WO2004063643A1 - Dispositif de refroidissement thermoelectrique - Google Patents

Dispositif de refroidissement thermoelectrique Download PDF

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Publication number
WO2004063643A1
WO2004063643A1 PCT/CN2004/000035 CN2004000035W WO2004063643A1 WO 2004063643 A1 WO2004063643 A1 WO 2004063643A1 CN 2004000035 W CN2004000035 W CN 2004000035W WO 2004063643 A1 WO2004063643 A1 WO 2004063643A1
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Prior art keywords
temperature difference
chamber
radiator
water
cooling device
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PCT/CN2004/000035
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English (en)
French (fr)
Inventor
Qinghua Wang
Rugen Bei
Original Assignee
Qinghua Wang
Rugen Bei
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Application filed by Qinghua Wang, Rugen Bei filed Critical Qinghua Wang
Publication of WO2004063643A1 publication Critical patent/WO2004063643A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • the invention relates to a cooling device, in particular to a circulating cooling device of a temperature difference semiconductor.
  • Temperature difference semiconductors are manufactured using the principle of the Petier effect of semiconductor materials, that is, when a current is passed across the PN-type particles, both sides of the semiconductor material are cooled on one side and heated on the other to generate heat.
  • the semiconductor is widely used in various fields due to its light weight, small size, no noise, no pollution, fast startup, accurate temperature control, etc., especially various low-power refrigeration applications, such as car refrigerators, hotel miniatures Refrigerator, etc.
  • this technology also generates a large amount of heat while cooling, and only guarantees that the heating surface heat is well dissipated, the cooling surface can be cooled and the effect is good, so the reliable operation of the temperature difference semiconductor must be ensured through reliable heat dissipation. Therefore, when this product is used, it generally consists of a heat sink, a temperature difference semiconductor, and a cooling device.
  • the cooling technologies used for temperature difference semiconductors are mainly air cooling and water cooling.
  • Air cooling is by installing a huge aluminum radiator and fan on the heating surface of the temperature difference semiconductor.
  • the method is cooled by the aluminum radiator and air contact.
  • the biggest disadvantage of this method is-
  • the aluminum radiator must be made large enough to increase production.
  • a heat conductor with a circulating liquid container inside is installed on the heating surface of the temperature difference semiconductor, and heat is transmitted through the wall of the heat conductor and the internal liquid circulation.
  • the circulating liquid of this method is moved in a special independent container. The liquid is not in direct contact with the temperature difference semiconductor.
  • the heat dissipation device made by this method has a good cooling effect, but because the wall on the side of the container needs to be very precise with the temperature difference semiconductor Fitting, so the processing requirements are high and the product manufacturing cost is high.
  • the present invention provides a temperature difference semiconductor cycle cooling device with simple manufacturing structure, low cost, small size, light weight, and good heat dissipation effect. Summary of invention
  • the present invention provides a circulating cooling device for temperature difference semiconductors, which is composed of at least one temperature difference semiconductor, a cooling system matching the temperature difference semiconductor, and a radiator.
  • the cooling system includes an open chamber, A pipe, a water pump, and the chamber and the heat-conducting medium in the pipe, the chamber includes a water outlet and a water inlet, the radiator includes a water outlet and a water inlet, and the water outlet and the water outlet of the chamber
  • the water inlet of the radiator is connected by a pipe, the water inlet of the chamber and the water outlet of the radiator are connected by a pipe pump, and the temperature difference semiconductor is fixedly connected to the opening surface of the chamber, which just closes the chamber;
  • the open cavity and the heating surface of the temperature difference semiconductor are used to form a closed chamber, which facilitates the manufacture of the open cavity, and at the same time, the heat conduction liquid flows directly from the temperature difference semiconductor heating surface. While reducing the manufacturing cost, it greatly improves the heat dissipation. effectiveness.
  • the above-mentioned chamber further includes two parts, a liquid inlet cavity and a liquid outlet cavity, and there are several shunt stoppers for shunting in the two cavity, and the liquid inlet cavity and the liquid delivery cavity are in communication with each other; ,
  • the water that flows in and out quickly can hit the stopper, and it is convenient for the water and the heat dissipation surface of the temperature difference semiconductor to make full contact, so that the cooling effect reaches an optimal state.
  • connection between the temperature difference semiconductor and the opening surface of the chamber is provided with a gasket, which can effectively prevent water from flowing out of the connection.
  • the above pump includes a pump body and a motor, the motor is a speed-regulating motor, and the pressure of the circulation system can be adjusted by adjusting the rotation speed of the motor.
  • the thermally conductive medium is water.
  • the temperature difference semiconductor circulation cooling device of the present invention has a sealing gasket between the thermoelectric semiconductor and the open cavity to seal; the present invention installs an air convection fan on the radiator ; And the water pump uses a speed-regulating motor.
  • the heat sink directly contacting the temperature difference semiconductor has a small volume and saves space:
  • the height of the heat sink does not exceed 1 cm, the size does not exceed 1 cm (about 6 cm) of the surrounding dimensions of the semiconductor, and the occupied volume is about 36 cm 3. It is 1/14 of the existing air-cooled temperature difference semiconductor heat sink (the heat sink height Around 5cm, both length and width are above 10cm, occupying 500cm 3 );
  • each fin can be conveniently connected to a liquid-cooled radiator through a pipe, and one radiator can be used for centralized heat dissipation.
  • the temperature difference semiconductor cycle cooling device of the present invention has good refrigeration performance:
  • FIG. 1 is a schematic structural diagram of a temperature difference semiconductor cycle cooling device according to the present invention.
  • FIG. 2 is a schematic structural diagram of a cavity of a temperature difference semiconductor circulation cooling device according to the present invention.
  • the temperature difference semiconductor cycle cooling device of this embodiment is mainly composed of a temperature difference semiconductor 11 and a matching cooling system and a radiator 15.
  • the cooling system is composed of a water cavity 9, a pipe 7, 7
  • the water outlet 18 of the chamber 9 and the water inlet 4 of the radiator 15 are connected through a pipe 7.
  • the water inlet 19 of the chamber and the water outlet 20 of the radiator are connected through a pipe 7, a 7K pump 17, and the temperature difference.
  • the semiconductor 11 is fixedly connected to the opening surface of the cavity 9 so that the cavity surface is closed.
  • the closed chamber 9 and the pipe 7 are filled with circulating water.
  • the circulating water provides pressure for circulating movement through the water pump 17 to bring the heat to the radiator 15, and the role of the fan 2 to radiate the heat to the air, thereby forming a Full link.
  • it is not limited to only one temperature difference semiconductor 11 and the corresponding water cavity 9. It may be a plurality of temperature difference semiconductors and the water cavity sharing a cycle cooling device, and the connection method is the same as this embodiment, which is not described in detail here. The description is omitted and the drawings are omitted.
  • the temperature difference semiconductor 11 and the water cavity 9 which is attached to the end face of the temperature difference semiconductor constitute a closed cavity.
  • the open cavity design can effectively reduce the manufacturing cost of the cavity 9.
  • the heating surface of the temperature difference semiconductor 11 is used as one side of the closed cavity, so that water directly flows on the heating surface, which can maximize the The heat generated by the temperature difference semiconductor 11 is walked.
  • the cavity 9 is a cavity having a shunt stopper 21, a water inlet 19, and a water outlet 18, and a water inlet cavity, a water outlet cavity, and the water inlet cavity and the water outlet cavity are internally connected. After the water flow enters the cavity from the water inlet 19, it is blocked by the stopper 21, spreads on the surface of the temperature difference semiconductor, and passes through the inlet. After the circulation of the water cavity and the water outlet cavity, the largest area flows on the temperature difference semiconductor surface and then flows out of the water outlet 18.
  • the water pump 17 provides power for the entire circulation system
  • the motor 5 is an adjustable motor.
  • the motor can also be a motor that regulates the speed in other ways, such as a variable frequency motor.
  • the heat transfer medium water with the temperature difference semiconductor heat enters the radiator 15 through the water inlet 4 under the pressure of the water pump.
  • the surface of the radiator 15 is in full contact with the air, and the fan 2 is used to circulate the air and accelerate the heat. Emission.
  • the cavity 9, the water pump 17 and the radiator 15 are connected by a pipe ⁇ , and a connection joint 16 is used at the connection portion.
  • the motor 5, the pump body 6, and the water tank 3, the radiator 15, and the fan 2 included in the water pump 17 are fixed on the fixing plate 1 and installed through the cover plate 14, and the cavity 9 is fixed to the heat conductive sheet 12 by screws 8.
  • the fixing method is not limited to the methods listed in this example. For example, glue bonding, the cooling surface of the temperature difference semiconductor 11 closely adheres to the heat conductive sheet 12, and the cold air is transmitted from the temperature difference semiconductor 11 to the inner liner 13 through the heat conductive sheet 12, thereby Achieve the freezing of the contents of the liner.
  • the present invention is not limited to the above-listed schemes.
  • water is used as a liquid conductive medium, and no matter how any other liquid transfer medium is used to achieve a liquid cooling method. It should also be considered within the scope of protection of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

一种温差半导体循环冷却装置 技术领域
本发明涉及一种冷却装置， 尤其是一种温差半导体的循环冷却装置。 技术背景
温差半导体是一种利用半导体材料的帕贴尔 （petier)效应， 即在 P.N型粒 子两端通过电流时， 半导体材料两侧通过一侧制冷另一侧制热来吸热放热的原 理而制成的一种半导体制品。 该半导体由于重量轻、 体积小、 无噪声、-无污染 以及启动快， 能精确控温等特点而被广泛地应用于各个领域， 特别是各种小功 率制冷场合， 如车用冰箱、 宾馆微型冰箱等。 但是该技术由于在制冷的同时也 产生大量的热量， 而且只有保证制热面热量散发良好， 才能保证制冷面制冷并 效果良好， 所以必须通过可靠的散热才能保证温差半导体可靠的运行。 因此该 产品在应用时一般都有吸热器、 温差半导体、 散热冷却装置组成。 目前温差半 导体采用的冷却技术主要是空冷和水冷两种。
空冷是通过在温差半导体的制热面安装巨大的铝制散热器和风扇通过铝散 热器和空气接触的方法来冷却， 该方式最大的缺点是-
1)要保证散热充分时铝制散热器就必须被做成足够大体积， 从而增加了产
P帝县
口口里里；
2)如果要增加功率， 尤其是在使用多片半导体制冷并排使用时， 要求半导 体与吸热器、 散热器有较好的平整度， 并且各半导体之间的高度误差很小； 由于散热***的局限， 因此现阶段利用温差半导体制冷的产品普遍现状是 制冷性能低， 温差只有在 20K左右； 制冷容积有限， 一般在 5L左右而已。
另外， 现有温差半导体的水冷装置主要是在温差半导体制热面安装一个内 部有循环液体容器热传导器， 通过热传导器的壁和内部的液体循环来传热， 这 种方法的循环液体是在一个专门独立的容器内运动的， 液体不是直接和温差半 导体接触， 这种方法制成的散热装置制冷效果好， 但是由于容器一侧的壁需要 和温差半导体很精密的贴合， 所以加工要求高， 产品制造成本大。 发明目的
根据以上情况， 本发明提供了一种制造结构简单、 成本低、 体积小、 重量 轻、 散热效果好的温差半导体循环冷却装置。 发明概要
为达到上述目的， 本发明提供了一种温差半导体的循环冷却装置， 它由至 少一个温差半导体、 与所述温差半导体相匹配的冷却***、 散热器组成， 所述 冷却***包括一开口腔室、 管道、 水泵以及所述腔室、 管道内的导热介质， 所 述腔室包括一出水口和一入水口， 所述散热器包括一出水口和一入水口， 所述 腔室的出水口和所述散热器入水口通过管道连接， 所述腔室的入水口与散热器 的出水口通过管道泵连接， 所述温差半导体固连在腔室的开口面上， 正好使腔 室封闭； 由于釆用了开口腔和温差半导体的制热面来组成一个密闭腔室， 因而 方便了开口腔的制造， 同时使热传导液体直接从温差半导体制热面流过， 在降 低制造成本的同时， 大大提高了散热效率。
上述腔室还包括进液腔和出液腔两部分， 并且两者腔内有若干用于分流的 分流挡块， 进液腔和出液腔之间是连通的； 开口腔内具有分流挡块， 可使快速 流入和流出的水冲击挡块， 便于水和温差半导体的散热面充分接触， 使冷却效 果达到最佳状态。
上述温差半导体与腔室开口面上的连接处有密封垫， 可以有效的防止水从 连接处流出。
上述散热器上还有一风扇， 促使空气流通， 更有效地加快了散热速度。 上述泵包括泵体和电机， 所述电机是调速电机， 可以通过调节电机的转速 可以调节循环***的压力。
上述导热介质是水。
本发明的温差半导体循环冷却装置， ； 本发明的温差半导体循环冷却装置 的； 而且本发明在热电半导体和开口腔之间有密封垫来密封； 本发明在散热器 上加装了一个空气对流风扇； 且中的水泵采用了调速电机。
本发明的温差半导体循环冷却装置中与温差半导体直接接触的散热片体积 小， 节约空间：
该散热器高度不超过 lcm， 大小不超过半导体周围尺寸的 1cm (约 6cm)， 占用体积约 36 cm3， 是现有釆用空冷式的温差半导体的散热器的 1/14 (该散热 器高度在 5cm左右， 长度和宽度均在 10cm以上， 占用空间 500cm3 );
再者， 本发明在使用半导体组时， 安装方便， 可共享一个散热***： 在很多情况下， 为了提高制冷功率， 缩短制冷时间， 必须考虑采用多片半 导体组来制冷 （由于技术限制， 制造一个大功率的半导体， 其价格是非常昂贵 的)， 因此就必须考虑各半导体的散热问题。采用本发明的循环冷却装置， 可以 方便地将每个散热片通过管道连接到液冷散热器， 由一个散热器集中散热。
另外， 本发明的温差半导体循环冷却装置的制冷性能好：
在 6升容积， 相同规格的半导体使用测试时， 当采用现有相同体积的空冷 散热器时， 其 30分钟后制冷温差为 15 °C， 而釆用本发明装置则可达到 25°C ; 经 2小时制冷后， 空冷式温差最大为 20°C， 而本发明可达到 35°C。 附图说明
图 1是本发明一种温差半导体循环冷却装置的结构示意图；
图 2为本发明温差半导体循环冷却装置的腔体结构示意图。
1. 固定架， 2. 风扇， 3. 水箱， 4. 散热器进水口， 5. 电机， 6. 水泵泵 体， 7. 水管， 8. 固定螺钉， 9. 腔室， 10. 密封垫圈， 11. 温差半导体， 1 热 传导片， 13. 内胆， 14. 盖板， 15. 散热器， 16. 连接接头， 17. 水泵， 18. 腔 室出水口， 19. 腔室进水口， 20. 散热器出水口， 21. 腔体的挡块。 发明内容
由图 1可知， 本实施例的温差半导体循环冷却装置主要由一个温差半导休 11和与之相匹配的冷却***、散热器 15.组成、所述冷却***由一个水腔 9、管 道 7、 7泵 17以及所述腔室 9、 管道 7内的导热介质， 所述腔室 9包括一个出 水口 18和一个进水口 19，所述散热器 15包括一个出水口 20和一入水口 4，所 述的腔室 9的出水口 18和所述散热器 15入水口 4通过管道 7连接， 所述腔室 的入水口 19与散热器的出水口 20通过管道 7、 7K泵 17连接， 所述温差半导体 11固连在腔室 9的开口面上， 使腔室面密闭。 在密闭腔室 9、 管道 7内充满了 循环水， 循环水通过水泵 17提供压力作循环运动， 把热量带到散热器 15中， 通过风扇 2的作用， 把热量散发到空气中， 从而形成一个完整的链路。 当然， 在实施中不限于只有一个温差半导体 11和与之对应的水腔 9， 可以是多个温差 半导体和水腔共用一个循环冷却装置， 其连接方式与本实施例相同， 这里不再 做详细描述， 并省略附图。
由图 1可知，温差半导体 11和与温差半导体端面贴合的水腔 9组成一个密 闭腔体。 开口式的腔体设计可以有效的减少腔体 9的制造成本， 利用温差半导 体 11的制热面来作为密闭腔体的一个侧面， 让水在制热面上直接流过， 可以最 大程度的带走温差半导体 11所产生的热量。在两者之间的贴合面上有一层密封 垫圈 10用来密闭， 它能有效地防止漏水。
由图 2可知， 腔体 9是一个具有分流挡块 21和进水口 19， 出水口 18， 并 具有进水腔， 出水腔的腔体， 进水腔和出水腔在内部是连通的， 当高压水流从 进水口 19进入腔体后， 受到挡块 21的阻挡， 在温差半导体表面散开， 经过进 水腔和出水腔的循环后， 最大面积的在温差半导体表面流过再从出水口 18流 出。
由图 1可知，水泵 17为整个循环***提供了动力，其中电机 5是可调电机， 如通过调整电机的电流大小时， 可以改变***的水压， 能满足不同压力要求系 统的使用， 当然可调电机也可以是其他方式调节转速的电机， 如变频电机。
由图 1可知， 带了温差半导体热量的传递介质水， 在水泵的压力下通过进 水口 4进入散热器 15， 散热器 15表面充分的和空气接触， 并使用风扇 2使空 气流通， 加快了热量的散发。
由图 1可知， 腔体 9， 水泵 17和散热器 15间是通过管道 Ί连接的， 在连 接部位采用了连接接头 16。 水泵 17所包括的电机 5、 泵体 6， 以及水箱 3、 散 热器 15和风扇 2都固定在固定板 1上并通过盖板 14安装， 腔体 9是通过螺钉 8固定到热传导片 12上的； 当然固定方法不局限于本实例列举方法， 如胶水粘 合等， 温差半导体 11的制冷面紧密贴合热传导片 12， 通过热传导片 12将冷气 从温差半导体 11传到内胆 13上， 从而来实现对内胆内的物品冷冻。
本发明不局限于上述列举方案， 在本实例中使用了水作为液体传导介质， 无论使用其他任何液态的传递介质来实现液体冷却的方法。 也均应认为在本发 明的保护范围内。

Claims

权利要求
1、 一种温差半导体循环冷却装置， 它由至少一个温差半导体 (11)、 与所述 温差半导体 (11)相匹配的冷却***、 散热器 (15)组成， 其特征在于所述冷却*** 包括一开口腔室 (9)、管道 (7)、水泵 (17)以及所述腔室 (9)、管道 (7)内的导热介质， 所述腔室包括一出水口 (18)和一入水口 (19)， 所述散热器 (15)包括一出水口 (20) 和一入水口 (4)，所述腔室的出水口 (18)和所述散热器入水口 (4)通过管道 (7)连接， 所述腔室的入水口 (19)与散热器的出水口 (20)通过管道 、 7j泵 (17)连接， 所述 温差半导体 (11)固连在腔室 (9)的开口面上， 正好使腔室 （9)封闭。
2、 根据权利 1 所述的温差半导体循环冷却装置， 其特征在于所述腔室 (9) 还包括进液腔和出液腔两部分， 并且两者腔内有若干用于分流的分流挡块 (21)， 进液腔和出液腔之间是连通的。
3、根据权利 1所述的温差半导体循环冷却装置，其特征在于温差半导体 (11) 与腔室 (9)开口面上的连接处有密封垫 (10)。
4、根据权利 1所述的温差半导体循环冷却装置，其特征在于所述散热器 (15) 上还有一风扇 (2)。
5、 根据权利 1所述的温差半导体循环冷却装置， 其特征在于所述水泵 (17) 包括泵体 (6)和电机 (5)， 所述电机 (5)是调速电机。
6、根据权利要求 1所述的温差半导体循环冷却装置， 其特征在于所述导热 介质是水。
PCT/CN2004/000035 2003-01-13 2004-01-13 Dispositif de refroidissement thermoelectrique WO2004063643A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100233372A1 (en) * 2006-07-17 2010-09-16 Yen-Chen Liao Method for horizontally electroplating, electro deposition and electroless-plating thin film on substrate
CN106770776A (zh) * 2016-12-29 2017-05-31 浙江福立分析仪器股份有限公司 一种液相色谱仪温控设备及除潮方法
CN106852096A (zh) * 2017-04-20 2017-06-13 石家庄东远散热技术有限公司 一种水冷散热装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107883670A (zh) * 2016-09-29 2018-04-06 浙江绍兴苏泊尔生活电器有限公司 液体即冷装置
CN110227007A (zh) * 2019-06-26 2019-09-13 广东工业大学 一种冷热敷袋
CN117080187B (zh) * 2023-08-21 2024-04-05 安徽国麒科技有限公司 一种bms电池管理***热电冷却结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829771A (en) * 1988-03-24 1989-05-16 Koslow Technologies Corporation Thermoelectric cooling device
US5072590A (en) * 1991-02-11 1991-12-17 Ebtech, Inc. Bottled water chilling system
CN2212757Y (zh) * 1995-01-20 1995-11-15 吴建国 半导体制冷设备
CN2268902Y (zh) * 1996-01-04 1997-11-26 青岛三斯自动控制工程公司 循环水散热式半导体制冷取暖装置
CN1236428A (zh) * 1996-11-08 1999-11-24 松下冷机株式会社 内装热电模块的热交换单元及热电冷却***

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829771A (en) * 1988-03-24 1989-05-16 Koslow Technologies Corporation Thermoelectric cooling device
US5072590A (en) * 1991-02-11 1991-12-17 Ebtech, Inc. Bottled water chilling system
CN2212757Y (zh) * 1995-01-20 1995-11-15 吴建国 半导体制冷设备
CN2268902Y (zh) * 1996-01-04 1997-11-26 青岛三斯自动控制工程公司 循环水散热式半导体制冷取暖装置
CN1236428A (zh) * 1996-11-08 1999-11-24 松下冷机株式会社 内装热电模块的热交换单元及热电冷却***

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100233372A1 (en) * 2006-07-17 2010-09-16 Yen-Chen Liao Method for horizontally electroplating, electro deposition and electroless-plating thin film on substrate
CN106770776A (zh) * 2016-12-29 2017-05-31 浙江福立分析仪器股份有限公司 一种液相色谱仪温控设备及除潮方法
CN106852096A (zh) * 2017-04-20 2017-06-13 石家庄东远散热技术有限公司 一种水冷散热装置
CN106852096B (zh) * 2017-04-20 2023-10-03 石家庄盈博智能科技有限公司 一种水冷散热装置

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