of the measurement beam irradiation point in the Z direction almost coincides with the position of the neutral plane CT (reticle surface).
- a fixed mirror Mry is provided via a mounting member 93 in the vicinity of the upper end of the lens barrel of the projection optical system PL.
- the reference beams from the Y-axis laser interferometers 69YA and 69YB are respectively projected to the fixed mirror Mry through the through-hole (optical path) 72 formed in the reticle base 16, and the respective reflected lights are projected to the Y-axis.
- laser interferometer 69YA, 69Y B is similar to the above-described X-axis laser interferometer 69X based on the interference light between the reflected light of the measurement beam and the reflected light of the reference beam.
- the position of the reticle stage main body 22 in the Y direction is always detected with a resolution of, for example, 0.5 to about Lnm with respect to the fixed mirror Mry.
- the pair of Y-axis laser interferometers 69YA and 69YB can also detect the amount of rotation of reticle stage RST about the Z-axis. Further, the speed in the Y direction of reticle stage main body 22 is also detected from the difference in position in the Y direction.
- the position in the Z direction of the optical path of the measurement beam of the X-axis laser interferometer 69X as described above coincides with the position of the neutral plane CT (reticle plane). It is possible to accurately measure the position of reticle stage RST (reticle R) in the X direction without error. For the same reason, the pair of Y-axis laser interferometers 69YA and 69YB can achieve high measurement accuracy without so-called Abbe error.
- FIG. 1 Note that three of the mirror part 24B and the retro-reflectors 32A and 32B as the moving mirror are illustrated as the moving mirror Mm in FIG. 1, and the X-axis laser interferometer 69X and a pair of Y-axis laser interferences are shown.
- the total 69YA and 69YB are shown as reticle interferometer 69 in FIG.
- the fixed mirrors (fixed mirrors Mrx and Mry) of FIGS. 5 and 6 are not shown.
- reticle interferometer 69 the position (including ⁇ z rotation) of reticle stage RST in the XY plane is measured by reticle interferometer 69.
- Position information (or velocity information) of reticle stage RST from reticle interferometer 69 is sent to stage control system 90 in FIG. 1 and main controller 70 via this, and stage control system 90
- stage control system 90 In response to an instruction from the control device 70, the driving of the reticle stage RST is controlled based on the position information of the reticle stage RST.
- a reduction system having a projection magnification of 1Z4 or 1Z5, which is a bilateral telecentric and is composed of a refractive system or a catadioptric system, is used.
- a reduced image of the pattern in the illumination area IAR of the reticle R through the projection optical system PL is exposed on the wafer W placed on the image plane of the projection optical system PL under the exposure light IL.
- One shot area is transferred onto the elongated exposure area IA on the resist layer.
- Wafer W as the substrate to be exposed is a disk-shaped substrate having a diameter of, for example, 150 to 300 mm, such as a semiconductor (silicon or the like) or SOI (silicon on insulator).
- Projection optical system PL includes a holding portion (not shown) via a flange portion FLG provided in the lens barrel portion. It is held by the material.
- wafer stage WST is arranged in wafer chamber 80.
- the wafer chamber 80 is covered with a partition wall 73 in which a circular opening 71a for passing the lower end portion of the projection optical system PL is formed at a substantially central portion of the ceiling portion.
- the partition wall 73 is made of a material with little degassing such as stainless steel (SUS).
- a wafer base BS force made of a surface plate is supported substantially horizontally via a plurality of vibration isolation units 86.
- Wafer stage WST holds the wafer and W by vacuum suction or the like via wafer holder 25, and is driven in the XY two-dimensional direction along the upper surface of wafer base BS by a wafer drive system (not shown) including a linear motor, for example.
- a wafer drive system (not shown) including a linear motor, for example.
- a light transmission window 185 is provided on the side wall on the ⁇ Y direction side of the partition wall 73 of the wafer chamber 80. Similarly, a light transmission window is also provided on the side wall on the + X direction side of the force partition 73 (not shown). Further, a Y-axis moving mirror 56 Y having a plane mirror force is extended in the X direction at the end of the wafer holder 25 on the ⁇ Y direction side. Similarly, an X-axis moving mirror having a plane mirror force is extended in the Y direction at the end of the force wafer holder 25 (not shown) on the + X direction side.
- the Y-axis laser interferometer 57Y and the X-axis laser interferometer (not shown) outside the wafer chamber 80 are used to measure the length of the measuring beam force.
- the X-axis moving mirror (not shown) is irradiated.
- Y-axis laser interferometer 57Y and X-axis laser interferometer are respectively the position and rotation angle of the corresponding moving mirror with respect to the internal reference mirror, for example, the X direction, the Y direction position, and the X axis of the wafer W. Measure the rotation angle around the Y and Z axes.
- the measured values of the Y-axis laser interferometer 57Y and the X-axis laser interferometer are supplied to the stage control system 90 and the main controller 70.
- the stage control system 90 uses the measured values and the control information from the main controller 70 as the control information. Based on this, the position and speed of the wafer stage WST are controlled via a drive system (not shown).
- reticle loading and wafer loading are performed by a reticle loader and wafer loader (not shown). Then, reticle alignment, wafer Reticle alignment and wafer alignment are performed using a reference mark plate on stage WST, an off-axis alignment detection system (both not shown), and the like.
- the wafer stage WST is first moved so as to be the scanning start position for the exposure of the first shot area (first 'shot) on the wafer W.
- the reticle stage RST is moved so that the position of the reticle R becomes the scanning start position.
- the stage control system 90 measures the position information of the reticle R measured by the reticle interferometer 69 and the wafer side Y-axis laser interferometer 57Y and the X-axis laser interferometer.
- the reticle R (reticle stage RST) and wafer W (wafer stage WST) are moved synchronously in the Y direction (scanning direction) and irradiated with the exposure light IL based on the position information of the wafer W. Scan exposure is performed on the shot.
- the displacement of the reticle stage RST in the X direction is measured and monitored by the X-axis laser interferometer 69X, and the stage control system 90 cancels the displacement.
- the molding temperature of the polyurethane forming the waterproof layer 150 is approximately 200 ° C.
- the heat resistant temperature of the high heat-resistant epoxy resin forming the mold layer 143 is 300 ° C or higher. Even when molding, the mold layer 143 is not adversely affected. Furthermore, even if the fusion layer of the coil body 144 is melted when the waterproof layer 150 is molded and the effect of adhesion to the coil is lost, the shape of the coil itself is retained by the mold layer 143. An error in the thrust constant is suppressed.
- the present embodiment it is possible to use an active refrigerant having high endothermic characteristics while maintaining electric insulation, and even when the motor is driven with high thrust, the surface temperature of the stator units 140A and 140B can be reduced. It is possible to suppress the rise. Therefore, in this embodiment, measurement errors of the reticle interferometer (laser interferometer) 69 and thermal deformation of surrounding members / devices can be prevented.
- FIGS. 8A and 8B a second embodiment of the linear motor according to the present invention will be described with reference to FIGS. 8A and 8B.
- the same components as those of the first embodiment shown in FIGS. 7A and 7B are denoted by the same reference numerals, and the description thereof is omitted.
- the illustration of the frame 142 is omitted, and only the coil unit 141 is illustrated. Further, in the coil unit 141 shown in FIGS. 8A and 8B, for the sake of convenience, it is illustrated as a rectangular cross-sectional shape with the flange portion omitted.
- FIG. 8A is a plan view of the coil unit 141
- FIG. 8B is a front sectional view.
- the coil body 144 is wrapped with a cylindrical thin plate body 151.
- This thin plate body 151 is formed in a rectangular frame shape with both ends opened by ultra-thin (eg, 0.1 mm thick) glass epoxy resin without pinholes.
- the coil body 144 is inserted from an opening at one end of the thin plate body 151 and is accommodated in the thin plate body 151 in a fitted state.
- the mold layer 143 is molded so as to cover the thin plate body 151, and the thin plate body 151 and the mold layer 143 constitute the molded layer according to the present invention.
- the mold layer 143 is covered with a waterproof layer 150 formed of polyurethane resin.
- an effect can be obtained. Even when a pinhole is formed in the mold layer 143 during molding and the refrigerant enters through the pinhole, the thin plate 151 can prevent the refrigerant and the coil body 144 from contacting each other. The electrical insulation can be ensured. For this reason, in the present embodiment, it becomes possible to allow pinholes to be formed in the mold layer 143, the accuracy of the molding technique can be relaxed and the molding operation can be facilitated, and the mold layer 143 can be made thinner and eventually fixed. The slave units 140A and 140B and the linear motor 79 can be made thinner.
- FIG. 7A and 7B the same components as those of the first embodiment shown in FIGS. 7A and 7B and the second embodiment shown in FIGS. 8A and 8B are denoted by the same reference numerals, and the description thereof is omitted.
- the coil unit 141 in the present embodiment is fixed to the frame 142 via the core member 146 of the coil body 144.
- the configuration of the second embodiment in which the entire coil body 144 including the core member 146 is covered with the cylindrical thin plate body 151 cannot be adopted. Therefore, only the coil body 144 is covered with the thin plate body 151, and the mold layer 143 and the waterproof layer 150 are formed thereon. In this configuration, the core member 146 and the mold layer 143, and the core member 146 and the waterproof layer 150 are formed. If the adhesion to the core is not good, the refrigerant also enters the interfacial force between the core member and each layer.
- At least one of the misalignment and the layer 152 made of a material is interposed between the core member 146, the mold layer 143, and the waterproof layer 150.
- the adhesion between the PPS resin, which is the material of the core member 146, the polyurethane resin, and the epoxy resin is so high that the glass epoxy is attached to the side surface portion of the core member 146 in contact with the coil body 144.
- a layer 152 of rosin is provided.
- the coil body 144 is covered with a glass epoxy resin thin plate 151 and is molded with an epoxy resin mold layer 143, and further coated with a water-proof layer 150 made of polyurethane resin. Speak.
- the layer 152 formed of glass epoxy resin has high adhesion with epoxy resin and polyurethane resin, it is possible to prevent the refrigerant from entering from the interface with the core member 146.
- a mold layer 143 is provided in addition to the waterproof layer 150.
- the coil unit 141 can be formed with high rigidity, and the shape of the coil unit can be maintained even if a large thrust is applied to the coil body 144 when the linear motor is driven. Also, when the linear motor is assembled, the shape of the coil unit 141 is strong, so that the coil unit 141 can be easily handled! Since defects such as cracks and delamination are unlikely to occur, the reliability of linear motors is improved.
- the waterproof layer 150, the mold layer 143, and the thin plate 151 are formed in this order from the outer surface of the coil unit 141.
- the present invention is not limited to this, and the waterproof layer 150 and the thin plate are formed from the outer surface.
- the body 151 and the mold layer 143 may be formed in this order. Even in this case, the coolant can be prevented from reaching the coil body 144 by the water-proof layer 150 and the thin plate body 151, and the shape of the coil unit 141 can be maintained with high rigidity by the mold layer 143.
- the order of forming these layers may be determined by the adhesion between the materials used for the coil body 144, the thin plate body 151, the mold layer 143, and the waterproof layer 150.
- the surface of the core member 146 made of PPS resin may be modified by ultraviolet irradiation to improve the adhesion to the polyurethane resin and the epoxy resin.
- a metal material for example, titanium having a small relative permeability (preferably 1 to 1.05) and a large specific resistance may be used. Since the metal material can be easily processed with high surface accuracy, the sealing property between the waterproof layer 150 or the frame 142 can be improved.
- the coil unit 141 is disposed facing the refrigerant flow path 142a! Therefore, it is necessary to lead out the wiring of the coil body 144 through the mold layer 143 and the waterproof layer 150.
- the optical member may be clouded by the outgas from the member. Therefore, the material used in the exposure apparatus should be a so-called chemical clean material (for example, fluorine-based material) with little outgas. Is desirable. For this reason, fluorine-based coated wiring is also used for the coating of the wiring led out from the coil body 144 to the outside.
- the fluorine-based coating is a molding material (for example, epoxy resin)
- a lead-out portion for leading out the wiring is provided separately from the coolant flow path to prevent inundation from the interface between the wiring and the mold layer.
- FIG. 10 is a cross-sectional view of the coil unit 141.
- FIG. 11 is an enlarged view of a main part of the derivation unit 170. As shown in FIG. 11, the lead-out portion 170 is provided so as to protrude from one corner of the coil unit 141, and the mold layer 143 is exposed at the lead-out portion 170, and is almost flat with the end face of the waterproof layer 150. A sealing surface 173 is formed.
- the sealing surface 173 is provided with a protrusion 174 in which the wiring 171 is embedded, and a groove 177 in which a sealing material 175 such as an O-ring is disposed surrounds the periphery of the protrusion 174. It is formed as follows.
- the frame 142 is joined to the coil unit 141 at the sealing surface 173, and a flow path 142a is formed between the frame 142 and the coil unit 141.
- the frame 142 has a hole 142b into which the protrusion 174 is fitted.
- the protrusion 174 is provided with a waterproof cover 176 for protecting the lead-out portion of the wiring from the outside.
- the lead-out portion 170 of the wiring 171 is isolated from the refrigerant flow path 142a. Can prevent flooding.
- the sealing material 175 is interposed between the sealing surface 173 and the frame 142 between the outlet portion 170 and the flow path 142a, the sealing surface 173 and the frame 142 are inserted. Even if the refrigerant enters from the flow path 142a in between, the refrigerant can be prevented from reaching the wiring 171 and electrical insulation of the refrigerant with respect to the coil body 144 can be ensured.
- the waterproof cover 176 is provided at the wiring exit portion, even when a liquid such as water falls from the outside, the liquid can enter the coil body 144 through the wiring 171. Can be prevented.
- a configuration in which a ferrule-type waterproofing retaining piece is insert-molded or a sealant material is insert-molded may be employed. Also, insert one of the waterproof terminals into the wiring outlet. It is also possible to adopt a configuration in which In this case, if the waterproof cap of the waterproof terminal has a high adhesion to the mold material, it is possible to prevent water from entering from the interface between the waterproof terminal and the mold material, and to the waterproof terminal. Since the wiring to be connected can be a chemical-clean wiring, the influence on the outgas to the optical member can be reduced. It is desirable that the waterproof terminal should meet IP57 as defined in IEC (International Electrotechnical Commission) standard 60 529!
- the waterproof layer 150 is formed of polyurethane resin, but is not limited to this.
- fluorine resin is formed of silicone resin. It can also be formed (coated).
- inorganic waterproof coatings such as glass coating and nickel coating, or titanium oxide (TiO) or oxidation
- inorganic oxide coating such as silicon (SiO 2).
- coolant is a pure water
- the above-mentioned hide mouth fluoroether and a fluorine-type inert liquid can be used.
- the molding layer may be covered with a liquid-proof layer made of a material having liquid-proof properties against these liquids.
- the force of the linear motor of the present invention applied to the stator units 140A and 140B of the X drive unit 40 is not limited to this.
- the Y-axis drive units 36 and 38 are not limited to this.
- Stator unit 136A, 136B, 138A, 138B [This is applicable.
- the present invention can also be applied to a force wafer stage WST configured to be applied to the reticle stage apparatus 12 as a stage apparatus having a linear motor according to the present invention.
- the open magnetic circuit type linear motor in which one permanent magnet 30 that is a mover is sandwiched between two stator units 140A and 140B that are stators is described.
- the present invention may be applied to a closed magnetic circuit type linear motor in which one permanent magnet 30 sandwiches one coil unit.
- the weight of the mover increases, but the leakage magnetism There is an advantage that the bundle can be reduced.
- the present invention can be applied to a force moving coil type linear motor described as applying the present invention to a moving magnet type linear motor.
- the substrate W of the above embodiment is used not only for a semiconductor wafer for a semiconductor device but also for a glass substrate for a liquid crystal display device, a ceramic wafer for a thin film magnetic head, or an exposure apparatus.
- Mask or reticle master synthetic quartz, silicon wafer, etc. are applied.
- the exposure apparatus 10 in addition to the step-and-scan type scanning exposure apparatus that scans and exposes the pattern of the reticle R by synchronously moving the reticle R and the substrate W, the reticle scale and the substrate W are It can also be applied to a step-and-repeat type projection exposure apparatus in which the pattern of the reticle R is exposed in a stationary state and the substrate W is sequentially moved stepwise.
- the present invention can also be applied to an immersion type exposure apparatus that exposes the pattern of the reticle R onto the substrate W via a predetermined liquid (for example, water).
- the present invention can also be applied to a twin stage type exposure apparatus.
- the structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 2 69 and 6, 590, 634), Special Table 2000—505958 (corresponding to US Pat. No. 5,969,441) US Patent 6,208,407 [disclosed! .
- the type of exposure apparatus 10 is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern on a wafer, but for manufacturing a liquid crystal display element that exposes a liquid crystal display element pattern on a square glass plate. It can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, an image sensor (CCD) or a mask. Furthermore, the present invention can also be applied to an exposure apparatus that projects a spot light onto the wafer W by projecting spot light with the projection optical system PL without using a reticulometer R.
- Bright light (g-line (436 nm), h-line (404.7 nm), i-line (365 nm)), KrF excimer laser (248 nm) that also generates ultra-high pressure mercury lamp force as a light source for exposure illumination light , ArF excimer laser (193 nm), F laser (157 nm) as well as charged particles such as X-rays and electron beams
- ArF excimer laser (193 nm) ArF excimer laser (193 nm), F laser (157 nm) as well as charged particles such as X-rays and electron beams
- a child wire can be used.
- thermionic emission type lanthanum hexabolite (LaB) or tantalum (Ta) can be used as the electron gun.
- a configuration using the reticle R may be used, or a pattern may be formed directly on the wafer without using the reticle R.
- the projection optical system PL when using far ultraviolet rays such as an excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as the glass material, and when using an F laser or X-ray.
- each stage WST, 12 may be a type that moves along a guide or a guideless type without a guide.
- the reaction force generated by the movement of the substrate stage WST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. Further, the reaction force generated by the movement of the reticle stage 12 may be mechanically released to the floor (ground) using a frame member as described in JP-A-8-330224.
- the exposure apparatus 10 provides various mechanical systems including the respective constituent elements recited in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to keep. In order to ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, various electrical systems Adjustments are made to achieve electrical accuracy.
- Various subsystem capabilities The assembly process to the exposure system involves mechanical connections and electrical circuit wiring connections between the various subsystems. Connection, piping connection of atmospheric pressure circuit, etc. are included. Needless to say, there is an assembly process for each subsystem before the assembly process to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. It is desirable to manufacture the exposure apparatus in a clean room where the temperature and cleanliness are controlled.
- step 201 for functional / performance design of the device step 202 for manufacturing a mask (reticle) based on this design step, substrate (wafer) which is the base material of the device Manufacturing step 203, wafer processing step 204 for exposing the mask pattern onto the substrate (weno) by the exposure apparatus 10 of the above-described embodiment, device assembly step (including dicing process, bonding process, and knocking process) 205 It is manufactured through inspection step 206 and the like.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Linear Motors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Motor Or Generator Cooling System (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/664,416 US9804508B2 (en) | 2004-10-01 | 2005-09-30 | Linear motor, stage apparatus, and exposure apparatus |
JP2006539269A JP4765937B2 (ja) | 2004-10-01 | 2005-09-30 | リニアモータ、ステージ装置、及び露光装置 |
CN2005800328104A CN101032068B (zh) | 2004-10-01 | 2005-09-30 | 线性电机、载台装置和曝光装置 |
EP05787500.7A EP1806828A4 (en) | 2004-10-01 | 2005-09-30 | LINEAR MOTOR, FLOOR APPARATUS AND EXPOSURE APPARATUS |
US15/788,745 US10459350B2 (en) | 2004-10-01 | 2017-10-19 | Linear motor, stage apparatus, and exposure apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-289924 | 2004-10-01 | ||
JP2004289924 | 2004-10-01 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/664,416 A-371-Of-International US9804508B2 (en) | 2004-10-01 | 2005-09-30 | Linear motor, stage apparatus, and exposure apparatus |
US15/788,745 Division US10459350B2 (en) | 2004-10-01 | 2017-10-19 | Linear motor, stage apparatus, and exposure apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006038563A1 true WO2006038563A1 (ja) | 2006-04-13 |
Family
ID=36142637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/018167 WO2006038563A1 (ja) | 2004-10-01 | 2005-09-30 | リニアモータ、ステージ装置、及び露光装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US9804508B2 (ja) |
EP (1) | EP1806828A4 (ja) |
JP (1) | JP4765937B2 (ja) |
KR (1) | KR101151575B1 (ja) |
CN (1) | CN101032068B (ja) |
WO (1) | WO2006038563A1 (ja) |
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JP7491827B2 (ja) | 2020-12-14 | 2024-05-28 | 株式会社日立製作所 | 荷電粒子線装置 |
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JP2009017315A (ja) * | 2007-07-05 | 2009-01-22 | Hoya Corp | 画像出力制御機能付き撮影装置 |
TWI579659B (zh) * | 2009-08-07 | 2017-04-21 | 尼康股份有限公司 | An exposure apparatus, and an element manufacturing method |
CN102854752B (zh) * | 2011-05-27 | 2014-07-23 | 恩斯克科技有限公司 | 接近式曝光装置 |
CN102955368B (zh) * | 2011-08-22 | 2015-09-30 | 上海微电子装备有限公司 | 一种步进光刻设备及光刻曝光方法 |
CN105703512B (zh) * | 2016-03-01 | 2018-06-15 | 北京理工大学 | 一种高平面度永磁直线电机平面线圈 |
JP6353018B2 (ja) * | 2016-12-16 | 2018-07-04 | ファナック株式会社 | リニアモータ用電機子及びリニアモータ |
CN107181367A (zh) * | 2017-05-22 | 2017-09-19 | 昆明理工大学 | 一种音圈电机水冷散热保护装置及其使用方法 |
KR102447776B1 (ko) * | 2018-01-19 | 2022-09-26 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치, 동작 방법 및 디바이스 제조 방법 |
JP2020065383A (ja) * | 2018-10-18 | 2020-04-23 | 株式会社日立ハイテク | 真空用リニアモータおよび真空処理装置 |
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- 2005-09-30 CN CN2005800328104A patent/CN101032068B/zh active Active
- 2005-09-30 US US11/664,416 patent/US9804508B2/en active Active
- 2005-09-30 WO PCT/JP2005/018167 patent/WO2006038563A1/ja active Application Filing
- 2005-09-30 KR KR1020077004817A patent/KR101151575B1/ko active IP Right Grant
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2017
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Also Published As
Publication number | Publication date |
---|---|
CN101032068A (zh) | 2007-09-05 |
US10459350B2 (en) | 2019-10-29 |
JPWO2006038563A1 (ja) | 2008-05-15 |
CN101032068B (zh) | 2010-12-22 |
JP4765937B2 (ja) | 2011-09-07 |
KR20070058470A (ko) | 2007-06-08 |
US20180046092A1 (en) | 2018-02-15 |
US9804508B2 (en) | 2017-10-31 |
KR101151575B1 (ko) | 2012-06-01 |
US20080212042A1 (en) | 2008-09-04 |
EP1806828A4 (en) | 2016-11-09 |
EP1806828A1 (en) | 2007-07-11 |
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