WO2005060000A3 - Steg-feldeffekttransistor-speicherzellen-anordnung und herstellungsverfahren - Google Patents
Steg-feldeffekttransistor-speicherzellen-anordnung und herstellungsverfahren Download PDFInfo
- Publication number
- WO2005060000A3 WO2005060000A3 PCT/DE2004/002739 DE2004002739W WO2005060000A3 WO 2005060000 A3 WO2005060000 A3 WO 2005060000A3 DE 2004002739 W DE2004002739 W DE 2004002739W WO 2005060000 A3 WO2005060000 A3 WO 2005060000A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- storage cell
- effect transistor
- bridge field
- transistor storage
- bridge
- Prior art date
Links
- 210000000352 storage cell Anatomy 0.000 title abstract 5
- 230000005669 field effect Effects 0.000 title abstract 4
- 210000004027 cell Anatomy 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000002800 charge carrier Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7923—Programmable transistors with more than two possible different levels of programmation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/845—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1211—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006544208A JP2007517386A (ja) | 2003-12-19 | 2004-12-14 | ブリッジ電界効果トランジスタメモリセル、上記セルを備えるデバイス、および、ブリッジ電界効果トランジスタメモリセルの製造方法 |
EP04802942A EP1704595A2 (de) | 2003-12-19 | 2004-12-14 | Steg-feldeffekttransistor-speicherzellen-anordnung und herstellungsverfahren |
US11/455,907 US20070018218A1 (en) | 2003-12-19 | 2006-06-19 | Fin field effect transistor memory cell, fin field effect transistor memory cell arrangement and method for producing the fin field effect transistor memory cell |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10359889A DE10359889A1 (de) | 2003-12-19 | 2003-12-19 | Steg-Feldeffekttransistor-Speicherzelle, Steg-Feldeffekttransistor-Speicherzellen-Anordnung und Verfahren zum Herstellen einer Steg-Feldeffekttransistor-Speicherzelle |
DE10359889.8 | 2003-12-19 | ||
DE102004023301.2 | 2004-05-11 | ||
DE102004023301A DE102004023301A1 (de) | 2004-05-11 | 2004-05-11 | Steg-Feldeffekttransistor-Speicherzelle, Steg-Feldeffekttranistor-Speicherzellen-Anordnung und Verfahren zum Herstellen einer Steg-Feldeffekttransitor-Speicherzelle |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/455,907 Continuation US20070018218A1 (en) | 2003-12-19 | 2006-06-19 | Fin field effect transistor memory cell, fin field effect transistor memory cell arrangement and method for producing the fin field effect transistor memory cell |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005060000A2 WO2005060000A2 (de) | 2005-06-30 |
WO2005060000A3 true WO2005060000A3 (de) | 2005-10-27 |
Family
ID=34702001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2004/002739 WO2005060000A2 (de) | 2003-12-19 | 2004-12-14 | Steg-feldeffekttransistor-speicherzellen-anordnung und herstellungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070018218A1 (de) |
EP (1) | EP1704595A2 (de) |
JP (1) | JP2007517386A (de) |
KR (1) | KR20060103455A (de) |
WO (1) | WO2005060000A2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7439594B2 (en) * | 2006-03-16 | 2008-10-21 | Micron Technology, Inc. | Stacked non-volatile memory with silicon carbide-based amorphous silicon thin film transistors |
KR101177282B1 (ko) * | 2006-03-24 | 2012-08-24 | 삼성전자주식회사 | 반도체 메모리 소자의 제조 방법 |
JP2009535800A (ja) * | 2006-04-26 | 2009-10-01 | エヌエックスピー ビー ヴィ | 不揮発性メモリデバイス |
US7452776B1 (en) * | 2007-04-24 | 2008-11-18 | Promos Technoloies Pte. Ltd. | Integrated circuits with substrate protrusions, including (but not limited to) floating gate memories |
US20080296674A1 (en) * | 2007-05-30 | 2008-12-04 | Qimonda Ag | Transistor, integrated circuit and method of forming an integrated circuit |
US8343189B2 (en) * | 2007-09-25 | 2013-01-01 | Zyga Technology, Inc. | Method and apparatus for facet joint stabilization |
US8143665B2 (en) * | 2009-01-13 | 2012-03-27 | Macronix International Co., Ltd. | Memory array and method for manufacturing and operating the same |
US8394125B2 (en) * | 2009-07-24 | 2013-03-12 | Zyga Technology, Inc. | Systems and methods for facet joint treatment |
US8212295B2 (en) * | 2010-06-30 | 2012-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | ROM cell circuit for FinFET devices |
US8900883B1 (en) | 2012-03-22 | 2014-12-02 | Iii Holdings 1, Llc | Methods for manufacturing carbon ribbons for magnetic devices |
CA2887215A1 (en) | 2012-11-15 | 2014-05-22 | Zyga Technology, Inc. | Systems and methods for facet joint treatment |
US9312183B1 (en) * | 2014-11-03 | 2016-04-12 | Globalfoundries Inc. | Methods for forming FinFETS having a capping layer for reducing punch through leakage |
US9911727B2 (en) | 2015-03-16 | 2018-03-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strapping structure of memory circuit |
US9305974B1 (en) * | 2015-04-16 | 2016-04-05 | Stmicroelectronics, Inc. | High density resistive random access memory (RRAM) |
CN109791945B (zh) * | 2016-09-24 | 2022-11-08 | 英特尔公司 | 具有共享栅的量子点阵列设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5045490A (en) * | 1990-01-23 | 1991-09-03 | Texas Instruments Incorporated | Method of making a pleated floating gate trench EPROM |
US5071782A (en) * | 1990-06-28 | 1991-12-10 | Texas Instruments Incorporated | Vertical memory cell array and method of fabrication |
EP0783180A1 (de) * | 1996-01-08 | 1997-07-09 | Siemens Aktiengesellschaft | Elektrisch programmierbare Speicherzellenanordnung und Verfahren zu deren Herstellung |
US5889304A (en) * | 1996-06-28 | 1999-03-30 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device |
DE19856294A1 (de) * | 1998-02-27 | 1999-09-09 | Fraunhofer Ges Forschung | Chemischer Feldeffekttransistor und Verfahren zu seiner Herstellung |
US20030042531A1 (en) * | 2001-09-04 | 2003-03-06 | Lee Jong Ho | Flash memory element and manufacturing method thereof |
US20030119254A1 (en) * | 2001-12-20 | 2003-06-26 | Boaz Eitan | Reducing secondary injection effects |
WO2003096424A1 (de) * | 2002-05-10 | 2003-11-20 | Infineon Technologies Ag | Nicht-flüchtiger flash-halbleiterspeicher und herstellungsverfahren |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0128063B1 (ko) * | 1988-01-29 | 1998-04-02 | 엔.라이스 머레르 | 플로팅 게이트 메모리셀 및 디바이스 및 이들의 제조 방법 |
JP2851968B2 (ja) * | 1991-04-26 | 1999-01-27 | キヤノン株式会社 | 改良された絶縁ゲート型トランジスタを有する半導体装置及びその製造方法 |
JPH06163921A (ja) * | 1992-11-19 | 1994-06-10 | Nippondenso Co Ltd | 不揮発性半導体記憶装置 |
US5411905A (en) * | 1994-04-29 | 1995-05-02 | International Business Machines Corporation | Method of making trench EEPROM structure on SOI with dual channels |
US6204103B1 (en) * | 1998-09-18 | 2001-03-20 | Intel Corporation | Process to make complementary silicide metal gates for CMOS technology |
JP4044276B2 (ja) * | 2000-09-28 | 2008-02-06 | 株式会社東芝 | 半導体装置及びその製造方法 |
US7352024B2 (en) * | 2001-02-22 | 2008-04-01 | Sharp Kabushiki Kaisha | Semiconductor storage device and semiconductor integrated circuit |
US6800905B2 (en) * | 2001-12-14 | 2004-10-05 | International Business Machines Corporation | Implanted asymmetric doped polysilicon gate FinFET |
KR100432889B1 (ko) * | 2002-04-12 | 2004-05-22 | 삼성전자주식회사 | 2비트 기입가능한 비휘발성 메모리 소자, 그 구동방법 및그 제조방법 |
US7098502B2 (en) * | 2003-11-10 | 2006-08-29 | Freescale Semiconductor, Inc. | Transistor having three electrically isolated electrodes and method of formation |
-
2004
- 2004-12-14 JP JP2006544208A patent/JP2007517386A/ja active Pending
- 2004-12-14 KR KR1020067012141A patent/KR20060103455A/ko not_active Application Discontinuation
- 2004-12-14 EP EP04802942A patent/EP1704595A2/de not_active Withdrawn
- 2004-12-14 WO PCT/DE2004/002739 patent/WO2005060000A2/de active Application Filing
-
2006
- 2006-06-19 US US11/455,907 patent/US20070018218A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5045490A (en) * | 1990-01-23 | 1991-09-03 | Texas Instruments Incorporated | Method of making a pleated floating gate trench EPROM |
US5071782A (en) * | 1990-06-28 | 1991-12-10 | Texas Instruments Incorporated | Vertical memory cell array and method of fabrication |
EP0783180A1 (de) * | 1996-01-08 | 1997-07-09 | Siemens Aktiengesellschaft | Elektrisch programmierbare Speicherzellenanordnung und Verfahren zu deren Herstellung |
US5889304A (en) * | 1996-06-28 | 1999-03-30 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device |
DE19856294A1 (de) * | 1998-02-27 | 1999-09-09 | Fraunhofer Ges Forschung | Chemischer Feldeffekttransistor und Verfahren zu seiner Herstellung |
US20030042531A1 (en) * | 2001-09-04 | 2003-03-06 | Lee Jong Ho | Flash memory element and manufacturing method thereof |
US20030119254A1 (en) * | 2001-12-20 | 2003-06-26 | Boaz Eitan | Reducing secondary injection effects |
WO2003096424A1 (de) * | 2002-05-10 | 2003-11-20 | Infineon Technologies Ag | Nicht-flüchtiger flash-halbleiterspeicher und herstellungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
KR20060103455A (ko) | 2006-09-29 |
US20070018218A1 (en) | 2007-01-25 |
WO2005060000A2 (de) | 2005-06-30 |
JP2007517386A (ja) | 2007-06-28 |
EP1704595A2 (de) | 2006-09-27 |
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