WO2005104242A1 - 太陽電池モジュールの製造方法 - Google Patents
太陽電池モジュールの製造方法 Download PDFInfo
- Publication number
- WO2005104242A1 WO2005104242A1 PCT/JP2005/008007 JP2005008007W WO2005104242A1 WO 2005104242 A1 WO2005104242 A1 WO 2005104242A1 JP 2005008007 W JP2005008007 W JP 2005008007W WO 2005104242 A1 WO2005104242 A1 WO 2005104242A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sealing resin
- solar cell
- resin sheet
- sealing
- cell module
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 386
- 229920005989 resin Polymers 0.000 claims abstract description 361
- 239000011347 resin Substances 0.000 claims abstract description 361
- 239000011521 glass Substances 0.000 claims description 46
- 238000004132 cross linking Methods 0.000 claims description 33
- 238000002844 melting Methods 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 19
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 18
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 18
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- 238000009429 electrical wiring Methods 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 64
- 239000000463 material Substances 0.000 description 21
- 238000005336 cracking Methods 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000005357 flat glass Substances 0.000 description 8
- 239000012528 membrane Substances 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 239000005341 toughened glass Substances 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 101001012040 Pseudomonas aeruginosa (strain ATCC 15692 / DSM 22644 / CIP 104116 / JCM 14847 / LMG 12228 / 1C / PRS 101 / PAO1) Immunomodulating metalloprotease Proteins 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
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- 239000004744 fabric Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000005779 cell damage Effects 0.000 description 1
- 208000037887 cell injury Diseases 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/1077—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method for manufacturing a solar cell module.
- the present invention relates to a method for manufacturing a solar cell module in which solar cells are sealed with resin between a light-receiving-surface-side transparent plate and a back plate.
- EVA ethylene-vinyl acetate copolymer
- Patent Document 1 discloses a laminated structure in which two plate-like bodies are joined via an adhesive sheet such that a solar cell is sandwiched between two adhesive sheets.
- a laminate is described in which a sheet piece having substantially the same thickness as the solar cell is sandwiched in a gap formed between the adhesive sheets outside the solar cell.
- JP-A-2003-110127 discloses a solar cell module in which a plurality of solar cells are arranged between a front cover and a back cover and sealed with a transparent filler such as EVA. Describes a solar cell module in which a translucent spacer (setting block) is arranged between solar cells. It is described that it is optimal to use a spacer having the same material as the transparent filler and the same thickness as the solar cell as the spacer. It is said that this spacer can secure an air flow path that is not deformed by the weight of the cover alone. It is described that this allows a solar cell module having no air to remain therein.
- Patent Document 3 JP-A-59-0222978 discloses a filling adhesive for a solar cell module containing an ethylene-based copolymer and an organic peroxide and having embossed patterns on both surfaces thereof. A material sheet is described. It is said that the adhesive sheet has an embossed pattern so that blocking of the sheet can be prevented, the degassing property in the modularizing process is excellent, and bubbles are hardly generated.
- the example of the publication describes a bonding method in which the temperature is raised to 150 ° C. while reducing the pressure in a vacuum laminator, the pressure is reduced at 150 ° C. for 1 hour, and the pressure is stopped, and the pressure reduction is stopped. ing.
- Patent Document 4 discloses that a photovoltaic element is formed as a laminate between a front surface member and a back surface member with a sealing resin interposed therebetween. It describes a solar cell module that is held at a vacuum degree of 5 ⁇ or less for 5 to 40 minutes, heat-pressed at a vacuum degree of 5 Torr or less, cooled and bonded after the heat-press bonding. It is described that a module that hardly causes peeling of the surface member and hardly generates air bubbles is provided by performing thermocompression bonding under such conditions. It is also described that a problem of remaining air bubbles can be improved by inserting a nonwoven fabric between the solar cell and the sealing resin and letting the air of the laminate escape through the voids in the nonwoven fabric.
- Patent Document 5 discloses a solar cell panel laminate in which solar cells are laminated between a cover glass and a back surface material via a filler, and a double vacuum system.
- EVA is used as a filler
- a double vacuum chamber is placed in a specific temperature range at a specific temperature.
- a method for manufacturing a solar cell panel to be held for a while is described. By bonding under specific temperature conditions, it is possible to crosslink all EVA without foaming and yellowing.
- the pressure was reduced to 0.3 Torr (approximately 0.0004 MPa), and then calo-heat was started.
- the temperature of the substrate surface on the heater side reached 140 ° C.
- vacuum compression was performed. After the cross-linking reaction at ° C, it is cooled to 50 ° C or less to release the pressure vacuum bonding.
- Patent Document 1 Utility model registration No. 2500974
- Patent Document 2 JP-A-2003-110127
- Patent Document 3 JP-A-59-0222978
- Patent Document 4 JP-A-09-036405
- Patent Document 5 Japanese Patent Application Laid-Open No. 61-069179
- the present invention has been made to solve such a problem, and a solar cell module capable of preventing damage to the solar cell when sealing the solar cell with resin. It is an object of the present invention to provide a method for producing the same.
- a first invention is directed to a method for manufacturing a solar cell module in which a plurality of solar cells are sealed between a light-receiving surface-side transparent plate and a back plate with a resin.
- Battery cells are arranged at an interval of 5 mm or less and connected to each other with conductors.
- a first sealing resin sheet that covers substantially the entire light-receiving-surface-side transparent plate between the cells and the second sealing resin that covers substantially the entire back plate between the back plate and the solar cells. Place a resin sheet and place a sealing resin sheet piece whose total thickness is greater than the thickness of the solar cells in the margins outside the solar cells.
- a method for manufacturing a solar cell module comprising discharging air between a face plate, heating and melting a resin, and cooling and sealing the solar cell module.
- the transparent plate on the light receiving surface side and the back plate are laminated.
- the sheet piece which does not directly apply a load on the front and back surfaces to the solar cell, receives the load.
- the resin softens and the thickness of the sheet piece under load decreases, and the cell or the portion of the conductor connected to the cell, and the upper and lower sealing resin sheets
- the entire resin sheet is softened, the cell or the conductive wire connected to the cell can be prevented from being subjected to a local load. It can be closely attached so as to be embedded.
- the total thickness of the sealing resin sheet pieces is larger than the total value of the thickness of the solar cell and the thickness of the conductive wire. It is also preferable that the total thickness of the sealing resin sheet pieces is 0.3 mm or more larger than the thickness of the solar cell. It is also preferable that the total thickness of the sealing resin sheet pieces is 1 to 5 mm.
- the sealing resin sheet piece is sandwiched between a first sealing resin sheet and a second sealing resin sheet.
- the sealing resin sheet piece substantially continuously arranged over the entire circumference of the margin portion and the sealing resin sheet piece overlapped therewith and arranged at an interval from each other, It is a preferred embodiment to be sandwiched between the first sealing resin sheet and the second sealing resin sheet.
- the margin at a position inside the sealing resin sheet piece which is arranged substantially continuously over the entire circumference, It is also a preferred embodiment to dispose a narrow sealing resin sheet piece at a position outside one solar cell.
- the first sealed resin sheet or the second sealed resin sheet is configured by laminating a plurality of sealed resin sheets. At this time, in the margin portion, the sealing resin sheet pieces are arranged at intervals from each other, and a plurality of sealing members forming the first sealing resin sheet or the second sealing resin sheet. It is a preferred embodiment to be sandwiched between the fat sheets.
- both the transparent plate on the light-receiving surface side and the back plate have a glass plate force having a warped surface compressive stress of 20 MPa or more, and a sealing operation is performed with the concave surfaces of the warp facing each other.
- the warpage of the glass plate is 0.05 to 0.5%.
- a second invention is directed to a method for manufacturing a solar cell module in which a plurality of solar cells are sealed with resin between a light-receiving surface side transparent plate and a back plate!
- the first sealing resin sheet that arranges the battery cells at intervals and connects them to each other with a conductor, and covers substantially the entire light-receiving-surface-side transparent plate between the light-receiving-surface-side transparent plate and the solar cell. Is disposed, and a second sealing resin sheet covering substantially the entire back plate is disposed between the back plate and the solar cell, and the first sealing resin sheet or the second sealing resin sheet is disposed.
- It is configured by laminating a plurality of sealing resin sheets, and a part of the electric wiring is arranged at a position overlapping without contacting the solar cell, and the first sealing resin sheet or the second sealing resin sheet is arranged. After arranging one sealing resin sheet in the resin sheet so as to be missing at the electric wiring section, the transparent plate on the light receiving surface side and the back surface Air discharge between a method for manufacturing a solar cell module, characterized in that heated to melt the ⁇ sealing and force cooled.
- the method of arranging the solar cells sealed in the solar cell module varies depending on the purpose and application. Usually, a plurality of adjacent solar cells are arranged at a predetermined interval and connected to each other by a conductor. In addition, when connecting cells that are not adjacent to each other or conductors that are far apart, or when drilling holes in the back plate to pull out the electrical wiring, some of the electrical wiring is It may be placed in a vertical position without contacting the cell. In such a case, the electrical distribution When the wires are overlapped, when a load is applied from above and below, excessive load is applied to the overlapped portion to easily cause cell cracking. On the other hand, cell cracking can be prevented by arranging one sealing resin sheet in the first sealing resin sheet or the second sealing resin sheet so as to be missing at the electrical wiring part. It is.
- the sealing resin sheet is thinner than the missing sealing resin sheet at the portion where the sealing resin sheet is missing at the electric wiring portion. It is preferred to supplement Preferably, an insulating film is disposed between the electric wiring and the solar cell, and the insulating film is laminated on the solar cell and the electric wiring via a sealing resin sheet, respectively. is there.
- the step of heating the sealing resin while maintaining the pressure in the sealing processing container at 0.05 MPa or more when sealing in the sealing processing container (step 1)
- a step of reducing the pressure inside the sealing container to a pressure of 0. OlMPa or less at a temperature lower than the melting point of the sealing resin (Step 2). It is preferable to perform a sealing operation in which the steps (Step 3), the step of increasing the pressure in the sealing container (Step 4), and the step of cooling (Step 6) are also performed.
- a third invention relates to a method for manufacturing a solar cell module in which solar cells are sealed with resin between a light-receiving-surface-side transparent plate and a back plate, and further includes a light-receiving-surface-side transparent plate.
- a first sealing resin sheet covering substantially the entire surface of the light-receiving-surface-side transparent plate is arranged between the solar cells, and a second sealing resin sheet covering substantially the entire back plate between the back plate and the solar cells.
- Step 2 OlMPa or less
- Step 3 Performing a sealing operation including a step of increasing the pressure in the sealing processing container (step 4) and a step of cooling (step 6). It is a manufacturing method of a solar cell module according to claim.
- the vertical force can also be hardened against the cell at the time of pressure reduction, and the resin can be prevented from being pressed, thereby preventing cell cracking. can do.
- the heating temperature during the decompression operation is higher than the temperature at which the sealing resin melts. Therefore, a passage for air existing between the transparent plate on the light receiving surface side and the back plate can be ensured, and air bubbles can be prevented from remaining.
- step 1 the inside of the sealing treatment container is heated until the temperature in the sealing treatment container reaches 40 to 65 ° C, and the temperature is maintained within the temperature range for 5 minutes or more.
- step 2 it is also preferable to reduce the pressure to 0.05 Olpa or lower while maintaining the temperature in the sealing treatment container at 40 to 65 ° C.
- step 2 it is also preferable to reduce the pressure to 0.05 MPa pressure to 0.05 OlMPa over 5 minutes or more.
- step 4 it is also preferable that the temperature at the time of increasing the pressure be S120 ° C or less.
- step 4 it is also preferable to simultaneously raise the temperature while increasing the pressure in the sealing treatment container.
- the ratio of the rate of pressure rise (MPaZ) to the rate of temperature rise (° CZ) is 0.001-0.1 (MPaZ ° C).
- the sealing resin is a crosslinkable thermoplastic resin
- the step of raising the temperature to a temperature equal to or higher than the melting point of the sealing resin while reducing the pressure step 3
- the step of increasing the pressure in the sealing container step 4
- the step of raising the temperature to a temperature range in which the crosslinking reaction proceeds step 5
- the step of cooling step 6
- the pressure in the sealing treatment container is maintained at 0.05 MPa or more and at atmospheric pressure or less to advance the crosslinking reaction.
- the solar cell module is a solar cell module in which a plurality of solar cells are sealed with resin, and the plurality of solar cells are arranged at intervals and connected to each other by a conductive wire. It is also preferable that this be done.
- the sealing resin is composed of a resin selected from the group consisting of ethylene vinyl acetate copolymer, polyvinyl butyral and polyurethane. It is.
- FIG. 1 is a schematic cross-sectional view of an example of a solar cell module after a sealing operation.
- FIG. 2 is a schematic cross-sectional view of an example of a laminate before a sealing operation.
- FIG. 3 is a schematic cross-sectional view of another example of a laminate before a sealing operation.
- FIG. 4 is a schematic diagram showing an outer shape of a solar cell module manufactured in an example and solar cell cells arranged therein.
- FIG. 5 is a view (No. 1) showing a step of manufacturing a laminate in an example.
- FIG. 6 is a view (No. 2) showing a step of manufacturing a laminate in the example.
- FIG. 7 is a view (No. 3) showing a step of manufacturing a laminate in the example.
- FIG. 8 is a view (No. 4) showing a step of manufacturing a laminate in the example.
- FIG. 9 is a view (No. 5) showing a step of manufacturing a laminate in the example.
- FIG. 10 is a view (No. 6) showing a step of manufacturing a laminated body in the example.
- FIG. 11 is a schematic view of a sealing apparatus.
- FIG. 12 is a diagram showing temperature and pressure during a sealing process in an example.
- FIG. 1 is a schematic cross-sectional view of an example of a solar cell module after a sealing operation.
- 2 and 3 are schematic cross-sectional views of an example of the laminate before the sealing operation.
- FIG. 1 shows a schematic cross-sectional view of an example of a solar cell module 1 obtained by the manufacturing method of the present invention.
- the solar cell module 1 is formed by sealing a solar cell 4 with a resin 5 between a transparent plate 2 on the light receiving surface side and a back plate 3.
- the number of the solar cells 4 sealed in the solar cell module 1 may be one, but it is preferable that a plurality of solar cells 4 are sealed.
- the light receiving surface 6 and the back surface 7 of the adjacent solar cell 4 are connected via the conducting wire 8.
- solar cell 4 used in the present invention various types of solar cells such as a single-crystal silicon solar cell, a polycrystalline silicon solar cell, an amorphous silicon solar cell, and a compound semiconductor solar cell can be used. .
- These solar cells 4 are generally thin plates having a thickness of 1 mm or less, more generally 0.5 mm or less, and are often rectangular with one side of 5 cm or more.
- a semiconductor substrate such as silicon or germanium, a glass substrate, a metal substrate, or the like can be used.
- a thin plate is desired in view of cost requirements. Since it is a brittle material, it is particularly significant to employ the manufacturing method of the present invention, which is particularly easily broken during sealing.
- the number of solar cells 4 sealed in one solar cell module 1 is not particularly limited, and may be only one. In that case, only the wiring to the outside of the solar cell is connected. However, as the number of solar cells 4 sealed in one solar cell module 1 increases, the reject rate due to damage to the solar cells 4 increases. Is big. Therefore, it is preferable that 10 or more, preferably 30 or more, and more preferably 100 or more solar cells 4 are arranged in one solar cell module 1.
- the width of the gap 9 between the adjacent solar cells 4 is not particularly limited, but is usually 0.5 mm or more, and when it is less than 0.5 mm, the adjacent solar cells 4 come into contact with each other to be sealed. In such a case, the cell may be damaged. If priority is given to daylighting, it is preferable to make the gap 9 wide. If priority is given to light use efficiency, it is preferable to make the gap 9 narrow. It is adjusted appropriately according to the requirements of the application and design.
- the plurality of solar cells 4 be arranged with a predetermined width and connected to each other by a conductor 8.
- the adjacent solar cells 4 are connected between the light receiving surface 6 and the back surface 7 by the conducting wire 8, and a large number of solar cells 4 are connected in series.
- the connection between the light receiving surface 6 or the back surface 7 and the conductor 8 is performed using a conductive adhesive such as solder.
- the conductor 8 is also called an interconnector.
- the material is not particularly limited, and a copper wire or the like is used. It is preferable to use a thin ribbon-shaped conductor 8 because it is sandwiched between the light receiving surface side transparent plate 2 and the back plate 3, and the thickness thereof is usually 0.5 mm or less, and preferably 0.5 mm or less. 3 mm or less. It is usually 0.05 mm or more. It is preferable that the conductive wire 8 be coated with a conductive adhesive such as solder in advance, since the connection work becomes easy. In the state where the conductor 8 is connected, the surface force of the photovoltaic cell 4 The height of the conductor 8 up to the highest part is a force that varies from place to place. In some cases, it is about 5mm thicker.
- the material of the light-receiving-surface-side transparent plate 2 besides glass that is good as long as it is transparent to sunlight, polycarbonate resin, acrylic resin, or the like can also be used. It is preferable to use glass in consideration of durability, hardness, flame retardancy, and the like while pressing. A glass plate having a surface compressive stress of 20 MPa or more is preferable because a structural material having a large area is often formed. In addition, if the area is large, thermal cracks are likely to occur due to temperature rise due to sunshine, etc. It is preferred to use. However, since a glass sheet having a large surface compressive stress is usually manufactured by heating and rapidly cooling a float sheet glass, occurrence of a certain strain is inevitable. Due to the warpage of the glass caused by this, an excessive load is applied to some of the solar cells 4 at the time of sealing, and the production method of the present invention capable of preventing cell breakage immediately has a great benefit.
- the surface compressive stress of the sheet glass is a value measured according to JIS R3222.
- Specific examples of the glass plate having a surface compressive stress of 20 MPa or more include double-strength glass, tempered glass, and ultra-tempered glass. Double-strength glass usually has a surface compressive stress of 20 to 60 MPa, tempered glass has a surface compressive stress of usually 90 to 130 MPa, and ultra-tempered glass has a surface compressive stress of usually 180 to 250 MPa. . As the surface compressive stress increases, the strength increases, but the warpage tends to increase and the manufacturing cost tends to increase. Further, double strength glass is preferable in that a glass with relatively small warpage is manufactured or when the glass breaks immediately, the glass does not fall into small pieces.
- the glass plate is selected according to the application and purpose.
- the back plate 3 does not necessarily have to be transparent, but it is preferable that the back plate 3 is also transparent to sunlight in consideration of lighting. Further, for the same reason as the transparent plate 2 on the light receiving surface side, it is preferable to use glass, particularly a glass plate having a surface compressive stress of 20 MPa or more.
- the material of the glass is not particularly limited, and among the powers in which soda-lime glass is preferably used, a high transmission glass (a so-called white plate glass) is preferably used for the light-receiving surface side transparent plate 2.
- High transmission glass is soda lime glass with a low iron content and high light transmittance.
- the thickness of the glass plate is not particularly limited, but is preferably 3 mm or more, more preferably 5 mm or more, when used as a structural material.
- a thick glass plate is used in this way, the influence of its own weight is large, and the cell may be damaged when the glass plate is stacked on the cell before bonding. large.
- Glass plate thickness Is usually less than 20 mm. Further, when the area of the glass is equal to or more than the force lm 2 adjusted according to the application, there is a great benefit to adopt the production method of the present invention.
- the material of the resin 5 is not particularly limited as long as it is transparent and has adhesiveness and flexibility, but also ethylene-butyl acetate copolymer (EVA), polybutyl butyral, and polyurethane.
- EVA ethylene-butyl acetate copolymer
- a type of resin whose group strength is also selected is preferably used.
- the crosslinked resin is preferable in terms of strength and durability. Therefore, it is preferable that the raw material of the resin 5 is a crosslinkable thermoplastic resin, particularly a resin whose crosslinking reaction proceeds when heated.
- Such resin is sandwiched between the transparent plate 2 on the light-receiving surface side and the back plate 3 in the form of a sheet, heated and melted, and then a crosslinking reaction is allowed to proceed if necessary, and then cooled and solidified to form a solar cell.
- Seal 4 By using a material which is crosslinked by heating, it is possible to obtain a material having excellent durability and adhesiveness.
- the crosslinkable thermoplastic resin is not particularly limited as long as the crosslinking reaction proceeds when heated, and is selected from the group consisting of ethylene-butyl acetate copolymer (EVA), polyvinyl butyral, and polyurethane. Resins are preferably used.
- EVA ethylene-butyl acetate copolymer
- polyvinyl butyral polyurethane
- Resins are preferably used.
- crosslinking can be carried out by mixing and heating a crosslinking agent
- polyurethane crosslinking can be carried out by reacting an isocyanate group
- polyurethane since the crosslinking reaction proceeds at a relatively low temperature, it is suitable when a resin plate having low heat resistance is used for at least one of the transparent plate on the light-receiving side and the back plate.
- polyurethane is excellent in flexibility, so peeling will occur even when a combination of materials with significantly different coefficients of thermal expansion, such as glass and plastic, is used for the transparent plate on the light-receiving side and the back plate. ⁇ It is suitable.
- polyurethane has excellent penetration strength.
- thermoplastic resin containing a crosslinking agent it is preferable to use a thermoplastic resin containing a crosslinking agent.
- the thermoplastic resin at this time is not particularly limited as long as the crosslinking reaction proceeds when heated together with the crosslinking agent, but the ethylene-vinyl acetate copolymer (excellent in transparency, flexibility, durability, etc.) EVA) is most preferably used.
- the sealing resin sheet is sandwiched between the transparent plate 2 on the light-receiving surface side and the back plate 3, heated and melted, and then cooled and solidified to seal the solar cell 4.
- Sealing resin sheet adds cross-linking agent to EVA resin
- the material is contained, and then the resin is heated and melted, then a crosslinking reaction is allowed to proceed, and then, after cooling, it can be sealed with a crosslinked EVA.
- the EVA in the sealed resin sheet should have a melting point of 50 to 80 ° C. as measured by the DSC method. The viewpoint of the balance between transparency and shape retention is also preferable.
- the sealing resin sheet has an appropriate embossing on one surface or both surfaces because it can prevent blocking and easily suppress the residual air bubbles.
- the preferred emboss depth is 10 to 100 m, and if it is too deep, air bubbles may remain on the contrary.
- the thickness of the sheet is preferably 0.2 to 2 mm, more preferably 0.3 to 1 mm, and one or a plurality of the sheets may be stacked and adjusted for use.
- the operation of superimposing the light receiving surface side transparent plate 2 on the lower side is performed.
- the rear surface plate 3 may be firstly disposed on the lower side, and then may be laminated in the reverse order.
- FIG. 2 is a schematic cross-sectional view of an example of the laminated body 60 before the sealing operation, and shows a cross section cut in parallel to a direction in which a plurality of solar cells 4 are connected in series.
- the first sealing resin sheet 20 is superimposed on the light-receiving-surface-side transparent plate 2 so as to cover substantially the entire surface thereof.
- the light receiving surface side transparent plate 2 is preferably a glass plate, particularly a glass plate having a warped surface compressive stress of 20 MPa or more.
- the first sealing resin sheet 20 is stacked on the light-receiving surface-side transparent plate 2 so that the inside of the warp, that is, the concave surface side is on the upper side.
- the warpage of the light-receiving surface side transparent plate 2 is preferably 0.05% to 0.5%.
- the warpage is too large, there is a possibility that a force that tends to peel off inside the module after sealing may remain, more preferably 0.4% or less, and even more preferably 0.3% or less.
- the load of the back plate 3 may be applied to the solar cell 4 near the center of the module during the sealing operation, which may cause cell cracking. 1 or more And more preferably 0.15% or more.
- the thickness of the first sealing resin sheet 20 is preferably 0.5 mm or more, more preferably 1 mm or more. Also, it is usually 5 mm or less, preferably 3 mm or less. By setting the thickness to a certain value or more, the impact can be efficiently absorbed, and the solar cell 4 can be effectively protected. It is preferable that the first sealing resin sheet 20 is configured by laminating a plurality of sealing resin sheets. This is because it becomes easy to adjust the thickness of the first sealing resin sheet 20 according to the use and required performance. In the example of FIG. 2, three sealing resin sheets 21, 22, and 23 are stacked to form a first sealing resin sheet 20. The first encapsulating resin sheet 20 may be partially omitted, for example, in order to dispose a conductive wire that covers substantially the entire light receiving surface side transparent plate 2. ⁇ A plurality of sealing resin sheets arranged on the by-side may be configured.
- the solar cell 4 is placed on the first sealing resin sheet 20. At this time, preferably, a plurality of solar cells 4 connected to each other in the manner described above are placed, and arranged vertically and horizontally as necessary. In this case, the solar cell 4 connected in advance may be placed, the connection may be made on the first sealing resin sheet 20, or the partially connected one may be placed and mounted. And the rest may be connected.
- the width of the gap 9 between the adjacent solar cells 4 is 5 mm or less, preferably 4 mm or less, more preferably 3 mm or less.
- the width of the gap 9 is usually at least 0.5 mm, preferably at least 1 mm.
- sealing resin sheet pieces 40, 41, 42, and 43 having a total thickness greater than the thickness of the solar cell 4 in the margin 10 outside the solar cell 4, the internal pressure is reduced.
- the sealing resin sheet pieces 40, 41, 42, and 43 which can prevent the load due to the atmospheric pressure from both the front and back surfaces from directly applying to the solar cell 4, receive the load. Therefore, in the module The load of the back plate 3 can be prevented from being directly applied to the arranged solar cells 4. Then, as the temperature rises, the resin is softened and the thickness of the encapsulating resin sheet pieces 40, 41, 42, 43, which have a strong load, decreases, and the cell or the conductor connected to the cell is reduced.
- the line 8 and the upper and lower sealing resin sheets come into contact with each other. At this time, the entire resin sheet is softened, so that a cell or cell where local load cannot be applied is prevented.
- the conductive wires 8 connected to the cells can be closely attached so as to be embedded in the softened sealing resin sheet. This can prevent cell cracking in the pressure reduction step. In particular, the larger the number of solar cells 4 enclosed in one solar cell module 1, the higher the reject rate due to damage to the solar cells 4 becomes.
- the benefits of deploying 40, 41, 42, 43 are significant.
- the thickness of the sealing resin sheet pieces 40, 41, 42, 43 arranged in the margin 10 outside the solar cell 4 is such that the total thickness thereof is greater than the thickness of the solar cell 4. It is necessary.
- the total thickness refers to the total thickness when a plurality of sealing resin sheet pieces 40, 41, 42, and 43 are used in an overlapping manner.
- the sealing resin sheet piece is not only disposed between the first sealing resin sheet 20 and the second sealing resin sheet 30, but also the first sealing resin sheet 20 or the second sealing resin sheet 20. This also includes a case where the sealing resin sheet 30 is disposed so as to be sandwiched between a plurality of sealing resin sheets. In the example of FIG.
- the total thickness of the sealing resin sheet pieces 40, 41, 42, and 43 is preferably larger than the total value of the thickness of the solar cell 4 and the thickness of the conductive wire 8 than the total value. 0.2 mm or more thicker is preferable. Further, the total thickness of the sealing resin sheet pieces 40, 41, 42, and 43 is preferably 0.3 mm or more larger than the thickness of the solar cell 4, and more preferably 0.6 mm or more. Specifically, the total thickness of the sealing resin sheet pieces 40, 41, 42, 43 is preferably 1 to 5 mm. The total thickness of the sealing resin sheet pieces 40, 41, 42, 43 is more preferably 1.5 mm or more, and even more preferably 2 mm or more. Also, more preferably, 4 mm Or less, more preferably 3 mm or less.
- the sealing resin sheet pieces 40, 41, 42, and 43 are arranged at intervals in the horizontal direction so that the internal air can be discharged therefrom. By securing a passage for actively discharging the internal air, the remaining air bubbles can be suppressed, and the solar cell module 1 having a good appearance can be manufactured. At this time, if the sealing resin sheet pieces are directly overlapped with each other, at least one of the sealing resin sheet pieces is horizontally spaced between the resin sheet pieces, and the internal air is discharged therefrom. It is good if it can be discharged.
- the sealing resin sheet piece 40 in the margin 10 outside the solar battery cell 4, it is disposed substantially continuously over the entire periphery of the margin 10 on the first sealing resin sheet 20.
- the sealed resin sheet piece 40 preferably has a width of 50% or more of the margin 10 and more preferably has a width of 70% or more.
- the sealing resin sheet piece 40 may also include a plurality of sheet pieces arranged in parallel. It is preferable to dispose the sealing resin sheet pieces 41 on the sealing resin sheet pieces 40 at a distance from each other, whereby the internal air can be discharged smoothly.
- the solar cell 4 is placed on the first sealing resin sheet 20, and the sealing resin sheet piece 40 is placed on the margin 10 outside the solar cell 4, and the sealing resin is placed.
- the sealing resin sheet piece 41 is placed on the sheet piece 40, and the whole is covered with the sealing resin sheet 31 constituting the second sealing resin sheet 30.
- the sealing resin sheet piece 42 is intermittently placed in the margin 10, the whole is covered with two sealing resin sheets 32 and 33, and the sealing resin sheet piece 43 is further placed in the margin 10. It is placed intermittently and the whole is covered with a sealing resin sheet 34.
- the second sealing resin sheet 30 is constituted by the four sealing resin sheets 31, 32, 33, and 34.
- the preferred thickness of the second sealing resin sheet 30 is the same as that of the first sealing resin sheet 20 described above.
- the second sealing resin sheet 30 is substantially the same as the back plate 3. Some may be missing for the placement of conductive wires that cover the entire surface, and may consist of a plurality of sealing resin sheets arranged side-by-side. You can do it.
- the back plate 3 is placed on the second sealing resin sheet 30.
- the back plate 3 is preferably a glass plate, particularly a glass plate having a warped surface compressive stress of 20 MPa or more.
- the warpage of the back plate 3 (a value measured in accordance with JIS R3206) is preferably 0.05% to 0.5%. If the warpage is too large, there is a possibility that a force that tends to peel off inside the module after sealing may remain, more preferably 0.4% or less, and even more preferably 0.3% or less.
- the load of the back plate 3 may be applied to the solar cell 4 near the center of the module during the sealing operation, which may cause cell cracking. It is 1% or more, more preferably 0.15% or more.
- the light-receiving surface side transparent plate 2 and the back surface plate 3 are sealed by using a glass plate having a certain curvature and performing a sealing operation with the concave surfaces facing each other.
- the solar cell 4 can be prevented from being damaged.
- the width of the gap 9 between the adjacent solar cell cells 4 is 5 mm or less, and it is difficult to arrange the sealing resin sheet pieces in the gap 9. Therefore, in order to prevent damage to a large number of solar cells 4 to be sealed, it is necessary to dispose sealing resin sheet pieces 40, 41, 42, and 43 only in the margin 10 outside the solar cells 4. There is.
- the radius of the glass sheet due to its own weight cannot be ignored.
- the weight of the 2810 mm x 1795 mm x 12 mm plate glass used as the back plate 3 in Example 1 described later is as much as 151 kg. Therefore, even if the center of the back plate 3 is radially lowered by its own weight, the light-receiving-surface-side transparent plate 2 and the back plate are so arranged that the load on the back plate 3 is not directly applied to the solar cell 4.
- the three concave surfaces face each other and are sealed. Normally, when manufacturing laminated glass in which nothing is sealed inside, it is often the case that two glass sheets are aligned after the direction of the warpage, and then the present invention employs a different method. It does. Next, the configuration of the second invention will be described with reference to the drawings.
- FIG. 3 is a schematic cross-sectional view of an example of the stacked body 60 before the sealing operation, and shows a cross section cut perpendicularly to a direction in which a plurality of solar cells 4 are connected in series.
- the width of the gap 9 between the adjacent solar cells 4 is 5 mm or less, but in the second invention, the width of the gap 9 may be further increased. If the width of the gap 9 exceeds 5 mm, it is also possible to arrange a sealing resin sheet piece in the gap 9, and in this case, the light receiving surface side where it is not necessary to support the glass sheet only at the periphery Even when a glass plate having a certain curvature is used as the transparent plate 2 and the back plate 3, the necessity of facing the concave surfaces is low.
- the conductor 50 in addition to the conductor 8 connecting the adjacent solar cells 4, the conductor 50 is arranged at a position overlapping the solar cell 4 without contact.
- the conductive wire 50 is arranged in parallel to the direction in which the plurality of solar cells 4 are connected in series, and FIG. 3 shows a cross section thereof. This is for electrically connecting the conductor 8 existing at one end of the group of solar cells 4 connected in series to the conductor 8 existing at the other end to form a binos circuit. Since the conductive wire 50 is disposed at a position vertically overlapping the solar cell 4, when a load is applied from above and below, an excessive load is applied to the overlapped portion, and cell cracking is likely to occur. In the example of FIG.
- the sealing resin sheet piece 41 is placed on the sheet piece 40, and the whole is covered with the sealing resin sheet 31 constituting the second sealing resin sheet 30. This operation is the same as in the example of FIG.
- An insulating film 55 is disposed on the sealing resin sheet 31.
- the insulating film 55 is for ensuring insulation between the conductive wire 50 and the solar cell 4, and is arranged so that the tape-shaped insulating film 55 overlaps the conductive wire 50.
- the sealing resin sheet piece 42 is intermittently placed in the margin 10 on the sealing resin sheet 31. Then, by covering the whole with the sealing resin sheet 32, the insulating film 55 is laminated on the solar cell 4 and the conductor 50 via the sealing resin sheets 31 and 32, respectively.
- the sealing resin sheets 31, 32 may be provided with holes and cutouts as appropriate.
- the sealing resin sheets 31 and 32 may be composed of a plurality of sealing resin sheets arranged on the side of the 'by' side, and the conductor 50 may be drawn out from the gap.
- the conducting wire 50 is arranged on the sealing resin sheet 32.
- the same as the conductor 8 can be used.
- the sealing resin sheet 33 is arranged so as to be cut off at the portion of the conductor 50.
- the sealing resin sheet 33 divided into a plurality of sheets is arranged with a gap so that the conductor 50 is not covered with the sealing resin sheet 33 so that the entire surface of the laminate is covered. ing.
- the sealing resin sheet 33 is locally formed at the portion of the conductor 50 in the sealing operation. It is possible to prevent the cell from being cracked without applying a heavy load to the solar cell 4.
- the width at which the sealing resin sheet 33 is cut off at the conductor 50 may be larger than the width of the conductor 50.
- the thickness of the sealing resin sheet piece 44 is preferably 0.1 mm or more thinner than the sealing resin sheet 33.
- the width of the sealing resin sheet piece 44 may be the same as or smaller than the width of the above-mentioned missing portion. If both overlap, at that part Cell cracking may occur. In consideration of the balance between the workability and the effect of preventing the generation of bubbles, it is preferable that the width is smaller than the width of the missing portion by about 0.5 to LOmm.
- the sealing resin sheet piece 43 is intermittently placed in the margin 10. Then, after covering the whole with the sealing resin sheet 34, the back plate 3 is placed thereon.
- the air between the light-receiving-surface-side transparent plate 2 and the back plate 3 is exhausted, heated to melt the resin, and then cooled and sealed.
- the resin is heated to melt the resin, the crosslinking reaction proceeds, and then the resin is cooled and sealed.
- the device used for sealing is not particularly limited as long as it can perform an air discharging operation and a heating operation. It is preferable to use one having a sealed processing container for housing the laminate 60 therein and capable of performing an air discharging operation and a heating operation.
- a part or the whole of the sealing treatment container is made of a gas-impermeable flexible film.
- a so-called single vacuum system in which the outside of a sealing treatment container made of a gas-impermeable flexible membrane is kept at atmospheric pressure can be used, or a partition wall made of a gas-impermeable flexible membrane can be used.
- a so-called double vacuum system that can adjust the degree of vacuum on both sides of the chamber can also be adopted.
- the single vacuum system is also preferable because it has simple facilities. According to the production method of the present invention, cell cracking can be prevented even in a single vacuum method in which the vertical force of the laminate 60 is applied before the sealing resin is melted.
- the material of the membrane has a certain degree of flexibility and strength, which is better if it is a gas-impermeable flexible membrane, and when the inside of the membrane is evacuated, the external pressure is uniformly applied to the entire laminate.
- the material is not particularly limited as long as it can be used, and a rubber or resin sheet or film can be used.
- the single-vacuum sealing treatment container may be one integrated with the heater, or only a part thereof may be formed of a gas-impermeable flexible film.
- a bag 61 made entirely of a gas-impermeable flexible membrane.
- the sealing container is merely a bag 61, it is possible to flexibly cope with the production of solar cell modules of various shapes and dimensions, and to manufacture products of various dimensions such as building materials. It is particularly suitable for applications that need to be manufactured.
- a bleeder 62 that has a breathable material strength.
- a fabric such as a woven fabric, a knitted fabric, or a non-woven fabric can be used.
- a plurality of the bags 61 into which the laminate 60 is introduced can be arranged in the heating device.
- An exhaustible pipe 63 is connected to each bag 61, and is connected to a vacuum pump 65 via a pressure adjusting valve 64.
- the air between the light-receiving-surface-side transparent plate 2 and the back plate 3 is discharged, heated to melt the resin, cooled by force, and sealed.
- the temperature condition at this time is not particularly limited, and if the temperature is raised to a temperature at which the resin can be melted, the resin may be heated to a temperature higher than the melting point of the resin.
- the sealing resin is a crosslinkable thermoplastic resin, the temperature is raised to a crosslinkable temperature and maintained at a crosslinkable temperature for a predetermined time.
- the pressure is not particularly limited as long as the pressure can be reduced to such a level that the air in the laminate 60 can be exhausted and the remaining air bubbles can be reduced.
- Step 1 a step of heating the sealing resin while maintaining the pressure in the sealing processing container at 0.05 MPa or more (Step 1), Step of reducing the pressure inside the sealing container to a pressure of less than or equal to 0.1 OlMPa at a temperature lower than the melting point of the resin (Step 2), and raising the temperature to a temperature above the melting point of the sealing resin while reducing the pressure (Step 3)
- Step 2 a step of heating the sealing resin while maintaining the pressure in the sealing processing container at 0.05 MPa or more
- Step 2 Step of reducing the pressure inside the sealing container to a pressure of less than or equal to 0.1 OlMPa at a temperature lower than the melting point of the resin
- Step 3 a step of cooling
- Step 6 a step of cooling
- the step 1 is a step of heating the sealed resin while keeping the pressure in the sealing treatment container at 0.05 MPa or more.
- the pressure is at least 0.06 MPa.
- the pressure inside the sealing treatment container may be the atmospheric pressure (0. IMPa), but for example, the pressure should be reduced to 0.09 MPa or less.
- the sealing resin has not been melted yet, if there is a leak in the sealing processing container, it can be repaired at this stage.
- the sealing container when a flexible bag is used as the sealing container, it is preferable to slightly reduce the pressure as described above because the bag is easily damaged.
- the time required for the pressure reducing operation is 10 minutes or more. Although large loads are not applied, sudden pressure reduction may cause cell cracking.
- the sealing resin is softened in advance.
- the temperature reached by the heating at this time is a temperature at which the elastic modulus decreases while the sealing resin does not melt.
- the temperature at which the sealing resin does not melt generally means a temperature lower than the melting point (Tm), preferably (Tm-5) ° C or less, more preferably (Tm-5) ° C. 10) It is below ° C. If the sealing resin does not have a melting point, the melting point may be replaced with a glass transition point or a softening point.
- the preferred temperature for many sealing resins is 65 ° C or less, and the more preferred temperature is 60 ° C or less.
- the temperature reached by the calorific heat is preferably (Tm ⁇ 30) ° C. or more, more preferably (Tm 20) ° C. or more.
- the preferred temperature for many sealing resins is 40 ° C. or higher, and the more preferred temperature is 45 ° C. or higher. If the temperature is too low, the decrease in the elastic modulus of the sealing resin is insufficient, and when the pressure in the sealing container is reduced in step 2, cell cracking may occur. It is preferable to maintain the temperature in such a temperature range for 5 minutes or more before starting the decompression operation in step 2.
- Step 2 is a step of reducing the pressure in the sealing container to a pressure of not more than 0.1 OlMPa at a temperature lower than the melting point of the sealing resin, and is a step that is performed subsequent to step 1.
- the pressure in the sealing container is preferably reduced to 0.005 MPa or less. Effectively reduces air bubbles after sealing by sufficiently reducing pressure Can be suppressed.
- the temperature during the pressure reduction to 0.05MPa in the step 2 to 0.05 OlMPa is maintained in the same temperature range as the temperature reached by the heating described in the step 1. Further, in order to prevent cell cracking due to a rapid pressure reduction operation, it is preferable to slowly reduce the pressure from 0.05 MPa to 0.05 OlMPa over 5 minutes or more.
- Step 3 is a step in which the temperature is raised to a temperature equal to or higher than the melting point of the sealing resin while the pressure is reduced, and is a step performed subsequent to step 2.
- the temperature of the sealing resin is raised, the elastic modulus is greatly reduced near the melting point and changes to a highly viscous liquid.
- step 3 is a step in which the pressure is reduced until such temperature is reached. . If the pressure is reduced and the pressure is increased while the elastic modulus is high, air may flow into the inside of the laminate 60, and air bubbles may remain in the sealing resin.
- the lower limit of the temperature reached by the temperature raising operation in step 3 is preferably (Tm + 10) ° C or more, and more preferably (Tm + 20) ° C or more.
- the preferred lower limit of many sealing resins is at least 80 ° C, more preferably at least 85 ° C.
- the upper limit is usually 200 ° C or less.
- the rate of temperature rise in step 3 is preferably slow, and it is preferable that the time required to raise the temperature from room temperature to the above temperature be 15 minutes or more, and more preferably 30 minutes or more. More preferably 1 hour or more.
- the heating rate may be changed midway, or a balancing operation may be performed to stop the heating and cancel the temperature distribution inside the stacked body 60. From the viewpoint of productivity, the heating time is usually less than 20 hours.
- Step 4 is a step of increasing the pressure in the sealing container
- step 6 is a step of cooling, and both are steps performed after step 3. Either step 4 or step 6 may be performed first, or both steps may be performed simultaneously.
- cooling is usually performed to around room temperature. However, if the cooling rate is too fast, the glass may be broken. Therefore, the cooling is preferably performed for 10 minutes or more, more preferably 30 minutes or more.
- step 4 it is preferable that the pressure be increased slowly, and the time required for the pressure increase be 5 minutes or more, more preferably 10 minutes or more, and more preferably 20 minutes or more. More preferred. From the viewpoint of productivity, the boosting time is usually 5 hours or less, preferably 2 hours. It is as follows.
- the pressure after the pressure can be increased to the same pressure as the atmospheric pressure (0. IMPa), which is preferably 0.05 MPa or more, more preferably 0.07 MPa or more. At this time, the pressure may be increased stepwise. If the temperature at the time of increasing the pressure in step 4 is too high, the molten resin may flow unnecessarily, and the cells may move. Usually, it is preferably 120 ° C or lower, more preferably 100 ° C or lower.
- the step 4 includes a step of simultaneously raising the temperature while increasing the pressure in the sealing treatment container.
- the pressure applied to the laminate 60 can be gradually released in the process of gradually increasing the fluidity, and the molten resin flows unnecessarily while suppressing the generation of residual air bubbles.
- the temperature at the start of pressure increase is (Tm-10) ° C to (Tm + 20) ° C, more preferably (Tm-5) ° C to (Tm + 15) ° C, and 3
- the temperature rise rate (° CZ minute) vs. the pressure rise rate (MPaZ minute) it should be 0.001 to 0.1 (MPa / ° C), and 0.002 to 0.05 (MPa / ° C) is more preferable! / ,.
- Step 3 When a crosslinkable thermoplastic resin is used as the sealing resin, after the step (Step 3) of raising the temperature to near the melting point of the sealing resin while reducing the pressure, the sealing is performed. After the step of increasing the pressure in the processing vessel (Step 4), the process must have a step of raising the temperature to the temperature range where the crosslinking reaction proceeds (Step 5) and a step of cooling (Step 6). Is preferred.
- the temperature is once cooled to a temperature equal to or lower than the melting point, and then, in step 5, the temperature is raised to a temperature range in which the crosslinking reaction proceeds.
- the pressure is increased, it is possible to raise the temperature to the temperature range where the crosslinking reaction proceeds.
- the temperature is raised to a temperature range in which the crosslinking reaction proceeds in step 5, and the crosslinking reaction proceeds.
- a temperature range in which the crosslinking reaction proceeds in step 5 Usually 100 ° C or higher, suitable Is heated to 120 ° C. or higher, more preferably 130 ° C. or higher, and still more preferably 140 ° C. or higher to allow the crosslinking reaction to proceed.
- a crosslinking temperature of 200 ° C or less is usually adopted.
- the time for keeping the temperature range in which the crosslinking reaction proceeds is generally 5 minutes to 2 hours, preferably 10 minutes to 1 hour, depending on the desired degree of crosslinking and the like.
- the pressure in the sealing treatment container when the crosslinking reaction proceeds in step 5 is preferably 0.05
- the vertical force can be reduced. Since the crosslinking reaction proceeds at a high temperature, the melt viscosity of the sealing resin at that time is considerably lower than that near the melting point. Therefore, it is important to prevent the cell from moving and the resin from sticking out at this time without applying unnecessary pressure.
- the pressure is increased to the same pressure as the atmospheric pressure, sink marks may occur depending on the configuration of the laminated body. In such a case, it is preferable to set the pressure lower than the atmospheric pressure. Also, if the pressure is increased to the same pressure as the atmospheric pressure, it becomes difficult for the bleeder to press around the laminate, and the resin may protrude.
- the pressure is set lower than the atmospheric pressure.
- the pressure is preferably lower than the atmospheric pressure by at least 0.001 MPa, more preferably lower than 0.0 OlMPa (in this case, at most 0.09 MPa).
- the atmospheric pressure referred to in the present invention refers to a state in which pressure operation or pressure reduction operation is not actively performed.For example, the pressure is slightly higher than the atmospheric pressure because hot air is forcibly blown into a hot air stove by a fan. Even in such cases, it is substantially the same as atmospheric pressure.
- Step 6 is as described above.
- the solar cell module thus obtained is one in which a plurality of solar cells are regularly arranged without being damaged. Since a large number of solar cells can be sealed with resin without damage, a large-sized solar cell module can be provided. In addition, since the residual air bubbles are suppressed, the resin with a strong edge portion is prevented from protruding, and the resin is correctly aligned and has a beautiful appearance, it is suitably used for the outer walls, roofs, windows, etc. of various buildings.
- Example 1 Example 1
- FIG. 4 shows the outer shape of the solar cell module 1 and the solar cells 4 arranged therein.
- the solar cell 416 square single-crystal silicon solar cells of 100 mm ⁇ 100 mm ⁇ 0.3 mm were used. The four corners are chamfered by several mm.
- the conductor 8 a solder dip copper ribbon wire manufactured by Hitachi Cable, Ltd. was used. The width of the ribbon wire is 1.5 mm and the thickness is 0.15 mm. Solder is printed in advance on the portion of the photovoltaic cell 4 where the light receiving surface 6 and the back surface 7 are bonded to the conductor 8.
- One end of the conducting wire 8 was overlapped and soldered on the solder printing portion of the light receiving surface 6 of the solar cell 4, and the other end was overlapped and soldered on the solder printing portion of the back surface 7 of the adjacent solar cell 4.
- Adjacent cells were connected by two conductors 8 so that the distance between them was 2 mm. That is, the width of the gap 9 is 2 mm.
- a 2810 mm ⁇ 1795 mm ⁇ 12 mm float plate reinforced glass (white plate glass) was used.
- the surface compressive stress of the tempered glass was 100 MPa, and the warpage measured according to JIS R3206 was 0.25%.
- a sealed resin sheet of “Solar Eva SC36” manufactured by Hi-Sheet Industry Co., Ltd. having a thickness of 0.6 mm was cut and used.
- the sealing resin sheet is a mixture of ethylene vinyl acetate copolymer (EVA) with a cross-linking agent, silane coupling agent, stabilizer, etc.
- EVA ethylene vinyl acetate copolymer
- the melting point of the resin before cross-linking measured by the DSC method is 71%. ° C.
- One side of the sealing resin sheet has a shallow enbossed pattern (pear-skinned) with a depth of about 45 m.
- Three transparent sealing resin sheets 21, 22, and 23 having dimensions of 2810 mm x 1795 mm were stacked on the light receiving surface side transparent plate 2 with the concave surface of the warp facing upward.
- the three sealing resin sheets 21, 22, and 23 constitute a first sealing resin sheet 20 having a thickness of 1.8 mm.
- FIG. 5 to FIG. 10 are enlarged views of the upper left portion and the upper right portion (portion surrounded by a dashed line) in FIG.
- 16 sets of 26 solar cells 4 connected in series in the longitudinal direction are arranged in parallel at 2 mm intervals, and a total of 416 cells are placed on the first sealing resin sheet 20.
- the width of the gap 9 between the adjacent solar cells 4 is 2 mm both vertically and horizontally.
- the conductors 8 connected to the photovoltaic cells 4 were connected to each other by a conductor 51 at a position separated by 5 mm.
- the end force of the solar cell 4 The distance to the end of the transparent plate 2 on the light-receiving side, that is, the width of the margin 10 is The length was 80 mm at the left and right edges and 82.5 mm at the upper and lower edges.
- the conductors 51 are connected by the conductor 52.
- solder-dipped copper ribbon wires having a width of 4. Omm and a thickness of 0.25 mm were used.
- a sealing resin sheet piece 40 is arranged in the margin 10.
- the sealing resin sheet piece 40 was arranged along the edge of the light-receiving-surface-side transparent plate 2 over the entire periphery of the margin 10.
- the width of the sealing resin sheet piece 40 is 49 mm
- the width of the sealing resin sheet piece 40 is Is 51.5 mm.
- a sealing resin sheet piece 45 having a width of 15 mm was arranged in parallel with the sealing resin sheet piece 40 at an interval of about 8 mm.
- the distance between the sealing resin sheet piece 45 and the end of the solar battery cell 4 is about 8 mm.
- the sealing resin sheet piece 45 was shifted slightly outside the other margins 10 so that the sealing resin sheet piece 45 did not overlap the conductor 52. Since the sealing resin sheet piece 45 having a width smaller than that of the sealing resin sheet piece 40 is disposed inside, when the sealing resin sheet piece 40 is melted by heating, the solar cell 4 Can be prevented from flowing unevenly in the direction of. Thereby, movement of the solar cell 4 and generation of bubbles can be prevented.
- a sealing resin sheet piece 41 having a length of 100 mm and a width of 10 mm was intermittently arranged along the edge of the transparent plate 2 on the light-receiving surface side. Thereby, a gap can be provided between the sealing resin sheet 31 and the sealing resin sheet piece 40 to be successively laminated, and the gap between the sealing resin sheet 23 and the sealing resin sheet 31 can be provided. The air in the formed space can be discharged smoothly.
- a gap 36 having a width of 5 mm is provided between the portion of the conductor 51 existing in the right margin 10 and the portion of the conductor 52 existing in the left margin 10, respectively, so as to cover almost the entire surface.
- a sealing resin sheet 31 composed of three sheets. It is possible to connect the conductor 50 to the conductors 51 and 52 through the gap 36.
- a sealing resin sheet piece 42 having a length of 100 mm and a width of 10 mm was intermittently arranged along the end of the transparent plate 2 on the light receiving surface side.
- an insulating film 55 having a width of 10 mm and a thickness of 0.1 mm was arranged at a position overlapping the lower side of the conductor 50 to be arranged later.
- an insulating film 56 having a width of 30 mm, a length of 100 mm and a thickness of 0.1 mm was arranged at a position overlapping with the lower side of the conductors 53 and 54 to be arranged later.
- the portion of the conductor 51 existing in the right margin 10 and the left margin are provided. Almost the entire surface was covered with a sealing resin sheet 32 composed of three sheets, with a gap 36 having a width of 5 mm in each of the conductors 52 existing in the white portion 10.
- the conductor 51 existing in the margin 10 on the right side of the figure and the conductor 52 existing in the margin 10 on the left side were connected by the conductor 50, and the conductor 50 was placed on the sealing resin sheet 32.
- As the conductor 50 a solder-dip copper ribbon wire having a width of 6 mm and a thickness of 0.1 mm was used.
- two conductors 53 and 54 drawn out to the terminal box were connected to the electric wiring (not shown) existing in the left margin 10.
- the conductors 53 and 54 are the same as the conductor 50. Elements such as diodes may be incorporated in the electric wiring (not shown) and the conductor 52 in the left margin 10 according to the specifications of the module. ,.
- a portion of the conductor 50 was cut off with a width of about 20 mm, and a portion of the conductors 53 and 54 was covered with a missing sealing resin sheet 33 having a dimension of 40 X 130mm.
- a 15 mm-wide sealing resin sheet piece 44 having a thickness of 0.4 mm and a thickness of "Solar Eva SC36" manufactured by Isheet Industrial Co., Ltd. was arranged on the conductor 50 in the missing portion.
- a sealing resin sheet piece 46 having a thickness of 0.4 mm was arranged on the conductors 53 and 54 in the missing portions so as to cover substantially the entire missing area.
- a sealing resin sheet piece 43 having a length of 100 mm and a width of 10 mm was intermittently arranged along the end of the transparent plate 2 on the light receiving surface side.
- the entire surface was covered with the sealing resin sheet 34.
- a cut 37 having a length of 300 mm was formed in the sealing resin sheet 34, and two conductive wires 53 and 54 drawn out to the terminal box were drawn out of the cut.
- the back plate 3 was stacked.
- the back plate 3 was made of 2810 mm x 1795 mm x 12 mm float tempered glass (blue plate glass).
- the surface compressive stress of the tempered glass was 100 MPa, and the warpage measured according to JIS R3206 was 0.25%.
- the back plate 3 is provided with a circular opening having a diameter of 20 mm for passing the two conductive wires 53 and 54 drawn out to the terminal box.
- the back plate 3 was placed with its concave surface facing down, and two conductive wires 53 and 54 were pulled out from an opening provided in the back plate 3 and stacked.
- the laminate 60 to be subjected to the sealing operation was obtained.
- the first sealing resin sheet 20 is composed of three sealing resin sheets, and the total thickness thereof is 1.8 mm.
- the second sealing resin sheet 30 is composed of four sealing resin sheets and has a total thickness of 2.4 m. m.
- the total thickness of the sealing resin sheet pieces 40, 41, 42, 43 arranged in the margin 10 was 2.4 mm.
- a plurality of sets of the rubber bag 61 are arranged on a shelf 67 provided in a hot blast stove 66.
- An exhaustible pipe 63 is connected to each rubber bag 61, which is connected to a vacuum pump 65 via a pressure regulating valve 64.
- Fig. 11 shows a schematic diagram of the sealing apparatus.
- Steps 1 to 6 After setting as described above, the following sealing process operations of Steps 1 to 6 were performed.
- the temperature and pressure at this time were controlled as shown in Table 1 and FIG. At this time, the temperature is the temperature in the hot blast stove 66, and the pressure is the pressure set by the pressure regulating valve 64.
- Step 1 "The step of heating the sealing resin while maintaining the pressure in the sealing container at 0.05 MPa or more"
- the temperature inside the hot blast stove 66 was started, and the pressure inside the sealing vessel was started.
- the pressure was slowly reduced from atmospheric pressure (0. IMPa) to 0.07 MPa over 45 minutes, while the temperature was slowly increased from room temperature (30 ° C) to 50 ° C.
- Step 2 Step of depressurizing the inside of the sealing container to a pressure of not more than 0.1 OlMPa at a temperature lower than the melting point of the sealing resin
- the temperature in the hot blast stove 66 was maintained at 50 ° C. for 30 minutes, during which time the pressure in the sealing treatment vessel was slowly reduced to 0.07 MPa to less than 0.005 MPa.
- Step 3 Step of raising the temperature to a temperature equal to or higher than the melting point of the sealing resin while reducing the pressure
- Step 4 "Step of increasing the pressure in the sealing treatment container"
- the pressure in the sealing treatment vessel was gradually increased from less than 0.005 MPa to 0.07 MPa over 70 minutes. .
- the temperature was slowly increased from 78 ° C to 90 ° C over 75 minutes.
- the ratio of the pressure raising rate (MPaZ) to the temperature raising rate (° CZ) was 0.0063 (MPa Z ° C).
- the temperature was maintained at 90 ° C for 30 minutes, cooled to 30 ° C over 30 minutes, and maintained at 30 ° C for 5 minutes, while maintaining the pressure of 0.07 MPa.
- Step 5 "Step of raising the temperature to a temperature range in which the cross-linking reaction proceeds to promote the cross-linking reaction" Subsequently, the temperature is raised from 30 ° C to 155 ° C over 90 minutes, and at 155 ° C for 36 minutes. The cross-linking reaction was allowed to proceed while maintaining. During that time, a pressure of 0.07 MPa was maintained.
- Step 6 "Cooling step"
- the mixture was cooled from 155 ° C. to 30 ° C. in 60 minutes, and when the temperature reached 30 ° C., the pressure in the sealing treatment container was reduced to 0.
- the pressure was raised to IMPa (atmospheric pressure) and removed from the hot stove 66.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
Claims
Priority Applications (1)
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JP2006512652A JP4290194B2 (ja) | 2004-04-27 | 2005-04-27 | 太陽電池モジュールの製造方法 |
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JP2004-131711 | 2004-04-27 | ||
JP2004131711 | 2004-04-27 |
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WO2005104242A1 true WO2005104242A1 (ja) | 2005-11-03 |
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PCT/JP2005/008007 WO2005104242A1 (ja) | 2004-04-27 | 2005-04-27 | 太陽電池モジュールの製造方法 |
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CN (1) | CN100511722C (ja) |
WO (1) | WO2005104242A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011249835A (ja) * | 2011-08-01 | 2011-12-08 | Nakajima Glass Co Inc | 太陽電池モジュールの製造方法 |
JP2012209346A (ja) * | 2011-03-29 | 2012-10-25 | Kyocera Corp | 光電変換モジュール |
WO2015190592A1 (ja) * | 2014-06-13 | 2015-12-17 | 株式会社ブリヂストン | 太陽電池モジュールの製造方法及び太陽電池モジュール |
WO2018033261A1 (fr) * | 2016-08-16 | 2018-02-22 | Solean | Système de lamination, installation incluant un tel système de lamination et procédé de lamination mis en oeuvre à l'aide d'un tel système de lamination |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386242A (zh) * | 2010-08-30 | 2012-03-21 | 杜邦太阳能有限公司 | 光伏面板 |
WO2012081328A1 (ja) * | 2010-12-16 | 2012-06-21 | 株式会社村田製作所 | 電子部品の製造方法 |
TWI561563B (en) * | 2012-02-15 | 2016-12-11 | Mitsui Chemicals Tohcello Inc | Encapsulating sheet for solar cell, solar cell and method for producing solar cell |
CN105720111B (zh) * | 2014-12-12 | 2018-02-09 | 比亚迪股份有限公司 | 太阳能电池单元、太阳能电池组件及其制备方法 |
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- 2005-04-27 CN CNB2005800214480A patent/CN100511722C/zh not_active Expired - Fee Related
- 2005-04-27 WO PCT/JP2005/008007 patent/WO2005104242A1/ja active Application Filing
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- 2008-09-08 JP JP2008230356A patent/JP4682237B2/ja active Active
- 2008-09-08 JP JP2008230357A patent/JP2008294486A/ja active Pending
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GB2025691A (en) * | 1978-06-14 | 1980-01-23 | Bfg Glassgroup | Photovoltaic cell panel |
US4249958A (en) * | 1978-06-14 | 1981-02-10 | Bfg Glassgroup | Panel comprising at least one photo-voltaic cell and method of manufacturing same |
JPS6169179A (ja) * | 1984-09-12 | 1986-04-09 | Toshiba Corp | 太陽電池パネルの製造方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012209346A (ja) * | 2011-03-29 | 2012-10-25 | Kyocera Corp | 光電変換モジュール |
JP2011249835A (ja) * | 2011-08-01 | 2011-12-08 | Nakajima Glass Co Inc | 太陽電池モジュールの製造方法 |
WO2015190592A1 (ja) * | 2014-06-13 | 2015-12-17 | 株式会社ブリヂストン | 太陽電池モジュールの製造方法及び太陽電池モジュール |
WO2018033261A1 (fr) * | 2016-08-16 | 2018-02-22 | Solean | Système de lamination, installation incluant un tel système de lamination et procédé de lamination mis en oeuvre à l'aide d'un tel système de lamination |
FR3055167A1 (fr) * | 2016-08-16 | 2018-02-23 | Claude Jacquot | Systeme de lamination, installation incluant un tel systeme de lamination et procede de lamination mis en oeuvre a l'aide d'un tel systeme de lamination |
US11130327B2 (en) | 2016-08-16 | 2021-09-28 | Solean | System for laminating photovoltaic stacks |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005104242A1 (ja) | 2008-03-13 |
CN100511722C (zh) | 2009-07-08 |
JP4290194B2 (ja) | 2009-07-01 |
JP2008294486A (ja) | 2008-12-04 |
CN1977390A (zh) | 2007-06-06 |
JP4682237B2 (ja) | 2011-05-11 |
JP2009010419A (ja) | 2009-01-15 |
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