WO2005073310A1 - Resin composition, method for production thereof and resin film - Google Patents

Resin composition, method for production thereof and resin film

Info

Publication number
WO2005073310A1
WO2005073310A1 PCT/JP2005/001212 JP2005001212W WO2005073310A1 WO 2005073310 A1 WO2005073310 A1 WO 2005073310A1 JP 2005001212 W JP2005001212 W JP 2005001212W WO 2005073310 A1 WO2005073310 A1 WO 2005073310A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
resin
resin composition
film
solvent
Prior art date
Application number
PCT/JP2005/001212
Other languages
French (fr)
Japanese (ja)
Inventor
Hironori Omori
Original Assignee
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to KR1020067015333A priority Critical patent/KR101220604B1/en
Priority to CN200580003684XA priority patent/CN1914271B/en
Priority to JP2005517514A priority patent/JP4997766B2/en
Publication of WO2005073310A1 publication Critical patent/WO2005073310A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/06Sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers

Definitions

  • the present invention relates to a resin composition capable of forming a resin film having both excellent transparency and in-plane thickness uniformity, a method for producing the same, and a resin film.
  • Organic electoluminescence is a type of display element such as an element or a liquid crystal display element, an integrated circuit element, a solid-state image sensor, a color filter, or a black matrix.
  • Components include a protective film to prevent their deterioration and damage, a sealing film to protect the contents, a flattening film to flatten the element surface and wiring, an electrical insulating film to keep electrical insulation, Various functional resin films such as an interlayer insulating film for insulating between wirings arranged in layers are provided.
  • these resin films may be required to have not only low dielectric properties but also transparency.
  • Examples of a material for forming a transparent resin film include a resin composition containing an alicyclic olefin-based addition copolymer having a reactive silyl group having a specific structure. It is known that when a metal oxide is added to a product, a crosslinked structure is formed to give a transparent resin film having excellent dimensional stability and the like (JP-A-2003-160620).
  • Japanese Patent Application Laid-Open No. 11-327125 discloses that the addition of inorganic fine particles such as colloidal silica to a photosensitive resin composition improves oxygen plasma resistance, heat resistance, dry etching resistance, and the like of the obtained resin film. It has been reported.
  • Japanese Patent Application Laid-Open No. 2003-156838 describes that a resin film having excellent coating film uniformity and storage stability can be obtained by adding a certain glycol-based solvent to an alicyclic resin. ing.
  • the alicyclic resin disclosed herein is capable of forming a transparent electric insulating film.
  • the present inventors have intensively studied to obtain a resin composition that can form a resin film that is transparent and has uniform in-plane film thickness.
  • a resin composition capable of forming a film can be obtained, and have completed the present invention.
  • carboxyl group, dicarboxylic anhydride group, hydroxyl group and imide group characterized in that it contains an alicyclic olefin resin having at least one member selected from the group consisting of in the molecule, inorganic fine particles, and a solvent.
  • Resin composition characterized in that it contains an alicyclic olefin resin having at least one member selected from the group consisting of in the molecule, inorganic fine particles, and a solvent.
  • the solvent contains at least 500 parts by weight of a solvent in which the solubility of the alicyclic olefin resin at 23 ° C. is 20% by weight or more based on 100 parts by weight of the alicyclic olefin resin.
  • the alicyclic resin is represented by the formula (I)
  • R 1 — R 4 are each independently a hydrogen atom or a formula: X n _R (X is a divalent group, n is 0 or 1, R is C 17 alkyl group which may have a substituent, C 3-8 cycloalkyl group which may have a substituent, aromatic group, carboxy group, dicarboxylic anhydride group , A hydroxy group, or an imide group), one or more of R 1 R 4 is a group represented by the formula: -X-R a (wherein X and n have the same meanings as described above) And Ra is a carboxyl group, a dicarboxylic anhydride group, a hydroxyl group, or an imide group. m is an integer of 0 2.
  • the resin composition according to (1) which is a resin having a repeating unit represented by the following formula:
  • the resin composition according to (1) further comprising a step of mixing a resin solution containing the alicyclic resin and a solvent with an inorganic fine particle dispersion containing the inorganic fine particles and a dispersion medium.
  • the dispersion medium is selected from the group consisting of glycol ether acetate compounds, glycol diether compounds, glycol monoether conjugates and amide compounds.
  • the resin composition of the present invention comprises an alicyclic resin having at least one selected from the group consisting of a carboxyl group, a dicarboxylic anhydride group, a hydroxy group and an imide group in a molecule, inorganic fine particles, and a solvent. It is characterized by containing.
  • the alicyclic olefin resin used in the present invention has a structural unit derived from a polymerizable monomer having an alicyclic structure and a carbon-carbon double bond (hereinafter, referred to as an “alicyclic olefin monomer”). It is a polymer.
  • the alicyclic structure of the alicyclic olefin monomer may be monocyclic or polycyclic (condensed polycyclic, bridged ring, combination of these, etc.). From the viewpoint of the mechanical strength and heat resistance of the resin film, a polycyclic ring is preferred.
  • the number of carbon atoms constituting the alicyclic structure is not particularly limited, but is usually 430, preferably 520, more preferably 515. When the number of carbon atoms is in such a range, various characteristics such as heat resistance and patternability of the resin film are highly balanced and suitable.
  • the proportion of the structural unit derived from the alicyclic olefin monomer in the alicyclic olefin resin is appropriately selected according to the purpose of use, but is usually from 30 to 100% by weight, preferably from 50 to 100% by weight. Preferably it is 70-100% by weight. If the proportion of the structural unit derived from the alicyclic olefin monomer is too small, the heat resistance of the resin film is poor, which is not preferable.
  • the alicyclic olefin resin used in the present invention includes a group consisting of a carboxyl group (hydroxycarbonyl group), a dicarboxylic anhydride group (carbonyloxycarbonyl group), a hydroxyl group, and an imide group in the molecule.
  • a carboxyl group hydroxycarbonyl group
  • a dicarboxylic anhydride group carbonyloxycarbonyl group
  • a hydroxyl group hydroxyl group
  • imide group in the molecule.
  • the specific polar group may be directly bonded to a carbon atom constituting the alicyclic structure which is the main chain of the resin, or may be a group containing the specific polar group which is bonded to a carbon atom constituting the alicyclic structure. It may be. In the latter case, the specific polar group is bonded to a carbon atom constituting the alicyclic structure via a divalent organic group such as an alkylene group.
  • Examples of the group containing a specific polar group include a group containing a carboxyl group, a group containing a dicarboxylic anhydride group, a group containing a hydroxyl group, and a group containing an imide group.
  • Examples of the group containing a carboxyl group include a hydroxycarbonylalkyl group and a hydroxycarboylphenyl group.
  • the group containing a dicarboxylic anhydride group is represented by an alkyleneoxycarbonyloxyalkyl group or [1- (CH) -CO-0-CO- (CH) _ (p is an arbitrary natural number)].
  • Examples of the group containing a hydroxyl group include a group containing a phenolic hydroxyl group such as a hydroxyphenyl group and a hydroxyphenylalkyl group; and an alcoholic hydroxyl group such as a hydroxyalkyl group, a hydroxyalkoxy group and a hydroxyalkoxycarbonyl group. And a group containing:
  • Examples of the group containing an imide group include an N-phenyldicarboximide group.
  • preferred specific examples of the specific polar group or the group containing the specific polar group include a carboxyl group, a hydroxycarbonylmethyl group, a carbonyloxycarbonyl group, a hydroxyyl group, a hydroxymethoxy group, a 2-hydroxyethoxy group.
  • the alicyclic olefin resin used in the present invention may have only one type of specific polar group, or may have a combination of two or more types. From the viewpoint of highly balancing the various properties of the resin composition of the present invention and the resin film obtained from the composition, the alicyclic resin preferably has a combination of two or more types. It is particularly preferred to have a carboxyl group and an imide group.
  • a resin having a repeating unit represented by the above formula (I) is preferable because it gives a resin film having excellent transparency.
  • R 1 R 4 are each independently a hydrogen atom or a group represented by the formula: -X-R Represents a group.
  • at least one of R 1 to R 4 is a group represented by the formula: -X n _R a (R a represents the above-mentioned specific polar group).
  • R 1 - of R 4 any two of the formula: is a group represented by -XR a, different carbon (For example, R 1 and R 3) arbitrarily is preferable're bound to.
  • X examples include an alkylene group such as a methylene group, an ethylene group, and a propylene group; an arylene group such as an o-phenylene group, an m-phenylene group, a p-phenylene group, and a naphthalene group; a group represented by; single R b _CO- R b - (R b represents an alkylene group or Ariren group.) a group represented by; and the like are.
  • specific examples of the alkylene group and the arylene group for R b include those similar to the alkylene group and the arylene group for X.
  • n 0 or 1.
  • n is an integer of 0 to 2, and is preferably 0 or 1.
  • R is an alkyl group having 17 to 17 carbon atoms which may have a substituent, a cycloalkyl group having 3 to 8 carbon atoms which may have a substituent, an aromatic group, or the aforementioned specific group. Represents a polar group.
  • Examples of the alkyl group having 17 carbon atoms include a methynole group, an ethyl group, an n-propyl group, an isopropyline group, an n-butyl group, an isobutyl group, a t-butyl group, an s-butyl group, an n-pentyl group, and a 1-methylbutyl group.
  • Examples of the C 3-8 cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group and the like.
  • substituents examples include a halogen atom such as a fluorine atom, a chlorine atom, and a bromine atom; a hydroxyl group; an acyl group such as an acetyl group and a benzoyl group; an alkoxyl group such as a methoxy group, an ethoxy group, and an isopropoxy group; Carbonyl groups such as methoxycarbonyl, ethoxycarbonyl and t-butoxycarbonyl; alkylcarbonyl groups such as acetooxy; benzoyloxy Aryloxycarbonyl group; nitro group; cyano group; and the like.
  • halogen atom such as a fluorine atom, a chlorine atom, and a bromine atom
  • a hydroxyl group such as an acyl group such as an acetyl group and a benzoyl group
  • an alkoxyl group such as a methoxy group, an ethoxy group, and an
  • Examples of the aromatic group include a phenyl group which may have a substituent such as a phenyl group, a 2-chlorophenyl group or a 4-methylphenyl group; a 1-naphthyl group, a 2-naphthyl group, a 6- Methyl-11-naphthyl group and other substituents; naphthyl group; 2-pyridyl group, 3_pyridyl group and 4-pyridinole group and other substituents. And pyridyl groups.
  • the method for obtaining the alicyclic olefin resin used in the present invention is not particularly limited, and examples thereof include the following method (i)-(iv).
  • a resin obtained by polymerizing an alicyclic olefin monomer having no specific polar group in the presence of a radical polymerization initiator is known by using a compound having a specific polar group. Method to introduce a specific polar group by denaturation according to the method.
  • Examples of the compound containing a specific polar group include acrylic acid, methacrylic acid, sodium ethacrylic acid, 2-hydroxyethylacrylic acid, 2-hydroxyethyl methacrylic acid, maleic acid, fumaric acid, itaconic acid, Unsaturated carboxylic acids such as endocis-bicyclo [2.2.1] hept_5_en-2,3-dicanolevonic acid and methinoleic endocis-bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid Acid compounds and imide derivatives thereof; unsaturated carboxylic anhydrides such as maleic anhydride, maleic anhydride, butulic succinic anhydride, tetrahydrophthalic anhydride and citraconic anhydride; and the like.
  • the polar group other than the specific polar group is a group that can be derived to a specific polar group by a chemical reaction such as hydrolysis or reduction.
  • a chemical reaction such as hydrolysis or reduction.
  • Re is a linear, branched or alicyclic, saturated or unsaturated hydrocarbon group.
  • the saturated hydrocarbon group or unsaturated hydrocarbon group may be substituted with a group containing a halogen atom, a silicon atom, an oxygen atom or a nitrogen atom (excluding a hydroxyl group and a hydroxycarboxy group).
  • the alicyclic olefin monomer having no specific polar group when subjected to radical polymerization, the alicyclic olefin monomer may be optionally combined with the alicyclic olefin monomer.
  • Other monomers capable of addition copolymerization or ring-opening copolymerization hereinafter, referred to as “other monomers” may be added.
  • the unsaturated bond portion of the obtained resin may be hydrogenated according to a conventional method.
  • the unsaturated bond portion of the obtained resin may be hydrogenated by a conventional method. You may.
  • an alicyclic olefin monomer having no specific polar group and an alicyclic olefin monomer having a specific polar group are combined with each other in the presence of an organic ruthenium polymerization catalyst.
  • the unsaturated bond portion is hydrogenated according to a conventional method, and if necessary, a polar group other than the specific polar group is induced to a specific polar group by hydrolysis or the like.
  • a polar group other than the specific polar group is induced to a specific polar group by hydrolysis or the like.
  • the organic ruthenium polymerization catalyst used herein is a ruthenium-containing catalyst that promotes ring-opening polymerization.
  • a polymerization catalyst containing an organic ruthenium compound to which a neutral electron donating ligand is coordinated as a main component is preferable.
  • Neutral electron donating ligands are ligands that have a neutral charge when separated from the central metal (ie, ruthenium).
  • More preferred organic ruthenium compounds are those in which an anionic ligand is coordinated together with a neutral electron donating ligand.
  • Anionic ligands are ligands that have a negative charge when separated from ruthenium.
  • the organic ruthenium compound may further include a counter anion.
  • the counter anion is not particularly limited as long as it can form an anion that forms an ion pair with a ruthenium cation, and can form such a pair.
  • organic ruthenium compound examples include bis (tricyclohexylphosphine) benzene.
  • Tenidimudichloride bis (1,3-diisopropylimidazoline-1-2-ylidene) benzylidene lutedichloride, bis (1,3-dicyclohexylimidazoline-2-ylidene) benzylidene tenidimudichloride, (1,3-dimesityl) Imidazoline-l- 2-ylidene) (tricyclohexylphosphine
  • pyridines; phosphines; and 1,3-diisopropylimidazoline-2_ylidene and 1,3-dimesitylimidazolidine_2_ylidene such as those described above.
  • a neutral electron-donating compound such as a nitrogen heterocyclic carbene compound is added at a ratio of 1 to 100 times in weight ratio to ruthenium metal in the polymerization catalyst.
  • diazo compounds such as N CHCOOEt
  • acetylene compounds such as phenylacetylene
  • a silyl compound such as SiH or Ph MeSiH;
  • Et represents an ethyl group
  • Ph represents a phenyl group
  • Me represents a methyl group
  • an aromatic polymerizable monomer is used instead of part or all of the alicyclic olefin monomer.
  • the desired alicyclic olefin resin can also be obtained by a method of polymerizing and hydrogenating an aromatic carbon-carbon double bond of the obtained resin.
  • dodecane force one 3- E down , 5, 6-di (hydroxy-carbonyl) tetracyclo [4.4.0.1 2, 5 .1 ⁇ , 10] dodecane force - 3 E emissions, 5 _ methyl - 5-hydroxycarbonyltetracyclo [4.4.0.
  • Kisashikuro to El [6 ⁇ 6.1. I 3 ' 6.
  • I 3 '. 6 I 10' 13 0 2 '7 .0 9' 14] heptadecyl force -. 4-E down, 11, 12 to the di (hydroxycarbonyl) Kisashikuro [6 .6 1. I 3 '6.
  • Kisashikuro to 11-hydroxy [6.6. 1. I 3 '6 . I 10' 13 .0 2 '7 .0 9' 14] heptadecyl force one 4-E down, Kisashikuro [6.6 to 11-hydroxymethyl. 1. I 3 '6. I 10 ' 13 .0 2,7 .0 9 '14] heptadeca 4-E down, 11, 12-bis Kisashikuro to (hydroxymethyl) [6 ⁇ 6.1 I 3,6 I 10, 13 .0 2 '7 .0 9' 14..] Heptadecyl force - 4 E down, Kisashikuro to 11- (2-hydroxyethoxy carbonyl) [6 • 6. 1. I 3 '6.
  • N-phenyl-substituted imido compounds such as N-phenyl (5-norbornene-2,3-dicarboximide);
  • Bicycloheptene derivatives such as 5-hydroxycarbonylbicyclo [2.2.1] hept_2_ene, 5,6-di (hydroxycarbonyl) bicyclo [2.2.1] hept-2-ene, and 8-hydro Xicarbonyltetracyclo [4.4.0. I 2 ' 5.
  • I 7 ' 10 Dode force-3-ene, 8, 9-di (hydroxycarbonyl) tetracyclo [4.4.0. I 2 ' 5.
  • I 7 Tetorashikurodode Sen derivatives such as' 10] de de force one 3-E down;
  • N-phenyl-substituted compounds such as N-phenyl (5-norbornene-2,3-dicarboximide) Midig compounds; etc.
  • the alicyclic olefin monomer having no specific polar group includes the following (e) and (f).
  • Pentade force one 4, 11-diene, cyclopentene, Shikuropentaji E emissions, 1, 4 Metano one 1, 4, 4a, 5, 10, Kisahidoro to 10a_ Anthracene, 8_ fenirutetracyclo [4. 4. 0. I 2 ' 5. I 7 ' 10 ]
  • (C) a group capable of being modified into a hydroxyl group, such as a formate such as a bicycloheptene derivative, a tetracyclododecene derivative, or a hexacycloheptadecene derivative, an acetate, a propionate, a butyrate, a valate, or a benzoate ;
  • alicyclic olefin monomers can be used alone or in combination of two or more.
  • Other monomers include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methynol-1-butene, 3-methynol-1-pentene, and 3-ethynol-1 —Pentene, 4—Methinole 1_pentene, 4—Methinole 1—hexene, 4,4—Dimethine 1—hexene, 4, 4-Dimethine 1—pentene, 4—Echinole 1—Hexene 1-hexene, 1-hexene, 1-otene, 1-decene, 1-dodecene, 1-tetradecene, 1_hexadecene, 1-octadecene, 1-ejicocene, etc.
  • C2-20 ethylene or ⁇ —Olefin C2-20 ethylene or ⁇ —Olefin; non-conjugated gens such as 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methinole 1,4-hexadiene, and 1,7-octadiene; These monomers can be used alone or in combination of two or more.
  • ⁇ -olefins when used for ring-opening copolymerization of alicyclic olefin monomers, function as a molecular weight regulator described later.
  • the molecular weight of the ring-opened polymer can be adjusted. It will be easier.
  • the amount of the molecular weight modifier used is small, a polymer having a relatively large weight average molecular weight (Mw) is obtained, and when it is large, a polymer having a relatively small weight average molecular weight (Mw) is obtained.
  • a molecular weight regulator As a molecular weight regulator, a Bürich compound, a gen compound or the like can be used.
  • bur compound examples include fluorinated compounds such as 1-butene, 1-pentene, 1-hexene, and 1-otathene; styrene compounds such as styrene and burtonolene; ethers such as ethyl butyl ether, isobutyl butyl ether and aryl glycidyl ether.
  • fluorinated compounds such as 1-butene, 1-pentene, 1-hexene, and 1-otathene
  • styrene compounds such as styrene and burtonolene
  • ethers such as ethyl butyl ether, isobutyl butyl ether and aryl glycidyl ether.
  • Compounds; halogen-containing compound such as aryl chloride; aryl acetate, aryl alcohol, glycyl Oxygen-containing vinyl compounds such as zirmetarylate; nitrogen-containing vinyl compounds such as
  • Examples of the gen compounds include non-conjugated gens such as 1,4 pentadiene, 1,5-hexadiene, 1,6-hexadiene, 2-methinolee 1,4 pentadiene, 2,5-dimethinolee 1,5-hexadiene, and the like.
  • Compounds; synergistic gen compounds such as 1,3-butadiene, 2-methinolay 1,3-butadiene, 2,3-dimethinole-1,3-butadiene, 1,3_pentadiene, and 1,3-hexadiene;
  • a horefin compound such as 1-hexene is particularly preferable.
  • Examples of the obtained alicyclic olefin resin include a ring-opened polymer of an alicyclic olefin monomer and a hydrogenated product thereof, an addition polymer of an alicyclic olefin monomer, and an alicyclic olefin resin. Addition polymer of monomer and vinyl compound, monocyclic cycloalkene polymer, alicyclic conjugated polymer, vinyl-based alicyclic hydrocarbon polymer and its hydrogenated product, aromatic olefin polymer And hydrogenated aromatic rings. In the present invention, these alicyclic resin may be used alone or in combination of two or more.
  • ring-opened polymers of alicyclic olefin monomers and hydrogenated products thereof addition polymers of alicyclic olefin monomers, and attachments of alicyclic olefin monomers and vinyl compounds
  • a hydrogenated product of a ring-opened polymer of an alicyclic olefin monomer is particularly preferred, in which a polymer or an aromatic ring hydrogenated product of an aromatic olefin polymer is preferred.
  • Examples of the inorganic fine particles used in the present invention include simple metals, inorganic oxides, inorganic carbonates, inorganic sulfates, inorganic phosphates, and the like. From the viewpoints of heat resistance and oxidation resistance, inorganic oxides are preferred. Oxides are particularly preferred.
  • metal oxides examples include silicon oxides such as colloidal silica, aerosil, and glass; aluminum oxides such as alumina; zirconium oxides such as zirconia; and titanium oxides such as titania.
  • silicon oxides such as colloidal silica, aerosil, and glass
  • aluminum oxides such as alumina
  • zirconium oxides such as zirconia
  • titanium oxides such as titania.
  • colloidal silica is particularly preferred from the viewpoint of productivity in which colloidal silica, anoremina, zirconia, and titania are preferred.
  • the primary particle diameter of the inorganic fine particles used in the present invention is generally 11 to 200 nm, preferably 11 to 150 nm, more preferably 5 100 nm from the viewpoints of transparency and pattern formability.
  • the primary particle diameter is measured by the BET method (specific surface area measurement method) based on the true density assuming a true sphere.
  • the amount of the inorganic fine particles used can be arbitrarily selected according to the use of the resin film to be formed.
  • the amount of the inorganic fine particles used can be arbitrarily selected according to the use of the resin film to be formed.
  • the resin film to be formed usually 51,000 parts by weight, preferably 5800 parts by weight, more preferably 5800 parts by weight, based on 100 parts by weight of the alicyclic olefin resin having a specific polar group described above. 10 500 parts by weight.
  • the solvent used in the present invention is not particularly limited as long as it contains an organic solvent (a good solvent) in which the alicyclic olefin resin can be dissolved.
  • the good solvent those having a solubility of 20% by weight or more at 23 ° C. of the alicyclic olefin resin are preferable.
  • the amount of the good solvent used is usually 500 parts by weight or more based on 100 parts by weight of the alicyclic olefin resin, and from the viewpoint of obtaining desired transparency, 500 to 10,000 parts by weight is preferred. Masu 500-5,000 parts by weight are more preferred 900-2,000 parts by weight are particularly preferred.
  • Examples of good solvents include glycol ethylene compounds such as diethylene glycol dimethyl ether, diethylene glycol methyl methyl ether, diethylene glycol dimethyl ether, and propylene glycol methylethyl ether; propylene glycol monomethyl ether, propylene glycol monoethyl ether; Glycol monoether compounds such as propylene glycol monoisopropyl ether and propylene glycol mono-n-butyl ether; amidated compounds such as N_methyl-2-pyrrolidone and N, N-dimethylacetamide; alicyclic ethers such as tetrahydrofuran Alicyclic ketone compounds such as cyclohexanone; and the like.
  • glyco-ester compounds, glycol monoether compounds, and amide compounds are preferred because of the ease of filtration of the resin composition.
  • a mixed solvent of a good solvent and a solvent other than the good solvent may be used.
  • the poor solvent include glycol monoether acetate conjugates such as propylene glycol monomethyl ether acetate.
  • the use amount of the poor solvent is usually 200% by weight or less, preferably 100% by weight or less based on the good solvent, since it is easy to obtain a resin film having excellent in-plane film thickness uniformity.
  • the resin composition of the present invention can add various additives according to the purpose.
  • the additive examples include a photosensitizer such as a quinonediazide compound; a crosslinking agent having at least two reactive groups such as an amino group, a carboxyl group, a hydroxyl group, an epoxy group, an isocyanate group, and a butyl group (a preferable specific example is a methylol compound).
  • curing components such as curing aids such as solid sulfonic acid compounds and amine compounds such as imidazole compounds; surfactants such as fluorine compounds and silicon compounds; hindered phenol compounds and the like Antioxidants; adhesion aids such as silane coupling agents; sensitizers such as phenolic compounds; antistatic agents; defoamers; dispersants;
  • the alicyclic olefin resin and the inorganic microparticles are excellent in operability and in that a composition excellent in filterability is obtained.
  • an alicyclic olefin resin solution hereinafter, simply referred to as “resin solution”
  • an inorganic fine particle dispersion respectively, and then mixing both.
  • These liquid media can be all or part of the solvent constituting the resin composition of the present invention.
  • liquid medium (solvent) used for dissolving the alicyclic olefin resin the glycol diether conjugates, glycol monoether compounds, and amide compounds, which are preferably used in the above-described good solvent, are particularly preferable. preferable.
  • liquid medium used to disperse the inorganic fine particles
  • examples of the liquid medium (dispersion medium) used to disperse the inorganic fine particles include glycol monoether acetate compounds, glycol diether compounds, Glycol monoether compounds and amide compounds are particularly preferred.
  • the dispersion medium may be used as it is in the production of the resin composition, or the dispersion medium may be replaced with another dispersion medium (dispersion medium exchange) if necessary. Can be. Even when the dispersion medium is water, the dispersion medium can be exchanged for use.
  • the method of mixing the resin solution and the inorganic fine particle dispersion There is no particular limitation on the method of mixing the resin solution and the inorganic fine particle dispersion. Regardless of whether the inorganic fine particle dispersion is added to the resin solution or the resin solution is added to the inorganic fine particle dispersion, both are simultaneously placed in a container. However, from the viewpoint of preventing aggregation of the fine particles, a method of adding a resin solution to the inorganic fine particle dispersion is preferable.
  • the temperature at the time of mixing there is no particular limitation on the temperature at the time of mixing, but it is general to set the temperature at which evaporation can be suppressed in consideration of the boiling point of the solvent in the resin composition. Therefore, the mixing temperature at normal pressure is usually 10-50 ° C, preferably 10-40 ° C, more preferably 15-35 ° C.
  • a container equipped with a stirrer or a container installed in a shaker may be used.
  • the resin composition of the present invention is capable of forming a resin film having excellent in-plane film thickness uniformity. It is preferable because a film can be formed.
  • the filtration speed was measured at room temperature (23 ° C) under a pressure of 0.5 kgf / cm 2 (gauge pressure) using a membrane filter with a diameter of 47 mm, a pore diameter of 1 ⁇ , and a porosity of 83%.
  • the average speed when filtration is performed, and this speed is usually 20 g / min or more, preferably 30 g / min or more, and more preferably 40 g / min or more.
  • a resin composition having such a filtration rate gives a resin film having particularly excellent in-plane thickness uniformity.
  • the porosity is a ratio of the pore volume to the total volume of the membrane filter including the pores.
  • a resin composition having a filtration rate in the above-described range can be easily obtained by the above-described method for producing a resin composition of the present invention.
  • a method for adjusting the filtration rate using the same component a method for adjusting the amount of the solvent may be employed.
  • a resin film having a thickness of 0.1200 xm can be easily formed.
  • the obtained resin film is a thin film having both excellent transparency and in-plane thickness uniformity.
  • the resin film of the present invention can be formed on a substrate of any shape. Although the resin film of the present invention can be used together with the substrate, the resin film can be used alone by peeling the resin film from the substrate as necessary.
  • the type and material of the substrate used for forming the resin film of the present invention are not particularly limited.
  • the substrate to be used may be a single-layer substrate or a substrate having a plurality of layers.
  • Specific examples of the substrate used include a substrate having wiring such as a printed wiring board and a display substrate; a flat substrate such as a glass substrate; and a resin or a resin which is appropriately separated from the resin film after forming the resin film.
  • Examples of a method for applying the resin composition of the present invention on a substrate include a method such as a spray method, a roll coating method, and a spin coating method.
  • the temperature at which the coating film of the resin composition is heated and dried is usually 150 to 300 ° C, preferably 200 to 250 ° C.
  • a curing component such as a crosslinking agent may be added to the resin composition of the present invention.
  • a curing component When a curing component is added, the resin film can be cured on the substrate by heating.
  • heating method for curing there is no particular limitation on the heating method for curing.
  • a coating film of the resin composition of the present invention containing a curing component is heated * dried and then further heated.
  • Heating for curing can be performed by a heating device such as a hot plate or an oven.
  • the resin film may cover the entire substrate or may partially cover the substrate surface such as in a pattern.
  • a method for forming a patterned resin film on a substrate there is a photolithography method using the resin composition of the present invention to which a photosensitive agent is added.
  • a resin composition containing a photosensitive agent is applied on a substrate in the same manner as described above, and dried (pre-beta).
  • the resin film thus obtained is irradiated with active radiation through a mask pattern, if necessary, to form a latent image pattern in the resin film, and the resin film having the latent image pattern is subjected to alkali development.
  • the type of actinic radiation is not particularly limited, and examples thereof include visible light, ultraviolet light, far ultraviolet light, X-rays, electron beams, and proton beam rays, with visible light and ultraviolet light being preferred.
  • the radiation dose for irradiation can be set arbitrarily according to the purpose of use of the transparent resin film, the thickness of the film, and the like.
  • the pattern may be formed by irradiating actinic radiation through a mask, or may be formed by directly drawing with an electron beam or the like.
  • the resin film of the present invention is excellent in transparency.
  • the transparency of the resin film can be evaluated by measuring the transmittance of the resin film with a spectrophotometer.
  • the resin film of the present invention has excellent in-plane thickness uniformity.
  • the in-plane film thickness uniformity is measured by measuring the in-plane film thickness under the conditions described in the examples and evaluating the in-plane film thickness and the difference between the maximum value and the minimum value of the film thickness. It can be evaluated that the smaller the difference is, the more excellent the in-plane film thickness uniformity is.
  • the film-like or pattern-like resin film of the present invention not only has excellent in-plane film thickness uniformity, but also has excellent electrical properties such as dielectric properties. Therefore, it can be used as an electronic component such as a display element, an integrated circuit element, and a solid-state imaging device, and a resin film for an electronic component such as a color filter for a display, a protective film, a flattening film, and an electric insulating film.
  • the average particle size of the inorganic fine particles is determined by the specific surface area 0 "(manufactured by Shimadzu Corporation) and the BET method (specific surface area measurement method), which calculates the surface area from the amount of nitrogen gas adsorbed, according to the method of JIS Z8830.
  • the weight average molecular weight (Mw) and number average molecular weight (Mn) of the resin were determined by gel permeation chromatography (GPC) using cyclohexane as an eluent.
  • the hydrogenation rate was determined by measuring the 1 ⁇ -NMR spectrum and calculating the ratio (mol%) of hydrogenated carbon-carbon double bonds to carbon-carbon double bonds before hydrogenation.
  • the water flow rate was obtained by filtering distilled water at 25 ° C filtered through a membrane filter with a pore diameter of 0.1 ⁇ under reduced pressure of -0.069 MPa, and displaying the flow rate in ml / min per lcm 2. It is.
  • the transmittance of the resin film thus formed was measured with a spectrophotometer.
  • the transmittance was calculated by converting the film thickness to 2 zm and calculating the total light transmittance so that the two could be compared. The higher the value, the better the transparency.
  • 0.7mm thick x 650mm long x 550mm wide glass substrate (made by Koingen Co., Ltd.) was deposited at a thickness of 2000 A to prepare a chromium-deposited glass substrate.
  • This chromium-deposited glass substrate was spin-coated at a rotation speed of 16.7 revolutions / second, and the resulting coating film was dried on a hot plate at 100 ° C for 2 minutes under a nitrogen atmosphere to obtain a film thickness.
  • a resin film of 1.5 / m was obtained.
  • This resin solution (a) was transferred into an autoclave equipped with a stirrer, and the hydrogen pressure was 4 MPa and the temperature was
  • the activated carbon was separated by filtration through a 0.2 / im fluororesin filter to obtain a resin solution (c).
  • the filtration could be performed without delay.
  • the mixture was stirred and stirred to prepare a silica sol dispersion (1) having a silica sol concentration of 20%.
  • the primary particle size of the silica sol particles in this dispersion (1) was about 20 nm.
  • this silica sol dispersion (1) and 150 parts of the resin solution (1) are mixed, and 0.1 part of a silicon-based surfactant (product name “KP-341” manufactured by Shin-Etsu Chemical Co., Ltd.) is added. After mixing and dissolving, the mixture was further stirred for 30 minutes to obtain a resin composition (1). For the resin composition (1), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
  • a silicon-based surfactant product name “KP-341” manufactured by Shin-Etsu Chemical Co., Ltd.
  • a silica sol dispersion liquid (2) was prepared.
  • the primary particle size of the silica sol particles in this dispersion (2) was about 20 nm.
  • 150 parts of this silica sol dispersion (2) and 150 parts of the resin solution (1) were mixed, and 0.1 part of a silicon-based surfactant (product name “KP-341”, manufactured by Shin-Etsu Chemical Co., Ltd.) was added. After mixing and dissolving, the mixture was further stirred for 30 minutes to obtain a resin composition (2).
  • the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
  • a silica sol dispersion liquid (3) having a silica zone concentration of 20% was prepared.
  • the primary particle size of the silica sol particles in this dispersion (3) was about 20 nm.
  • the resin solution (1) was changed to the resin solution (2), and the silica sol dispersion (1) was changed to the silica sol dispersion (
  • a resin composition (3) was prepared in the same manner as in Example 1 except that the composition was changed to 3).
  • the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
  • PGMEA propylene glycol monomethyl ether acetate
  • solid content concentration 30%
  • the resin solution (1) was changed to the resin solution (3), and the silica sol dispersion (1) was changed to the silica sol dispersion (
  • a resin composition (4) was prepared in the same manner as in Example 1 except that the composition was changed to 4).
  • the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
  • a resin composition (5) was prepared in the same manner as in Example 1 except that the composition was changed to (4).
  • the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
  • a resin composition (6) was prepared in the same manner as in Example 1 except that the composition was changed to (5).
  • the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
  • a silica sol dispersion liquid (5) was prepared by adding 50 parts of cyclohexane (CH) to 100 parts of an organosilica sol (product name “PMA-ST”, manufactured by Nissan Chemical Industries, Ltd.) and mixing.
  • the primary particle diameter of the silica sol particles in this dispersion (5) was about 20 nm.
  • the resin composition (8) was not a uniform solution due to precipitation of fine particles.
  • the resin composition of the present invention contains an alicyclic olefin resin having a specific polar group, inorganic fine particles, and a solvent, and has excellent filterability, excellent transparency, and excellent in-plane film thickness uniformity. It is useful as a material for forming a resin film having both functions.
  • the resin film of the present invention is excellent in electrical properties such as transparency, in-plane film thickness uniformity, and dielectric properties. Therefore, it can be used as an electronic component such as a display element, an integrated circuit element, and a solid-state imaging device, and a resin film for an electronic component such as a display color filter, a protective film, a flattening film, and an electric insulating film.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

A resin composition, characterized in that it comprises an alicyclic olefin resin having, in its molecule, one or more selected from the group consisting of a carboxyl group, a dicarboxylic acid anhydride group, a hydroxyl group and an imide group, inorganic fine particles, and a solvent; a method for production thereof; and a resin film being formed from the resin composition and having a thickness of 1 to 200 μm. The resin composition is useful as a material for forming a resin film which is excellent in filtration characteristics and combines excellent transparency and the uniformity of the thickness in a plane. The resin film can be suitably used in electronic parts such as a display element, an integrated circuit and a solid photographing element, and as a resin film for electronic parts such as a color filter for a display, a protective film, a flattening film and an electric insulation film.

Description

明 細 書  Specification
樹脂組成物、その製造方法及び樹脂膜  Resin composition, method for producing the same, and resin film
技術分野  Technical field
[0001] 本発明は、優れた透明性と面内膜厚均一性を兼ね備えた樹脂膜を形成できる樹脂 組成物、その製造方法及び樹脂膜に関する。  The present invention relates to a resin composition capable of forming a resin film having both excellent transparency and in-plane thickness uniformity, a method for producing the same, and a resin film.
背景技術  Background art
[0002] 有機エレクト口ルミネッセンス(以下、エレクト口ルミネッセンスを、 ¾し」と略記する。 ) 素子や液晶表示素子等の各種表示素子、集積回路素子、固体撮像素子、カラーフ ィルター、ブラックマトリックス等の電子部品には、その劣化や損傷を防止するための 保護膜、内容物を保護する封止膜、素子表面や配線を平坦化するための平坦化膜 、電気絶縁性を保っための電気絶縁膜、層状に配置される配線の間を絶縁するため の層間絶縁膜等、種々の機能性の樹脂膜が設けられている。  [0002] Organic electoluminescence (hereinafter abbreviated as "e") is a type of display element such as an element or a liquid crystal display element, an integrated circuit element, a solid-state image sensor, a color filter, or a black matrix. Components include a protective film to prevent their deterioration and damage, a sealing film to protect the contents, a flattening film to flatten the element surface and wiring, an electrical insulating film to keep electrical insulation, Various functional resin films such as an interlayer insulating film for insulating between wirings arranged in layers are provided.
[0003] これらの樹脂膜には、用途の多様化にともない、樹脂膜材料に低誘電性のみなら ず、透明性が要求される場合がある。  [0003] With the diversification of uses, these resin films may be required to have not only low dielectric properties but also transparency.
[0004] 透明性を有する樹脂膜を形成する材料としては、例えば、特定の構造を有する反 応性シリル基をもつ脂環式ォレフイン系付加共重合体を含有する樹脂組成物があり 、この樹脂組成物に金属酸化物を添加すると、架橋構造が形成されて寸法安定性等 に優れた透明樹脂膜を与えることが知られている(特開 2003— 160620号公報)。  [0004] Examples of a material for forming a transparent resin film include a resin composition containing an alicyclic olefin-based addition copolymer having a reactive silyl group having a specific structure. It is known that when a metal oxide is added to a product, a crosslinked structure is formed to give a transparent resin film having excellent dimensional stability and the like (JP-A-2003-160620).
[0005] 特開平 11-327125号公報には、感光性樹脂組成物にコロイダルシリカ等の無機 微粒子を添加すると、得られる樹脂膜の酸素プラズマ耐性、耐熱性、ドライエツチン グ耐性等が向上することが報告されている。また、特開 2003—156838号公報には、 脂環式ォレフイン樹脂にある種のグリコール系溶媒を添加することにより、塗膜均一 性と保存安定性に優れた樹脂膜が得られることが記載されている。ここに開示された 脂環式ォレフイン樹脂は、透明な電気絶縁膜を形成できるものである。  [0005] Japanese Patent Application Laid-Open No. 11-327125 discloses that the addition of inorganic fine particles such as colloidal silica to a photosensitive resin composition improves oxygen plasma resistance, heat resistance, dry etching resistance, and the like of the obtained resin film. It has been reported. Japanese Patent Application Laid-Open No. 2003-156838 describes that a resin film having excellent coating film uniformity and storage stability can be obtained by adding a certain glycol-based solvent to an alicyclic resin. ing. The alicyclic resin disclosed herein is capable of forming a transparent electric insulating film.
発明の開示  Disclosure of the invention
[0006] これらの従来技術のもとで本発明者は、透明性に優れる樹脂膜を得るベぐ樹脂成 分として脂環式ォレフイン樹脂を選択し、特開平 11—327125号公報で提案されたシ リカゾルを添加した樹脂組成物の調製を試みた。し力 ながら、この樹脂組成物を用 レ、ると、透明性に優れる樹脂膜を得ることができるものの、面内で膜厚が均一な樹脂 膜 (面内膜厚均一性のある樹脂膜)が得られない場合があることが判った。 [0006] Under these conventional techniques, the present inventors have selected an alicyclic olefin resin as a resin component for obtaining a resin film having excellent transparency, and have been proposed in JP-A-11-327125. Shi An attempt was made to prepare a resin composition to which licazol was added. When this resin composition is used, a resin film having excellent transparency can be obtained, but a resin film having a uniform in-plane film thickness (a resin film having uniform in-plane film thickness). Was not obtained in some cases.
[0007] かかる知見に基づき、本発明者は、透明で、かつ、面内膜厚均一性のある樹脂膜 を形成できる樹脂組成物を得るべく鋭意検討した。その結果、樹脂成分として、ある 種の極性基を有する脂環式ォレフイン樹脂を使用すると、シリカゾル等の無機微粒子 が存在していても、優れた透明性と面内膜厚均一性を兼ね備えた樹脂膜を形成でき る樹脂組成物が得られることを見い出し、本発明を完成するに至った。  [0007] Based on this finding, the present inventors have intensively studied to obtain a resin composition that can form a resin film that is transparent and has uniform in-plane film thickness. As a result, when an alicyclic resin having a certain kind of polar group is used as a resin component, a resin having excellent transparency and uniform in-plane film thickness can be obtained even when inorganic fine particles such as silica sol are present. The present inventors have found that a resin composition capable of forming a film can be obtained, and have completed the present invention.
[0008] 力べして本発明の第 1によれば、下記(1)一(7)の樹脂組成物が提供される。  [0008] By virtue of the first aspect of the present invention, the following resin composition (1)-(7) is provided.
(1)カルボキシル基、ジカルボン酸無水物基、ヒドロキシル基及びイミド基力 なる群 より選ばれる 1種以上を分子内に有する脂環式ォレフイン樹脂、無機微粒子、並びに 溶媒を含有することを特徴とする樹脂組成物。  (1) carboxyl group, dicarboxylic anhydride group, hydroxyl group and imide group, characterized in that it contains an alicyclic olefin resin having at least one member selected from the group consisting of in the molecule, inorganic fine particles, and a solvent. Resin composition.
(2) 23°C、 0. 5kgf/cm2の加圧下で、直径 47mm、孔径 l /i m、多孔度 83%のメン プレンフィルターを用いてろ過したときのろ過速度が 20g/分以上であることを特徴と する(1)の樹脂組成物。 (2) 23 ° C, under a pressure of 0. 5kgf / cm 2, the filtration rate is 20 g / min or more when filtered using diameter 47 mm, pore size l / im, porosity 83% of Men-plane filter (1) The resin composition of (1).
[0009] (3)前記溶媒が、前記脂環式ォレフイン樹脂の 23°Cにおける溶解度が 20重量%以 上である溶媒を、脂環式ォレフイン樹脂 100重量部に対して、 500重量部以上含有 することを特徴とする(1)の樹脂組成物。  (3) The solvent contains at least 500 parts by weight of a solvent in which the solubility of the alicyclic olefin resin at 23 ° C. is 20% by weight or more based on 100 parts by weight of the alicyclic olefin resin. (1) The resin composition according to (1),
(4)前記溶媒が、グリコールジエーテル化合物、グリコールモノエーテルィヒ合物及び アミド化合物からなる群より選ばれる少なくとも 1種である(3)の樹脂組成物。  (4) The resin composition according to (3), wherein the solvent is at least one selected from the group consisting of a glycol diether compound, a glycol monoether compound and an amide compound.
(5)前記脂環式ォレフイン樹脂が、式 (I) (5) The alicyclic resin is represented by the formula (I)
[0010] [化 1] [0010] [Formula 1]
Figure imgf000004_0001
Figure imgf000004_0001
[0011] 〔式中、 R1— R4は、それぞれ独立して、水素原子又は式:一 Xn_R (Xは二価の基であ り、 nは 0又は 1であり、 Rは、置換基を有していてもよい炭素数 1一 7のアルキル基、 置換基を有していてもよい炭素数 3— 8のシクロアルキル基、芳香族基、カルボキシ ル基、ジカルボン酸無水物基、ヒドロキシノレ基、又はイミド基である)で示される基を表 し、 R1 R4のうち 1つ以上は、式: -X -Ra (式中、 X、 nは前記と同じ意味を表し、 Ra は、カルボキシル基、ジカルボン酸無水物基、ヒドロキシル基、又はイミド基である。 ) で示される基である。 mは 0 2の整数である。〕で表される繰り返し単位を有する樹 脂である(1)の樹脂組成物。 [Wherein, R 1 — R 4 are each independently a hydrogen atom or a formula: X n _R (X is a divalent group, n is 0 or 1, R is C 17 alkyl group which may have a substituent, C 3-8 cycloalkyl group which may have a substituent, aromatic group, carboxy group, dicarboxylic anhydride group , A hydroxy group, or an imide group), one or more of R 1 R 4 is a group represented by the formula: -X-R a (wherein X and n have the same meanings as described above) And Ra is a carboxyl group, a dicarboxylic anhydride group, a hydroxyl group, or an imide group. m is an integer of 0 2. ] The resin composition according to (1), which is a resin having a repeating unit represented by the following formula:
(6)前記無機微粒子が、 1一 200nmの一次粒子径を有するものである(1)の樹脂組 成物。  (6) The resin composition according to (1), wherein the inorganic fine particles have a primary particle diameter of 200 nm.
(7)前記無機微粒子が金属酸化物である(1)の樹脂組成物。  (7) The resin composition according to (1), wherein the inorganic fine particles are a metal oxide.
[0012] 本発明の第 2によれば、下記(8)—(10)の樹脂組成物の製造方法が提供される。  According to a second aspect of the present invention, there is provided a method for producing a resin composition according to the following (8) to (10).
(8)前記脂環式ォレフイン樹脂及び溶媒を含有する樹脂溶液と、前記無機微粒子及 び分散媒を含有する無機微粒子分散液とを混合する工程を有することを特徴とする ( 1)の樹脂組成物の製造方法。  (8) The resin composition according to (1), further comprising a step of mixing a resin solution containing the alicyclic resin and a solvent with an inorganic fine particle dispersion containing the inorganic fine particles and a dispersion medium. Method of manufacturing a product.
(9)前記溶媒が、グリコールジエーテル化合物、グリコールモノエーテルィヒ合物及び アミド化合物からなる群より選ばれる少なくとも 1種である(8)の樹脂組成物の製造方 法。  (9) The method for producing a resin composition according to (8), wherein the solvent is at least one selected from the group consisting of a glycol diether compound, a glycol monoether compound and an amide compound.
(10)前記分散媒が、グリコールエーテルアセテートィヒ合物、グリコールジエーテル化 合物、グリコールモノエーテルィ匕合物及びアミド化合物からなる群より選ばれる少なく とも 1種である(8)又は(9)の樹脂組成物の製造方法。 (10) The dispersion medium is selected from the group consisting of glycol ether acetate compounds, glycol diether compounds, glycol monoether conjugates and amide compounds. The method for producing a resin composition according to (8) or (9), which is one of them.
[0013] 本発明の第 3によれば、下記(11)の樹脂膜が提供される。 According to a third aspect of the present invention, there is provided the following resin film (11).
(11)前記(1)一(7)いずれかの樹脂組成物を用いて形成された、厚さ 0· 1— 200 μ mの樹脂膜。  (11) A resin film having a thickness of 0.1 to 200 μm formed using any one of the resin compositions (1) and (7).
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0014] 以下、本発明を詳細に説明する。 Hereinafter, the present invention will be described in detail.
1)樹脂組成物  1) Resin composition
本発明の樹脂組成物は、カルボキシル基、ジカルボン酸無水物基、ヒドロキシノレ基 及びイミド基からなる群より選ばれる 1種以上を分子内に有する脂環式ォレフイン榭 脂、無機微粒子、並びに溶媒を含有することを特徴とする。  The resin composition of the present invention comprises an alicyclic resin having at least one selected from the group consisting of a carboxyl group, a dicarboxylic anhydride group, a hydroxy group and an imide group in a molecule, inorganic fine particles, and a solvent. It is characterized by containing.
[0015] (1)脂環式ォレフイン樹脂 [0015] (1) Alicyclic resin
本発明に用いる脂環式ォレフイン樹脂は、脂環構造と炭素一炭素二重結合とを有 する重合性単量体 (以下、「脂環式ォレフイン単量体」という)由来の構造単位を有す る重合体である。  The alicyclic olefin resin used in the present invention has a structural unit derived from a polymerizable monomer having an alicyclic structure and a carbon-carbon double bond (hereinafter, referred to as an “alicyclic olefin monomer”). It is a polymer.
脂環式ォレフイン単量体が有する脂環構造は、単環であっても、多環 (縮合多環、 橋架け環、これらの組み合わせ多環等)であってもよい。樹脂膜の機械的強度、耐熱 性等の観点から多環が好ましレ、。  The alicyclic structure of the alicyclic olefin monomer may be monocyclic or polycyclic (condensed polycyclic, bridged ring, combination of these, etc.). From the viewpoint of the mechanical strength and heat resistance of the resin film, a polycyclic ring is preferred.
[0016] 脂環構造を構成する炭素原子数は、特に制約はないが、通常 4一 30個、好ましく は 5 20個、より好ましくは 5 15個である。炭素原子数がこのような範囲であるとき に、樹脂膜の耐熱性、及びパターン性等の諸特性が高度にバランスされ好適である The number of carbon atoms constituting the alicyclic structure is not particularly limited, but is usually 430, preferably 520, more preferably 515. When the number of carbon atoms is in such a range, various characteristics such as heat resistance and patternability of the resin film are highly balanced and suitable.
[0017] 脂環式ォレフイン樹脂中、脂環式ォレフイン単量体由来の構造単位の割合は、使 用目的に応じて適宜選択されるが、通常 30 100重量%、好ましくは 50 100重量 ヽより好ましくは 70— 100重量%である。脂環式ォレフイン単量体由来の構造単位 の割合が過度に少ないと、樹脂膜の耐熱性に劣り好ましくない。 [0017] The proportion of the structural unit derived from the alicyclic olefin monomer in the alicyclic olefin resin is appropriately selected according to the purpose of use, but is usually from 30 to 100% by weight, preferably from 50 to 100% by weight. Preferably it is 70-100% by weight. If the proportion of the structural unit derived from the alicyclic olefin monomer is too small, the heat resistance of the resin film is poor, which is not preferable.
[0018] 本発明に用いる脂環式ォレフイン樹脂は、分子内に、カルボキシル基 (ヒドロキシカ ルボニル基)、ジカルボン酸無水物基(カルボニルォキシカルボニル基)、ヒドロキシ ル基、及びイミド基からなる群より選ばれる 1種以上(以下、これらをまとめて「特定極 性基」ということがある。)を有する。 [0018] The alicyclic olefin resin used in the present invention includes a group consisting of a carboxyl group (hydroxycarbonyl group), a dicarboxylic anhydride group (carbonyloxycarbonyl group), a hydroxyl group, and an imide group in the molecule. One or more selected from the following (collectively, Sex group ". ).
[0019] 特定極性基は、樹脂の主鎖である脂環構造を構成する炭素原子に直接結合して いてもよいし、特定極性基を含む基として、脂環構造を構成する炭素原子と結合して いてもよい。後者の場合、特定極性基は、アルキレン基等の二価の有機基を介して、 脂環構造を構成する炭素原子と結合してレ、る。  [0019] The specific polar group may be directly bonded to a carbon atom constituting the alicyclic structure which is the main chain of the resin, or may be a group containing the specific polar group which is bonded to a carbon atom constituting the alicyclic structure. It may be. In the latter case, the specific polar group is bonded to a carbon atom constituting the alicyclic structure via a divalent organic group such as an alkylene group.
[0020] 特定極性基を含む基としては、カルボキシル基を含む基、ジカルボン酸無水物基 を含む基、ヒドロキシル基を含む基、及びイミド基を含む基が挙げられる。  [0020] Examples of the group containing a specific polar group include a group containing a carboxyl group, a group containing a dicarboxylic anhydride group, a group containing a hydroxyl group, and a group containing an imide group.
[0021] カルボキシル基を含む基としては、ヒドロキシカルボニルアルキル基ゃヒドロキシカ ルポユルフェニル基等が挙げられる。  [0021] Examples of the group containing a carboxyl group include a hydroxycarbonylalkyl group and a hydroxycarboylphenyl group.
ジカルボン酸無水物基を含む基としては、アルキレンォキシカルボニルォキシアル キル基、〔一 (CH ) -CO-0-CO- (CH ) _ (pは任意の自然数を示す)〕で表され  The group containing a dicarboxylic anhydride group is represented by an alkyleneoxycarbonyloxyalkyl group or [1- (CH) -CO-0-CO- (CH) _ (p is an arbitrary natural number)].
2 p 2 p  2 p 2 p
る基等が挙げられる。  Groups and the like.
[0022] ヒドロキシル基を含む基としては、ヒドロキシフエニル基、ヒドロキシフエニルアルキル 基等のフエノール性ヒドロキシル基を含む基;ヒドロキシアルキル基、ヒドロキシアルコ キシ基、ヒドロキシアルコキシカルボニル基等のアルコール性ヒドロキシル基を含む基 ;が挙げられる。  Examples of the group containing a hydroxyl group include a group containing a phenolic hydroxyl group such as a hydroxyphenyl group and a hydroxyphenylalkyl group; and an alcoholic hydroxyl group such as a hydroxyalkyl group, a hydroxyalkoxy group and a hydroxyalkoxycarbonyl group. And a group containing:
イミド基を含む基としては、 N-フエニルジカルボキシイミド基等が挙げられる。  Examples of the group containing an imide group include an N-phenyldicarboximide group.
[0023] これらの中でも、特定極性基又は特定極性基を含む基の好ましい具体例としては、 カルボキシル基、ヒドロキシカルボニルメチル基、カルボニルォキシカルボニル基、ヒ ドロキシル基、ヒドロキシメトキシ基、 2—ヒドロキシエトキシ基が挙げられる。  Among these, preferred specific examples of the specific polar group or the group containing the specific polar group include a carboxyl group, a hydroxycarbonylmethyl group, a carbonyloxycarbonyl group, a hydroxyyl group, a hydroxymethoxy group, a 2-hydroxyethoxy group. Groups.
[0024] 本発明に用いる脂環式ォレフイン樹脂は、特定極性基の 1種類のみを有していても よいし、 2種類以上を組み合わせて有していてもよい。本発明の樹脂組成物及び該 組成物から得られる樹脂膜の諸特性を高度にバランスさせる観点から、脂環式ォレ フィン樹脂は、 2種類以上を組み合わせて有しているのが好ましぐカルボキシル基と イミド基とを有しているのが特に好ましい。  [0024] The alicyclic olefin resin used in the present invention may have only one type of specific polar group, or may have a combination of two or more types. From the viewpoint of highly balancing the various properties of the resin composition of the present invention and the resin film obtained from the composition, the alicyclic resin preferably has a combination of two or more types. It is particularly preferred to have a carboxyl group and an imide group.
[0025] 本発明に用いる脂環式ォレフイン樹脂としては、前記式 (I)で表される繰り返し単位 を有する樹脂が、透明性に優れる樹脂膜を与えることから好ましレ、。  As the alicyclic olefin resin used in the present invention, a resin having a repeating unit represented by the above formula (I) is preferable because it gives a resin film having excellent transparency.
[0026] 前記式 (I)中、 R1 R4は、それぞれ独立して、水素原子、又は、式: -X -Rで示さ れる基を表す。但し、 R1— R4のうち 1つ以上は、式: -Xn_Ra (Raは前記特定極性基を 表す。)で示される基である。また、前記 R1— R4のうち、いずれか 2つが前記式: -X Raで示される基である場合、異なる炭素(例えば、 R1と R3)に結合しているのが好ま しい。 In the above formula (I), R 1 R 4 are each independently a hydrogen atom or a group represented by the formula: -X-R Represents a group. Here, at least one of R 1 to R 4 is a group represented by the formula: -X n _R a (R a represents the above-mentioned specific polar group). Further, the R 1 - of R 4, any two of the formula: is a group represented by -XR a, different carbon (For example, R 1 and R 3) arbitrarily is preferable're bound to.
[0027] 前記式:一 X— Rにおいて、 Xは二価の基を表す。  In the above formula: one X—R, X represents a divalent group.
Xの具体例としては、メチレン基、エチレン基、プロピレン基等のアルキレン基; o—フ ェニレン基、 m—フエ二レン基、 p—フエ二レン基、ナフタレン基等のァリーレン基;一〇— で表される基;一 Rb_CO— Rb— (Rbはアルキレン基又はァリーレン基を表す。)で示さ れる基;等が挙げられる。ここで、 Rbのアルキレン基及びァリーレン基の具体例として は、前記 Xのアルキレン基、ァリーレン基と同様のものが挙げられる。 Specific examples of X include an alkylene group such as a methylene group, an ethylene group, and a propylene group; an arylene group such as an o-phenylene group, an m-phenylene group, a p-phenylene group, and a naphthalene group; a group represented by; single R b _CO- R b - (R b represents an alkylene group or Ariren group.) a group represented by; and the like are. Here, specific examples of the alkylene group and the arylene group for R b include those similar to the alkylene group and the arylene group for X.
これらの中でも、安定性の観点から、アルキレン基又はァリーレン基が好ましい。 nは 0又は 1である。  Among these, an alkylene group or an arylene group is preferable from the viewpoint of stability. n is 0 or 1.
また、 mは 0— 2の整数であり、 0又は 1であるのが好ましい。  In addition, m is an integer of 0 to 2, and is preferably 0 or 1.
[0028] Rは、置換基を有していてもよい炭素数 1一 7のアルキル基、置換基を有していても よい炭素数 3— 8のシクロアルキル基、芳香族基、又は前記特定極性基を表す。  [0028] R is an alkyl group having 17 to 17 carbon atoms which may have a substituent, a cycloalkyl group having 3 to 8 carbon atoms which may have a substituent, an aromatic group, or the aforementioned specific group. Represents a polar group.
[0029] 炭素数 1一 7のアルキル基としては、メチノレ基、ェチル基、 n—プロピル基、イソプロ ピノレ基、 n ブチル基、イソブチル基、 t ブチル基、 s ブチル基、 n ペンチル基、 1 メチルブチル基、 2—メチルブチル基、イソペンチル基、 n—へキシル基、 1ーメチルぺ ンチノレ基、 2—メチルペンチル基、 2 ェチルブチル基、 3—メチルペンチル基、イソへ キシル基、 n—へプチル基、 1 メチルへキシル基、 2 メチルへキシル基、 3 メチルへ キシル基、 2—ェチルー 3 メチルブチル基、イソへプチル基等が挙げられる。  [0029] Examples of the alkyl group having 17 carbon atoms include a methynole group, an ethyl group, an n-propyl group, an isopropyline group, an n-butyl group, an isobutyl group, a t-butyl group, an s-butyl group, an n-pentyl group, and a 1-methylbutyl group. Group, 2-methylbutyl group, isopentyl group, n-hexyl group, 1-methylpentinole group, 2-methylpentyl group, 2-ethylbutyl group, 3-methylpentyl group, isohexyl group, n-heptyl group, 1 Examples include a methylhexyl group, a 2-methylhexyl group, a 3-methylhexyl group, a 2-ethyl-3-methylbutyl group, and an isoheptyl group.
炭素数 3— 8のシクロアルキル基としては、シクロプロピル基、シクロブチル基、シク 口ペンチル基、シクロへキシル基、シクロォクチル基等が挙げられる。  Examples of the C 3-8 cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group and the like.
[0030] 置換基としては、フッ素原子、塩素原子、臭素原子等のハロゲン原子;ヒドロキシノレ 基;ァセチル基、ベンゾィル基等のァシル基;メトキシ基、エトキシ基、イソプロポキシ 基等のアルコキシル基;フエノキシ基、 4一メチルフエノキシ基等のァリールォキシ基; メトキシカルボニル基、エトキシカルボニル基、 t—ブトキシカルボニル基等のアルコキ シカルボニル基;ァセトキシ基等のアルキルカルボニルォキシ基;ベンゾィルォキシ 基等のァリールカルボニルォキシ基;ニトロ基;シァノ基;等が挙げられる。 Examples of the substituent include a halogen atom such as a fluorine atom, a chlorine atom, and a bromine atom; a hydroxyl group; an acyl group such as an acetyl group and a benzoyl group; an alkoxyl group such as a methoxy group, an ethoxy group, and an isopropoxy group; Carbonyl groups such as methoxycarbonyl, ethoxycarbonyl and t-butoxycarbonyl; alkylcarbonyl groups such as acetooxy; benzoyloxy Aryloxycarbonyl group; nitro group; cyano group; and the like.
[0031] 芳香族基としては、フエ二ル基、 2—クロロフヱニル基、 4一メチルフエニル基等の置 換基を有していてもよいフエニル基; 1一ナフチル基、 2—ナフチル基、 6—メチルー 1一 ナフチル基等の置換基を有してレ、てもよレ、ナフチル基; 2_ピリジル基、 3_ピリジル基 、 4一ピリジノレ基等の置換基を有してレ、てもよレ、ピリジル基;等が挙げられる。  [0031] Examples of the aromatic group include a phenyl group which may have a substituent such as a phenyl group, a 2-chlorophenyl group or a 4-methylphenyl group; a 1-naphthyl group, a 2-naphthyl group, a 6- Methyl-11-naphthyl group and other substituents; naphthyl group; 2-pyridyl group, 3_pyridyl group and 4-pyridinole group and other substituents. And pyridyl groups.
[0032] 本発明に用いる脂環式ォレフイン樹脂を得る方法は特に制限されず、例えば、次 の(i)一 (iv)の方法が挙げられる。  [0032] The method for obtaining the alicyclic olefin resin used in the present invention is not particularly limited, and examples thereof include the following method (i)-(iv).
[0033] (i)特定極性基を有さなレ、脂環式ォレフイン単量体を、ラジカル重合開始剤の存在下 重合して得られる樹脂を、特定極性基を含有する化合物を用いて公知の方法により 変性して、特定極性基を導入する方法。  (I) A resin obtained by polymerizing an alicyclic olefin monomer having no specific polar group in the presence of a radical polymerization initiator is known by using a compound having a specific polar group. Method to introduce a specific polar group by denaturation according to the method.
[0034] 特定極性基を含有する化合物としては、アクリル酸、メタクリル酸、 ひ—ェチルアタリ ル酸、 2—ヒドロキシェチルアクリル酸、 2—ヒドロキシェチルメタクリル酸、マレイン酸、 フマール酸、ィタコン酸、エンドシス—ビシクロ [2. 2. 1]ヘプト _5_ェンー 2, 3—ジカ ノレボン酸、メチノレーエンドシス一ビシクロ [2· 2. 1]ヘプトー 5_ェンー 2, 3—ジカルボン 酸等の不飽和カルボン酸化合物、及びこれらのイミド誘導体;無水マレイン酸、クロ口 無水マレイン酸、ブテュル無水コハク酸、テトラヒドロ無水フタル酸、無水シトラコン酸 等の不飽和カルボン酸無水物;等が挙げられる。  [0034] Examples of the compound containing a specific polar group include acrylic acid, methacrylic acid, sodium ethacrylic acid, 2-hydroxyethylacrylic acid, 2-hydroxyethyl methacrylic acid, maleic acid, fumaric acid, itaconic acid, Unsaturated carboxylic acids such as endocis-bicyclo [2.2.1] hept_5_en-2,3-dicanolevonic acid and methinoleic endocis-bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid Acid compounds and imide derivatives thereof; unsaturated carboxylic anhydrides such as maleic anhydride, maleic anhydride, butulic succinic anhydride, tetrahydrophthalic anhydride and citraconic anhydride; and the like.
[0035] (ii)アルコキシカルボニル基等の特定極性基以外の極性基を有し、特定極性基を有 さなレ、脂環式ォレフイン単量体を、ラジカル重合開始剤の存在下に重合して重合体 を得、得られた重合体中に含まれる特定極性基以外の極性基を、公知の方法により 加水分解又は還元して特定極性基に誘導する方法。  (Ii) Polymerization of an alicyclic olefin monomer having a polar group other than a specific polar group such as an alkoxycarbonyl group and having no specific polar group in the presence of a radical polymerization initiator. And obtaining a polymer by hydrolysis or reduction of a polar group other than the specific polar group contained in the obtained polymer into a specific polar group by a known method.
[0036] 前記特定極性基以外の極性基は、加水分解や還元などの化学反応により、特定 極性基に誘導することができる基である。具体的には、 -ORc; -OCORc; -COORc; N—置換アミド基;等が挙げられる。ここで、 Reは、直鎖状、分岐鎖状又は脂環式の、 飽和炭化水素基又は不飽和炭化水素基である。また、前記飽和炭化水素基又は不 飽和炭化水素基は、ハロゲン原子、ケィ素原子、酸素原子もしくは窒素原子を含む 基(但し、ヒドロキシル基及びヒドロキシカルボ二ル基を除く)に置換されていてもよい [0037] (i)、 (ii)の方法において、特定極性基を有さない脂環式ォレフイン単量体をラジカ ル重合する際には、必要に応じて前記脂環式ォレフイン単量体と付加共重合又は開 環共重合可能なその他の単量体 (以下、「その他の単量体」という)を添加してもよい 。また、必要に応じて、得られる樹脂の不飽和結合部分を常法に従って水素添加し てもよい。 [0036] The polar group other than the specific polar group is a group that can be derived to a specific polar group by a chemical reaction such as hydrolysis or reduction. Specifically, -OR c ; -OCOR c ; -COOR c ; N-substituted amide group; and the like. Here, Re is a linear, branched or alicyclic, saturated or unsaturated hydrocarbon group. The saturated hydrocarbon group or unsaturated hydrocarbon group may be substituted with a group containing a halogen atom, a silicon atom, an oxygen atom or a nitrogen atom (excluding a hydroxyl group and a hydroxycarboxy group). Good [0037] In the methods (i) and (ii), when the alicyclic olefin monomer having no specific polar group is subjected to radical polymerization, the alicyclic olefin monomer may be optionally combined with the alicyclic olefin monomer. Other monomers capable of addition copolymerization or ring-opening copolymerization (hereinafter, referred to as “other monomers”) may be added. Further, if necessary, the unsaturated bond portion of the obtained resin may be hydrogenated according to a conventional method.
[0038] (iii)特定極性基を有さない脂環式ォレフイン単量体と、特定極性基を有する脂環式 ォレフィン単量体とを共重合する方法。  (Iii) A method of copolymerizing an alicyclic olefin monomer having no specific polar group and an alicyclic olefin monomer having a specific polar group.
この方法において、共重合する際には、必要に応じてその他の単量体を添加しても よぐまた、必要に応じて、得られる樹脂の不飽和結合部分を常法に従って水素添カロ してもよい。  In this method, when copolymerizing, other monomers may be added as necessary.If necessary, the unsaturated bond portion of the obtained resin may be hydrogenated by a conventional method. You may.
[0039] また、 (iii)の方法において、特定極性基を有さない脂環式ォレフイン単量体と、特 定極性基を有する脂環式ォレフイン単量体とを、有機ルテニウム重合触媒の存在下 で開環メタセシス共重合したのち、必要に応じて不飽和結合部分を常法に従って水 素添加し、さらに、必要に応じて特定極性基以外の極性基を加水分解等により特定 極性基に誘導することによつても、 目的とする脂環式ォレフイン樹脂を得ることができ る。この方法によれば、分子量分布の狭い、特定極性基を有する脂環式ォレフイン樹 脂を効率よく得ることができる。  In the method (iii), an alicyclic olefin monomer having no specific polar group and an alicyclic olefin monomer having a specific polar group are combined with each other in the presence of an organic ruthenium polymerization catalyst. After the ring-opening metathesis copolymerization below, if necessary, the unsaturated bond portion is hydrogenated according to a conventional method, and if necessary, a polar group other than the specific polar group is induced to a specific polar group by hydrolysis or the like. By doing so, the desired alicyclic resin can be obtained. According to this method, an alicyclic resin having a narrow molecular weight distribution and having a specific polar group can be efficiently obtained.
[0040] ここで用いる有機ルテニウム重合触媒は、開環重合を促進する、ルテニウムを含有 する触媒である。なかでも、中性の電子供与性配位子が配位している有機ルテニゥ ム化合物を主成分とする重合触媒が好ましい。中性の電子供与性配位子は、中心 金属(すなわちルテニウム)から引き離されたときに中性の電荷を持つ配位子である。  [0040] The organic ruthenium polymerization catalyst used herein is a ruthenium-containing catalyst that promotes ring-opening polymerization. Among them, a polymerization catalyst containing an organic ruthenium compound to which a neutral electron donating ligand is coordinated as a main component is preferable. Neutral electron donating ligands are ligands that have a neutral charge when separated from the central metal (ie, ruthenium).
[0041] より好適な有機ルテニウム化合物は、中性の電子供与性配位子とともに、ァニオン 性配位子が配位したものである。ァニオン性配位子は、ルテニウムから引き離された ときに負の電荷を持つ配位子である。  [0041] More preferred organic ruthenium compounds are those in which an anionic ligand is coordinated together with a neutral electron donating ligand. Anionic ligands are ligands that have a negative charge when separated from ruthenium.
[0042] また、有機ルテニウム化合物には、さらに対ァニオンが存在してレ、てもよレ、。対ァニ オンは、ルテニウム陽イオンとイオン対を形成する陰イオンをレ、い、こうした対を形成 できる陰イオンであれば特に限定されない。  [0042] In addition, the organic ruthenium compound may further include a counter anion. The counter anion is not particularly limited as long as it can form an anion that forms an ion pair with a ruthenium cation, and can form such a pair.
[0043] 有機ルテニウム化合物の具体例としては、ビス(トリシクロへキシルホスフィン)ベン ジリデンルテニウムジクロリド、ビス(トリフエニルホスフィン)— 3, 3—ジフエニルプロぺ 二リデンルテニウムジクロリド、ビス(トリシクロへキシルホスフィン)フエ二ルビ二リデン ルテニウムジクロリド、ビス(トリシクロへキシルホスフィン) t—ブチルビニリデンルテニゥ ムジクロリド、ビス(1, 3—ジイソプロピルイミダゾリン一 2—イリデン)ベンジリデンルテ二 ゥムジクロリド、ビス(1, 3—ジシクロへキシルイミダゾリン— 2—イリデン)ベンジリデンル テニゥムジクロリド、(1, 3—ジメシチルイミダゾリン一 2—イリデン)(トリシクロへキシルホ スフイン)ベンジリデンルテニウムジクロリド、(1 , 3—ジメシチルイミダゾリジン一 2_イリ デン)(トリシクロへキシルホスフィン)ベンジリデンルテニウムジクロリド等が挙げられる [0043] Specific examples of the organic ruthenium compound include bis (tricyclohexylphosphine) benzene. Dilidene ruthenium dichloride, bis (triphenylphosphine) —3,3-diphenylpro ぺ dirilidene ruthenium dichloride, bis (tricyclohexylphosphine) phenylidene ruthenium dichloride, bis (tricyclohexylphosphine) t-butylvinylidene Tenidimudichloride, bis (1,3-diisopropylimidazoline-1-2-ylidene) benzylidene lutedichloride, bis (1,3-dicyclohexylimidazoline-2-ylidene) benzylidene tenidimudichloride, (1,3-dimesityl) Imidazoline-l- 2-ylidene) (tricyclohexylphosphine) benzylidene ruthenium dichloride, (1,3-dimesitylimidazolidine-l_ 2-ylidene) (tricyclohexylphosphine) benzylidene ruthenium dichloride Etc.
[0044] また、上述した重合触媒の重合活性を高めるため、ピリジン類;ホスフィン類;前述 の 1, 3—ジイソプロピルイミダゾリン— 2_イリデン、 1 , 3—ジメシチルイミダゾリジン _2_ イリデン等の、含窒素複素環式カルベン化合物等の中性の電子供与性化合物を、 重合触媒中のルテニウム金属に対して、重量比で 1一 100倍の割合で添加すること あでさる。 [0044] Further, in order to enhance the polymerization activity of the polymerization catalyst, pyridines; phosphines; and 1,3-diisopropylimidazoline-2_ylidene and 1,3-dimesitylimidazolidine_2_ylidene such as those described above. A neutral electron-donating compound such as a nitrogen heterocyclic carbene compound is added at a ratio of 1 to 100 times in weight ratio to ruthenium metal in the polymerization catalyst.
[0045] さらに、上述した重合触媒を使用する場合には、重合活性を高めるために、例えば 、 N CHCOOEt等のジァゾ化合物;フエニルアセチレン等のアセチレン化合物; Et  Further, when the above-mentioned polymerization catalyst is used, for example, diazo compounds such as N CHCOOEt; acetylene compounds such as phenylacetylene;
2 2 twenty two
SiH、 Ph MeSiH等のシリル化合物;を、ルテニウム金属に対して、重量比で 1 A silyl compound such as SiH or Ph MeSiH;
2 一 10 2 one 10
0倍の割合で使用することもできる。ここで、 Etはェチル基、 Phはフエ二ノレ基、 Meは メチル基をそれぞれ示す。 It can be used at a rate of 0 times. Here, Et represents an ethyl group, Ph represents a phenyl group, and Me represents a methyl group.
[0046] (iv)また、上記(i)一 (iii)の方法にぉレ、て、脂環式ォレフイン単量体の一部又は全部 の代わりに、芳香族重合性単量体を用いて重合し、得られる樹脂の芳香族性の炭素 —炭素二重結合を水素添加する方法によっても、 目的とする脂環式ォレフイン樹脂を 得ること力 Sできる。 (Iv) Further, according to the above method (i)-(iii), an aromatic polymerizable monomer is used instead of part or all of the alicyclic olefin monomer. The desired alicyclic olefin resin can also be obtained by a method of polymerizing and hydrogenating an aromatic carbon-carbon double bond of the obtained resin.
[0047] 上記 (i)一 (iv)の方法において、脂環式ォレフイン樹脂を得るために使用される重 合性単量体の具体例を、以下の(a) (d)に挙げる。尚、特定極性基を有する脂環 式ォレフイン単量体として例示された化合物は、前記式 (I)で表される繰り返し単位を 与える単量体である。  [0047] Specific examples of the polymerizable monomer used to obtain the alicyclic olefin resin in the method (i)-(iv) are described in (a) and (d) below. The compound exemplified as the alicyclic olefin monomer having a specific polar group is a monomer that gives the repeating unit represented by the formula (I).
[0048] (a)特定極性基としてカルボキシノレ基を有する脂環式ォレフイン単量体 5—ヒドロキシカルボ二ルビシクロ [2· 2. 1]ヘプト— 2_ェン、 5—ヒドロキシカルボニル メチルビシクロ [2· 2.1]ヘプト _2_ェン、 5, 6—ジ(ヒドロキシカルボニル)ビシクロ [2 .2. 1]ヘプト— 2_ェン、 5—メチルー 5—ヒドロキシカルボ二ルビシクロ [2· 2.1]ヘプト —2—ェン、 5—メチル _5, 6—ジ(ヒドロキシカルボニル)ビシクロ [2.2. 1]ヘプト _2— ェン、 5—ヒドロキシカルボ二ノレ— 5—ヒドロキシカルボ二ルメチルビシクロ [2.2.1]ヘプ ト— 2—ェン等のビシクロヘプテン誘導体; 5—ヒドロキシカルボ二ルテトラシクロ [4.4. 0. I2'5. I7'10]ドデ力一 3—ェン、 5—ヒドロキシカルボ二ルメチルテトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン、 5, 6—ジ(ヒドロキシカルボニル)テトラシクロ [4.4.0.1 2, 5.1ァ, 10]ドデ力— 3—ェン、 5_メチル—5—ヒドロキシカルボ二ルテトラシクロ [4.4.0.(A) Alicyclic olefin monomer having a carboxy group as a specific polar group 5-hydroxycarbonylbicyclo [2.2.1] hept-2-ene, 5-hydroxycarbonylmethylbicyclo [2.2.1] hept_2_ene, 5,6-di (hydroxycarbonyl) bicyclo [2. 2.1] Hept-2-ene, 5-methyl-5-hydroxycarborbicyclo [2.2.1] hept-2-ene, 5-methyl_5,6-di (hydroxycarbonyl) bicyclo [2.2.1] Bicycloheptene derivatives such as hept-2-ene, 5-hydroxycarbinole-5-hydroxycarbonylmethylbicyclo [2.2.1] hept-2-ene; 5-hydroxycarbonyltetracyclo [4.4. 2 '5. I 7' 10 ] dodecane force one 3-E down, 5-hydroxy-carbonylation methyl tetracyclo [4.4.0. I 2 '5. I 7' 10] dodecane force one 3- E down , 5, 6-di (hydroxy-carbonyl) tetracyclo [4.4.0.1 2, 5 .1 §, 10] dodecane force - 3 E emissions, 5 _ methyl - 5-hydroxycarbonyltetracyclo [4.4.0.
I2'5. I7'10]ドデ力一 3—ェン、 5—メチル _5, 6—ジ(ヒドロキシカルボニル)テトラシクロ [ 4.4.0. I2,5. I7'10]ドデ力一 3—ェン、 5—ヒドロキシカルボニル一5—ヒドロキシカルボ 二ルメチルテトラシクロ [4.4.0. I2'5. 17' 1C>]ドデ力一 3—ェン; 8—ヒドロキシカルボ二 ルテトラシクロ [4.4.0. I2,5. I7'10]ドデ力— 3—ェン、 8—ヒドロキシカルボニルメチル テトラシクロ [4.4.0. I2'5. I7'10]ドデ力— 3—ェン、 8, 9—ジ(ヒドロキシカルボニル) テトラシクロ [4· 4.0. I2,5. I7'10]ドデ力一 3—ェン、 8—メチル 8—ヒドロキシカルボ二 ルテトラシクロ [4· 4.0. I2,5. I7'10]ドデ力— 3—ェン、 8—メチルー 8, 9—ジ(ヒドロキシ カルボニル)テトラシクロ [4.4.0. I2,5. I7'10]ドデ力— 3—ェン、 8—ヒドロキシカルボ ニル 8—ヒドロキシカルボ二ルメチルテトラシクロ [4· 4.0. I2,5. I7'10]ドデ力一 3—ェ ン等のテトラシクロドデセン誘導体; I 2 '5. I 7' 10] dodecane force one 3-E down, 5-methyl _5, 6- di (hydroxycarbonyl) tetracyclo [4.4.0. I 2,5. I 7 '10] de de force one 3-E down, 5-hydroxycarbonyl one 5-hydroxy-carbonylation methyl tetracyclo [4.4.0 I 2 '5 1 7 .'1C>.] dodecane force one 3-E emissions; 8-hydroxy-carbonylation Rutetorashikuro [4.4.0 I 2,5 I 7.. '10] de de force - 3-E down, 8-hydroxy-carbonyl-methyl tetracyclo [. 4.4.0 I 2'. 5 I 7 '10] de de force - 3-E down, 8, 9-di (hydroxy-carbonyl) tetracyclo [4 · 4.0. I 2,5. I 7 '10] dodecane force one 3-E down, 8-methyl-8-hydroxy carbonylation Rutetorashikuro [4 · 4.0 I 2,5 I 7.. '10] de de force -.. 3-E down, 8-methyl-8, 9-di (hydroxy-carbonyl) tetracyclo [4.4.0 I 2,5 I 7' 10 ] Dode force—3-ene, 8-hydroxycarbonyl 8-hydroxy Rubo two methyl tetracyclo [.. 4 · 4.0 I 2,5 I 7 '10] tetracyclododecene derivatives such as de de force one 3-E down;
11—ヒドロキシカルボエルへキサシクロ [6· 6.1. I3'6. I10'13.02' 7.09'14]ヘプタ デカ一 4—ェン、 11—ヒドロキシカルボニルメチルへキサシクロ [6.6.1. I3'6. I10'13. 02'7.09'14]ヘプタデ力— 4—ェン、 11, 12—ジ(ヒドロキシカルボニル)へキサシクロ [6 .6. 1. I3'6. I10'13.02'7.09'14]ヘプタデ力一 4_ェン、 11—メチル一11—ヒドロキシカ ルポニルへキサシクロ [6.6.1. I3'6. I10'13.02'7.09'14]ヘプタデカ _4_ェン、 11- メチル—11, 12—ジ(ヒドロキシカルボニル)へキサシクロ [6.6. 1. I3'6. I10'13.02'7 .09'14]ヘプタデ力— 4—ェン、 11—ヒドロキシカルボ二ルー 11—ヒドロキシカルボニルメ チルへキサシクロ [6.6.1. I3'6. I10'13.02'7.09'14]ヘプタデ力— 4—ェン等のへキ サシクロへプタデセン誘導体;等。 [0050] (b)特定極性基としてジカルボン酸無水物基を有する脂環式ォレフイン単量体 ビシクロ [2· 2.1]ヘプト _2_ェンー 5, 6—ジカルボン酸無水物、 5—メチルビシクロ [ 2.2. 1]ヘプトー 2—ェンー 5, 6—ジカルボン酸無水物等のビシクロヘプテン誘導体、 テトラシクロ [4.4.0. I2'5. '1。]ドデ力一 3—ェン一8, 9—ジカルボン酸無水物、 8—メ チルテトラシクロ [4.4.0. I2'5. '1。]ドデ力— 3—ェン— 8, 9—ジカルボン酸無水物 等のテトラシクロドデセン誘導体、へキサシクロ [6.6.1. I3'6. I10'13.02'7.09'14]へ プタデカー 4_ェンー 11, 12—ジカルボン酸無水物、 11一メチルへキサシクロ [6.6.1 . I3'6. I10'13.02'7.09'14]ヘプタデ力— 4—ェン—11, 12—ジカルボン酸無水物等の へキサシクロへプタデセン誘導体;等。 11-hydroxy-carbonitrile Kisashikuro to El [6 · 6.1. I 3 ' 6. I 10' 13 .0 2 '7 .0 9' 14] heptadecaethylene one 4-E down, Kisashikuro [6.6 to 11-hydroxycarbonyl methyl. . 1. I 3 '. 6 I 10' 13 0 2 '7 .0 9' 14] heptadecyl force -. 4-E down, 11, 12 to the di (hydroxycarbonyl) Kisashikuro [6 .6 1. I 3 '6. I 10' 13 .0 2 '7 .0 9' 14] heptadecyl force one 4_ E down, Kisashikuro to 11-methyl-one 11-hydroxy mosquito Ruponiru [6.6.1. I 3 '6. I 10' 13.0 2 '7.0 9' 14] heptadeca _4_ E down, 11-methyl -11 Kisashikuro [6.6 to 12 di (hydroxycarbonyl). 1. I 3 '6. I 10' 13 .0 2 '7.0 9' 14] heptadecyl force -. 4-E down, Kisashikuro to 11-hydroxy carbonylation route 11-hydroxy carbonyl methylation [6.6.1 I 3 '. 6 I 10' 13 .0 2 '7. etc.; - 0 9 '14] heptadecyl force 4- Putadesen derivatives E emissions, etc., to the to the key Sashikuro. (B) alicyclic olefin monomer having a dicarboxylic anhydride group as a specific polar group, bicyclo [2.2.1] hept_2_en- 5,6-dicarboxylic anhydride, 5-methylbicyclo [2.2. bicycloheptene derivatives such as 1] Heputo 2 En 5, 6-dicarboxylic anhydride, tetracyclo [4.4.0. I 2 '5. ' 1. ] 3-1-8,9-dicarboxylic anhydride, 8-methyltetracyclo [4. 4.0. I 2 ' 5. ' 1 . ] Dodecane force - 3-E down -. 8, tetracyclododecene derivatives such as 9-dicarboxylic acid anhydride, to Kisashikuro [6.6.1 I 3 '. 6 I 10' 13 .0 2 '7 .0 9 . '. Putadeka 4_ En 11 to 14], 12-dicarboxylic anhydride, 11 Kisashikuro to single methyl [6.6.1 I 3' 6 I 10 '13 .0 2' 7 .0 9 '14] heptadecyl force - Hexacycloheptadecene derivatives such as 4-ene-11,12-dicarboxylic anhydride; etc.
[0051] (c)特定極性基としてヒドロキシル基を有する脂環式ォレフイン単量体  (C) Alicyclic olefin monomer having a hydroxyl group as a specific polar group
5—ヒドロキシビシクロ [2.2.1]ヘプト一 2—ェン、 5—ヒドロキシメチルビシクロ [2.2. 1]ヘプト _2_ェン、 5, 6—ジヒドロキシメチルビシクロ [2.2.1]ヘプト _2_ェン、 5_(2 —ヒドロキシエトキシカルボニル)ビシクロ [2· 2.1]ヘプト— 2—ェン、 5—メチル -5— (2 —ヒドロキシエトキシカルボニル)ビシクロ [2· 2.1]ヘプト _2_ェン、 5_(3—ヒドロキシ プロポキシカルボニル)ビシクロ [2· 2.1]ヘプト— 2—ェン、 5—メチルー 5— (3—ヒドロキ シプロポキシカルボニル)ビシクロ [2· 2.1]ヘプト _2_ェン、 5_(4—ヒドロキシブトキ シカルボニル)ビシクロ [2.2.1]ヘプト _2_ェン、等のビシクロヘプテン誘導体;  5-hydroxybicyclo [2.2.1] hept-1-ene, 5-hydroxymethylbicyclo [2.2.1] hept_2_ene, 5,6-dihydroxymethylbicyclo [2.2.1] hept_2_ene, 5_ (2-Hydroxyethoxycarbonyl) bicyclo [2.2.1] hept-2-ene, 5-methyl-5- (2-hydroxyethoxycarbonyl) bicyclo [2.2.1] hept_2_ene, 5_ (3— Hydroxypropoxycarbonyl) bicyclo [2.2.1] hept-2-ene, 5-methyl-5- (3-hydroxypropoxycarbonyl) bicyclo [2.2.1] hept_2_ene, 5_ (4-hydroxybutoxy) Bicycloheptene derivatives such as carbonyl) bicyclo [2.2.1] hept_2_ene;
[0052] 8—ヒドロキシテトラシクロ [4· 4.0. I2,5. I7' 10]ドデ力一 3—ェン、 8—ヒドロキシメチル テトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン、 8, 9—ビス(ヒドロキシメチル)テト ラシクロ [4· 4.0. I2'5. I7'10]ドデ力— 3—ェン、 8— (2—ヒドロキシエトキシカルボニル )テトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン、 8—メチノレー 8— (2—ヒドロキシエト キシカルボニル)テトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン、 8— (3—ヒドロキ シプロポキシカルボニル)テトラシクロ [4.4.0. I2'5. l7'10]ドデ力— 3—ェン、 8—メチ ノレ— 8— (3—ヒドロキシプロポキシカルボニル)テトラシクロ [4.4.0. I2'5. I7'10]ドデカ — 3_ェン、 8— (4—ヒドロキシブトキシカルボニル)テトラシクロ [4.4.0. I2'5. I7'10]ド デ力— 3—ェン等のテトラシクロドデセン誘導体; [0052] 8-hydroxy-tetramethyl cyclo [4 · 4.0. I 2,5. I 7 '10] dodecane force one 3-E down, 8-hydroxymethyl-tetracyclo [4.4.0. I 2' 5. I 7 ' 10 ] Dode force 3-ene, 8, 9-bis (hydroxymethyl) tetracyclyl [4 • 4.0. I 2 ' 5. I 7 ' 10 ] Dode force 3-ene, 8- (2 —Hydroxyethoxycarbonyl) tetracyclo [4.4.0. I 2 ' 5. I 7 ' 10 ] doderic 3-ene, 8-methylinole 8 -— (2-hydroxyethoxycarbonyl) tetracyclo [4.4.0. I . 2 '. 5 I 7' 10] dodecane force one 3-E down, 8- (3-hydroxy shea propoxycarbonyl) tetracyclo [4.4.0 I 2 '. 5 l 7' 10] de de force - 3- E down, 8-methylcarbamoyl Honoré - 8- (3 - hydroxypropoxy carbonyl) tetracyclo [4 .4.0 I 2 '5 I 7.' 10.] dodeca - 3_ E down, 8- (4-hydroxy-butoxycarbonyl) tetracyclo [4.4.0. I 2 '5. I 7' 10] de de - tetracyclododecene derivatives such as 3-E emissions;
[0053] 11—ヒドロキシへキサシクロ [6.6. 1. I3'6. I10'13.02' 7.09' 14]ヘプタデ力一 4—ェ ン、 11—ヒドロキシメチルへキサシクロ [6.6.1. I3'6. I10'13.02,7.09'14]ヘプタデカ —4—ェン、 11, 12—ビス(ヒドロキシメチル)へキサシクロ [6· 6.1. I3,6. I10, 13.02' 7 .09'14]ヘプタデ力— 4—ェン、 11— (2—ヒドロキシエトキシカルボニル)へキサシクロ [6 • 6. 1. I3'6. I10'13.02'7.09'14]ヘプタデ力一 4-ェン、 11-メチル一11— (2—ヒドロキ シェトキシカルボニル)へキサシクロ [6.6. 1. I3'6. I10'13.02'7.09'14]ヘプタデ力— 4—ェン、 11— (3—ヒドロキシプロポキシカルボニル)へキサシクロ [6.6.1. I3'6. I10' 13.02'7.09'14]ヘプタデカ一4—ェン、 11—メチノレ一 11— (3—ヒドロキシプロポキシカル ボニル)へキサシクロ [6.6.1. I3'6. I10'13.02'7.09'14]ヘプタデカー 4一ェン、 11— ( 4—ヒドロキシブトキシカルボニル)へキサシクロ [6.6.1. I3'6. I10'13.02'7.09'14]へ プタデカー 4—ェン等のへキサシクロへプタデセン誘導体;等。 [0053] Kisashikuro to 11-hydroxy [6.6. 1. I 3 '6 . I 10' 13 .0 2 '7 .0 9' 14] heptadecyl force one 4-E down, Kisashikuro [6.6 to 11-hydroxymethyl. 1. I 3 '6. I 10 ' 13 .0 2,7 .0 9 '14] heptadeca 4-E down, 11, 12-bis Kisashikuro to (hydroxymethyl) [6 · 6.1 I 3,6 I 10, 13 .0 2 '7 .0 9' 14..] Heptadecyl force - 4 E down, Kisashikuro to 11- (2-hydroxyethoxy carbonyl) [6 • 6. 1. I 3 '6. I 10' 13 .0 2 '7 .0 9' 14] heptadecyl force one 4-E down, 11-methyl-one 11- (2-hydroxy shell butoxycarbonyl) to Kisashikuro [6.6 1. I 3 '6 I 10.' 13 .0 2 '7 .0 9' 14.] heptadecyl force - 4 E down, 11- (3- Kisashikuro to hydroxypropoxy carbonyl) [6.6.1. I 3 '6 . I 10' 1 3 .0 2 '7 .0 9' 14] heptadeca one 4-E down, 11 Mechinore one 11- (3-hydroxypropoxy Cal Boniru) to Kisashikuro [6.6.1. I 3 '6. I 10' 13 .0 2 '7 .0 9' 14] Heputadeka 4 one E down, Kisashikuro [6.6 to 11- (4-hydroxy-butoxycarbonyl). 1. I 3 Kisa '6. I 10' 13 .0 2 '7 .0 9' 14] to Putadeka 4 E emissions, etc., to the And the like; Putadesen derivatives to black.
[0054] (d)特定極性基としてイミド基を有する脂環式ォレフイン単量体 (D) Alicyclic olefin monomer having imide group as specific polar group
N—フエ二ルー(5—ノルボルネンー 2, 3—ジカルボキシイミド)等の N—フエニル置換ィ ミド化合物;  N-phenyl-substituted imido compounds such as N-phenyl (5-norbornene-2,3-dicarboximide);
[0055] これらの中でも、以下の単量体が特に好ましい。  [0055] Among these, the following monomers are particularly preferred.
5—ヒドロキシカルボ二ルビシクロ [2· 2. 1]ヘプト _2_ェン、 5, 6—ジ(ヒドロキシカル ボニル)ビシクロ [2· 2.1]ヘプト— 2—ェン等のビシクロヘプテン誘導体や、 8—ヒドロ キシカルボ二ルテトラシクロ [4.4.0. I2'5. I7'10]ドデ力— 3—ェン、 8, 9—ジ(ヒドロキ シカルボニル)テトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン等のテトラシクロドデ セン誘導体; Bicycloheptene derivatives such as 5-hydroxycarbonylbicyclo [2.2.1] hept_2_ene, 5,6-di (hydroxycarbonyl) bicyclo [2.2.1] hept-2-ene, and 8-hydro Xicarbonyltetracyclo [4.4.0. I 2 ' 5. I 7 ' 10 ] Dode force-3-ene, 8, 9-di (hydroxycarbonyl) tetracyclo [4.4.0. I 2 ' 5. I 7 Tetorashikurodode Sen derivatives such as' 10] de de force one 3-E down;
ビシクロ [2· 2.1]ヘプト _2_ェンー 5, 6—ジカルボン酸無水物、テトラシクロ [4· 4. 0. I2'5.17'1Q]ドデ力— 3_ェンー 8, 9—ジカルボン酸無水物等のへキサシクロへプタ デセン誘導体; Bicyclo [2 · 2.1] hept _2_ En 5, 6-dicarboxylic anhydride, tetracyclo [4 · 4. 0. I 2 ' 5 .1 7' 1Q] de de force - 3_ En 8, 9-dicarboxylic acid Hexacycloheptadecene derivatives such as anhydrides;
[0056] 5_ (2—ヒドロキシエトキシカルボニル)ビシクロ [2.2.1]ヘプト _2_ェン、 5_(3—ヒ ドロキシプロポキシカルボニル)ビシクロ [2.2.1]ヘプト _2_ェン、 8_(3—ヒドロキシ プロポキシカルボニル)テトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン、 5— (4—ヒ ドロキシブトキシカルボニル)ビシクロ [2.2.1]ヘプト _2_ェン、 8_(4—ヒドロキシブト キシカルボニル)テトラシクロ [4.4.0. I2'5. I7'10]ドデ力一 3—ェン等のへキサシクロ ヘプタデセン誘導体; [0056] 5_ (2-hydroxyethoxycarbonyl) bicyclo [2.2.1] hept_2_ene, 5_ (3-hydroxypropoxycarbonyl) bicyclo [2.2.1] hept_2_ene, 8_ (3-hydroxy Propoxycarbonyl) tetracyclo [4.4.0. I 2 ' 5. I 7 ' 10 ] dodecane 3-ene, 5- (4-hydroxybutoxycarbonyl) bicyclo [2.2.1] hept_2_ene Hexacycloheptadecene derivatives such as 8_ (4-hydroxybutoxycarbonyl) tetracyclo [4.4.0. I 2 ' 5. I 7 ' 10 ] dodeca-3-ene;
N—フエ二ルー(5—ノルボルネンー 2, 3—ジカルボキシイミド)等の N—フエニル置換ィ ミドィヒ合物;等。 N-phenyl-substituted compounds such as N-phenyl (5-norbornene-2,3-dicarboximide) Midig compounds; etc.
[0057] 特定極性基を有さない脂環式ォレフイン単量体としては、以下の(e)、 (f)のものが 挙げられる。  The alicyclic olefin monomer having no specific polar group includes the following (e) and (f).
(e)極性基を有さなレ、脂環式ォレフイン単量体  (e) Le, alicyclic olefin monomer having no polar group
ビシクロ [2. 2. 1]ヘプト— 2—ェン(慣用名:ノルボルネン)、 5_ェチル—ビシクロ [2. 2. 1]ヘプト _2_ェン、 5—ブチノレ—ビシクロ [2. 2. 1]ヘプト _2_ェン、 5—ェチリデン —ビシクロ [2. 2. 1]ヘプト _2_ェン、 5—メチリデン—ビシクロ [2. 2. 1]ヘプト— 2—ェン 、 5—ビュル一ビシクロ [2. 2. 1コヘプト一 2—ェン、トリシクロ [4. 3. 0. I2' 5コデ力一 3, 7 —ジェン (慣用名:ジシクロペンタジェン)、テトラシクロ [8. 4. 0. I11' 14. 02' 8]テトラデ 力一 3, 5, 7, 12, 11—テトラエン、テトラシクロ [4. 4. 0. I2' 5. I7' 10]デカ一 3—ェン( 慣用名:テトラシクロドデセン)、 8—メチルーテトラシクロ [4. 4. 0. I2' 5. l7' 10]ドデ力— 3_ェン、 8—ェチルーテトラシクロ [4. 4. 0. I2, 5. I7' 10]ドデ力— 3_ェン、 8—メチリデ ンーテトラシクロ [4. 4. 0. I2, 5. I7' 10]ドデ力一 3—ェン、 8—ェチリデンーテトラシクロ [4 • 4. 0. I2' 5. I7' 10]ドデ力一 3—ェン、 8—ビニルーテトラシクロ [4· 4. 0. I2, 5. I7' 10コド デカ— 3—ェン、 8—プロぺニルーテトラシクロ [4· 4. 0. I2, 5. I7' 10]ドデ力— 3—ェン、ぺ ンタシクロ [6. 5. 1. I3, 6. 02, 7. 09' 13]ペンタデ力一 3, 10—ジェン、ペンタシクロ [7. 4. 0. I3' 6. I10' 13. 02' 7]ペンタデ力一 4, 11—ジェン、シクロペンテン、シクロペンタジ ェン、 1, 4ーメタノ一1 , 4, 4a, 5, 10, 10a_へキサヒドロアントラセン、 8_フエ二ルーテ 卜ラシクロ [4. 4. 0. I2' 5. I7' 10]ドデ力一 3—ェン等。 Bicyclo [2.2.1] hept-2-ene (common name: norbornene), 5_ethyl-bicyclo [2.2.1] hept_2_ene, 5-butynole-bicyclo [2.2.1] ] Hept_2_2_ene, 5-ethylidene-bicyclo [2.2.1] Hept_2_2_ene, 5-methylidene-bicyclo [2.2.1] hept-2-ene, 5-Bu-bicyclo [ 2.2.1 cohept-1-ene, tricyclo [4.3.0. I 2 ' 5 code force 3, 7-gen (common name: dicyclopentadiene), tetracyclo [8.4.0. I 11 '14. 0 2' 8] Tetorade force one 3, 5, 7, 12, 11-tetraene, tetracyclo [4. 4. 0. I 2 '5 . I 7' 10] deca one 3- E down ( trivial name: tetracyclododecene), 8-methyl-over tetracyclo [4. 4. 0. I 2 '. 5 l 7' 10] de de force - 3_ E down, 8 E Chiru tetracyclo [4. 4. 0. I 2, 5 I 7 '10] de de force -.. 3_ E down, 8- Mechiride Hmm tetracyclo [4. 4. 0. I 2, 5 I 7 '10] dodecane force one 3-E down, 8 E Chile den over tetracyclo [4 • 4. 0. I 2' 5. I 7 '10] dodecane force one 3-E down, 8--vinyl tetracyclo [4 · 4. 0. I 2, 5 I 7. '10 codon deca -. 3 E down, 8-propenyl over tetracyclo [4 · 4. 0. I 2, 5 I 7' 10] de de force - 3-E down, Bae Ntashikuro [.. 6. 5. 1. I 3 , 6 0 2, 7 0 9 '13] Pentade force one 3, 10-Zhen, pentacyclo [7.4.1 zero. I 3 '6. I 10' 13. 0 2 '7] Pentade force one 4, 11-diene, cyclopentene, Shikuropentaji E emissions, 1, 4 Metano one 1, 4, 4a, 5, 10, Kisahidoro to 10a_ Anthracene, 8_ fenirutetracyclo [4. 4. 0. I 2 ' 5. I 7 ' 10 ]
[0058] (f)特定極性基以外の極性基を有する脂環式ォレフイン単量体 (F) Alicyclic olefin monomer having a polar group other than the specific polar group
前記(c)の、ビシクロヘプテン誘導体、テトラシクロドデセン誘導体、へキサシクロへ プタデセン誘導体等のホルメート、アセテート、プロピオネート、ブチレート、バレート 、ベンゾエート等の、ヒドロキシノレ基に変性されうる基:一 OC〇Reが結合した脂環式ォ レフイン単量体;前記(c)の、ビシクロヘプテン誘導体、テトラシクロドデセン誘導体、 へキサシクロへプタデセン誘導体等のメチルエステル、ェチルエステル、イソプロピル エステノレ、 n—ブチノレエステノレ、 t—ブチノレエステノレ、フエニノレエステノレ、ベンジノレエス テル等の、カルボキシル基に変性されうる基:一 CO〇Reが結合した脂環式ォレフイン 単量体;等。ここで、 Reは前記と同じ意味を表す。 [0059] 前記特定極性基以外の極性基を有する脂環式ォレフイン単量体の具体例としては 、 8—メチルー 8—メトキシカルボ二ルテトラシクロ [4· 4. 0. I2' 5. I7' 10]ドデ力— 3—ェン 、 5—メトキシカルボ二ルービシクロ [2· 2. 1]ヘプト一 2—ェン、 5—シァノ一ビシクロ [2· 2 . 1]ヘプト _2_ェン、 5_メチル _5—メトキシカルボニル—ビシクロ [2. 2. 1]ヘプト _2_ ェン等が挙げられる。 (C) a group capable of being modified into a hydroxyl group, such as a formate such as a bicycloheptene derivative, a tetracyclododecene derivative, or a hexacycloheptadecene derivative, an acetate, a propionate, a butyrate, a valate, or a benzoate ; An alicyclic olefin monomer bonded with: methyl ester such as bicycloheptene derivative, tetracyclododecene derivative, hexacycloheptadecene derivative, ethyl ester, isopropyl ester, n-butynole ester, - butylate Norre Este Honoré, Hue Nino Les Este Honoré, such Benjinoreesu ether, carboxyl group-modified group which may be: a CO_〇_R alicyclic e are bonded Orefuin monomer; and the like. Here, Re represents the same meaning as described above. [0059] Specific examples of the above alicyclic Orefuin monomer having a polar group other than the specific polar group is 8- methyl-8-methoxy-carbonylation Rutetorashikuro [4 · 4. 0. I 2 ' 5. I 7' 10 ] Dode force-3-ene, 5-methoxycarbonirubicyclo [2.2.1] hept-12-ene, 5-cyano-bicyclo [2.2.1] hept_2_ene, 5 _Methyl_5-methoxycarbonyl-bicyclo [2.2.1] hept_2_ene and the like.
これらの脂環式ォレフイン単量体は一種単独で、あるいは二種以上を組み合わせ て用いることができる。  These alicyclic olefin monomers can be used alone or in combination of two or more.
[0060] その他の単量体としては、エチレン、プロピレン、 1—ブテン、 1—ペンテン、 1—へキ セン、 3—メチノレ一 1—ブテン、 3—メチノレ一 1—ペンテン、 3—ェチノレ一 1—ペンテン、 4—メ チノレー 1_ペンテン、 4—メチノレ一 1—へキセン、 4, 4_ジメチノレ一 1—へキセン、 4, 4—ジメ チノレ一 1_ペンテン、 4—ェチノレ一 1—へキセン、 3—ェチノレ一 1—へキセン、 1—オタテン、 1—デセン、 1—ドデセン、 1—テトラデセン、 1_へキサデセン、 1—ォクタデセン、 1—ェ ィコセン等の炭素数 2— 20のエチレン又は α—ォレフィン; 1 , 4一へキサジェン、 4—メ チルー 1, 4一へキサジェン、 5—メチノレー 1 , 4一へキサジェン、 1, 7—ォクタジェン等の 非共役ジェン;等が挙げられる。これらの単量体は一種単独で、あるいは二種以上を 組み合わせて使用することができる。  [0060] Other monomers include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methynol-1-butene, 3-methynol-1-pentene, and 3-ethynol-1 —Pentene, 4—Methinole 1_pentene, 4—Methinole 1—hexene, 4,4—Dimethine 1—hexene, 4, 4-Dimethine 1—pentene, 4—Echinole 1—Hexene 1-hexene, 1-hexene, 1-otene, 1-decene, 1-dodecene, 1-tetradecene, 1_hexadecene, 1-octadecene, 1-ejicocene, etc. C2-20 ethylene or α —Olefin; non-conjugated gens such as 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methinole 1,4-hexadiene, and 1,7-octadiene; These monomers can be used alone or in combination of two or more.
なお、 α—ォレフインには、脂環式ォレフイン単量体の開環共重合に使用されると、 後述する分子量調整剤として機能するものもある。  It should be noted that some α-olefins, when used for ring-opening copolymerization of alicyclic olefin monomers, function as a molecular weight regulator described later.
[0061] 脂環式ォレフイン単量体の開環重合に際して、分子量調整剤を、単量体全量に対 して 0. 1— 10モル%程度を添加すると、開環重合体の分子量の調整が容易になる。 用いる分子量調整剤の量が少ない場合は、比較的大きい重量平均分子量 (Mw)の 重合体が得られ、逆に多い場合は、比較的小さい重量平均分子量 (Mw)の重合体 が得られる。  [0061] In the ring-opening polymerization of the alicyclic olefin monomer, when a molecular weight modifier is added in an amount of about 0.1 to 10 mol% based on the total amount of the monomers, the molecular weight of the ring-opened polymer can be adjusted. It will be easier. When the amount of the molecular weight modifier used is small, a polymer having a relatively large weight average molecular weight (Mw) is obtained, and when it is large, a polymer having a relatively small weight average molecular weight (Mw) is obtained.
[0062] 分子量調整剤として、ビュルィヒ合物、ジェン化合物等を使用することができる。  [0062] As a molecular weight regulator, a Bürich compound, a gen compound or the like can be used.
ビュル化合物としては、 1—ブテン、 1—ペンテン、 1—へキセン、 1—オタテン等のひ— ォレフィン化合物;スチレン、ビュルトノレェン等のスチレン化合物;ェチルビュルエー テル、イソブチルビュルエーテル、ァリルグリシジルエーテル等のエーテル化合物;ァ リルクロライド等のハロゲン含有ビュル化合物;酢酸ァリル、ァリルアルコール、グリシ ジルメタタリレート等の酸素含有ビニルイヒ合物;アクリルアミド等の窒素含有ビュル化 合物;等が挙げられる。ジェン化合物としては、 1, 4 ペンタジェン、 1 , 5—へキサジ ェン、 1, 6—へブタジエン、 2—メチノレー 1, 4 ペンタジェン、 2, 5—ジメチノレー 1 , 5—へ キサジェン等の非共役ジェン化合物; 1 , 3 ブタジエン、 2—メチノレー 1 , 3 ブタジエン 、 2, 3—ジメチノレー 1 , 3 ブタジエン、 1 , 3_ペンタジェン、 1, 3—へキサジェン等の共 役ジェン化合物;が挙げられる。これらの中でも、 1—へキセン等のひ—ォレフィン化合 物が特に好ましい。 Examples of the bur compound include fluorinated compounds such as 1-butene, 1-pentene, 1-hexene, and 1-otathene; styrene compounds such as styrene and burtonolene; ethers such as ethyl butyl ether, isobutyl butyl ether and aryl glycidyl ether. Compounds; halogen-containing compound such as aryl chloride; aryl acetate, aryl alcohol, glycyl Oxygen-containing vinyl compounds such as zirmetarylate; nitrogen-containing vinyl compounds such as acrylamide; and the like. Examples of the gen compounds include non-conjugated gens such as 1,4 pentadiene, 1,5-hexadiene, 1,6-hexadiene, 2-methinolee 1,4 pentadiene, 2,5-dimethinolee 1,5-hexadiene, and the like. Compounds; synergistic gen compounds such as 1,3-butadiene, 2-methinolay 1,3-butadiene, 2,3-dimethinole-1,3-butadiene, 1,3_pentadiene, and 1,3-hexadiene; Among these, a horefin compound such as 1-hexene is particularly preferable.
[0063] 得られる脂環式ォレフイン樹脂としては、例えば、脂環式ォレフイン単量体の開環 重合体及びその水素添加物、脂環式ォレフイン単量体の付加重合体、脂環式ォレフ イン単量体とビニル化合物との付加重合体、単環シクロアルケン重合体、脂環式共 役ジェン重合体、ビニル系脂環式炭化水素重合体及びその水素添加物、芳香族ォ レフイン重合体の芳香環水素添加物等が挙げられる。本発明において、これらの脂 環式ォレフイン樹脂は一種単独で、あるいは二種以上を組み合わせて用いることが できる。  Examples of the obtained alicyclic olefin resin include a ring-opened polymer of an alicyclic olefin monomer and a hydrogenated product thereof, an addition polymer of an alicyclic olefin monomer, and an alicyclic olefin resin. Addition polymer of monomer and vinyl compound, monocyclic cycloalkene polymer, alicyclic conjugated polymer, vinyl-based alicyclic hydrocarbon polymer and its hydrogenated product, aromatic olefin polymer And hydrogenated aromatic rings. In the present invention, these alicyclic resin may be used alone or in combination of two or more.
[0064] これらの中でも、脂環式ォレフイン単量体の開環重合体及びその水素添加物、脂 環式ォレフイン単量体の付加重合体、脂環式ォレフイン単量体とビニル化合物との 付加重合体、芳香族ォレフイン重合体の芳香環水素添加物が好ましぐ脂環式ォレ フィン単量体の開環重合体の水素添加物が特に好ましい。  Among these, ring-opened polymers of alicyclic olefin monomers and hydrogenated products thereof, addition polymers of alicyclic olefin monomers, and attachments of alicyclic olefin monomers and vinyl compounds A hydrogenated product of a ring-opened polymer of an alicyclic olefin monomer is particularly preferred, in which a polymer or an aromatic ring hydrogenated product of an aromatic olefin polymer is preferred.
[0065] (2)無機微粒子  (2) Inorganic fine particles
本発明に用いる無機微粒子としては、金属単体、無機酸化物、無機炭酸塩、無機 硫酸塩、無機リン酸塩等が挙げられ、耐熱性や耐酸化性の観点から無機酸化物が 好ましぐ金属酸化物が特に好ましい。  Examples of the inorganic fine particles used in the present invention include simple metals, inorganic oxides, inorganic carbonates, inorganic sulfates, inorganic phosphates, and the like. From the viewpoints of heat resistance and oxidation resistance, inorganic oxides are preferred. Oxides are particularly preferred.
[0066] 金属酸化物としては、コロイダルシリカ、ァエロジル、ガラス等のケィ素酸化物;アル ミナ等のアルミニウム酸化物;ジルコユア等のジルコニウム酸化物;チタニア等のチタ ン酸化物;が挙げられる。これらの中でも、コロイダルシリカ、ァノレミナ、ジルコユア、チ タニアが好ましぐ生産性の観点から、コロイダルシリカの使用が特に好ましい。  Examples of metal oxides include silicon oxides such as colloidal silica, aerosil, and glass; aluminum oxides such as alumina; zirconium oxides such as zirconia; and titanium oxides such as titania. Among them, the use of colloidal silica is particularly preferred from the viewpoint of productivity in which colloidal silica, anoremina, zirconia, and titania are preferred.
[0067] 本発明に用いる無機微粒子の一次粒子径は、通常 1一 200nmであり、透明性や パターン形成性の観点から、好ましくは 1一 150nm、より好ましくは 5 lOOnmであ る。また、無機微粒子の一次粒子径がこの範囲であると、後述する範囲のろ過速度を もつ樹脂組成物を容易に得ることができる。 [0067] The primary particle diameter of the inorganic fine particles used in the present invention is generally 11 to 200 nm, preferably 11 to 150 nm, more preferably 5 100 nm from the viewpoints of transparency and pattern formability. The When the primary particle diameter of the inorganic fine particles is in this range, a resin composition having a filtration rate in a range described later can be easily obtained.
ここで一次粒子径は、真球であると仮定したときの、真密度を基準にして、 BET法( 比表面積測定法)により測定されたものである。  Here, the primary particle diameter is measured by the BET method (specific surface area measurement method) based on the true density assuming a true sphere.
[0068] 無機微粒子の使用量は、形成する樹脂膜の用途に応じて任意に選択することがで きる。例えば、表示素子用透明樹脂膜を得る場合であれば、上述した特定極性基を 有する脂環式ォレフイン樹脂 100重量部に対して、通常 5 1000重量部、好ましく は 5 800重量部、より好ましくは 10 500重量部である。 [0068] The amount of the inorganic fine particles used can be arbitrarily selected according to the use of the resin film to be formed. For example, in the case of obtaining a transparent resin film for a display element, usually 51,000 parts by weight, preferably 5800 parts by weight, more preferably 5800 parts by weight, based on 100 parts by weight of the alicyclic olefin resin having a specific polar group described above. 10 500 parts by weight.
[0069] (3)溶媒 [0069] (3) Solvent
本発明に用いる溶媒は、前記脂環式ォレフイン樹脂が溶解可能な有機溶媒(良溶 媒)を含有する限り、格別な制限はない。  The solvent used in the present invention is not particularly limited as long as it contains an organic solvent (a good solvent) in which the alicyclic olefin resin can be dissolved.
良溶媒としては、前記脂環式ォレフイン樹脂の 23°Cにおける溶解度が 20重量%以 上であるものが好ましい。  As the good solvent, those having a solubility of 20% by weight or more at 23 ° C. of the alicyclic olefin resin are preferable.
[0070] 良溶媒の使用量は、前記脂環式ォレフイン樹脂 100重量部に対して、通常 500重 量部以上であり、所望の透明性を得る観点から、 500— 10, 000重量部が好ましぐ 500— 5, 000重量部がより好ましぐ 900— 2, 000重量部が特に好ましい。  [0070] The amount of the good solvent used is usually 500 parts by weight or more based on 100 parts by weight of the alicyclic olefin resin, and from the viewpoint of obtaining desired transparency, 500 to 10,000 parts by weight is preferred. Masu 500-5,000 parts by weight are more preferred 900-2,000 parts by weight are particularly preferred.
[0071] 良溶媒としては、ジエチレングリコールジメチルエーテル、ジエチレングリコールェ チルメチルエーテル、ジエチレングリコールジェチルエーテル、プロピレングリコーノレ メチルェチルエーテル等のグリコールジェ一テル化合物;プロピレングリコールモノメ チルエーテル、プロピレングリコールモノェチルエーテル、プロピレングリコールモノィ ソプロピルエーテル、プロピレングリコールモノー n—ブチルエーテル等のグリコールモ ノエーテル化合物; N_メチル _2—ピロリドン、 N, N—ジメチルァセトアミド等のアミド化 合物;テトラヒドロフラン等の脂環式エーテル化合物;シクロへキサノン等の脂環式ケト ン化合物;等が挙げられる。これらの中でも、樹脂組成物のろ過のし易さから、グリコ 一ルジェ一テル化合物、グリコールモノエーテル化合物、及びアミド化合物が好まし レ、。  Examples of good solvents include glycol ethylene compounds such as diethylene glycol dimethyl ether, diethylene glycol methyl methyl ether, diethylene glycol dimethyl ether, and propylene glycol methylethyl ether; propylene glycol monomethyl ether, propylene glycol monoethyl ether; Glycol monoether compounds such as propylene glycol monoisopropyl ether and propylene glycol mono-n-butyl ether; amidated compounds such as N_methyl-2-pyrrolidone and N, N-dimethylacetamide; alicyclic ethers such as tetrahydrofuran Alicyclic ketone compounds such as cyclohexanone; and the like. Among these, glyco-ester compounds, glycol monoether compounds, and amide compounds are preferred because of the ease of filtration of the resin composition.
[0072] 本発明の樹脂組成物においては、溶媒として、良溶媒及び良溶媒以外の溶媒 (貧 溶媒)の混合溶媒を用いることもできる。 貧溶媒としては、プロピレングリコールモノメチルエーテルアセテート等のグリコール モノエーテルアセテートィ匕合物等が挙げられる。 [0072] In the resin composition of the present invention, a mixed solvent of a good solvent and a solvent other than the good solvent (poor solvent) may be used. Examples of the poor solvent include glycol monoether acetate conjugates such as propylene glycol monomethyl ether acetate.
貧溶媒の使用量は、面内膜厚均一性に優れる樹脂膜を得るのが容易であることか ら、良溶媒に対して、通常 200重量%以下、好ましくは 100重量%以下である。  The use amount of the poor solvent is usually 200% by weight or less, preferably 100% by weight or less based on the good solvent, since it is easy to obtain a resin film having excellent in-plane film thickness uniformity.
[0073] (4)他の成分 [0073] (4) Other components
本発明の樹脂組成物には、上述した成分以外に、各種添加剤を目的に応じて添 カロすること力 Sできる。  In addition to the components described above, the resin composition of the present invention can add various additives according to the purpose.
添加剤としては、キノンジアジド化合物等の感光剤;アミノ基、カルボキシル基、ヒド 口キシル基、エポキシ基、イソシァネート基、ビュル基等の反応性基を 2以上有する 架橋剤(好ましい具体例としてはメチロール化合物やエポキシィヒ合物等が挙げられる )、固体スルホン酸化合物、イミダゾール化合物等のアミン化合物等の硬化助剤等の 硬化成分;フッ素系化合物やシリコン系化合物等の界面活性剤;ヒンダードフエノー ル化合物等の酸化防止剤;シランカップリング剤等の接着助剤;フエノール化合物等 の増感剤;帯電防止剤;消泡剤;分散剤;等が挙げられる。  Examples of the additive include a photosensitizer such as a quinonediazide compound; a crosslinking agent having at least two reactive groups such as an amino group, a carboxyl group, a hydroxyl group, an epoxy group, an isocyanate group, and a butyl group (a preferable specific example is a methylol compound). And epoxy compounds, etc.), curing components such as curing aids such as solid sulfonic acid compounds and amine compounds such as imidazole compounds; surfactants such as fluorine compounds and silicon compounds; hindered phenol compounds and the like Antioxidants; adhesion aids such as silane coupling agents; sensitizers such as phenolic compounds; antistatic agents; defoamers; dispersants;
[0074] 2)樹脂組成物の製造方法 [0074] 2) Method for producing resin composition
本発明の樹脂組成物を製造する方法に格別な制限はないが、操作性に優れること や、ろ過性に優れる組成物が得られること等の理由から、前記脂環式ォレフイン樹脂 と無機微粒子とを、それぞれ任意の液状媒体と混合して、脂環式ォレフイン樹脂溶液 (以下、単に「樹脂溶液」という)と、無機微粒子分散液とをそれぞれ調製した後、両 者を混合する方法、即ち、脂環式ォレフイン樹脂及び溶媒を含有する樹脂溶液と、 前記無機微粒子及び分散媒を含有する無機微粒子分散液とを混合する工程を有す ることが好ましい。これらの液状媒体は、本発明の樹脂組成物を構成する溶媒の全 部又は一部とすることができる。  There is no particular limitation on the method for producing the resin composition of the present invention.However, the alicyclic olefin resin and the inorganic microparticles are excellent in operability and in that a composition excellent in filterability is obtained. Are mixed with an arbitrary liquid medium to prepare an alicyclic olefin resin solution (hereinafter, simply referred to as “resin solution”) and an inorganic fine particle dispersion, respectively, and then mixing both. It is preferable to include a step of mixing a resin solution containing an alicyclic olefin resin and a solvent with an inorganic fine particle dispersion containing the inorganic fine particles and a dispersion medium. These liquid media can be all or part of the solvent constituting the resin composition of the present invention.
[0075] 前記脂環式ォレフイン樹脂を溶解するのに用いる液状媒体 (溶媒)としては、前述し た良溶媒が好ましぐグリコールジエーテルィ匕合物、グリコールモノエーテル化合物、 及びアミド化合物が特に好ましい。 [0075] As the liquid medium (solvent) used for dissolving the alicyclic olefin resin, the glycol diether conjugates, glycol monoether compounds, and amide compounds, which are preferably used in the above-described good solvent, are particularly preferable. preferable.
無機微粒子を分散させるのに用いる液状媒体 (分散媒)としては、前述した溶媒が 好ましぐグリコールモノエーテルアセテート化合物、グリコールジエーテル化合物、 グリコールモノエーテル化合物、及びアミド化合物が特に好ましレ、。 Examples of the liquid medium (dispersion medium) used to disperse the inorganic fine particles include glycol monoether acetate compounds, glycol diether compounds, Glycol monoether compounds and amide compounds are particularly preferred.
[0076] 金属酸化物の中で、ケィ素酸化物等は、水や有機分散媒に分散された状態で巿 販されているものが多い。本発明においては、有機分散媒に分散されたものであれ ば、そのまま樹脂組成物の製造に用いたり、必要に応じて分散媒を他の分散媒に交 換 (分散媒交換)して用いることができる。分散媒が水であるものも、分散媒交換して 用いることができる。  [0076] Among metal oxides, silicon oxide and the like are often sold in a state of being dispersed in water or an organic dispersion medium. In the present invention, if dispersed in an organic dispersion medium, the dispersion medium may be used as it is in the production of the resin composition, or the dispersion medium may be replaced with another dispersion medium (dispersion medium exchange) if necessary. Can be. Even when the dispersion medium is water, the dispersion medium can be exchanged for use.
[0077] 樹脂溶液と無機微粒子分散液とを混合する方法に格別な制限はなぐ樹脂溶液に 無機微粒子分散液を加えても、無機微粒子分散液に樹脂溶液を加えても、両者を同 時に容器に加えてもよいが、微粒子の凝集を防止する観点から、無機微粒子分散液 に樹脂溶液を加える方法が好ましレ、。  There is no particular limitation on the method of mixing the resin solution and the inorganic fine particle dispersion. Regardless of whether the inorganic fine particle dispersion is added to the resin solution or the resin solution is added to the inorganic fine particle dispersion, both are simultaneously placed in a container. However, from the viewpoint of preventing aggregation of the fine particles, a method of adding a resin solution to the inorganic fine particle dispersion is preferable.
[0078] 混合時の温度に格別な制限はないが、樹脂組成物中の溶媒の沸点を考慮して、そ の蒸発を抑制できる温度に設定するのが一般的である。従って、常圧での混合温度 は、通常 10— 50°C、好ましくは 10— 40°C、より好ましくは 15— 35°Cである。  [0078] There is no particular limitation on the temperature at the time of mixing, but it is general to set the temperature at which evaporation can be suppressed in consideration of the boiling point of the solvent in the resin composition. Therefore, the mixing temperature at normal pressure is usually 10-50 ° C, preferably 10-40 ° C, more preferably 15-35 ° C.
混合は、攪拌機付きの容器を用いても、振とう機に設置された容器を用いてもよい。  For mixing, a container equipped with a stirrer or a container installed in a shaker may be used.
[0079] 本発明の樹脂組成物は、優れた面内膜厚均一性を有する樹脂膜を形成できるもの であるが、ろ過速度の大きいものが、より優れた面内膜厚均一性を有する樹脂膜を形 成できることから好ましい。  [0079] The resin composition of the present invention is capable of forming a resin film having excellent in-plane film thickness uniformity. It is preferable because a film can be formed.
[0080] ここで、ろ過速度は、常温(23°C)、 0. 5kgf/cm2 (ゲージ圧)の加圧下で、直径 4 7mm、孔径 1 μ ΐη、多孔度 83%のメンブレンフィルターを用いてろ過したときの平均 速度であり、この速度は、通常 20g/分以上、好ましくは 30g/分以上、より好ましく は 40g/分以上である。このようなろ過速度を有する樹脂組成物は、特に優れた面 内膜厚均一性を有する樹脂膜を与える。ここで、多孔度は、細孔を含めてのメンブレ ンフィルターの全容積に対する細孔容積の割合である。 [0080] Here, the filtration speed was measured at room temperature (23 ° C) under a pressure of 0.5 kgf / cm 2 (gauge pressure) using a membrane filter with a diameter of 47 mm, a pore diameter of 1 μΐη, and a porosity of 83%. The average speed when filtration is performed, and this speed is usually 20 g / min or more, preferably 30 g / min or more, and more preferably 40 g / min or more. A resin composition having such a filtration rate gives a resin film having particularly excellent in-plane thickness uniformity. Here, the porosity is a ratio of the pore volume to the total volume of the membrane filter including the pores.
[0081] ろ過速度が上述した範囲である樹脂組成物は、上述した本発明の樹脂組成物の 製造方法により容易に得ることができる。また、同一成分を使用して、ろ過速度を調 整する方法としては、溶媒量を調整する方法を採用することもできる。  [0081] A resin composition having a filtration rate in the above-described range can be easily obtained by the above-described method for producing a resin composition of the present invention. As a method for adjusting the filtration rate using the same component, a method for adjusting the amount of the solvent may be employed.
[0082] 3)樹脂膜  [0082] 3) Resin film
本発明の樹脂組成物を用いることで、厚みが 0. 1 200 x mの樹脂膜を容易に形 成すること力 Sできる。得られる樹脂膜は、優れた透明性と面内膜厚均一性とを兼ね備 えた薄膜である。 By using the resin composition of the present invention, a resin film having a thickness of 0.1200 xm can be easily formed. The ability to generate S. The obtained resin film is a thin film having both excellent transparency and in-plane thickness uniformity.
[0083] 本発明の樹脂膜は、任意の形状の基板上に形成することができる。本発明の樹脂 膜は、基板と共に使用することもできるが、必要に応じて基板から樹脂膜を剥離して 、樹脂膜を単独で使用することもできる。  [0083] The resin film of the present invention can be formed on a substrate of any shape. Although the resin film of the present invention can be used together with the substrate, the resin film can be used alone by peeling the resin film from the substrate as necessary.
[0084] 本発明の樹脂膜の形成に用いる基板の種類や材質等は、特に制限されない。また 、用いる基板としては、単層の基板であっても、複数の層からなる基板であってもよい 。用いる基板の具体例としては、プリント配線板、ディスプレイ用基板等の配線を有す る基板;ガラス基板等の平坦な基板;樹脂膜を形成した後、適宜、樹脂膜と剥離され る樹脂製又は金属製の支持フィルムや支持プレート;等が挙げられる。  [0084] The type and material of the substrate used for forming the resin film of the present invention are not particularly limited. Further, the substrate to be used may be a single-layer substrate or a substrate having a plurality of layers. Specific examples of the substrate used include a substrate having wiring such as a printed wiring board and a display substrate; a flat substrate such as a glass substrate; and a resin or a resin which is appropriately separated from the resin film after forming the resin film. Metal support films and support plates; and the like.
[0085] 基板上に樹脂膜を形成する方法に格別な制限はなぐ例えば、基板上に樹脂組成 物を塗布し、得られた樹脂組成物の塗膜を加熱'乾燥する方法等が挙げられる。  [0085] There are no particular restrictions on the method of forming a resin film on a substrate. For example, a method of applying a resin composition on a substrate and heating and drying the obtained resin composition coating film may be mentioned.
[0086] 本発明の樹脂組成物を基板上に塗布する方法としては、スプレー法、ロールコート 法、回転塗布法等の方法が挙げられる。  [0086] Examples of a method for applying the resin composition of the present invention on a substrate include a method such as a spray method, a roll coating method, and a spin coating method.
[0087] 樹脂組成物の塗膜を加熱'乾燥する温度に格別な制限はなぐ通常 150— 300°C 、好ましくは 200— 250°Cである。また、加熱 ·乾燥する時間に格別な制限はなぐ例 えばホットプレートを用いる場合、通常 5— 60分間であり、オーブンを用いる場合、通 常 30— 90分間である。高い透明性のある樹脂膜を得る必要がある場合、窒素雰囲 気下で加熱するのが好ましレ、。  [0087] There is no particular limitation on the temperature at which the coating film of the resin composition is heated and dried. The temperature is usually 150 to 300 ° C, preferably 200 to 250 ° C. There is no particular limitation on the time for heating and drying. For example, when using a hot plate, it is usually 5 to 60 minutes, and when using an oven, it is usually 30 to 90 minutes. If it is necessary to obtain a highly transparent resin film, it is preferable to heat it in a nitrogen atmosphere.
[0088] 本発明の樹脂組成物には、架橋剤等の硬化成分を添加することもできる。硬化成 分を添加した場合、加熱により、基板上で樹脂膜を硬化させることができる。  [0088] A curing component such as a crosslinking agent may be added to the resin composition of the present invention. When a curing component is added, the resin film can be cured on the substrate by heating.
硬化のための加熱方法に格別な制限はなぐ例えば、硬化成分を含有する本発明 の樹脂組成物の塗膜を加熱 *乾燥したのち、更に加熱する方法が挙げられる。硬化 のための加熱は、ホットプレートやオーブン等の加熱装置により行うことができる。  There is no particular limitation on the heating method for curing. For example, there is a method in which a coating film of the resin composition of the present invention containing a curing component is heated * dried and then further heated. Heating for curing can be performed by a heating device such as a hot plate or an oven.
[0089] また樹脂膜は、基板全体を覆っているものであっても、パターン状等部分的に基板 表面を覆うものであってもよレ、。  The resin film may cover the entire substrate or may partially cover the substrate surface such as in a pattern.
パターン状の樹脂膜を基板上に形成する方法としては、感光剤を添加した本発明 の樹脂体組成物を用いたフォトリソグラフィ一法が挙げられる。 [0090] フォトリソグラフィ一法により、パターン状の樹脂膜を形成する具体的な方法としては 、基板上に感光剤を含有する樹脂組成物を、上述と同様の要領によって塗布、乾燥 (プリベータ)して得られた樹脂膜に、必要に応じてマスクパターンを介して、活性放 射線を照射して、前記樹脂膜中に潜像パターンを形成し、潜像パターンを有する当 該樹脂膜とアルカリ現像液とを接触させることによりパターンを顕在化して、基板上に パターン状の樹脂膜を形成する方法が挙げられる。更に、パターン状の樹脂膜をカロ 熱 (ポストベータ)すれば、パターン状の樹脂膜を硬化させることもできる。 As a method for forming a patterned resin film on a substrate, there is a photolithography method using the resin composition of the present invention to which a photosensitive agent is added. As a specific method of forming a patterned resin film by one photolithography method, a resin composition containing a photosensitive agent is applied on a substrate in the same manner as described above, and dried (pre-beta). The resin film thus obtained is irradiated with active radiation through a mask pattern, if necessary, to form a latent image pattern in the resin film, and the resin film having the latent image pattern is subjected to alkali development. There is a method of forming a pattern-like resin film on a substrate by making a pattern visible by contacting the liquid. Further, if the pattern-like resin film is subjected to calo-heating (post beta), the pattern-like resin film can be cured.
[0091] 活性放射線の種類は特に制限されず、例えば可視光線、紫外線、遠紫外線、 X線 、電子線、プロトンビーム線等が挙げられ、可視光線、紫外線が好ましい。  [0091] The type of actinic radiation is not particularly limited, and examples thereof include visible light, ultraviolet light, far ultraviolet light, X-rays, electron beams, and proton beam rays, with visible light and ultraviolet light being preferred.
照射する放射線量は、透明樹脂膜の使用目的、膜の厚み等により任意に設定する こと力 Sできる。また、パターンは、マスクを介して活性放射線を照射することによって形 成しても、電子線等で直接描画することによって形成してもよい。  The radiation dose for irradiation can be set arbitrarily according to the purpose of use of the transparent resin film, the thickness of the film, and the like. The pattern may be formed by irradiating actinic radiation through a mask, or may be formed by directly drawing with an electron beam or the like.
[0092] 本発明の樹脂膜は透明性に優れる。樹脂膜の透明性は、樹脂膜の透過率を分光 光度計にて測定することにより評価することができる。  [0092] The resin film of the present invention is excellent in transparency. The transparency of the resin film can be evaluated by measuring the transmittance of the resin film with a spectrophotometer.
また、本発明の樹脂膜は、面内膜厚均一性に優れる。面内膜厚均一性は、実施例 記載の条件により面内の膜厚を測定し、面内膜厚、膜厚の最大値と最小値の差によ り評価される。この差が小さい程、面内膜厚均一性に優れると評価できる。  Further, the resin film of the present invention has excellent in-plane thickness uniformity. The in-plane film thickness uniformity is measured by measuring the in-plane film thickness under the conditions described in the examples and evaluating the in-plane film thickness and the difference between the maximum value and the minimum value of the film thickness. It can be evaluated that the smaller the difference is, the more excellent the in-plane film thickness uniformity is.
[0093] フィルム状やパターン状の、本発明の樹脂膜は、面内膜厚均一性に優れるばかり でなぐ誘電特性等の電気特性にも優れる。従って、表示素子、集積回路素子、固 体撮像素子等の電子部品や、ディスプレイ用カラーフィルター、保護膜、平坦化膜、 電気絶縁膜等の電子部品用樹脂膜として使用することができる。  [0093] The film-like or pattern-like resin film of the present invention not only has excellent in-plane film thickness uniformity, but also has excellent electrical properties such as dielectric properties. Therefore, it can be used as an electronic component such as a display element, an integrated circuit element, and a solid-state imaging device, and a resin film for an electronic component such as a color filter for a display, a protective film, a flattening film, and an electric insulating film.
実施例  Example
[0094] 次に、実施例及び比較例を挙げて、本発明を更に具体的に説明するが、本発明は 以下の実施例により何ら限定されない。なお、部及び%は、特記のない限り質量基 準である。  Next, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited by the following examples. Parts and percentages are by mass unless otherwise specified.
[0095] <評価方法 >  [0095] <Evaluation method>
(1)無機微粒子の一次粒子径  (1) Primary particle diameter of inorganic fine particles
無機微粒子の平均粒径は、比表面積 ·細孔分布測定装置 (製品名「トライスター 30 0」、島津製作所社製)を用い、 JIS Z8830の方法に準じて、窒素ガスの吸着量から 表面積を計算する BET法 (比表面積測定法)で測定した。 The average particle size of the inorganic fine particles is determined by the specific surface area 0 "(manufactured by Shimadzu Corporation) and the BET method (specific surface area measurement method), which calculates the surface area from the amount of nitrogen gas adsorbed, according to the method of JIS Z8830.
[0096] (2)樹脂の分子量の測定と水素添加率 (2) Measurement of Resin Molecular Weight and Hydrogenation Rate
樹脂の重量平均分子量 (Mw)及び数平均分子量 (Mn)は、シクロへキサンを溶離 液とするゲルパーミエーシヨンクロマトグラフィー(GPC)により測定して求めた。  The weight average molecular weight (Mw) and number average molecular weight (Mn) of the resin were determined by gel permeation chromatography (GPC) using cyclohexane as an eluent.
水素添加率は、ェ1^ - NMRスペクトルを測定して、水素添加前の炭素 -炭素二重結 合に対する水素添加された炭素-炭素二重結合の割合 (モル%)を算出して求めた  The hydrogenation rate was determined by measuring the 1 ^ -NMR spectrum and calculating the ratio (mol%) of hydrogenated carbon-carbon double bonds to carbon-carbon double bonds before hydrogenation.
[0097] (3)ろ過速度 [0097] (3) Filtration speed
樹脂と無機微粒子の混合溶液 100gを、 23°C、 0. 5kgf/cm2の加圧下、ろ過装置 (製品名「LS_47V」、アドバンテック社製)を用レ、、直径 47mm、孔径 1 μ mの親水 性ポリテトラフルォロエチレン製メンブレンフィルター(製品名「H100A07A」、アドバ ンテック社製、多孔度 83%、質量 1. 3mg/cm2、厚さ 35 / m、水流量 73ml/分 ' c m2)でろ過し、ろ過量とろ過時間とから、平均ろ過速度 (g/分)を求めた。 100 g of a mixed solution of the resin and the inorganic fine particles was applied to a filtration device (product name “LS_47V”, manufactured by Advantech) under a pressure of 0.5 kgf / cm 2 at 23 ° C, with a diameter of 47 mm and a pore size of 1 μm. hydrophilic poly tetrafluoropropoxy O b ethylene membrane filter made (product name "H100A07A" ADVA Ntekku Co., porosity 83%, by weight 1. 3 mg / cm 2, thickness 35 / m, water flow rate 73 ml / min 'cm 2 ), And the average filtration rate (g / min) was determined from the filtration amount and the filtration time.
ここで水流量は、孔径 0. 1 μ ΐηのメンブレンフィルターでろ過した 25°Cの蒸留水を -0. 069MPaの減圧下でろ過し、その流量を lcm2当たりの ml/分数で表示したも のである。 Here, the water flow rate was obtained by filtering distilled water at 25 ° C filtered through a membrane filter with a pore diameter of 0.1 μΐη under reduced pressure of -0.069 MPa, and displaying the flow rate in ml / min per lcm 2. It is.
[0098] (4)透過率  [0098] (4) Transmittance
厚さ 0. 7mm X縦 lOOmm X横 100mmに切断したガラス基板(製品名「1737 A MLCD」、コ一二ング社製)に、樹脂組成物を 16. 7回転/秒の回転速度で回転塗 布し、得られた塗膜を、 100°Cのホットプレート上で 2分間乾燥し、厚さ 1一 3 μ ΐηの榭 脂膜を得た。次いで、この樹脂膜を、窒素雰囲気下のクリーンオーブン中で、 230°C にて 1時間加熱した。  Spin coating the resin composition on a glass substrate (product name "1737 A MLCD", manufactured by Koingen Co., Ltd.) cut at a thickness of 0.7 mm x length 100 mm x width 100 mm at a rotation speed of 16.7 rpm. The resulting coating film was dried on a hot plate at 100 ° C. for 2 minutes to obtain a resin film having a thickness of 13 μm μη. Next, this resin film was heated at 230 ° C. for 1 hour in a clean oven under a nitrogen atmosphere.
[0099] このようにして形成した樹脂膜の透過率を分光光度計にて測定した。透過率はそれ ぞれが比較できるよう、膜厚を 2 z mに換算し、全光線透過率として計算して求めた。 この値が大きい程、透明性に優れる。  [0099] The transmittance of the resin film thus formed was measured with a spectrophotometer. The transmittance was calculated by converting the film thickness to 2 zm and calculating the total light transmittance so that the two could be compared. The higher the value, the better the transparency.
[0100] (5)面内膜厚均一性  [0100] (5) In-plane film thickness uniformity
厚さ 0. 7mm X縦 650mm X横 550mmのガラス基板(コ一二ング社製)に、クロム を 2000Aの厚さで蒸着させたクロム蒸着ガラス基板を用意した。このクロム蒸着ガラ ス基板に、 16. 7回転/秒の回転速度で回転塗布し、得られた塗膜を、窒素雰囲気 下、 100°Cで 2分間、ホットプレート上で乾燥して、厚さ 1. 5 / mの樹脂膜を得た。 0.7mm thick x 650mm long x 550mm wide glass substrate (made by Koingen Co., Ltd.) Was deposited at a thickness of 2000 A to prepare a chromium-deposited glass substrate. This chromium-deposited glass substrate was spin-coated at a rotation speed of 16.7 revolutions / second, and the resulting coating film was dried on a hot plate at 100 ° C for 2 minutes under a nitrogen atmosphere to obtain a film thickness. A resin film of 1.5 / m was obtained.
[0101] 得られた樹脂膜の面内 121点の膜厚を、光学式膜厚計 (製品名「Nan0metriCS Nanospec M6500」、ナノメトリタス 'ジャパン社製)にて測定した。測定点は 650m m X 550mmのガラス基板を縦横 12分割したときの交点とした。この測定点における 膜厚に基づいて、下記式にて算出される値を面内膜厚均一性とした。この値が小さ い程、樹脂膜の面内膜厚均一性に優れる。 [0101] The thickness of the plane 121 points of the obtained resin film, optical film thickness meter (product name "Nan 0 m e tri CS Nanospec M6500", Nanometoritasu 'manufactured by Japan) was measured by. The measurement points were the intersections of a 650 mm × 550 mm glass substrate divided vertically and horizontally into 12 parts. Based on the film thickness at this measurement point, a value calculated by the following equation was defined as in-plane film thickness uniformity. The smaller this value is, the better the in-plane thickness uniformity of the resin film is.
[0102] [数 1] 面内膜厚均一性 = (膜厚最大値—膜厚最小値) ノ 均膜厚) X 1 0 0  [0102] [Equation 1] In-plane film thickness uniformity = (film thickness maximum value – film thickness minimum value) (uniform film thickness) X 100
[0103] <合成例 1 > [0103] <Synthesis example 1>
8—ヒドロキシカルボ二ルテトラシクロドデセン 60部、 Ν—フエ二ルー(5—ノルボルネ ン一 2, 3—ジカルボキシイミド) 40部、 1一へキセン 1. 3部、 (1, 3—ジメチルイミダゾ リジン一 2_イリデン)(トリシクロへキシルホスフィン)ベンジリデンルテニウムジクロリド 0. 05部、及びテトラヒドロフラン 400部を、窒素置換したガラス製耐圧反応器に仕 込み、攪拌しつつ 70°Cにて 2時間反応させて樹脂溶液 (a) (固形分濃度:約 20%)を 得た。  60 parts of 8-hydroxycarbonyltetracyclododecene, 40 parts of n-phenyl (5-norbornene-1,2,3-dicarboximide), 1.3 parts of 11-hexene, 1.3 parts of (1,3-dimethyl) Charge 0.05 parts of imidazolysine-1_2_ylidene) (tricyclohexylphosphine) benzylideneruthenium dichloride and 400 parts of tetrahydrofuran into a nitrogen-substituted glass pressure-resistant reactor and react at 70 ° C for 2 hours with stirring. Thus, a resin solution (a) (solid content concentration: about 20%) was obtained.
この樹脂溶液(a)を攪拌機付きオートクレープ内に移し、水素圧力 4MPa、温度 15 This resin solution (a) was transferred into an autoclave equipped with a stirrer, and the hydrogen pressure was 4 MPa and the temperature was
0°Cにて 5時間反応させて、水素添加された樹脂 (水素添加率 99%)を含む樹脂溶 液 )(固形分濃度:約 20%)を得た。 The reaction was carried out at 0 ° C. for 5 hours to obtain a resin solution containing a hydrogenated resin (hydrogenation rate: 99%) (solid content: about 20%).
[0104] 次に、樹脂溶液 (b) 100部及び活性炭粉末 1部を耐熱製のオートクレープ内に入 れ、水素圧力 4MPa、温度 150°Cで 3時間反応させた。反応終了後、反応液を孔径Next, 100 parts of the resin solution (b) and 1 part of activated carbon powder were put into a heat-resistant autoclave, and reacted at a hydrogen pressure of 4 MPa and a temperature of 150 ° C. for 3 hours. After completion of the reaction, the reaction solution is
0. 2 /i mのフッ素樹脂製フィルターでろ過して活性炭を分離して樹脂溶液 (c)を得たThe activated carbon was separated by filtration through a 0.2 / im fluororesin filter to obtain a resin solution (c).
。このとき、ろ過は滞りなく行うことができた。 . At this time, the filtration could be performed without delay.
[0105] 次いで、樹脂溶液(c)をエチルアルコール中に注加して、生成したクラムを乾燥し て樹脂(1)を得た。樹脂(1)のポリイソプレン換算の Mwは 5, 500、Mnは 3, 200で あった。また、水素添加率は 99%であった。 [0106] <合成例 2 > Next, the resin solution (c) was poured into ethyl alcohol, and the generated crumb was dried to obtain a resin (1). The Mw of the resin (1) in terms of polyisoprene was 5,500, and the Mn was 3,200. The hydrogenation rate was 99%. <Synthesis Example 2>
8—メチルー 8—メトキシカルボ二ルテトラシクロ [4· 4. 0. I2' 5. I7' 10]ドデ力— 3—ェン8-Methyl-8-methoxycarbonyltetracyclo [4 • 4.0. I 2 ' 5. I 7 ' 10 ]
100部、 1一へキセン 1. 3部、 1, 3_ジメチルイミダゾリジン _2—イリデン(トリシクロ へキシルホスフィン)ベンジリデンルテニウムジクロリド 0. 05部、及びシクロへキサン100 parts, 1-hexene 1.3 parts, 1,3-dimethylimidazolidine_2-ylidene (tricyclohexylphosphine) benzylidene ruthenium dichloride 0.05 part, and cyclohexane
400部を、窒素置換したガラス製耐圧反応器に仕込み、合成例 1と同様の方法で 重合反応及び水素添加反応を行い、樹脂 (Α)を得た。樹脂 (Α)の Mwは 5, 300、 Mnは 3, 200であった。また、水素添加率は 99%であった。 400 parts were charged into a nitrogen-purged glass pressure-resistant reactor, and a polymerization reaction and a hydrogenation reaction were carried out in the same manner as in Synthesis Example 1 to obtain a resin (Α). Mw of the resin (Α) was 5,300 and Mn was 3,200. The hydrogenation rate was 99%.
[0107] 次に、上記で得た樹脂(A) 100部、 N—メチルピロリドン 100部、プロピレングリコ ール 500部、 85%水酸化カリウム 84. 5部を反応器に仕込み、全容を 4. 5時間 1 90°Cで加熱撹拌した。得られた反応液を、大量の水、テトラヒドロフラン及び塩酸の 混合溶液に注いで加水分解物を凝固させた。凝固ポリマーを水洗、乾燥して加水分 解された樹脂(2)を得た。樹脂(2)の加水分解率は 95%であった。 [0107] Next, 100 parts of the resin (A) obtained above, 100 parts of N-methylpyrrolidone, 500 parts of propylene glycol, and 84.5 parts of 85% potassium hydroxide were charged into a reactor, and the whole volume was 4. The mixture was heated and stirred at 190 ° C for 5 hours. The obtained reaction solution was poured into a large amount of a mixed solution of water, tetrahydrofuran and hydrochloric acid to coagulate the hydrolyzate. The coagulated polymer was washed with water and dried to obtain a hydrolyzed resin (2). The hydrolysis rate of the resin (2) was 95%.
[0108] <合成例 3 > <Synthesis Example 3>
5_ (2—ヒドロキシエトキシカルボニル)ビシクロ [2· 2. 1]ヘプト— 2—ェン 100部、 1 —へキセン 1. 3部、 1 , 3_ジメチルイミダゾリジン一 2_イリデン(トリシクロへキシルホ スフイン)ベンジリデンルテニウムジクロリド 0· 05部、及びテトラヒドロフラン 400部 を、窒素置換したガラス製耐圧反応器に仕込み、合成例 1と同様の方法で重合反応 、水素添加反応を行い、樹脂(3)を得た。樹脂(3)の Mwは 5, 500、 Mnは 3, 300 であった。また、水素添加率は 99%であった。  5_ (2-Hydroxyethoxycarbonyl) bicyclo [2.2.1] hept-2-ene 100 parts, 1-hexene 1.3 parts, 1,3_dimethylimidazolidine-1 2_ylidene (tricyclohexylphosphine) ) Benzylidene ruthenium dichloride (0.05 parts) and tetrahydrofuran (400 parts) were charged into a nitrogen-purged glass pressure-resistant reactor, and a polymerization reaction and a hydrogenation reaction were carried out in the same manner as in Synthesis Example 1 to obtain a resin (3). . The Mw of the resin (3) was 5,500 and the Mn was 3,300. The hydrogenation rate was 99%.
[0109] <合成例 4 > <Synthesis Example 4>
8—ェチリデン一テトラシクロ [4. 4. 0. I2' 5. I7' 10]デカ一 3—ェン 100部、 1—へキ セン 1. 3部、 1 , 3_ジメチルイミダゾリジン一 2—イリデン(トリシクロへキシルホスフィン )ベンジリデンルテニウムジクロリド 0. 05部、及びシクロへキサン 400部を、窒素 置換したガラス製耐圧反応器に仕込み、合成例 1と同様の方法で重合反応、水素添 加反応を行い、樹脂(B)を得た。樹脂(B)の Mwは 5, 500、 Mnは 3, 200であった。 また、水素添加率は 99%であった。 8 Echiriden one tetracyclo [4. 4. 0. I 2 '5 . I 7' 10] deca one 3-E down 100 parts, key sensor 1.3 parts to 1, 1, 3_ dimethyl imidazolidine one 2 — Charge 0.05 parts of ylidene (tricyclohexylphosphine) benzylidene ruthenium dichloride and 400 parts of cyclohexane into a nitrogen-substituted glass pressure-resistant reactor, and conduct polymerization and hydrogenation reactions in the same manner as in Synthesis Example 1. Was carried out to obtain a resin (B). The Mw of the resin (B) was 5,500 and the Mn was 3,200. The hydrogenation rate was 99%.
[0110] <実施例 1 > <Example 1>
合成例 1で得た樹脂(1) 30部を、プロピレングリコールェチルメチルエーテル (ED M) 120部と混合し溶解させた後、孔径 1. 0 μ ΐηのフッ素樹脂製メンブレンフィルター でろ過して、樹脂濃度が 20%の樹脂溶液(1)を調製した。 30 parts of the resin (1) obtained in Synthesis Example 1 was mixed with propylene glycol ethyl methyl ether (ED M) After mixing and dissolving with 120 parts, the mixture was filtered through a fluororesin membrane filter having a pore size of 1.0 μΐη to prepare a resin solution (1) having a resin concentration of 20%.
表面処理されたコロイダルシリカであるオルガノシリカゾル(製品名「PMA— ST」、 日産化学社製;分散媒=プロピレングリコールモノメチルエーテルアセテート(PGM EA)、固形分濃度 = 30%) 100部に、 EDM 50部をカ卩えて撹拌して、シリカゾル濃 度が 20%のシリカゾノレ分散液(1)を調製した。この分散液(1)中のシリカゾル粒子の 一次粒子径は約 20nmであった。  EDM 50 in 100 parts of organosilica sol which is a surface-treated colloidal silica (product name "PMA-ST", manufactured by Nissan Chemical Co., Ltd .; dispersion medium = propylene glycol monomethyl ether acetate (PGM EA), solid content concentration = 30%) The mixture was stirred and stirred to prepare a silica sol dispersion (1) having a silica sol concentration of 20%. The primary particle size of the silica sol particles in this dispersion (1) was about 20 nm.
このシリカゾル分散液(1) 150部と樹脂溶液(1) 150部とを混合し、これに、シリコン 系界面活性剤 (製品名「KP - 341」、信越化学工業社製) 0. 1部を混合し溶解した後 、さらに 30分間攪拌し、樹脂組成物(1)を得た。樹脂組成物(1)について、ろ過速度 を測定し、また、透明性と面内膜厚均一性を評価した。  150 parts of this silica sol dispersion (1) and 150 parts of the resin solution (1) are mixed, and 0.1 part of a silicon-based surfactant (product name “KP-341” manufactured by Shin-Etsu Chemical Co., Ltd.) is added. After mixing and dissolving, the mixture was further stirred for 30 minutes to obtain a resin composition (1). For the resin composition (1), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0111] <実施例 2 > <Example 11>
オノレガノシリカゾル (製品名「ΡΜΑ— ST」、 日産化学社製) 100部に、プロピレンダリ コールェチルメチルエーテル(EDM) 20部、プロピレングリコールモノメチルエーテ ルアセテート(PGMEA) 30部をカ卩えて混合することにより、シリカゾル分散液(2)を 調製した。この分散液(2)中のシリカゾル粒子の一次粒子径は約 20nmであった。 このシリカゾル分散液(2) 150部と樹脂溶液(1) 150部とを混合し、これに、シリコン 系界面活性剤 (製品名「KP - 341」、信越化学工業社製) 0. 1部を混合し溶解した後 、さらに 30分間攪拌し、樹脂組成物(2)を得た。樹脂組成物(2)について、ろ過速度 の測定、透明性、面内膜厚均一性の評価を行った。  100 parts of Onoleganosilica sol (product name "ΡΜΑ-ST", manufactured by Nissan Chemical Co., Ltd.), 20 parts of propylene glycol alcohol methyl ether (EDM) and 30 parts of propylene glycol monomethyl ether acetate (PGMEA) are mixed together. As a result, a silica sol dispersion liquid (2) was prepared. The primary particle size of the silica sol particles in this dispersion (2) was about 20 nm. 150 parts of this silica sol dispersion (2) and 150 parts of the resin solution (1) were mixed, and 0.1 part of a silicon-based surfactant (product name “KP-341”, manufactured by Shin-Etsu Chemical Co., Ltd.) was added. After mixing and dissolving, the mixture was further stirred for 30 minutes to obtain a resin composition (2). For the resin composition (2), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0112] <実施例 3 > <Example 3>
合成例 1で得た樹脂(1) 30部を、 Ν—メチルー 2_ピロリドン (ΝΜΡ) 120部と混合し 溶解させた後、孔径 1. 0 x mのフッ素樹脂製メンブレンフィルターでろ過して、樹脂 濃度が 20%の樹脂溶液(2)を調製した。  After mixing and dissolving 30 parts of the resin (1) obtained in Synthesis Example 1 with 120 parts of Ν-methyl-2-pyrrolidone (ΝΜΡ), the resin was filtered through a fluororesin membrane filter having a pore diameter of 1.0 xm, and the resin was filtered. A resin solution (2) having a concentration of 20% was prepared.
オノレガノシリカゾル (製品名「PMA— ST」、 日産化学社製;分散媒=プロピレンダリ コールモノメチルエーテルアセテート(PGMEA)、固形分濃度 = 30%) 100部に N MP 50部を加えて撹拌して、シリカゾノレ濃度が 20%のシリカゾル分散液(3)を調製 した。この分散液(3)中のシリカゾル粒子の一次粒子径は約 20nmであった。 樹脂溶液(1)を樹脂溶液(2)に変更し、シリカゾル分散液(1)をシリカゾル分散液(Onoleganosilica sol (product name "PMA-ST", manufactured by Nissan Chemical Co., Ltd .; dispersion medium = propylene glycol monomethyl ether acetate (PGMEA), solid content concentration = 30%) Then, a silica sol dispersion liquid (3) having a silica zone concentration of 20% was prepared. The primary particle size of the silica sol particles in this dispersion (3) was about 20 nm. The resin solution (1) was changed to the resin solution (2), and the silica sol dispersion (1) was changed to the silica sol dispersion (
3)に変更したほかは、実施例 1と同様の方法で樹脂組成物(3)を調製した。樹脂組 成物(3)について、ろ過速度の測定、透明性、面内膜厚均一性の評価を行った。 A resin composition (3) was prepared in the same manner as in Example 1 except that the composition was changed to 3). For the resin composition (3), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0113] <実施例 4 >  <Example 4>
合成例 1で得た樹脂(1) 30部を、プロピレングリコールモノェチルエーテル(PGEE ) 120部と混合し溶解させた後、孔径 1. 0 x mのフッ素樹脂製メンブレンフィルターで ろ過して、樹脂濃度が 20%の樹脂溶液(3)を調製した。  After mixing and dissolving 30 parts of the resin (1) obtained in Synthesis Example 1 with 120 parts of propylene glycol monoethyl ether (PGEE), the mixture was filtered through a fluororesin membrane filter having a pore diameter of 1.0 xm to obtain a resin. A resin solution (3) having a concentration of 20% was prepared.
オノレガノシリカゾル (製品名「PMA— ST」、 日産化学社製;分散媒=プロピレンダリ コールモノメチルエーテルアセテート(PGMEA)、固形分濃度 = 30%) 100部に PG EE50部をカ卩えて撹拌して、シリカゾル濃度が 20%のシリカゾノレ分散液 (4)を調製し た。この分散液(4)中のシリカゾル粒子の一次粒子径は約 20nmであった。  Onoleganosilica sol (Product name "PMA-ST", manufactured by Nissan Chemical Co., Ltd .; dispersion medium = propylene glycol monomethyl ether acetate (PGMEA), solid content concentration = 30%) Then, a silica zonole dispersion liquid (4) having a silica sol concentration of 20% was prepared. The primary particle size of the silica sol particles in this dispersion (4) was about 20 nm.
樹脂溶液(1)を樹脂溶液(3)に変更し、シリカゾル分散液(1)をシリカゾル分散液( The resin solution (1) was changed to the resin solution (3), and the silica sol dispersion (1) was changed to the silica sol dispersion (
4)に変更したほかは、実施例 1と同様の方法で樹脂組成物 (4)を調製した。樹脂組 成物(4)について、ろ過速度の測定、透明性、面内膜厚均一性の評価を行った。 A resin composition (4) was prepared in the same manner as in Example 1 except that the composition was changed to 4). For the resin composition (4), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0114] <実施例 5 >  <Example 14>
合成例 2で得た樹脂(2)を 30部と、溶媒としてプロピレングリコールェチルメチルェ 一テル(EDM) 120部を混合し溶解させた後、孔径 1. 0 μ mのメンブレンフィルター でろ過して、樹脂濃度が 20%の樹脂溶液 (4)を調製した。樹脂溶液(1)を樹脂溶液 After mixing and dissolving 30 parts of the resin (2) obtained in Synthesis Example 2 and 120 parts of propylene glycol ethyl methyl ether (EDM) as a solvent, the mixture was filtered through a membrane filter having a pore size of 1.0 μm. Thus, a resin solution (4) having a resin concentration of 20% was prepared. Resin solution (1)
(4)に変更したほかは、実施例 1と同様の方法で樹脂組成物(5)を調製した。樹脂組 成物(5)について、ろ過速度の測定、透明性、面内膜厚均一性の評価を行った。 A resin composition (5) was prepared in the same manner as in Example 1 except that the composition was changed to (4). For the resin composition (5), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0115] <実施例 6 >  <Example 15>
合成例 3で得た樹脂(3)を 30部と、溶媒としてプロピレングリコールェチルメチルェ 一テル(EDM) 120部を混合し溶解させた後、孔径 1. 0 μ mのメンブレンフィルター でろ過して、樹脂濃度が 20%の樹脂溶液(5)を調製した。樹脂溶液(1)を樹脂溶液 After mixing and dissolving 30 parts of the resin (3) obtained in Synthesis Example 3 and 120 parts of propylene glycol ethyl methyl ether (EDM) as a solvent, the mixture was filtered through a membrane filter having a pore size of 1.0 μm. Thus, a resin solution (5) having a resin concentration of 20% was prepared. Resin solution (1)
(5)に変更したほかは、実施例 1と同様の方法で樹脂組成物 (6)を調製した。樹脂組 成物(6)について、ろ過速度の測定、透明性、面内膜厚均一性の評価を行った。 A resin composition (6) was prepared in the same manner as in Example 1 except that the composition was changed to (5). For the resin composition (6), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0116] <比較例 1 >  <Comparative Example 1>
合成例 2で得た樹脂 (A) 30部と、溶媒としてシクロへキサン (CH) 120部を混合し 溶解させた後、孔径 1 · 0 μ ΐηのメンブレンフィルターでろ過して、樹脂濃度が 20%の 樹脂溶液 (6)を調製した。 30 parts of the resin (A) obtained in Synthesis Example 2 and 120 parts of cyclohexane (CH) were mixed as a solvent. After dissolution, the solution was filtered through a membrane filter having a pore diameter of 1.0 μ μη to prepare a resin solution (6) having a resin concentration of 20%.
オルガノシリカゾル(製品名「PMA— ST」、 日産化学社製) 100部にシクロへキサン (CH)を 50部加え混合してシリカゾル分散液(5)を調製した。この分散液(5)中のシ リ力ゾル粒子の一次粒子径は約 20nmであつた。  A silica sol dispersion liquid (5) was prepared by adding 50 parts of cyclohexane (CH) to 100 parts of an organosilica sol (product name “PMA-ST”, manufactured by Nissan Chemical Industries, Ltd.) and mixing. The primary particle diameter of the silica sol particles in this dispersion (5) was about 20 nm.
このシリカゾル分散液(5) 150部と樹脂溶液 (6) 150部とを混合して樹脂組成物(7 )を調製した。樹脂組成物(7)について、ろ過速度の測定、透明性、面内膜厚均一性 の言平価を行った。  150 parts of the silica sol dispersion (5) and 150 parts of the resin solution (6) were mixed to prepare a resin composition (7). For the resin composition (7), the filtration rate was measured, and the transparency and the in-plane film thickness uniformity were evaluated.
[0117] <比較例 2 > <Comparative Example 2>
合成例 4で得た樹脂(B) 30部と、溶媒としてシクロへキサン(CH) 120部を混合し 溶解させた後、孔径 1. 0 x mのメンブレンフィルターでろ過して、樹脂濃度が 20%の 樹脂溶液(7)を調製した。  After mixing and dissolving 30 parts of the resin (B) obtained in Synthesis Example 4 and 120 parts of cyclohexane (CH) as a solvent, the mixture was filtered through a membrane filter having a pore size of 1.0 xm to give a resin concentration of 20%. Resin solution (7) was prepared.
比較例 1で得たシリカゾル分散液(5) 150部と樹脂溶液(7) 150部とを混合して榭 脂組成物(8)を調製した。樹脂組成物(8)は、微粒子が析出して均一な溶液ではな かった。  150 parts of the silica sol dispersion (5) obtained in Comparative Example 1 and 150 parts of the resin solution (7) were mixed to prepare a resin composition (8). The resin composition (8) was not a uniform solution due to precipitation of fine particles.
上記実施例及び比較例の結果を下記第 1表にまとめた。  The results of the above Examples and Comparative Examples are summarized in Table 1 below.
[0118] [表 1] 第 表 [Table 1] Table 1
Figure imgf000027_0001
第 1表より、特定極性基を有する脂環式ォレフイン樹脂を用いた実施例 1一 6の樹 脂組成物は、透明性、面内膜厚均一性に優れた樹脂膜を形成できることがわかる。 特に、ろ過速度が速い樹脂組成物を用いると、面内膜厚均一性により優れた樹脂膜 の得られることがわかる。
Figure imgf000027_0001
From Table 1, it can be seen that the trees of Examples 1-16 using an alicyclic resin having a specific polar group It can be seen that the resin composition can form a resin film having excellent transparency and uniformity of in-plane film thickness. In particular, it can be seen that when a resin composition having a high filtration rate is used, a resin film having more excellent in-plane thickness uniformity can be obtained.
産業上の利用可能性  Industrial applicability
[0119] 本発明の樹脂組成物は、特定極性基を有する脂環式ォレフイン樹脂と無機微粒子 と溶媒とを含有するものであり、ろ過性に優れ、優れた透明性と面内膜厚均一性を兼 ね備える樹脂膜の形成材料として有用である。  [0119] The resin composition of the present invention contains an alicyclic olefin resin having a specific polar group, inorganic fine particles, and a solvent, and has excellent filterability, excellent transparency, and excellent in-plane film thickness uniformity. It is useful as a material for forming a resin film having both functions.
[0120] 本発明の樹脂膜は、透明性、面内膜厚均一性、及び誘電特性等の電気特性に優 れる。従って、表示素子、集積回路素子、固体撮像素子等の電子部品や、ディスプ レイ用カラーフィルター、保護膜、平坦化膜、電気絶縁膜等の電子部品用樹脂膜とし て用いることができる。  [0120] The resin film of the present invention is excellent in electrical properties such as transparency, in-plane film thickness uniformity, and dielectric properties. Therefore, it can be used as an electronic component such as a display element, an integrated circuit element, and a solid-state imaging device, and a resin film for an electronic component such as a display color filter, a protective film, a flattening film, and an electric insulating film.

Claims

請求の範囲 The scope of the claims
[1] カルボキシル基、ジカルボン酸無水物基、ヒドロキシル基及びイミド基からなる群より 選ばれる 1種以上を分子内に有する脂環式ォレフイン樹脂、無機微粒子、並びに溶 媒を含有することを特徴とする樹脂組成物。  [1] An alicyclic resin having at least one selected from the group consisting of a carboxyl group, a dicarboxylic anhydride group, a hydroxyl group and an imide group in a molecule, inorganic fine particles, and a solvent. Resin composition.
[2] 23。C、 0. 5kgfZcm2の加圧下で、直径 47mm、孔径 1 μ m、多孔度 83%のメンブ レンフィルターを用いてろ過したときのろ過速度が 20g/分以上であることを特徴とす る請求項 1記載の樹脂組成物。 [2] 23. C. A claim characterized by having a filtration rate of 20 g / min or more when filtered using a membrane filter having a diameter of 47 mm, a pore diameter of 1 μm, and a porosity of 83% under a pressure of 0.5 kgfZcm 2. Item 4. The resin composition according to Item 1.
[3] 前記溶媒が、前記脂環式ォレフイン樹脂の 23°Cにおける溶解度が 20重量%以上 である溶媒を、脂環式ォレフイン樹脂 100重量部に対して、 500重量部以上含有す ることを特徴とする請求項 1記載の樹脂組成物。 [3] The solvent contains at least 500 parts by weight of a solvent in which the solubility of the alicyclic olefin resin at 23 ° C. is 20% by weight or more based on 100 parts by weight of the alicyclic olefin resin. The resin composition according to claim 1, wherein
[4] 前記溶媒が、グリコールジエーテル化合物、グリコールモノエーテル化合物及びァ ミド化合物からなる群より選ばれる少なくとも 1種である請求項 3記載の樹脂組成物。 4. The resin composition according to claim 3, wherein the solvent is at least one selected from the group consisting of a glycol diether compound, a glycol monoether compound, and an amide compound.
[5] 前記脂環式ォレフイン樹脂が、式 (I) [5] The alicyclic resin is a compound represented by the formula (I)
[化 1]  [Chemical 1]
Figure imgf000029_0001
Figure imgf000029_0001
〔式中、 R1 R4は、それぞれ独立して、水素原子又は式: - X - R (Xは二価の基であ り、 nは 0又は 1であり、 Rは、置換基を有していてもよい炭素数 1一 7のアルキル基、 置換基を有していてもよい炭素数 3— 8のシクロアルキル基、芳香族基、カルボキシ ル基、ジカルボン酸無水物基、ヒドロキシノレ基、又はイミド基である。)で示される基を 表し、 R1 R4のうち 1つ以上は、式: -X -Ra (式中、 X、 nは前記と同じ意味を表し、 R aは、カルボキシル基、ジカルボン酸無水物基、ヒドロキシル基又はイミド基である。 ) で示される基である。 mは 0 2の整数である。〕で表される繰り返し単位を有する樹 脂である請求項 1記載の樹脂組成物。 Wherein R 1 R 4 are each independently a hydrogen atom or a formula:-X-R (X is a divalent group, n is 0 or 1, and R is a substituent. An alkyl group having 17 carbon atoms which may be substituted, a cycloalkyl group having 3 to 8 carbon atoms which may have a substituent, an aromatic group, a carboxy group, a dicarboxylic anhydride group, a hydroxy group Or an imide group.), Wherein at least one of R 1 R 4 is a group represented by the formula: —X—R a (wherein X and n have the same meanings as described above; Is a carboxyl group, a dicarboxylic anhydride group, a hydroxyl group or an imide group. m is an integer of 0 2. A tree having a repeating unit represented by 2. The resin composition according to claim 1, which is a fat.
[6] 前記無機微粒子が、 1一 200nmの一次粒子径を有するものである請求項 1記載の 樹脂組成物。 6. The resin composition according to claim 1, wherein the inorganic fine particles have a primary particle diameter of 200 nm.
[7] 前記無機微粒子が金属酸化物である請求項 1記載の樹脂組成物。  7. The resin composition according to claim 1, wherein the inorganic fine particles are a metal oxide.
[8] 前記脂環式ォレフイン樹脂及び溶媒を含有する樹脂溶液と、前記無機微粒子及び 分散媒を含有する無機微粒子分散液とを混合する工程を有することを特徴とする請 求項 1記載の樹脂組成物の製造方法。  [8] The resin according to claim 1, further comprising a step of mixing a resin solution containing the alicyclic resin and a solvent with an inorganic fine particle dispersion containing the inorganic fine particles and a dispersion medium. A method for producing the composition.
[9] 前記溶媒が、グリコールジエーテル化合物、グリコールモノエーテル化合物及びァ ミド化合物からなる群より選ばれる少なくとも 1種である請求項 8記載の樹脂組成物の 製造方法。 9. The method according to claim 8, wherein the solvent is at least one selected from the group consisting of a glycol diether compound, a glycol monoether compound, and an amide compound.
[10] 前記分散媒が、グリコールエーテルアセテートィヒ合物、グリコールジエーテル化合 物、グリコールモノエーテルィ匕合物及びアミド化合物からなる群より選ばれる少なくと も 1種である請求項 8又は 9記載の樹脂組成物の製造方法。  [10] The dispersion medium according to claim 8 or 9, wherein the dispersion medium is at least one selected from the group consisting of a glycol ether acetate compound, a glycol diether compound, a glycol monoether conjugate, and an amide compound. A method for producing the resin composition as described above.
[11] 請求項 1一 7のいずれかに記載の樹脂組成物を用いて形成された、厚さ 0· 1— 20 0 μ mの樹脂膜。  [11] A resin film having a thickness of 0.1 to 200 μm formed using the resin composition according to any one of claims 17 to 17.
PCT/JP2005/001212 2004-01-30 2005-01-28 Resin composition, method for production thereof and resin film WO2005073310A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020067015333A KR101220604B1 (en) 2004-01-30 2005-01-28 Resin composition, method for production thereof and resin film
CN200580003684XA CN1914271B (en) 2004-01-30 2005-01-28 Resin composition, method for production thereof and resin film
JP2005517514A JP4997766B2 (en) 2004-01-30 2005-01-28 Resin composition, method for producing the same, and resin film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004023681 2004-01-30
JP2004-023681 2004-01-30

Publications (1)

Publication Number Publication Date
WO2005073310A1 true WO2005073310A1 (en) 2005-08-11

Family

ID=34823883

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/001212 WO2005073310A1 (en) 2004-01-30 2005-01-28 Resin composition, method for production thereof and resin film

Country Status (5)

Country Link
JP (1) JP4997766B2 (en)
KR (1) KR101220604B1 (en)
CN (1) CN1914271B (en)
TW (1) TW200537243A (en)
WO (1) WO2005073310A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206798A (en) * 2005-01-31 2006-08-10 Nippon Zeon Co Ltd Resin composition for display device and laminate using the same
WO2008105244A1 (en) * 2007-02-28 2008-09-04 Zeon Corporation Active matrix substrate, method for producing the same, and flat display
WO2008123234A1 (en) * 2007-03-30 2008-10-16 Zeon Corporation Active matrix substrate and method for producing the same
JP2011528385A (en) * 2008-07-18 2011-11-17 エボニック デグサ ゲーエムベーハー Hydrophobized silicon dioxide particles and dispersions thereof
JP2012077194A (en) * 2010-09-30 2012-04-19 Nippon Zeon Co Ltd Modified silica dispersion liquid and method of manufacturing the same, and resin composition for insulating material

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101009318B1 (en) * 2008-07-21 2011-01-18 부산대학교 산학협력단 Polynorbornenedicarboximide film modified with phenyl and Organic light-emitting device using the same
CN102024562B (en) * 2009-09-17 2016-03-09 大赛璐化学工业株式会社 For the manufacture of solvent or the solvent compositions of laminated ceramic component
KR102503173B1 (en) 2016-03-31 2023-02-23 동우 화인켐 주식회사 Flexible color filter
KR102159253B1 (en) * 2016-11-01 2020-09-23 동우 화인켐 주식회사 Film Antenna Device and Method for Fabricating the Same
KR20210121643A (en) 2020-03-31 2021-10-08 동우 화인켐 주식회사 Curable resine composition and transparent film prepared by using the same
KR20210121645A (en) 2020-03-31 2021-10-08 동우 화인켐 주식회사 Curable resine composition and transparent film prepared by using the same
KR102636067B1 (en) 2020-03-31 2024-02-13 동우 화인켐 주식회사 Curable resine composition and transparent film prepared by using the same
KR102243738B1 (en) * 2020-09-16 2021-04-23 동우 화인켐 주식회사 Film Antenna Device and Method for Fabricating the Same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202277A (en) * 1990-11-29 1992-07-23 Japan Synthetic Rubber Co Ltd Coating material
JPH08120220A (en) * 1994-10-26 1996-05-14 Japan Synthetic Rubber Co Ltd Coating material
JPH08183817A (en) * 1994-07-26 1996-07-16 Hoechst Ag Cycloolefin copolymers and their production
WO1998059004A1 (en) * 1997-06-20 1998-12-30 Nippon Zeon Co., Ltd. Electronic component-protecting material
JP2002293843A (en) * 2001-03-30 2002-10-09 Jsr Corp Cycloolefinic copolymer, its composite material, these crosslinked material and optical material therefrom
JP2002317014A (en) * 2001-02-15 2002-10-31 Jsr Corp Imido group-containing olefin-based (co)polymer, optical material, adhesive, coating agent, and composite material made of the (co)polymer
JP2004058339A (en) * 2002-07-26 2004-02-26 Jsr Corp Base material covered with coating material containing cyclic olefin addition polymer and laminated material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4150839B2 (en) * 1999-11-10 2008-09-17 Jsr株式会社 Thermosetting resin composition and cured product thereof
JP4221850B2 (en) * 1999-11-10 2009-02-12 Jsr株式会社 Thermosetting resin composition and cured product thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202277A (en) * 1990-11-29 1992-07-23 Japan Synthetic Rubber Co Ltd Coating material
JPH08183817A (en) * 1994-07-26 1996-07-16 Hoechst Ag Cycloolefin copolymers and their production
JPH08120220A (en) * 1994-10-26 1996-05-14 Japan Synthetic Rubber Co Ltd Coating material
WO1998059004A1 (en) * 1997-06-20 1998-12-30 Nippon Zeon Co., Ltd. Electronic component-protecting material
JP2002317014A (en) * 2001-02-15 2002-10-31 Jsr Corp Imido group-containing olefin-based (co)polymer, optical material, adhesive, coating agent, and composite material made of the (co)polymer
JP2002293843A (en) * 2001-03-30 2002-10-09 Jsr Corp Cycloolefinic copolymer, its composite material, these crosslinked material and optical material therefrom
JP2004058339A (en) * 2002-07-26 2004-02-26 Jsr Corp Base material covered with coating material containing cyclic olefin addition polymer and laminated material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206798A (en) * 2005-01-31 2006-08-10 Nippon Zeon Co Ltd Resin composition for display device and laminate using the same
WO2008105244A1 (en) * 2007-02-28 2008-09-04 Zeon Corporation Active matrix substrate, method for producing the same, and flat display
WO2008123234A1 (en) * 2007-03-30 2008-10-16 Zeon Corporation Active matrix substrate and method for producing the same
JP5182287B2 (en) * 2007-03-30 2013-04-17 日本ゼオン株式会社 Active matrix substrate and manufacturing method thereof
JP2011528385A (en) * 2008-07-18 2011-11-17 エボニック デグサ ゲーエムベーハー Hydrophobized silicon dioxide particles and dispersions thereof
JP2012077194A (en) * 2010-09-30 2012-04-19 Nippon Zeon Co Ltd Modified silica dispersion liquid and method of manufacturing the same, and resin composition for insulating material

Also Published As

Publication number Publication date
CN1914271B (en) 2010-12-29
KR20070011281A (en) 2007-01-24
TW200537243A (en) 2005-11-16
TWI375120B (en) 2012-10-21
KR101220604B1 (en) 2013-01-10
JPWO2005073310A1 (en) 2007-10-11
JP4997766B2 (en) 2012-08-08
CN1914271A (en) 2007-02-14

Similar Documents

Publication Publication Date Title
WO2005073310A1 (en) Resin composition, method for production thereof and resin film
TW570934B (en) Cyclic olefin addition copolymer and process for producing same, crosslinking composition, crosslinked product and process for producing same, and optically transparent material and application thereof
TW575596B (en) Fluorine-containing cyclic olefin polymer, its cyclic olefinic monomer, process for producing the polymer and use thereof
TWI458759B (en) Resin composition and semiconductor element substrate
WO2002100917A1 (en) Open-ring copolymer, hydrogenated open-ring copolymer, processes for production of both, and compositions
CN102782001B (en) A self-imageable film forming polymer, compositions thereof and devices and structures made therefrom
TW201314364A (en) Resin composition and semiconductor element substrate
WO2007086499A1 (en) Film comprising norbornene compound addition polymer
KR101008801B1 (en) Radiation-sensitive resin composition
TW201544899A (en) Radiation-sensitive resin composition, resin film, and electronic component
KR20190134602A (en) Film with conductive layer, touch panel, manufacturing method of film with conductive layer and manufacturing method of touch panel
KR20120100721A (en) Thermosetting resin composition and cured film from the same
JP6032272B2 (en) Method for producing ring-opening metathesis polymer hydride and resin composition
WO2005096100A1 (en) Radiation-sensitive composition, laminate, process for producing the sane and electronic part
TW201015224A (en) Positive photosensitive resin composition
CN105492467B (en) Resin combination, resin film and electronic unit
WO2003056391A1 (en) Radiation-sensitive resin composition and process for formation of patterns
JP4876596B2 (en) Film comprising a norbornene compound addition polymer
TW202216820A (en) Negative photosensitive resin composition
KR102368697B1 (en) Photosensitive resin composition, pixel define layer prepared by using the same, and electronic device comprising the pixel define layer
JP2006106530A (en) Photosensitive resin composition for display device color filter, display device using same and manufacturing method of display device
JP2006098984A (en) Flattening resin layer, and semiconductor device and display apparatus having same
JP2006206798A (en) Resin composition for display device and laminate using the same
WO2019188432A1 (en) Resin composition and electronic component
JP3945220B2 (en) Low dielectric constant polymer

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005517514

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020067015333

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 200580003684.X

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

WWP Wipo information: published in national office

Ref document number: 1020067015333

Country of ref document: KR

122 Ep: pct application non-entry in european phase