WO2005056269A3 - Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine - Google Patents

Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine Download PDF

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Publication number
WO2005056269A3
WO2005056269A3 PCT/DE2004/002652 DE2004002652W WO2005056269A3 WO 2005056269 A3 WO2005056269 A3 WO 2005056269A3 DE 2004002652 W DE2004002652 W DE 2004002652W WO 2005056269 A3 WO2005056269 A3 WO 2005056269A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
circuit board
printed circuit
printed
emitting semiconductor
Prior art date
Application number
PCT/DE2004/002652
Other languages
English (en)
French (fr)
Other versions
WO2005056269A2 (de
Inventor
Jochen Kunze
Veit Schwegler
Thorsten Ricking
Thomas Manth
Cem Olkay
Original Assignee
G L I Global Light Ind Gmbh
Jochen Kunze
Veit Schwegler
Thorsten Ricking
Thomas Manth
Cem Olkay
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10357818A external-priority patent/DE10357818B4/de
Priority claimed from DE200410033533 external-priority patent/DE102004033533B4/de
Application filed by G L I Global Light Ind Gmbh, Jochen Kunze, Veit Schwegler, Thorsten Ricking, Thomas Manth, Cem Olkay filed Critical G L I Global Light Ind Gmbh
Priority to US10/582,311 priority Critical patent/US20070117248A1/en
Publication of WO2005056269A2 publication Critical patent/WO2005056269A2/de
Publication of WO2005056269A3 publication Critical patent/WO2005056269A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung mindestens einer lichtemittierenden Halbleiterdiode (20) auf einer elektrische Leiterbahnen umfassenden Platine (10) sowie eine Leuchteinheit, die eine elektrische Leiterbahnen (12, 13) aufweisende, mit mindestens einem lichtemittierenden Chip (21) bestückte Platine und mindestens einen, einen lichtemittierenden Chip oder eine Gruppe von lichtemittierenden Chips kontaktierend umgebenden Lichtverteilkörper umfasst. Dazu wird mindestens ein lichtemittierender Chip auf die Platine aufgesetzt. Die Platine wird in eine Spritzgießform eingesetzt und die Spritzgießform mit einem Thermoplast ausgespritzt, der die Platine durch mindestens einen Durchbruch (15, 123) durchdringt oder die Platine umfließt. Mit der vorliegenden Erfindung wird ein Verfahren zur wiederholbaren Herstellung einer lichtemittierenden Halbleiterdiode hoher Leistung auf einer Platine entwickelt sowie eine entsprechende Leuchteinheit mit integrierter Platine.
PCT/DE2004/002652 2003-12-09 2004-12-03 Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine WO2005056269A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/582,311 US20070117248A1 (en) 2003-12-09 2004-12-03 Method for the production of light-emitting semiconductor diodes

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10357818A DE10357818B4 (de) 2003-12-09 2003-12-09 Verfahren zur Herstellung lichtemittierender Halbleiterdioden auf einer Platine
DE10357818.8 2003-12-09
DE200410033533 DE102004033533B4 (de) 2004-07-09 2004-07-09 Leuchteinheit mit integrierter Platine
DE102004033533.8 2004-07-09

Publications (2)

Publication Number Publication Date
WO2005056269A2 WO2005056269A2 (de) 2005-06-23
WO2005056269A3 true WO2005056269A3 (de) 2005-11-10

Family

ID=34680022

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/002652 WO2005056269A2 (de) 2003-12-09 2004-12-03 Verfahren zur herstellung lichtemittierender halbleiterdioden auf einer platine und leuchteinheiten mit integrierter platine

Country Status (3)

Country Link
US (1) US20070117248A1 (de)
TW (1) TW200525786A (de)
WO (1) WO2005056269A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789951B1 (ko) 2006-06-09 2008-01-03 엘지전자 주식회사 발광 유닛 제작 장치 및 방법
US7909482B2 (en) 2006-08-21 2011-03-22 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
US8408773B2 (en) * 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
WO2009076579A2 (en) 2007-12-12 2009-06-18 Innotec Corporation Overmolded circuit board and method
WO2011067115A1 (en) * 2009-12-04 2011-06-09 Osram Gesellschaft mit beschränkter Haftung Led lighting module with co-molded metal contacts
CN102412345A (zh) * 2010-09-23 2012-04-11 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
DE112013002944T5 (de) 2012-06-13 2015-02-19 Innotec, Corp. Flexibler Hohllichtleiter
FR3065276B1 (fr) * 2017-04-12 2019-11-29 Valeo Vision Surmoulage d’un element optique sur un cadre thermoplastique

Citations (10)

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Publication number Priority date Publication date Assignee Title
JPS611067A (ja) * 1984-06-13 1986-01-07 Stanley Electric Co Ltd プリント基板に装着されたｌｅｄチツプのモ−ルド方法
JPH0249478A (ja) * 1988-05-31 1990-02-19 Iwasaki Electric Co Ltd 光ファイバ用半導体発光装置
JPH0563239A (ja) * 1991-08-29 1993-03-12 Mitsubishi Cable Ind Ltd Ｌｅｄ表示装置
JPH05109788A (ja) * 1991-06-04 1993-04-30 Rohm Co Ltd ダイボンデイング装置
JPH0653258A (ja) * 1992-07-29 1994-02-25 Mitsubishi Cable Ind Ltd 表示装置の製造方法
JPH06334224A (ja) * 1993-05-24 1994-12-02 Mitsubishi Cable Ind Ltd Ｌｅｄ照明具の製造方法
EP0632511A2 (de) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. Lichtemittierende Diodenanordnung und Herstellungsverfahren
JPH0730152A (ja) * 1993-07-09 1995-01-31 Mitsubishi Cable Ind Ltd 基板に実装された電子部品のモールド方法およびそのモールド用基板構造
JP2001168122A (ja) * 1999-12-03 2001-06-22 Matsushita Electronics Industry Corp 電子部品実装モジュールの製造方法および電子部品実装モジュール
JP2003008065A (ja) * 2001-06-21 2003-01-10 Citizen Electronics Co Ltd Ｓｍｄ型光素子モジュールの製造方法

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Publication number Priority date Publication date Assignee Title
DE4242842C2 (de) * 1992-02-14 1999-11-04 Sharp Kk Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung
DE19612388C2 (de) * 1996-03-28 1999-11-04 Siemens Ag Integrierte Halbleiterschaltung insb. optoelektronisches Bauelement mit Überspannungsschutz
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10243247A1 (de) * 2002-09-17 2004-04-01 Osram Opto Semiconductors Gmbh Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611067A (ja) * 1984-06-13 1986-01-07 Stanley Electric Co Ltd プリント基板に装着されたｌｅｄチツプのモ−ルド方法
JPH0249478A (ja) * 1988-05-31 1990-02-19 Iwasaki Electric Co Ltd 光ファイバ用半導体発光装置
JPH05109788A (ja) * 1991-06-04 1993-04-30 Rohm Co Ltd ダイボンデイング装置
JPH0563239A (ja) * 1991-08-29 1993-03-12 Mitsubishi Cable Ind Ltd Ｌｅｄ表示装置
JPH0653258A (ja) * 1992-07-29 1994-02-25 Mitsubishi Cable Ind Ltd 表示装置の製造方法
JPH06334224A (ja) * 1993-05-24 1994-12-02 Mitsubishi Cable Ind Ltd Ｌｅｄ照明具の製造方法
EP0632511A2 (de) * 1993-06-29 1995-01-04 MITSUBISHI CABLE INDUSTRIES, Ltd. Lichtemittierende Diodenanordnung und Herstellungsverfahren
JPH0730152A (ja) * 1993-07-09 1995-01-31 Mitsubishi Cable Ind Ltd 基板に実装された電子部品のモールド方法およびそのモールド用基板構造
JP2001168122A (ja) * 1999-12-03 2001-06-22 Matsushita Electronics Industry Corp 電子部品実装モジュールの製造方法および電子部品実装モジュール
JP2003008065A (ja) * 2001-06-21 2003-01-10 Citizen Electronics Co Ltd Ｓｍｄ型光素子モジュールの製造方法

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Also Published As

Publication number Publication date
US20070117248A1 (en) 2007-05-24
TW200525786A (en) 2005-08-01
WO2005056269A2 (de) 2005-06-23

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