WO2004102659A3 - Composite material, electrical circuit or electric module - Google Patents

Composite material, electrical circuit or electric module Download PDF

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Publication number
WO2004102659A3
WO2004102659A3 PCT/DE2004/000824 DE2004000824W WO2004102659A3 WO 2004102659 A3 WO2004102659 A3 WO 2004102659A3 DE 2004000824 W DE2004000824 W DE 2004000824W WO 2004102659 A3 WO2004102659 A3 WO 2004102659A3
Authority
WO
WIPO (PCT)
Prior art keywords
composite material
electrical circuit
electric module
novel
axes
Prior art date
Application number
PCT/DE2004/000824
Other languages
German (de)
French (fr)
Other versions
WO2004102659A2 (en
Inventor
Juergen Schulz-Harder
Ernst Hammel
Original Assignee
Curamik Electronics Gmbh
Electrovac Gesmbh
Juergen Schulz-Harder
Ernst Hammel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics Gmbh, Electrovac Gesmbh, Juergen Schulz-Harder, Ernst Hammel filed Critical Curamik Electronics Gmbh
Priority to JP2006529582A priority Critical patent/JP2007500450A/en
Priority to EP04728319A priority patent/EP1620892A2/en
Priority to US10/554,496 priority patent/US20060263584A1/en
Publication of WO2004102659A2 publication Critical patent/WO2004102659A2/en
Publication of WO2004102659A3 publication Critical patent/WO2004102659A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49877—Carbon, e.g. fullerenes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2204/00—End product comprising different layers, coatings or parts of cermet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity

Abstract

The invention relates to a novel composite material, especially for applications in the field of electrical engineering. Said novel material has a thermal coefficient of expansion that is smaller than 12x10-6 K-1 in at least two axes of a three-dimensional system that are perpendicular in relation to each other and contains nanofibers.
PCT/DE2004/000824 2003-05-08 2004-04-20 Composite material, electrical circuit or electric module WO2004102659A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006529582A JP2007500450A (en) 2003-05-08 2004-04-20 Composite materials and electrical circuits or modules
EP04728319A EP1620892A2 (en) 2003-05-08 2004-04-20 Composite material, electrical circuit or electric module
US10/554,496 US20060263584A1 (en) 2003-05-08 2004-04-20 Composite material, electrical circuit or electric module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10320838.0 2003-05-08
DE2003120838 DE10320838B4 (en) 2003-05-08 2003-05-08 Fiber-reinforced metal-ceramic / glass composite material as a substrate for electrical applications, method for producing such a composite material and use of this composite material

Publications (2)

Publication Number Publication Date
WO2004102659A2 WO2004102659A2 (en) 2004-11-25
WO2004102659A3 true WO2004102659A3 (en) 2005-06-09

Family

ID=33394381

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/000824 WO2004102659A2 (en) 2003-05-08 2004-04-20 Composite material, electrical circuit or electric module

Country Status (6)

Country Link
US (1) US20060263584A1 (en)
EP (1) EP1620892A2 (en)
JP (1) JP2007500450A (en)
CN (1) CN100454525C (en)
DE (1) DE10320838B4 (en)
WO (1) WO2004102659A2 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2312878T3 (en) * 2004-05-18 2009-03-01 Soemtron Ag COOLING DEVICE.
JP2006152338A (en) * 2004-11-26 2006-06-15 Sumitomo Electric Ind Ltd Diamond-coated electrode and production method therefor
US7651766B2 (en) * 2005-05-20 2010-01-26 University Of Central Florida Research Foundation, Inc. Carbon nanotube reinforced metal composites
US8231703B1 (en) * 2005-05-25 2012-07-31 Babcock & Wilcox Technical Services Y-12, Llc Nanostructured composite reinforced material
US7886813B2 (en) * 2005-06-29 2011-02-15 Intel Corporation Thermal interface material with carbon nanotubes and particles
DE102006037185A1 (en) * 2005-09-27 2007-03-29 Electrovac Ag Treating nano-synthetic material, preferably in production of composite material comprising nano-fiber material and matrix, comprises adjusting physical and/or chemical properties of composite material
DE102005046404B4 (en) * 2005-09-28 2008-12-24 Infineon Technologies Ag A method for reducing variations in the deflection of rolled bottom plates and power semiconductor module with a bottom plate produced by this method
TW200726344A (en) * 2005-12-30 2007-07-01 Epistar Corp Hybrid composite material substrate
US7592688B2 (en) * 2006-01-13 2009-09-22 International Rectifier Corporation Semiconductor package
DE102007001743A1 (en) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Semiconductor laser has laser active semiconductor sequence layer with principal surface that is arranged on heat conducting layer
AU2007307054B2 (en) * 2006-10-06 2011-01-27 Microsemi Corporation High temperature, high voltage SiC void-less electronic package
DE102007031490B4 (en) * 2007-07-06 2017-11-16 Infineon Technologies Ag Method for producing a semiconductor module
AT505491B1 (en) * 2007-07-10 2010-06-15 Electrovac Ag COMPOSITE
DE102007051613A1 (en) * 2007-10-24 2009-04-30 Siemens Ag Switching and protection device e.g. gate, for e.g. switching electric current, has current flow paths, where carbon nanotube material is aligned such that conductivity is higher in current flow direction than transverse to flow direction
DE102008044641A1 (en) * 2008-04-28 2009-10-29 Osram Opto Semiconductors Gmbh Optoelectronic component
DE202009008337U1 (en) * 2009-06-12 2009-08-27 Picolas Gmbh Device for controlling a laser diode array
JP2012253125A (en) * 2011-06-01 2012-12-20 Sumitomo Electric Ind Ltd Semiconductor device and wiring board
DE102012102611B4 (en) * 2012-02-15 2017-07-27 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
JP2014047127A (en) * 2012-09-04 2014-03-17 Toyo Tanso Kk Metal-carbon composite material, manufacturing method of metal-carbon composite material, and sliding member

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US4083719A (en) * 1975-10-29 1978-04-11 Hitachi, Ltd. Copper-carbon fiber composites and process for preparation thereof
JPH01148542A (en) * 1987-12-04 1989-06-09 Ok Trading Kk Fiber-reinforced metallized ceramic
WO1990007023A1 (en) * 1988-12-16 1990-06-28 Hyperion Catalysis International Carbon fibrils and a catalytic vapor growth method for producing carbon fibrils
US5424054A (en) * 1993-05-21 1995-06-13 International Business Machines Corporation Carbon fibers and method for their production
US5495979A (en) * 1994-06-01 1996-03-05 Surmet Corporation Metal-bonded, carbon fiber-reinforced composites
US5578543A (en) * 1984-12-06 1996-11-26 Hyperion Catalysis Int'l, Inc. Carbon fibrils, method for producing same and adhesive compositions containing same
US5660923A (en) * 1994-10-31 1997-08-26 Board Of Trustees Operating Michigan State University Method for the preparation of metal matrix fiber composites
US5707715A (en) * 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
US5814408A (en) * 1996-01-31 1998-09-29 Applied Sciences, Inc. Aluminum matrix composite and method for making same
US6406790B1 (en) * 1999-09-30 2002-06-18 Yazaki Corporation Composite material and manufacturing method therefor
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
EP1265281A2 (en) * 2001-06-06 2002-12-11 Polymatech Co., Ltd. Thermally conductive molded article and method of making the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
JPS6141538A (en) * 1984-08-06 1986-02-27 株式会社日立製作所 Ceramic substrate and manufacture thereof
NL9001662A (en) * 1990-07-20 1992-02-17 Velterop F M Bv METHOD FOR CONNECTING A CERAMIC MATERIAL WITH ANOTHER MATERIAL
JPH06196585A (en) * 1992-12-24 1994-07-15 Toshiba Corp Circuit board
JP2914076B2 (en) * 1993-03-18 1999-06-28 株式会社日立製作所 Ceramic particle-dispersed metal member, its manufacturing method and its use
US5981085A (en) * 1996-03-21 1999-11-09 The Furukawa Electric Co., Inc. Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
JPH1053405A (en) * 1996-08-06 1998-02-24 Otsuka Chem Co Ltd Hexagonal boron nitride polycrystalline substance consisting of microcrystal and its production
JP3607934B2 (en) * 1996-09-19 2005-01-05 国立大学法人 東京大学 Carbon nanotube reinforced aluminum composite
US6245442B1 (en) * 1997-05-28 2001-06-12 Kabushiki Kaisha Toyota Chuo Metal matrix composite casting and manufacturing method thereof
JP2001010874A (en) * 1999-03-27 2001-01-16 Nippon Hybrid Technologies Kk Production of composite material of inorganic material with metal containing aluminum and product related to the same
JP3953276B2 (en) * 2000-02-04 2007-08-08 株式会社アルバック Graphite nanofiber, electron emission source and manufacturing method thereof, display element having the electron emission source, and lithium ion secondary battery
JP2002080280A (en) * 2000-06-23 2002-03-19 Sumitomo Electric Ind Ltd High temperature conductive composite material and method of manufacturing the same
JP3893860B2 (en) * 2000-08-11 2007-03-14 株式会社豊田自動織機 Electronic component case and method of manufacturing the same
US6420293B1 (en) * 2000-08-25 2002-07-16 Rensselaer Polytechnic Institute Ceramic matrix nanocomposites containing carbon nanotubes for enhanced mechanical behavior
US6460497B1 (en) * 2000-10-16 2002-10-08 Donald Eugene Hodgson Hodgson piston type engine
KR100565139B1 (en) * 2001-02-22 2006-03-30 니뽄 가이시 가부시키가이샤 Member for electronic circuit, method for manufacturing the member, and electronic part
JP3632682B2 (en) * 2001-07-18 2005-03-23 ソニー株式会社 Method for manufacturing electron emitter, method for manufacturing cold cathode field emission device, and method for manufacturing cold cathode field emission display

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US4083719A (en) * 1975-10-29 1978-04-11 Hitachi, Ltd. Copper-carbon fiber composites and process for preparation thereof
US5578543A (en) * 1984-12-06 1996-11-26 Hyperion Catalysis Int'l, Inc. Carbon fibrils, method for producing same and adhesive compositions containing same
JPH01148542A (en) * 1987-12-04 1989-06-09 Ok Trading Kk Fiber-reinforced metallized ceramic
WO1990007023A1 (en) * 1988-12-16 1990-06-28 Hyperion Catalysis International Carbon fibrils and a catalytic vapor growth method for producing carbon fibrils
US5424054A (en) * 1993-05-21 1995-06-13 International Business Machines Corporation Carbon fibers and method for their production
US5495979A (en) * 1994-06-01 1996-03-05 Surmet Corporation Metal-bonded, carbon fiber-reinforced composites
US5660923A (en) * 1994-10-31 1997-08-26 Board Of Trustees Operating Michigan State University Method for the preparation of metal matrix fiber composites
US5814408A (en) * 1996-01-31 1998-09-29 Applied Sciences, Inc. Aluminum matrix composite and method for making same
US5707715A (en) * 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
US6406790B1 (en) * 1999-09-30 2002-06-18 Yazaki Corporation Composite material and manufacturing method therefor
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
EP1265281A2 (en) * 2001-06-06 2002-12-11 Polymatech Co., Ltd. Thermally conductive molded article and method of making the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BIERCUK M J ET AL: "Carbon nanotube composites for thermal management", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 80, no. 15, 15 April 2002 (2002-04-15), pages 2767 - 2769, XP012030590, ISSN: 0003-6951 *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 405 (M - 868) 7 September 1989 (1989-09-07) *

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