WO2004100264A1 - 回路素子内蔵モジュール - Google Patents
回路素子内蔵モジュール Download PDFInfo
- Publication number
- WO2004100264A1 WO2004100264A1 PCT/JP2004/006496 JP2004006496W WO2004100264A1 WO 2004100264 A1 WO2004100264 A1 WO 2004100264A1 JP 2004006496 W JP2004006496 W JP 2004006496W WO 2004100264 A1 WO2004100264 A1 WO 2004100264A1
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- WO
- WIPO (PCT)
- Prior art keywords
- circuit element
- module
- built
- heat
- insulating material
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Definitions
- the present invention relates to a circuit module used for an electronic device, and more particularly to a circuit element built-in module having a built-in circuit element.
- circuit modules Conventionally, various types of circuit modules have been mounted on electronic devices.
- a plurality of circuit elements for example, active elements such as transistors and ICs and passive elements such as resistors and capacitors
- active elements such as transistors and ICs and passive elements
- passive elements such as resistors and capacitors
- These circuit elements and the substrate are entirely sealed with an electrically insulating material such as an epoxy resin.
- the plurality of circuit elements are mounted two-dimensionally on the substrate at a high density, and the circuit module itself is small. It is effective in performance improvement. For this reason, this circuit module has conventionally been used favorably in information terminal equipment such as PDAs (Personal Digital Assistance) and electronic equipment that requires particularly small size, such as mobile phones.
- PDAs Personal Digital Assistance
- the circuit elements built-in module is, P built the circuit element is a circuit module having improved three-dimensionally mounting density of O connection, circuit elements that a part of the circuit elements is embedded in the substrate of the circuit module Since the module is smaller than the conventionally used circuit module, mounting this module with a built-in circuit element makes it possible to mount the module more efficiently than mounting the circuit module that has been conventionally used suitably. The effect that the size of the device can be reduced is obtained. However, in this module with a built-in circuit element, since the circuit element is embedded in the resin with low thermal conductivity, Is stored in the circuit element built-in module.
- the buried circuit element may be excessively heated due to the effect of the stored heat.
- the temperature of the embedded circuit element exceeds the allowable limit, there is a problem that the embedded circuit element is damaged. Therefore, in the development of a module with a built-in circuit element, it is necessary to adopt a configuration that can release the heat generated from the embedded circuit element during operation of the equipment to the outside of the module with a built-in circuit element.
- various configurations as exemplified below have been proposed as circuit element built-in modules capable of releasing heat generated from the circuit elements to the outside during operation of the device.
- FIG. 14 is a perspective cross-sectional view showing a part of an example of a circuit element built-in module having a configuration capable of releasing heat generated from a buried circuit element to the outside.
- the circuit element built-in module 400 shown in FIG. 14 includes substrates (layers) 401 a, 401 b, and 401 c, and wirings (wiring patterns) 402 d. Also, the substrates 4 O la, 410 b and 401 c are composed of the wirings 402 a, 402 b and 402 c, and the electrically insulating materials 400 a and 400 b and 4 0 5 c. The circuit elements 403a and / or 403b are embedded in each of the electrically insulating materials 405a, 405b, and 405c. These circuit elements 400 a and 400 b are electrically connected to predetermined positions on wirings 402 a, 402 b and 402 c.
- the wires 410a, 410b, 401c, and 402d are opposed to each other, that is, the wires 402a and 402b, the wires 402b and the wires 402 c, the wiring 402 c and the wiring 402 d are electrically connected to each other by an inner via 404.
- the inside of the inner via 404 is filled with a conductive resin, and the conductive resin is electrically connected to the surfaces of the wirings 402 a to 402 d, whereby The opposing wirings are electrically connected.
- the electrically insulating materials 405a, 405b and 405c are constituted by a mixture of a thermosetting resin and an inorganic filler (70% to 95% by weight). I have. Since the thermal conductivity of the inorganic filler is higher than the thermal conductivity of the thermosetting resin, the thermal conductivity of the electrically insulating materials 405a, 405b and 405c is This is a remarkable improvement compared to the case where only resin is used. Therefore, when the electronic device operates, the heat generated from the circuit elements 403a and 403b is generated by the circuit elements 403a and 403b from the electrically insulating materials 405a and 405b.
- the signal is transmitted to 05b and 405c, and further reaches the main surface and side surface of the circuit element built-in module 400.
- much of the heat generated from the circuit elements 403a and 403b is radiated to the outside from the main surface and the side surfaces of the circuit element built-in module 400 (for example, Japanese Patent Laid-Open Publication; Japanese Patent Laid-Open Publication No. 11-220202).
- FIG. 15 is a perspective view showing an example of a circuit element built-in module having a configuration capable of releasing heat generated from a mounted circuit element to the outside.
- a multilayer electronic component 110 described later and a semiconductor chip 140 mounted on the multilayer electronic component 110 are separated from each other. It is shown in an upright position.
- the semiconductor chip 140 is shown in a transparent manner.
- the laminated electronic component 110 is illustrated with a part thereof cut off to clearly show the internal structure thereof.
- the circuit element built-in module 100 shown in FIG. 15 includes a multilayer electronic component 110 and a semiconductor chip 140.
- the multilayer electronic component 110 and the semiconductor chip 140 are composed of a plurality of lands 114 formed on the main surface 111 of the multilayer electronic component 110 and the main surface of the semiconductor chip 140.
- the plurality of connection poles 142 formed on the surface 141 are electrically connected to each other by a predetermined means to be integrated.
- One end of the inner via 118 is electrically connected to a plurality of lands 114 formed on the main surface 111 of the multilayer electronic component 110.
- this inner The other end of one via 1 18 is electrically connected to heat dissipation conductor 1 16 or connection terminal 1 17 of inductor element 1 15.
- the inner via 1 118, the heat dissipation conductor 1 16 and the inductor element 115 are embedded inside the magnetic sintered body 113. It is constituted by doing.
- the heat dissipation conductor 1 16 is formed in a rectangular shape, and is close to the main surface 1 11 inside the multilayer electronic component 100. At a predetermined slip position, it is buried so as to be substantially parallel to the main surface 111 and to be in a heat transfer state with the land 114 at at least one place. Therefore, heat generated from the semiconductor chip 140 is transmitted to the land 114 via the connection pole 142, and further to the heat dissipation conductor 116 via the inner via 118. It is transmitted. As a result, much of the heat generated from the semiconductor chip 140 is released to the outside from the main surface 111 of the multilayer electronic component 110 (for example, Japanese Patent Publication No. 2000-2000). — See 3 3 1 8 3 5).
- the power consumption of electronic devices tends to increase due to the effects of higher performance and higher functions of the electronic devices.
- the power handled by the circuit modules and the module with built-in circuit elements mounted on the electronic devices tends to increase. If the power handled by the circuit module and the module with a built-in circuit element is larger than before, the current flowing through the circuit module and the circuit element mounted or embedded in the module with a built-in circuit element is larger than before. Therefore, the heat generation temperature of the mounted or buried circuit element becomes higher than before.
- the heat generated from the circuit element is sufficiently released to the outside of the module with a built-in circuit element.
- the mixing ratio of the inorganic filler may be increased, but the mixing ratio of the inorganic filler is increased. In such a case, the fluidity of the electrically insulating material deteriorates.
- the thickness of the heat dissipation conductor must be increased in order to efficiently release the heat generated from the circuit element, which increases with the increase in the power handled by the module with a built-in circuit element. Need to be done. However, in this case, the thickness of the module with a built-in circuit element itself increases, which causes a problem that the miniaturization of the module with a built-in circuit element is hindered.
- the 15 has a baking step in the manufacturing process, it includes active elements such as transistors and ICs and organic compounds having a feature of being weak to heat. There is a problem that circuit elements such as passive elements cannot be buried inside the electrically insulating material.In addition, since the material used for wiring is a high-resistance material such as tantalum-molybdenum, wiring has large power loss. There is also the problem.
- the present invention has been made to solve the above-mentioned problems, is easy to manufacture, has no obstructive factor in downsizing, and efficiently removes heat generated from the circuit element. It is an object of the present invention to provide a circuit element built-in module using a resin-based electrically insulating material that can be released to the outside.
- a module with a built-in circuit element includes a plurality of wirings formed in a substantially two-dimensional shape laminated via an electrically insulating material. Is composed of a mixture containing at least a filler and an electrically insulating resin, one or more circuit elements are electrically connected to the wiring, and at least a part of the circuit elements is embedded in the electrically insulating material.
- the high heat-generating circuit element having the highest temperature rise is arranged so as to overlap when viewed from the lamination direction of the wiring.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler.
- it can be moved to a heat dissipating member having a higher thermal conductivity than the electrically insulating material.
- the temperature rise of the high heat-generating circuit elements during the operation of electronic equipment is suppressed. Therefore, it is possible to prevent the high heat generating circuit element from being damaged due to high heat. In other words, the effect is obtained that the module with a built-in circuit element operates normally continuously.
- the heat dissipating member and the high heat-generating circuit element are arranged so as to face each other in the laminating direction of the wiring.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler. Further, it is possible to efficiently move to a heat dissipating member having a higher thermal conductivity than the electrically insulating material. As a result, the temperature rise of the high heat-generating circuit element during the operation of the electronic device is efficiently suppressed, so that the high heat-generating circuit element can be effectively prevented from being damaged due to high heat. . That is, an effect is obtained that the module with a built-in circuit element operates continuously and more normally.
- the heat dissipating member may be provided on a surface of the electrically insulating material.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler.
- the temperature rise of the high heat generating circuit element during the operation of the electronic device is more efficiently suppressed, so that the damage of the high heat generating circuit element due to the high heat can be more effectively prevented. It can be possible. That is, it is possible to obtain an effect that the module with a built-in circuit element operates continuously and more normally.
- the area of the heat dissipation member is larger than the area of the high heat generation circuit element.
- the high heat generating circuit element may be provided on a surface of the electrically insulating material.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler.
- heat generated from the high heat-generating circuit element can be released directly from the surface of the high heat-generating circuit element to the outside of the circuit element built-in module.
- the temperature rise of the high heat-generating circuit element during the operation of the electronic device is more efficiently suppressed, so that the high heat-generating circuit element can be more effectively prevented from being damaged due to high heat. It will be possible. That is, there is an effect that the module with a built-in circuit element operates continuously and more normally.
- the heat dissipation member is electrically connected to the wiring.
- an electrically conductive member that electrically connects the plurality of wirings to each other is provided in contact with the electrically insulating material, and the electrically conductive member and the heat dissipation member are thermally connected. It is provided with a portion to be formed.
- the electric insulating material is generated from the high heat-generating circuit element during the operation of the electronic device, and passes through the electric insulating material whose thermal conductivity is improved by the addition of the filler.
- Heat transmitted to the heat dissipating member having higher thermal conductivity can be directly transmitted to the electrically conductive member without passing through the wiring.
- the electric conductive member is a through hole.
- the electric conductive member may be an inner via.
- the electrically insulating material and the electrically conductive member can be configured by a conventionally used manufacturing facility and manufacturing process. As a result, there is no need to construct a new facility and develop a new manufacturing process, so that it is possible to provide an economical circuit element built-in module.
- the heat dissipation member has a chip component shape.
- the heat radiation member can be mounted by using a chip component mounting apparatus generally used conventionally. As a result, it is not necessary to construct new equipment and develop a new manufacturing process. Is obtained.
- the heat dissipating member may be a member mainly composed of metal.
- Transient thermal resistance is reduced by such a structure, that is, by disposing a heat-dissipating member having a very high thermal conductivity, such as a metal or a member mainly composed of a metal, in the vicinity of the high heat-generating circuit element. It becomes possible to do.
- This transient thermal resistance is a kind of heat dissipation characteristic and represents the degree of heat dissipation in a short period of time after heat is generated (the degree of heat dissipation for instantaneous heat generation). If the transient thermal resistance is small, heat spots are less likely to be formed, and the effect of improving the reliability (heat resistance) of the module with a built-in circuit element in a thermal cycle test or the like can be obtained.
- the heat dissipating member may be a member mainly composed of ceramics.
- the thermal conductivity of the heat dissipating member can be arbitrarily controlled by selecting the material.
- the heat dissipating member is a small piece, any of the components constituting the circuit element built-in module can be arbitrarily disposed near the circuit element.
- the thermal conductivity of the heat dissipating member is at least three times the thermal conductivity of the electrically insulating material.
- the high heat generating circuit element and the heat radiating member have an area of a portion overlapping each other when viewed from the laminating direction of the wiring, which is 40% of an area of the high heat generating circuit element viewed from the laminating direction of the wiring. It is arranged so that it becomes ing.
- the distance between the high heat-generating circuit element and the heat-dissipating member may be greater than O mm and equal to or less than 0.5 mm.
- the high heat generating circuit element and the heat radiating member may be in close contact with each other via at least the electrically insulating material.
- the thermal resistance between the highly heat-generating circuit element and the heat dissipating member is lower than when there is a gap between them, so that the heat generated from the highly heat-generating circuit element can be stabilized. And release to the outside.
- the wiring may be further provided between the high heat generation circuit element and the heat dissipation member.
- the thickness of the heat dissipation member may be larger than the thickness of the wiring.
- the thickness of the heat radiation member is 0.1 mm or more and 1.0 mm It may be the following.
- a plurality of wirings formed in a substantially two-dimensional shape are laminated via an electrically insulating material, and the electrically insulating material is at least electrically insulated from the filler.
- a circuit element comprising a mixture containing a conductive resin, wherein at least one circuit element is electrically connected to the wiring, and at least a part of the circuit element is embedded in the electrically insulating material.
- a module wherein the circuit element has a heat dissipation circuit element having a higher thermal conductivity than the electrically insulating material, and the heat dissipation circuit element, and at least the circuit element built-in module of the circuit element And the high heat-generating circuit element having the highest temperature rise is arranged so as to overlap when viewed from the lamination direction of the wiring.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler. Further, it is possible to move to a heat-dissipating circuit element having a higher thermal conductivity than the electrically insulating material. As a result, a rise in temperature of the high heat generating circuit element during operation of the electronic device is suppressed, so that damage to the high heat generating circuit element due to high heat can be prevented. That is, an effect is obtained that the module with a built-in circuit element operates normally continuously.
- a circuit element for constituting the module with a built-in circuit element is also used as a heat dissipating member having a higher thermal conductivity than an electrically insulating material. There is no need to mount other members. Further, since a region for mounting other members other than the circuit element is not required, the mounting density of the circuit element in the circuit element built-in module can be increased. In other words, the module with built-in circuit elements can be made even smaller. And the effect that becomes possible.
- the circuit element for heat dissipation and the circuit element for high heat generation are arranged so as to face each other in the direction of lamination of the wiring.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler, Further, it is possible to efficiently move to a heat dissipation circuit element having a higher thermal conductivity than the electrically insulating material. As a result, the temperature rise of the high heat generating circuit element during the operation of the electronic device is efficiently suppressed, so that the high heat generating circuit element can be effectively prevented from being damaged due to high heat. In other words, the effect is obtained that the circuit element built-in module operates continuously and more normally.
- the heat dissipation circuit element may be provided on a surface of the electrically insulating material.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler.
- the temperature rise of the high heat generating circuit element during the operation of the electronic device is more efficiently suppressed, so that the damage of the high heat generating circuit element due to the high heat can be more effectively prevented. It can be possible. In other words, it is possible to obtain the effect that the module with a built-in circuit element operates continuously and more normally.
- the area of the circuit element for heat dissipation is larger than the area of the circuit element having high heat generation as viewed from the lamination direction of the wiring.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred by the addition of the filler. Transfer to an electrically insulating material having improved conductivity, and further to a heat-dissipating circuit element having higher thermal conductivity than the electric-insulating material, and from the heat-dissipating circuit element to the outside of the circuit element built-in module. Can be released to As a result, the temperature rise of the high heat generating circuit element during the operation of the electronic device is more efficiently suppressed, so that the damage of the high heat generating circuit element caused by the high heat can be more effectively prevented. Becomes possible. That is, there is an effect that the module with a built-in circuit element operates continuously and more normally.
- the high heat generating circuit element may be provided on a surface of the electrically insulating material.
- the heat generated from the high heat-generating circuit element during the operation of the electronic device is transferred to the electrically insulating material whose thermal conductivity has been improved by adding the filler. Further, it is possible to efficiently move to a heat dissipation circuit element having a higher thermal conductivity than the electrically insulating material. Further, heat generated from the high heat generating circuit element can be released directly from the surface of the high heat generating circuit element to the outside of the circuit element built-in module. As a result, the temperature rise of the high heat generating circuit element during the operation of the electronic device is more efficiently suppressed, so that the damage of the high heat generating circuit element due to the high heat can be more effectively prevented. It will work. That is, an effect is obtained that the module with a built-in circuit element operates continuously and more normally.
- the heat dissipation circuit element is a resistor.
- the heat dissipation circuit element may be a capacitor.
- the heat dissipation circuit element may be an inductive element.
- the heat dissipation circuit element may be a laminate of a capacitor and an inductor.
- circuit elements are generally made of a material having a high thermal conductivity, they can be used as heat radiation circuit elements. It is possible to fulfill the function sufficiently.
- circuit elements are also circuit elements for configuring a module with a built-in circuit element, and therefore, the mounting density of the circuit elements in the module with a built-in circuit element can be increased. That is, there is an effect that it is possible to provide a small module with a built-in circuit element that normally operates normally.
- the laminate is disposed such that the condenser is near the high heat generating circuit element.
- the capacitor is a ceramic capacitor.
- the capacitor may be a solid electrolytic capacitor. Even with such a configuration, since these circuit elements are generally made of a material having a high thermal conductivity, it is possible to sufficiently fulfill the function as a heat radiation circuit element. The effect is obtained.
- the inductor has a laminated structure of a winding and a magnetic material, and has a thin sheet shape.
- the inductor may have a laminated structure of a winding and a magnetic material, and a sheet-like coil formed by a plating method may be configured as the winding.
- the inductor has a laminated structure of a winding and a magnetic material
- the magnetic body may be configured by using at least a thin metal body. Even with such a configuration, since these circuit elements are generally made of a material having a high thermal conductivity, it is possible to sufficiently fulfill the function as a heat radiation circuit element. The effect is obtained.
- the heat conductivity of the circuit element for heat dissipation is at least three times the heat conductivity of the electrically insulating material.
- the high heat-generating circuit element and the heat-dissipating circuit element may have an area of a part overlapping each other when viewed from the lamination direction of the wiring, and the area of the overlapping part of the high heat-generating circuit element being four times the area viewed from the lamination direction of the wiring. It is arranged so that it becomes 0% or more.
- the distance between the high heat generating circuit element and the heat radiating circuit element may be more than 0 mm and 0.5 mm or less.
- circuit element having high heat generation and the circuit element for heat dissipation may be in close contact with each other via at least the above-mentioned electrically insulating material.
- the wiring may be further provided between the high heat generation circuit element and the heat radiation circuit element.
- the thickness of the circuit element for heat dissipation may be larger than the thickness of the wiring.
- the thickness of the heat dissipation circuit element may be 0.1 mm or more and 1.0 mm or less.
- FIG. 1 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the first embodiment of the present invention.
- FIG. 2 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the second embodiment of the present invention.
- FIG. 3 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to a third embodiment of the present invention.
- FIG. 4 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the fourth embodiment of the present invention.
- FIG. 5 shows the structure of the module with a built-in circuit element according to the fifth embodiment of the present invention. It is sectional drawing which showed the structure typically.
- FIG. 6 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to a sixth embodiment of the present invention.
- FIG. 7 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the seventh embodiment of the present invention.
- FIG. 8 is a cross-sectional view schematically showing a part of an example of a switching power supply module according to an eighth embodiment of the present invention.
- FIG. 9 is a cross-sectional view schematically showing a part of a switching power supply module of another configuration according to the eighth embodiment of the present invention.
- FIG. 10 is a general circuit diagram of a switching power supply module.
- FIG. 11 is a cross-sectional view schematically illustrating a module with a built-in circuit element according to a ninth embodiment of the present invention.
- FIG. 12 shows the ratio of the area of the opposing portion between the circuit element and the heat dissipation member to the area of the main surface of the circuit element, and the heat transfer from the circuit element to the heat dissipation member according to the ninth embodiment of the present invention.
- FIG. 4 is a schematic diagram showing a relationship with a thermal resistance ratio at the time of transmission.
- FIG. 13 is a graph showing the heat conduction between the electrically insulating material and the heat radiating member when the heat radiating member having a high thermal conductivity is opposed to the circuit element in the same area according to the ninth embodiment of the present invention.
- FIG. 3 is a schematic diagram showing a relationship between a ratio of the ratio and a heat resistance ratio when heat is transmitted from a circuit element to a heat dissipation member.
- FIG. 14 is a perspective sectional view showing a part of an example of a conventional circuit element built-in module having a configuration capable of releasing heat generated from a buried circuit element to the outside.
- FIG. 15 is a perspective view showing an example of a conventional circuit element built-in module having a configuration capable of releasing heat generated from a mounted circuit element to the outside. [Best mode for carrying out the invention]
- FIG. 1 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the first embodiment of the present invention.
- the module with a built-in circuit element 51 shown in FIG. 1 includes an electrically insulating material 11, a plurality of wirings (wiring patterns) 12 attached to the electrically insulating material 11, and a signal pattern 12 a.
- An inner via 41 electrically connecting the plurality of wirings 12 so as to have a predetermined connection relationship; and an inner via 41 electrically connected to the wiring 12 and electrically conductive with the electrically insulating material 11.
- a circuit element 14 and a circuit element 15 buried so as to be connected to each other; and an electrically insulating material 1 disposed substantially parallel to the main surface of the circuit element 14 and arranged so as to face each other.
- a heat radiation member 13 having a higher thermal conductivity than 1.
- the circuit element built-in module 51 shown in FIG. 1 is configured by laminating a substrate (layer) 201, a substrate (layer) 202, and a substrate (layer) 203.
- the electrically insulating material 11 is composed of a mixture of an inorganic filler and an electrically insulating resin.
- an inorganic filler for example, aluminum oxide, magnesium oxide, polon nitride, aluminum nitride, silicon dioxide, silicon carbide, ferrite and the like can be used.
- the electrically insulating resin for example, a thermosetting resin such as an epoxy resin, a phenol resin, a cyanate resin, a fluorine resin, a polyester, a polyphenylene ether, and a polyimide can be used.
- the electrical insulating material 11 has a compounding ratio of the inorganic filler and the electrical insulating resin, and the electrical insulating material 11 has various characteristics such as a coefficient of linear expansion, a thermal conductivity, a relative dielectric constant, and a magnetic permeability. It has been determined to be an appropriate value. For example, if the circuit element 14 is a circuit element having large heat generation, The heat causes the electrically insulating material 11 near the circuit element 14 to thermally expand. However, if the coefficient of linear expansion of the electrically insulating material 11 is close to the coefficient of linear expansion of the circuit element 14 by the above-described means, the amount of thermal expansion of the electrically insulating material 11 near the circuit element 14 is Becomes smaller. In this case, since the internal stress of the electrically insulating material 11 due to the temperature change of the circuit element 14 can be reduced, the operation reliability of the circuit element built-in module 51 can be improved.
- the wiring 12 and the signal pattern 12a are made of a substance having electrical conductivity, and are formed by, for example, molding a copper foil or a conductive resin composition into a predetermined shape. As described above, since the area of the wiring can be reduced by using a substance having high electric conductivity, the module 51 with a built-in circuit element is effective for miniaturization.
- the wiring 12 and the signal pattern 12 a are also provided between the circuit element 14 and the heat radiating member 13.
- the circuit element 14 is an active element such as a power transistor or an IC for power supply such as a three-terminal regulator, and is a circuit element having a relatively high heat generation temperature and a large heat generation amount.
- the circuit element 15 is a passive element such as a ceramic capacitor, a solid electrolytic capacitor, and an inductor, and has a relatively low heat generation temperature and a small heat generation amount.
- the circuit element 14 and the circuit element 15 are mounted at predetermined positions on the wiring 12 by an arbitrary mounting method such as soldering. Further, the main surface and the side surface of the circuit element 14 and the circuit element 15 are in contact with the electrically insulating material 11, that is, are thermally conductively connected to the electrically insulating material 11.
- the heat radiation member 13 having a high thermal conductivity it is desirable to use metal, ceramics, or the like.
- the reason is that the thermal conductivity of metals and ceramics is two to one orders of magnitude higher than the thermal conductivity of electrically insulating material 11 composed of inorganic filler and thermosetting resin. This is because the generated heat can be efficiently released to the outside.
- the type of metal Suitable materials are copper (thermal conductivity: 398 (W / m ⁇ K)), aluminum (thermal conductivity: 237 (W / m ⁇ K)), and the like.
- Suitable types of ceramics include aluminum oxide (thermal conductivity: 22 (W / m ⁇ K)), aluminum nitride (thermal conductivity: 170 (W / m ⁇ K)), and the like.
- the metal has a shielding effect of electromagnetic noise, and thus, for example, noise generated from the circuit element 14 or noise radiated from outside. Etc. can be shielded.
- the heat radiating member 13 having a high thermal conductivity is made of ceramics, a similar effect can be obtained by forming a metal film on the surface of the ceramics (at least half of the surface where the ceramics are mounted). It becomes possible.
- the heat radiation member 13 having a high thermal conductivity has a chip component shape.
- the reason is that the heat radiation member 13 has a chip component shape, so that the heat radiation member 13 can be mounted using chip component mounting equipment generally used conventionally.
- the thickness of the heat radiation member 13 is desirably equal to or less than the thickness of the other circuit elements 15 provided on the same wiring layer. The reason is that by making the thickness of the heat radiation member 13 and the circuit element 15 equal to or less than the thickness, the thickness of the module with a built-in circuit element is not affected and the size can be reduced. Because.
- an insulating film may be formed on the surface of the heat radiating member 13.
- the heat radiating member 13 is made of ceramics, it is not necessary to particularly form an insulating film since the ceramics is originally an insulator.
- the thickness of the heat radiating member 13 having a high thermal conductivity is configured to be thicker than the thickness of the wiring 12 or the signal panel 12a. In this case, it is preferable that the thickness of the heat radiation member 13 be 0.1 mm or more and 1.0 mm or less. This generates from circuit element 14 Heat can be effectively released.
- the distance between the heat radiation member 13 and the circuit element 14 is desirably more than 0 mm and 0.5 mm or less. This makes it possible to more effectively release the heat generated from the circuit element 14.
- the inner pier 41 electrically connects a plurality of wires 12 attached to the circuit element built-in module 51 so that a predetermined circuit is formed.
- the inside of the inner via 41 is filled with a conductive resin, and the conductive resin is electrically connected to the surface of the wiring 12 to electrically connect the opposing wirings 12.
- the inner via 41 electrically connects a plurality of wirings 12 in the circuit element built-in module so as to form a predetermined circuit, and also connects the wirings 12 with each other in a heat conductive manner.
- a method of electrically connecting the wirings to each other in addition to the method using the inner via as described above, there is also a method using the through hole. However, from the viewpoint of high-density mounting of circuit elements, it is more appropriate to use an internal via.
- the heat radiating member 13 having a higher thermal conductivity than the electrically insulating material 11 is substantially parallel to the main surface of the circuit element 14. And are arranged so as to face each other. Therefore, the heat generated from the circuit element 14 is transmitted to the electrically insulating material 11 on the circuit element 14, and further moves to the heat radiation member 13 having a high thermal conductivity via the wiring 12. Then, it is released to the outside of the circuit element built-in module 51 by passing through the electrically insulating material 11 and the wiring 12 again.
- the temperature rise of the circuit element 14 during operation of the device is suppressed, so that the damage of the circuit element 14 can be prevented, and the module 51 with a built-in circuit element operates normally continuously.
- the heat radiation property is improved by disposing the heat radiation member 13 having a high thermal conductivity, the weight ratio of the inorganic filler in the electrically insulating material 11 can be reduced.
- the module with a built-in circuit element The embedding property of the circuit element 14 and the like in manufacturing the module 51 is improved. Further, since external stress applied to the circuit element 14 and the like is reduced, it is possible to prevent the circuit element from being damaged.
- FIG. 2 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the second embodiment of the present invention.
- the circuit element built-in module 51 shown in FIG. 2 includes an electrically insulating material 11, a plurality of wirings 12 attached to the electrically insulating material 11, and a plurality of wirings 12 in a predetermined connection relationship.
- a plurality of circuit elements 15 and a plurality of heat radiators having a higher thermal conductivity than the electrically insulating material 11 and arranged so as to be substantially parallel to and opposed to the main surface of the circuit element 14. It has a component 13 and a through hole 17.
- the module 51 with a built-in circuit element is configured to include two heat radiation members 13 having high thermal conductivity. These heat-radiating members 13 are disposed so as to be substantially parallel to each other, and are disposed so as to be substantially parallel to the main surface of the circuit element 14 and to be opposed to each other. I have. Further, one of the plurality of heat dissipating members 13 is directly and thermally connected to the through hole 17. Therefore, even when the circuit element 14 is disposed deep in the circuit element built-in module 51 as shown in FIG. 2, the heat generated from the circuit element 14 is not affected by the electric insulating material 1.
- a third embodiment of the present invention will be described with reference to FIG.
- a third example in a form in which a member other than a circuit element, such as a metal or a ceramic, is used as a heat radiating member having a high thermal conductivity will be described.
- FIG. 3 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to a third embodiment of the present invention.
- the module with built-in circuit element 51 shown in FIG. 3 includes an electrically insulating material 11, a plurality of wirings 12 attached to the electrically insulating material 11, and a plurality of wirings 12 in a predetermined connection relationship.
- a plurality of vias 41 electrically connected to each other so as to be electrically connected to the wiring 12 and a circuit buried so as to be thermally conductively connected to the electrically insulating material 11 Heat radiation having a higher thermal conductivity than the electrically insulating material 11 disposed so as to be substantially parallel to and opposed to the main surface of the circuit element 14 with the element 14 and the circuit element 15 And a housing 31 that is thermally conductively connected to the heat radiating member 13.
- the heat radiating member 13 having a high thermal conductivity is arranged so as to be substantially parallel to the circuit element 14 and to face the circuit element 14. In addition, it is disposed so as to be exposed on the surface of the circuit element built-in module 51.
- a housing 31 serving as a forced cooling means to the outside is thermally adhered or adhered to the upper portion of the heat radiation member 13 having a high thermal conductivity. Therefore, the heat generated from the circuit element 14 is transferred to the heat radiating member 13 having high thermal conductivity via the electrically insulating material 11. Then, it is released to the outside of the circuit element built-in module 51 via the housing 31.
- the same effects as those of the first embodiment of the present invention can be obtained.
- the rest is the same as in the first embodiment.
- a fourth embodiment of the present invention will be described with reference to FIG.
- a fourth example will be described in which a member other than a circuit element, such as a metal or a ceramic, is used as a heat radiating member having a high thermal conductivity.
- FIG. 4 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the fourth embodiment of the present invention.
- the module with built-in circuit element 51 shown in FIG. 4 has a predetermined connection between the electrically insulating material 11, the plurality of wires 12 attached to the electrically insulating material 11, and the plurality of wires 12.
- a plurality of inner vias 41 electrically connected to each other so as to be related to each other; and a circuit buried electrically connected to the wiring 12 and electrically connected to the electrically insulating material 11.
- the heat radiation member 13 is provided.
- FIG. 5 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to a fifth embodiment of the present invention.
- the circuit element built-in module 52 shown in FIG. 5 includes an electrically insulating material 11, a plurality of wirings 12 attached to the electrically insulating material 11, and a plurality of wirings 12 with a predetermined connection relationship.
- a circuit element 19 which is a circuit component is used as a heat dissipating member having high thermal conductivity.
- the circuit element 19 is arranged at a predetermined position on the wiring 12 so as to be substantially parallel to the main surface of the circuit element 14 and to have a relationship facing the main surface. Therefore, the heat generated from the circuit element 14 moves to the circuit element 19 via the electrically insulating material 11 and the wiring 12, and further passes through the electrically insulating material 11 to incorporate the circuit element. Released outside module 52.
- the same effects as those of the first embodiment of the present invention can be obtained.
- the rest is the same as in the first embodiment.
- the circuit element 19 having a high thermal conductivity is a circuit element that functions functionally in an electronic circuit constituting the circuit element built-in module.
- various circuit elements such as a capacitor, an inductor, a resistor, and a semiconductor device. Can be targeted.
- the circuit element 14 is a semiconductor device that handles a large amount of power, the power supply It is necessary to mount a capacitor for smoothing.
- the inductor needs to be arranged near the semiconductor device. In such a case, the heat generated from the circuit element 14 due to the handling of large power is reduced by the effect of the capacitor, inductor, and the like arranged near the circuit element 14 as described above.
- a member used only for cooling the circuit element 14 is not newly added, so that the mounting density of the circuit element is increased. Becomes possible. Furthermore, by disposing the circuit element 19 having a high thermal conductivity in the vicinity of the circuit element 14, wiring for electrically connecting the circuit elements is minimized, so that noise generated from the circuit can be reduced. It is also effective for reduction. In addition, since the inductor and the like of the wiring itself can be minimized, the performance as a module with a built-in circuit element can be improved.
- a multilayer ceramic capacitor As the circuit element 19 for heat dissipation, heat generated from the circuit element 14 can be efficiently released to the outside.
- the reason for this is that although a general multilayer ceramic capacitor uses a low-thermal-conductivity titanium titanate barrier as a dielectric material, the multilayer ceramic capacitor occupies nearly half in volume, nickel, This is because there is a metal internal electrode made of copper, silver, or the like. For this reason, the multilayer ceramic capacitor has excellent thermal conductivity, and the metal internal electrodes formed in a layer form can provide the same thermal conductivity as that of metal, particularly in the horizontal direction. Thereby, the heat generated from the circuit element 14 is radiated well.
- a sixth embodiment of the present invention will be described with reference to FIG.
- a sixth embodiment of the present invention a second example in a case where a circuit element is used as a heat radiating member having a high thermal conductivity will be described.
- FIG. 6 shows the structure of the module with a built-in circuit element according to the sixth embodiment of the present invention. It is sectional drawing which showed the structure typically.
- a solid electrolytic capacitor is used as a heat radiation member having high thermal conductivity.
- a solid electrolytic capacitor is formed by forming an anode oxide film on the surface of a valve metal sheet etched to increase the surface area, and using a composite of the valve metal sheet and the anode oxide film as a dielectric.
- a solid electrolyte, a carbon layer, and a silver conductive resin layer are formed in a portion of the dielectric other than the anode lead portion (this stage is referred to as a capacitor body), and an anode terminal and a cathode terminal are further formed. And then package it by transfer molding potting or the like.
- the module with a built-in circuit element is configured by directly arranging the capacitor element body directly on the wiring without connecting the anode terminal and the cathode terminal to the capacitor element body.
- the circuit element built-in module 52 shown in FIG. 6 includes an electrically insulating material 11, a plurality of wirings 12 attached to the electrically insulating material 11, and a plurality of wirings 12 in a predetermined connection relationship.
- a valve metal thin plate 32 arranged substantially in parallel with and facing the main surface of the circuit element 14; and a carbon layer 33 formed around the valve metal thin plate 32.
- a silver conductive resin layer 34 that electrically connects the bonding layer 3 3 and the wiring 12.
- the capacitor element functioning as a solid electrolytic capacitor is composed of a valve metal thin plate 32, a carbon layer 33, a silver conductive resin layer 34, an anode oxide film (not shown), and a solid electrolyte. Then, the capacitor element thus configured is used as a circuit element 20. Used.
- a circuit element 20 which is a circuit element is used as a heat radiation member having a high thermal conductivity.
- the circuit element 20 is disposed at a predetermined position on the wiring 12 so as to be substantially parallel to the main surface of the circuit element 14 and to have a relationship facing the main surface. Therefore, the heat generated from the circuit element 14 moves to the circuit element 20 via the electrically insulating material 11 and the wiring 12, and further passes through the electrically insulating material 11 to incorporate the circuit element. Released outside module 52.
- the same effects as those of the first embodiment of the present invention can be obtained.
- the rest is the same as in the first embodiment.
- an aluminum solid electrolytic capacitor is suitably used as the solid electrolytic capacitor.
- an aluminum plate is used as the valve metal thin plate 32, and since this aluminum plate occupies almost half of the capacitor body in volume, the heat conduction of the element This is because the rate is excellent.
- the capacitor body in the present embodiment is built in the electrically insulating material 11, there is no need to package it again by transfer molding potting or the like.
- a seventh embodiment of the present invention will be described with reference to FIG.
- a seventh embodiment of the present invention a third example in a case where a circuit element is used as a heat radiating member having high thermal conductivity will be described.
- FIG. 7 is a cross-sectional view schematically illustrating a configuration of a module with a built-in circuit element according to the seventh embodiment of the present invention.
- the circuit element built-in module 52 shown in FIG. 7 includes an electrically insulating material 11, a plurality of wirings 12 attached to the electrically insulating material 11, and a plurality of wirings 12 in a predetermined connection relationship.
- a plurality of vias that are electrically connected to each other A circuit element 14 and a circuit element 15 buried so as to be electrically connected to the wiring 12 and thermally conductively connected to the electrically insulating material 11, and the circuit element 14
- a circuit element 21 having a thermal conductivity higher than that of the electrically insulating material 11 and arranged so as to be substantially parallel to and opposed to the main surface.
- the circuit element 21 is an inductor and includes a sheet-shaped winding conductor 22 and a magnetic layer 23.
- a circuit element 21 which is a circuit component is used as a heat dissipation member having a high thermal conductivity.
- the circuit element 21 is disposed at a predetermined position on the wiring 12 so as to be substantially parallel to the main surface of the circuit element 14 and to be opposed to each other. Therefore, the heat generated from the circuit element 14 moves to the circuit element 21 via the electrically insulating material 11 and the wiring 12, and further passes through the electric insulating material 11 to incorporate the circuit element. Released outside module 52.
- the same effects as those of the first embodiment of the present invention can be obtained.
- the rest is the same as in the first embodiment.
- a metal is used for the winding conductor, and a sintered magnetic material or metal is used for the magnetic layer.
- These metals and sintered magnetic materials have a high thermoelectric coefficient and thus a high thermal conductivity, and are suitable for modules with built-in circuit elements.
- a general inductor has a structure in which a conductive wire is wound around a sintered magnetic body, it is difficult to reduce the thickness of the inductor.
- the sintered magnetic material may be broken by pressure during molding.
- windings formed by winding conductive wires are not suitable as embedded circuit elements due to the presence of voids inside. Therefore, in the present embodiment, as shown in FIG.
- the inductor 21 is configured by arranging the sheet-shaped winding conductor 22 and the magnetic layer 23 in a plane. Due to its shape, the planar inductor 21 thus configured is strong against molding pressure when the element is buried.
- the winding conductor 22 is flat It is desirable to use a sheet coil because of its good surface properties.
- As a method for manufacturing the sheet-shaped coil there is a method based on an etching method or a plating method. However, in the etching method, the distance between the windings of the coil is greater than the conductor thickness, and the ratio of the conductor cross-sectional area to the total cross-sectional area of the winding, that is, the space factor Is difficult to raise.
- the space factor in the etching method is usually 50% or less. For this reason, it is desirable to manufacture a sheet-like coil by a plating method. With this plating method, even if the winding has a conductor thickness of 80 m or more, the line-to-line distance can be reduced to 20 m or less. That is, it is possible to improve the space factor. If the space factor is improved, the resistance component of the inductor decreases, and thus it becomes possible to reduce the power loss due to the inductor. Further, since the conductor volume can be increased, it is possible to further increase the thermal conductivity of the conductor. In an inductor formed by the etching method and the plating method, a resin is filled between conductors.
- a hole may be formed in the center or the periphery of the sheet-shaped winding, and the hole may be filled with a magnetic material to form an inductor.
- a magnetic material used for filling a material obtained by mixing a sintered magnetic powder or a metal magnetic powder with a resin can be used.
- the magnetic material layer 23 examples include a sintered magnetic material, a mixture of a magnetic powder and a resin, and a metal magnetic foil.
- a mixture of a magnetic powder and a resin or a metal magnetic foil has a high strength, and the strength of an element in the case of forming an inductor is improved, so that it is suitable as a buried circuit element.
- the magnetic permeability of the metal magnetic foil is high and has a noise shielding effect, it is necessary to arrange the metal magnetic foil close to noise-sensitive elements such as semiconductor elements. Therefore, there is also an effect that the influence of noise can be reduced.
- the winding conductor 22 has a single layer here, but may have a multilayer structure. By forming the winding conductor 22 in multiple layers, an effect is obtained that the terminal arrangement of the winding becomes easier.
- a switching power supply module will be described as an example of a circuit element built-in module.
- FIG. 8 is a cross-sectional view schematically illustrating a part of an example of a switching power supply module
- FIG. 9 is a cross-sectional view schematically illustrating a part of a switching power supply module having another configuration.
- FIG. 10 shows a general circuit diagram of a switching power supply module.
- the circuit element 24 is a single semiconductor device having a built-in control circuit, and the circuit element 20 is the solid electrolytic capacitor described in the sixth embodiment.
- the circuit element 21 is the inductor described in the seventh embodiment.
- the switching power supply module 53 shown in FIG. 9 includes a terminal 43 for electrically connecting the switching power supply module to another substrate and a preferably metal case 42 for covering the inductor 21. It is configured to have. 8 and 9, the electrically insulating material 11, the wiring 12, and the inner via 41 are the same as those in the first to seventh embodiments. Normally, in a switching power supply, power loss in the circuit element 24, which is a power semiconductor device, is dominant, so that heat generated from the circuit element 24 is very large.
- a circuit element 20 which is a solid electrolytic capacitor and a circuit element 21 which is an inductor are opposed to the circuit element 24 which is a power semiconductor device.
- This arrangement allows the heat generated by the circuit element 24 to be switched
- the power supply module 53 is configured to be discharged to the outside.
- FIG. 10 is a general circuit diagram of a switching power supply module.
- the example of the circuit diagram shown in FIG. 10 is a circuit diagram of a so-called step-down switching power supply circuit.
- the circuit element 24 is a power semiconductor device incorporating a control circuit
- the circuit element 21 is an inductor
- the circuit element 20 is a solid electrolytic capacitor.
- the circuit element 21 has an inductance of the order of / H
- the circuit element 20 has an inductance of the order of F. Capacitance is required.
- the circuit element 24 which is a power semiconductor device
- the circuit elements 20 and 21 which are solid electrolytic capacitors and inductors are arranged as close as possible.
- the switching power supply module 53 shown in FIGS. 8 and 9 the circuit element 24 and the circuit element 20 and the circuit element 21 are arranged so as to be close to each other.
- the wiring for electrically connecting circuit elements is kept as short as possible. As a result, it is possible to effectively suppress the pulse-like noise generated corresponding to the switching frequency.
- the circuit element 21 is an inductor using a low-permeability magnetic material
- the magnetic flux leaking from the inductor may adversely affect the semiconductor device and its peripheral circuits.
- the shield effect of the circuit element 20 causes It is possible to suppress the adverse effect due to the leakage magnetic flux.
- the circuit element 20 is a solid electrolytic capacitor.
- the present invention is not limited to this, and a capacitor having a high thermal conductivity such as a ceramic capacitor may be used. (Ninth embodiment)
- heat generated from the circuit element having a heat-generating property is radiated to the outside of the module with a built-in circuit element through the heat radiation member and the electrically insulating material.
- the module with built-in circuit elements is mounted on a motherboard (main board). Therefore, as a method of cooling a heat-generating circuit element, there is a method of transferring the heat generated from the circuit element to a mother board through a circuit element built-in module.
- the heat-dissipating member in the circuit element built-in module in order to efficiently cool the heat-generating circuit element, must be at least opposed to the heat-generating circuit element and the mother pod. It is arranged so as to have a region to be formed. By arranging the heat dissipating member in such a manner, the heat generated from the circuit elements can be efficiently transferred to the mother board.
- the configuration of the circuit element built-in module by disposing the heat radiating member as described above can be applied and effective in all forms including the first to eighth embodiments of the present invention.
- FIG. 11 is a cross-sectional view schematically illustrating the circuit element built-in module 54 according to the present embodiment.
- a circuit element 14 is a semiconductor element whose main surface has a dimension of 2 mm ⁇ 2 mm.
- the thickness 11 d of the electrically insulating material 11 in the gap between the circuit element 14 and the wiring 12 is 0.4 mm.
- a heat dissipating member 13 having a high thermal conductivity disposed opposite to the circuit element 14 is provided.
- the thickness 13d is 0.3 mm.
- the thermal conductivity of the electrically insulating material 11 is 3 (W / m ⁇ K), and the thermal conductivity of the heat radiation member 13 is 400 (W / ⁇ K).
- the circuit element built-in module 54 configured as described above, the circuit element 14 was operated, and an investigation on the transfer of heat generated from the circuit element 14 was conducted. Since the heat generated from the circuit element 14 is released only from the upper surface of the circuit element built-in module 54, the upper surface of the circuit element built-in module 54 (the surface close to the heat radiation member 13) was cooled. .
- FIG. 12 shows the first result obtained by the above experiment, in which the ratio of the area of the opposing portion between the circuit element 14 and the heat radiation member 13 to the area of the main surface of the circuit element 14 is shown.
- FIG. 4 is a schematic diagram showing a relationship between the heat resistance ratio when heat is transmitted from the circuit element 14 to the heat radiation member 13. The horizontal axis shows the area ratio (%), and the vertical axis shows the thermal resistance ratio.
- FIG. 13 shows the second result obtained by the above experiment, and shows the electrical insulation when the heat radiating member 13 having high thermal conductivity is opposed to the circuit element 14 with the same area.
- FIG. 4 is a schematic diagram showing a relationship between a ratio of thermal conductivity between conductive material 11 and heat dissipation member 13 and a heat resistance ratio when heat is transmitted from circuit element 14 to heat dissipation member 13. .
- the horizontal axis shows the thermal conductivity magnification (times), and the vertical axis shows the thermal resistance ratio.
- the heat resistance decreases as the heat conductivity of heat dissipation member 13 with high heat conductivity increases. Less.
- magnification of the thermal conductivity is around three, there is an inflection point on the characteristic curve. That is, the heat generated from the circuit element 14 can be stabilized by setting the heat conductivity of the heat radiation member 13 having a high heat conductivity to be three times or more the heat conductivity of the electrically insulating material 11. It was found that it was possible to efficiently release the substance to the outside.
- the module with a built-in circuit element according to the present invention is a resin-based module that is easy to manufacture, has no obstructive factor in miniaturization, and can efficiently release heat generated from the circuit element to the outside. It is useful as a module with a built-in circuit element that uses an electrically insulating material.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/555,097 US20070035013A1 (en) | 2003-05-09 | 2004-05-07 | Module with built-in circuit elements |
EP04731753A EP1643552A1 (en) | 2003-05-09 | 2004-05-07 | Module including circuit elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003132066 | 2003-05-09 | ||
JP2003-132066 | 2003-05-09 |
Publications (1)
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WO2004100264A1 true WO2004100264A1 (ja) | 2004-11-18 |
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PCT/JP2004/006496 WO2004100264A1 (ja) | 2003-05-09 | 2004-05-07 | 回路素子内蔵モジュール |
Country Status (5)
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US (1) | US20070035013A1 (ja) |
EP (1) | EP1643552A1 (ja) |
KR (1) | KR20060003078A (ja) |
CN (1) | CN1784785A (ja) |
WO (1) | WO2004100264A1 (ja) |
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US8144478B1 (en) * | 2005-07-01 | 2012-03-27 | Globalfoundries Inc. | Circuit module and method |
US7580240B2 (en) * | 2005-11-24 | 2009-08-25 | Ngk Spark Plug Co., Ltd. | Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same |
JP4277036B2 (ja) * | 2006-09-29 | 2009-06-10 | Tdk株式会社 | 半導体内蔵基板及びその製造方法 |
US8576515B2 (en) | 2007-02-16 | 2013-11-05 | Seagate Technology Llc | Thin film structure with controlled lateral thermal spreading in the thin film |
US7869162B2 (en) * | 2007-02-16 | 2011-01-11 | Seagate Technology Llc | Thin film structure with controlled lateral thermal spreading in the thin film |
KR100816324B1 (ko) * | 2007-05-23 | 2008-03-24 | 전자부품연구원 | 칩 내장형 인쇄회로기판 및 그 제조방법 |
JP2008305937A (ja) * | 2007-06-07 | 2008-12-18 | Panasonic Corp | 電子部品内蔵モジュールおよびその製造方法 |
CN101594739A (zh) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | 器件埋入式电路板散热装置及加工方法 |
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KR20110095279A (ko) * | 2008-10-31 | 2011-08-24 | 덴끼 가가꾸 고교 가부시키가이샤 | 발광 소자 패키지용 기판 및 발광 소자 패키지 |
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- 2004-05-07 KR KR1020057021185A patent/KR20060003078A/ko not_active Application Discontinuation
- 2004-05-07 EP EP04731753A patent/EP1643552A1/en not_active Withdrawn
- 2004-05-07 CN CNA200480012550XA patent/CN1784785A/zh active Pending
- 2004-05-07 WO PCT/JP2004/006496 patent/WO2004100264A1/ja not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
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US20070035013A1 (en) | 2007-02-15 |
EP1643552A1 (en) | 2006-04-05 |
KR20060003078A (ko) | 2006-01-09 |
CN1784785A (zh) | 2006-06-07 |
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