WO2004063643A1 - Dispositif de refroidissement thermoelectrique - Google Patents

Dispositif de refroidissement thermoelectrique Download PDF

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Publication number
WO2004063643A1
WO2004063643A1 PCT/CN2004/000035 CN2004000035W WO2004063643A1 WO 2004063643 A1 WO2004063643 A1 WO 2004063643A1 CN 2004000035 W CN2004000035 W CN 2004000035W WO 2004063643 A1 WO2004063643 A1 WO 2004063643A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature difference
chamber
radiator
water
cooling device
Prior art date
Application number
PCT/CN2004/000035
Other languages
English (en)
Chinese (zh)
Inventor
Qinghua Wang
Rugen Bei
Original Assignee
Qinghua Wang
Rugen Bei
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinghua Wang, Rugen Bei filed Critical Qinghua Wang
Publication of WO2004063643A1 publication Critical patent/WO2004063643A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • the invention relates to a cooling device, in particular to a circulating cooling device of a temperature difference semiconductor.
  • Temperature difference semiconductors are manufactured using the principle of the Petier effect of semiconductor materials, that is, when a current is passed across the PN-type particles, both sides of the semiconductor material are cooled on one side and heated on the other to generate heat.
  • the semiconductor is widely used in various fields due to its light weight, small size, no noise, no pollution, fast startup, accurate temperature control, etc., especially various low-power refrigeration applications, such as car refrigerators, hotel miniatures Refrigerator, etc.
  • this technology also generates a large amount of heat while cooling, and only guarantees that the heating surface heat is well dissipated, the cooling surface can be cooled and the effect is good, so the reliable operation of the temperature difference semiconductor must be ensured through reliable heat dissipation. Therefore, when this product is used, it generally consists of a heat sink, a temperature difference semiconductor, and a cooling device.
  • the cooling technologies used for temperature difference semiconductors are mainly air cooling and water cooling.
  • Air cooling is by installing a huge aluminum radiator and fan on the heating surface of the temperature difference semiconductor.
  • the method is cooled by the aluminum radiator and air contact.
  • the biggest disadvantage of this method is-
  • the aluminum radiator must be made large enough to increase production.
  • a heat conductor with a circulating liquid container inside is installed on the heating surface of the temperature difference semiconductor, and heat is transmitted through the wall of the heat conductor and the internal liquid circulation.
  • the circulating liquid of this method is moved in a special independent container. The liquid is not in direct contact with the temperature difference semiconductor.
  • the heat dissipation device made by this method has a good cooling effect, but because the wall on the side of the container needs to be very precise with the temperature difference semiconductor Fitting, so the processing requirements are high and the product manufacturing cost is high.
  • the present invention provides a temperature difference semiconductor cycle cooling device with simple manufacturing structure, low cost, small size, light weight, and good heat dissipation effect. Summary of invention
  • the present invention provides a circulating cooling device for temperature difference semiconductors, which is composed of at least one temperature difference semiconductor, a cooling system matching the temperature difference semiconductor, and a radiator.
  • the cooling system includes an open chamber, A pipe, a water pump, and the chamber and the heat-conducting medium in the pipe, the chamber includes a water outlet and a water inlet, the radiator includes a water outlet and a water inlet, and the water outlet and the water outlet of the chamber
  • the water inlet of the radiator is connected by a pipe, the water inlet of the chamber and the water outlet of the radiator are connected by a pipe pump, and the temperature difference semiconductor is fixedly connected to the opening surface of the chamber, which just closes the chamber;
  • the open cavity and the heating surface of the temperature difference semiconductor are used to form a closed chamber, which facilitates the manufacture of the open cavity, and at the same time, the heat conduction liquid flows directly from the temperature difference semiconductor heating surface. While reducing the manufacturing cost, it greatly improves the heat dissipation. effectiveness.
  • the above-mentioned chamber further includes two parts, a liquid inlet cavity and a liquid outlet cavity, and there are several shunt stoppers for shunting in the two cavity, and the liquid inlet cavity and the liquid delivery cavity are in communication with each other; ,
  • the water that flows in and out quickly can hit the stopper, and it is convenient for the water and the heat dissipation surface of the temperature difference semiconductor to make full contact, so that the cooling effect reaches an optimal state.
  • connection between the temperature difference semiconductor and the opening surface of the chamber is provided with a gasket, which can effectively prevent water from flowing out of the connection.
  • the above pump includes a pump body and a motor, the motor is a speed-regulating motor, and the pressure of the circulation system can be adjusted by adjusting the rotation speed of the motor.
  • the thermally conductive medium is water.
  • the temperature difference semiconductor circulation cooling device of the present invention has a sealing gasket between the thermoelectric semiconductor and the open cavity to seal; the present invention installs an air convection fan on the radiator ; And the water pump uses a speed-regulating motor.
  • the heat sink directly contacting the temperature difference semiconductor has a small volume and saves space:
  • the height of the heat sink does not exceed 1 cm, the size does not exceed 1 cm (about 6 cm) of the surrounding dimensions of the semiconductor, and the occupied volume is about 36 cm 3. It is 1/14 of the existing air-cooled temperature difference semiconductor heat sink (the heat sink height Around 5cm, both length and width are above 10cm, occupying 500cm 3 );
  • each fin can be conveniently connected to a liquid-cooled radiator through a pipe, and one radiator can be used for centralized heat dissipation.
  • the temperature difference semiconductor cycle cooling device of the present invention has good refrigeration performance:
  • FIG. 1 is a schematic structural diagram of a temperature difference semiconductor cycle cooling device according to the present invention.
  • FIG. 2 is a schematic structural diagram of a cavity of a temperature difference semiconductor circulation cooling device according to the present invention.
  • the temperature difference semiconductor cycle cooling device of this embodiment is mainly composed of a temperature difference semiconductor 11 and a matching cooling system and a radiator 15.
  • the cooling system is composed of a water cavity 9, a pipe 7, 7
  • the water outlet 18 of the chamber 9 and the water inlet 4 of the radiator 15 are connected through a pipe 7.
  • the water inlet 19 of the chamber and the water outlet 20 of the radiator are connected through a pipe 7, a 7K pump 17, and the temperature difference.
  • the semiconductor 11 is fixedly connected to the opening surface of the cavity 9 so that the cavity surface is closed.
  • the closed chamber 9 and the pipe 7 are filled with circulating water.
  • the circulating water provides pressure for circulating movement through the water pump 17 to bring the heat to the radiator 15, and the role of the fan 2 to radiate the heat to the air, thereby forming a Full link.
  • it is not limited to only one temperature difference semiconductor 11 and the corresponding water cavity 9. It may be a plurality of temperature difference semiconductors and the water cavity sharing a cycle cooling device, and the connection method is the same as this embodiment, which is not described in detail here. The description is omitted and the drawings are omitted.
  • the temperature difference semiconductor 11 and the water cavity 9 which is attached to the end face of the temperature difference semiconductor constitute a closed cavity.
  • the open cavity design can effectively reduce the manufacturing cost of the cavity 9.
  • the heating surface of the temperature difference semiconductor 11 is used as one side of the closed cavity, so that water directly flows on the heating surface, which can maximize the The heat generated by the temperature difference semiconductor 11 is walked.
  • the cavity 9 is a cavity having a shunt stopper 21, a water inlet 19, and a water outlet 18, and a water inlet cavity, a water outlet cavity, and the water inlet cavity and the water outlet cavity are internally connected. After the water flow enters the cavity from the water inlet 19, it is blocked by the stopper 21, spreads on the surface of the temperature difference semiconductor, and passes through the inlet. After the circulation of the water cavity and the water outlet cavity, the largest area flows on the temperature difference semiconductor surface and then flows out of the water outlet 18.
  • the water pump 17 provides power for the entire circulation system
  • the motor 5 is an adjustable motor.
  • the motor can also be a motor that regulates the speed in other ways, such as a variable frequency motor.
  • the heat transfer medium water with the temperature difference semiconductor heat enters the radiator 15 through the water inlet 4 under the pressure of the water pump.
  • the surface of the radiator 15 is in full contact with the air, and the fan 2 is used to circulate the air and accelerate the heat. Emission.
  • the cavity 9, the water pump 17 and the radiator 15 are connected by a pipe ⁇ , and a connection joint 16 is used at the connection portion.
  • the motor 5, the pump body 6, and the water tank 3, the radiator 15, and the fan 2 included in the water pump 17 are fixed on the fixing plate 1 and installed through the cover plate 14, and the cavity 9 is fixed to the heat conductive sheet 12 by screws 8.
  • the fixing method is not limited to the methods listed in this example. For example, glue bonding, the cooling surface of the temperature difference semiconductor 11 closely adheres to the heat conductive sheet 12, and the cold air is transmitted from the temperature difference semiconductor 11 to the inner liner 13 through the heat conductive sheet 12, thereby Achieve the freezing of the contents of the liner.
  • the present invention is not limited to the above-listed schemes.
  • water is used as a liquid conductive medium, and no matter how any other liquid transfer medium is used to achieve a liquid cooling method. It should also be considered within the scope of protection of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement thermoélectrique offrant les avantages suivants : structure simple, compacité, prix bas, légèreté et excellente dispersion de la chaleur. Le dispositif de refroidissement est constitué d'au moins un module thermoélectrique, un circuit de refroidissement pour le module thermoélectrique et un radiateur. Le circuit de refroidissement comprend une chambre à ouverture, des conduites et une pompe, un fluide caloporteur s'écoulant dans la chambre et les conduites. La chambre et les radiateurs comprennent respectivement un orifice de sortie d'eau et un orifice d'entrée d'eau. L'orifice de sortie de la chambre est relié à l'orifice d'entrée du radiateur par un tuyau, et l'orifice d'entrée de la chambre est relié à l'orifice de sortie du radiateur par un tuyau. Le module thermoélectrique est fixé sur le côté de l'ouverture de la chambre et ferme celle-ci. Ce dispositif présente une efficacité d'échange de chaleur améliorée et son coût de production est réduit.
PCT/CN2004/000035 2003-01-13 2004-01-13 Dispositif de refroidissement thermoelectrique WO2004063643A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA031012442A CN1517636A (zh) 2003-01-13 2003-01-13 一种温差半导体循环冷却装置
CN03101244.2 2003-01-13

Publications (1)

Publication Number Publication Date
WO2004063643A1 true WO2004063643A1 (fr) 2004-07-29

Family

ID=32686828

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Application Number Title Priority Date Filing Date
PCT/CN2004/000035 WO2004063643A1 (fr) 2003-01-13 2004-01-13 Dispositif de refroidissement thermoelectrique

Country Status (2)

Country Link
CN (1) CN1517636A (fr)
WO (1) WO2004063643A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100233372A1 (en) * 2006-07-17 2010-09-16 Yen-Chen Liao Method for horizontally electroplating, electro deposition and electroless-plating thin film on substrate
CN106770776A (zh) * 2016-12-29 2017-05-31 浙江福立分析仪器股份有限公司 一种液相色谱仪温控设备及除潮方法
CN106852096A (zh) * 2017-04-20 2017-06-13 石家庄东远散热技术有限公司 一种水冷散热装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107883670A (zh) * 2016-09-29 2018-04-06 浙江绍兴苏泊尔生活电器有限公司 液体即冷装置
CN110227007A (zh) * 2019-06-26 2019-09-13 广东工业大学 一种冷热敷袋
CN117080187B (zh) * 2023-08-21 2024-04-05 安徽国麒科技有限公司 一种bms电池管理***热电冷却结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829771A (en) * 1988-03-24 1989-05-16 Koslow Technologies Corporation Thermoelectric cooling device
US5072590A (en) * 1991-02-11 1991-12-17 Ebtech, Inc. Bottled water chilling system
CN2212757Y (zh) * 1995-01-20 1995-11-15 吴建国 半导体制冷设备
CN2268902Y (zh) * 1996-01-04 1997-11-26 青岛三斯自动控制工程公司 循环水散热式半导体制冷取暖装置
CN1236428A (zh) * 1996-11-08 1999-11-24 松下冷机株式会社 内装热电模块的热交换单元及热电冷却***

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829771A (en) * 1988-03-24 1989-05-16 Koslow Technologies Corporation Thermoelectric cooling device
US5072590A (en) * 1991-02-11 1991-12-17 Ebtech, Inc. Bottled water chilling system
CN2212757Y (zh) * 1995-01-20 1995-11-15 吴建国 半导体制冷设备
CN2268902Y (zh) * 1996-01-04 1997-11-26 青岛三斯自动控制工程公司 循环水散热式半导体制冷取暖装置
CN1236428A (zh) * 1996-11-08 1999-11-24 松下冷机株式会社 内装热电模块的热交换单元及热电冷却***

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100233372A1 (en) * 2006-07-17 2010-09-16 Yen-Chen Liao Method for horizontally electroplating, electro deposition and electroless-plating thin film on substrate
CN106770776A (zh) * 2016-12-29 2017-05-31 浙江福立分析仪器股份有限公司 一种液相色谱仪温控设备及除潮方法
CN106852096A (zh) * 2017-04-20 2017-06-13 石家庄东远散热技术有限公司 一种水冷散热装置
CN106852096B (zh) * 2017-04-20 2023-10-03 石家庄盈博智能科技有限公司 一种水冷散热装置

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Publication number Publication date
CN1517636A (zh) 2004-08-04

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