WO2019223284A1 - 散热装置及其制造方法、服务器 - Google Patents

散热装置及其制造方法、服务器 Download PDF

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Publication number
WO2019223284A1
WO2019223284A1 PCT/CN2018/118909 CN2018118909W WO2019223284A1 WO 2019223284 A1 WO2019223284 A1 WO 2019223284A1 CN 2018118909 W CN2018118909 W CN 2018118909W WO 2019223284 A1 WO2019223284 A1 WO 2019223284A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
component
substrate
dissipating
Prior art date
Application number
PCT/CN2018/118909
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English (en)
French (fr)
Inventor
曹磊
许寿标
池善久
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP18919851.8A priority Critical patent/EP3779640B1/en
Publication of WO2019223284A1 publication Critical patent/WO2019223284A1/zh
Priority to US17/089,089 priority patent/US11490545B2/en
Priority to US17/949,801 priority patent/US11737242B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Definitions

  • the present invention relates to the technical field of hardware heat dissipation, and in particular, to a heat dissipation device, a manufacturing method thereof, and a server.
  • the chip With the continuous improvement of the chip performance in the server, the chip generates more and more heat. At the same time, due to the high integration of the internal components of the server, the heat in the server is highly concentrated. Therefore, how to effectively cool the server is urgent. solved problem.
  • the chip in the server may include a processing chip, and other low-power consumption chips such as a memory chip.
  • the processing chip may include a central processing unit (CPU) and a graphics processing unit (GPU).
  • the chip may include a High-Bandwidth Memory (HBM) chip and the like.
  • HBM High-Bandwidth Memory
  • other low power consumption chips such as processing chips and memory chips are packaged in the same packaged chip.
  • a heat-dissipating device is used to dissipate the sealed chip.
  • the heat-dissipating device includes a heat-dissipating substrate and a plurality of heat-dissipating fins evenly arranged on the heat-dissipating substrate.
  • the heat-dissipating substrate is an integrated structure, which is bonded to the heat-sealing.
  • the surface of the chip is used for heat exchange with the packaged chip, and the heat dissipation fin is used for heat exchange with the heat dissipation substrate to dissipate the heat on the heat dissipation substrate, and then dissipate heat from the packaged chip.
  • the present application provides a heat dissipation device, a method for manufacturing the same, and a server, which can solve the problem of low heat dissipation efficiency of heat dissipation for a packaged chip in related technologies.
  • the technical solution provided by the present application is as follows:
  • the present application provides a heat dissipation device.
  • the heat dissipation device includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. Dissipates heat on the heat dissipation substrate; the first side of the heat dissipation component is fixedly disposed on the second side of the heat dissipation substrate, and there is a gap between the side surface of the heat dissipation component and the heat dissipation substrate.
  • the second surface is adapted to be attached to the first to-be-radiated component to dissipate heat on the first to-be-radiated component.
  • the first side and the second side are opposite sides.
  • the surface and the second surface are opposite surfaces of the heat dissipation component, and the side surface is a surface of the heat dissipation component except the first surface and the second surface;
  • the area on the second side where the heat dissipating component is not provided is used for bonding with other to-be-radiated components, and the heating power of the first to-be-radiated component is greater than the heating power of the other-to-radiated components. Except the first to be cooled Device outside of the member.
  • the heat on the first heat sink component cannot be transferred from the side of the heat sink component to other heat sink components.
  • the heat transfer path is reduced, and The heat transferred between the first to-be-radiated component and other to-be-radiated components reduces the degree of thermal influence between different to-be-radiated components, and can effectively dissipate the other to-be-radiated components through the heat-dissipating substrate, thereby improving the heat dissipation of the heat-dissipating device effectiveness.
  • the orthographic projection of the heat dissipating component on the heat dissipating substrate may cover the orthographic projection of the first heat dissipating component on the heat dissipating substrate.
  • the second surface of the heat dissipating component includes a region to be bonded to the first heat dissipating component.
  • the area not bonded to the heat sink component, and the heat in the area where the heat dissipation component is bonded to the first heat sink component can be transferred to the area where the heat dissipation component is not bonded to the heat sink component, and through the heat dissipation component
  • the area where the device is attached is dissipated to increase the heat dissipation area for dissipating heat from the first to-be-heat-dissipated component, thereby improving the heat dissipation efficiency.
  • a vacuum cavity is provided in the heat dissipation component, and a working medium is provided in the vacuum cavity.
  • the volume of the working medium is smaller than the volume of the vacuum cavity.
  • the working medium is used for Dissipate heat from the heat sink.
  • a surface of the heat dissipation substrate on the second side and an inner wall of the heat dissipation component surround a vacuum cavity, and a working medium is disposed in the vacuum cavity, and the volume of the working medium is Less than the volume of the vacuum cavity, the working medium is used to dissipate heat from the heat sink.
  • the working medium undergoes a phase change in the vacuum chamber, realizing the primary heat dissipation, and transferring the heat in the working medium.
  • the heat can be dissipated again through the heat-dissipating substrate, and the first heat-dissipating component can be quickly dissipated through the process of once-dissipating and re-dissipating.
  • the inner surface of the vacuum cavity is provided with a porous structure.
  • the porous structure can form a capillary structure inside the vacuum cavity.
  • the capillary force provided by the capillary structure can fix the working medium in the hole of the vacuum cavity away from the first side of the heat dissipation substrate (that is, the bottom of the vacuum cavity), so that the working medium Centralized heating to speed up the vaporization of the working fluid.
  • the porous structure can fix the vaporized working medium in a hole in the vacuum cavity near the first side of the heat dissipation substrate (that is, the top of the vacuum cavity), so that the vaporized working medium can be concentrated to dissipate heat, so as to speed up the vaporized working medium. Quality liquefaction process.
  • the liquefied working fluid can be returned to the bottom of the vacuum cavity under the action of the capillary force provided by the capillary structure, so as to realize the circulating flow of the working fluid in the vacuum cavity.
  • the porous structure may be a structure formed by laying copper powder on the inner surface and performing a sintering treatment on the copper powder.
  • the orthographic projection of the first to-be-radiated component on the heat-dissipating substrate is located on the heat-dissipating substrate of the vacuum cavity. Orthographic projection inside.
  • a support column is provided inside the vacuum cavity.
  • a second groove is provided on a second side of the heat dissipation substrate, and the heat dissipation component is disposed in the first groove.
  • the opening surfaces of the first grooves are coplanar, so that both the heat dissipating component and the heat dissipating substrate can be in good contact with the component to be dissipated.
  • the heat dissipating method of the heat dissipating fins can be adopted to dissipate the heat dissipating components into zones, and the implementation methods can include at least the following:
  • a distance between every two adjacent cooling fins in the first region is smaller than a distance between every two adjacent cooling fins in the second region, and the first region is
  • the orthographic projection on the heat-dissipating substrate covers the orthographic projection of the first to-be-radiated component on the heat-dissipating substrate, and the orthographic projection of the second region on the heat-dissipating substrate covers the other to-be-radiated components in the heat dissipation. Orthographic projection on the substrate.
  • the heat radiation areas for heat radiation using the heat radiation fins in the corresponding areas are different.
  • the area of the heat radiation fins with a smaller distance is larger in the area.
  • the heat dissipation area can dissipate heat faster.
  • the heat dissipating device further includes: a protective shell buckled on the heat dissipating substrate, the protective shell covering the plurality of heat dissipation fins, and a gap is provided between the plurality of heat dissipation fins. quality.
  • the protective shell is covered with a plurality of radiating fins to form a closed space, so that the working medium circulates in the closed space, and no working medium leaks.
  • the heat dissipating device further includes: a shunt component, which is configured to input a working medium inputted from a working medium inlet to the first area and the second area, respectively, wherein the first A working medium outlet is provided in both the region and the second region.
  • the orthographic projection of the first region on the heat dissipation substrate covers the orthographic projection of the heat dissipation component on the heat dissipation substrate, and the second region is at The orthographic projection on the heat dissipation substrate and the orthographic projection of the heat dissipation component on the heat dissipation substrate do not overlap.
  • working fluid outlets are provided in both the first and second areas, the working fluid in the first area tends to pass through when the working fluid is input into the first and second areas, respectively, according to the fluid flow properties.
  • the working medium outlet provided in the first area flows out, and the working medium located in the second area tends to flow out through the working medium outlet provided in the second area, thereby reducing the possibility of heat exchange between working areas in different regions. Ensure the realization of partition heat dissipation.
  • the heat dissipating device further includes: a shunt component, which is configured to control a flow rate of the working medium in the first region and the second region, and / or the shunt The module is also used to control the flow rate of the working medium in the first area and the second area, and then dissipate heat through the working medium with different flow rates and / or different flows to further reduce the heat exchange between the working mediums in different areas. possibility.
  • a baffle is provided on a first side of the heat dissipation substrate near the heat dissipation fin, and the baffle is used to separate a region where the heat dissipation fin is located into a first region and a second region. Area to realize the partitioning of the flow channels in the first and second areas, so that the working medium in the first area cannot exchange with the working medium in the second area, thereby reducing the possibility of heat exchange between working areas in different areas. .
  • the heat-dissipating device further includes: a heat pipe, one end of which is embedded between the heat-dissipating substrate and the second to-be-radiated component, and the other end of the heat pipe is provided At the working fluid inlet, the heat pipe is used to transfer heat from the second to-be-radiated component to the working fluid inlet (or other low temperature place).
  • a second groove is further provided on a first side of the heat dissipation substrate away from the heat dissipation fin, and the heat pipe is disposed in the second groove so that the heat pipe The first side far from the heat sink fin is coplanar with the opening surface of the second groove, so that the heat pipe, the heat sink component, and the heat sink substrate can all make good contact with the heat sink component.
  • the thickness of the heat dissipation substrate at the first groove is less than 5 mm.
  • the support post is made of copper.
  • the heat dissipation component and the heat dissipation substrate are connected by welding.
  • the first to-be-radiated device includes: a central processing unit CPU or a graphics processor GPU, and the other to-be-radiated device includes: a high-bit-wide memory HBM chip.
  • the present application provides a method for manufacturing a heat sink, including: providing a heat sink substrate; and providing a plurality of heat sink fins on a first side of the heat sink substrate, the heat sink fins used to dissipate the heat sink Heat on the substrate; a heat dissipating component is provided on the second side of the heat dissipating substrate, a first surface of the heat dissipating component is fixedly connected to the heat dissipating substrate, and a gap exists between a side surface of the heat dissipating component and the heat dissipating substrate, The second surface of the heat dissipating component is adapted to be attached to the first to-be-radiated component to dissipate heat on the first to-be-radiated component, and the first side and the second side are two opposite sides.
  • the first surface and the second surface are opposite surfaces of the heat dissipating component, and the side surfaces are surfaces of the heat dissipating component except the first surface and the second surface;
  • the area on the second side of the heat-dissipating substrate on which the heat-dissipating component is not provided is used for lamination with other heat-dissipating components, and the heat-generating power of the first heat-dissipating component is greater than that of the other heat-dissipating components, Said other pending
  • the first device is a device to be outside of the heat sink member.
  • a structure having a cavity is provided in the heat dissipating component, or a surface of the heat dissipating substrate on the second side and an inner wall of the heat dissipating component surround a structure having a cavity, and the method further includes: The method includes: performing a vacuuming process on the cavity; injecting a working fluid into the cavity after the vacuuming process, and the volume of the injected working fluid is smaller than the volume of the cavity, and the working fluid is used to dissipate heat from the radiator; The cavity after the working fluid is injected is sealed.
  • the heat dissipating component provided on the second side of the heat dissipating substrate includes: a cavity structure providing an opening on the first side; a surface at a preset position on the second side of the heat dissipating substrate and the cavity Copper powder is laid inside the structure; the cavity structure with the copper powder laid inside is fixed at a preset position on the second side of the heat dissipation substrate; the heat dissipation substrate provided with the cavity structure is sintered to obtain an inner surface A heat dissipation component with a porous structure is provided.
  • the method further includes: installing a support post inside the cavity structure.
  • the disposing a heat dissipating component on the second side of the heat dissipating substrate includes: providing the heat dissipating component; providing a first groove at a preset position on the second side of the heat dissipating substrate, the first groove The depth of the groove is less than or equal to the thickness of the heat dissipation component in the direction where the depth is located; the heat dissipation component is fixedly disposed in the first groove.
  • a method for manufacturing a heat sink provided by the present application.
  • the method for manufacturing a heat sink includes a heat sink substrate and a heat sink component, and a gap exists between a side surface of the heat sink component and the heat sink substrate, so that the heat on the first heat sink component cannot be removed from the heat sink component.
  • the side transfer to other to-be-radiated components reduces the heat transfer path, reduces the heat transfer between the first to-be-radiated component and other to-be-radiated components, thereby reducing the The degree of heat influence can effectively dissipate heat to other components to be dissipated through the heat dissipating substrate, which improves the heat dissipating efficiency of the heat dissipating device.
  • the present application provides a server.
  • the server includes a server case and a heat dissipation device.
  • the server case is provided with a first heat sink component and other heat sink components.
  • the heat dissipation device includes the first aspect. Heat sink.
  • the first to-be-radiated component and other to-be-radiated components are packaged in a packaged chip, and the heat sink is bonded to the packaged chip.
  • the server provided in this application includes a heat dissipation device for dissipating heat from a first heat sink component and other heat sink components in a server chassis. Since the heat dissipation device includes a heat dissipation substrate and a heat dissipation component, a side of the heat dissipation component There is a gap between the heat sink and the heat sink, so that the heat on the first heat sink cannot be transferred from the side of the heat sink to other heat sinks. Compared with the related technology, the heat transfer path is reduced and the first heat sink is reduced.
  • the heat transferred between the heat sink and other heat sinks thereby reducing the degree of heat influence between different heat sinks, and can effectively dissipate heat to other heat sinks through the heat sink substrate, which improves the heat dissipation efficiency of the heat sink and further improves Server productivity.
  • FIG. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of another heat dissipation device according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a vacuum cavity enclosed by a heat dissipation component and a heat dissipation substrate according to an embodiment of the present application;
  • FIG. 4 is a schematic structural diagram of still another heat dissipation device provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a distance between each adjacent two cooling fins in a first region provided in an embodiment of the present application smaller than a distance between each adjacent two cooling fins in a second region;
  • FIG. 6 is a schematic structural diagram of still another heat dissipation device according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of still another heat dissipation device according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of still another heat dissipation device provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of still another heat dissipation device according to an embodiment of the present application.
  • FIG. 10 is a schematic diagram of relative positions of a heat dissipation component and a heat pipe on a heat dissipation substrate provided by an embodiment of the present application;
  • FIG. 11 is a schematic diagram of relative positions of a heat dissipation component and a heat pipe on a heat dissipation substrate according to an embodiment of the present application;
  • FIG. 12 is a schematic diagram of relative positions of another heat dissipation component and a heat pipe on a heat dissipation substrate according to an embodiment of the present application;
  • FIG. 13 is a schematic diagram of relative positions of a heat dissipation component and a heat pipe on a heat dissipation substrate according to an embodiment of the present application;
  • FIG. 14 is a schematic diagram of relative positions of yet another heat dissipation component and a heat pipe on a heat dissipation substrate according to an embodiment of the present application;
  • FIG. 15 is a flowchart of a method for manufacturing a heat sink according to an embodiment of the present application.
  • FIG. 16 is a flowchart of a method for setting a heat dissipation component on a second side of a heat dissipation substrate according to an embodiment of the present application.
  • multiple chips are generally packaged on a sealed chip.
  • the multiple chips include a main chip and other chips, and the thicknesses of the multiple chips are the same.
  • the heating power of the main chip is greater than the heating power of other chips.
  • the main chip may be a processor chip such as a CPU or GPU on a packaged chip, and the other chips may be HBM chips other than the GPU on the packaged chip or other chips with lower power consumption.
  • a heat-dissipating device may be used to dissipate the sealed chip.
  • the heat-dissipating device includes a heat-dissipating substrate and a plurality of heat-dissipating fins evenly arranged on the heat-dissipating substrate.
  • the surface of the chip is used to perform heat exchange with multiple chips on the packaged chip
  • the heat dissipation fin is used to perform heat exchange with the heat dissipation substrate to dissipate the heat on the heat dissipation substrate, and further perform the multiple chips on the packaged chip. Cooling.
  • the heat generated by the main chip during operation is generally greater than the heat generated by other chips during operation, and the case temperature (referring to the surface temperature of the chip) and the junction temperature (referring to the maximum allowable operation of the chip) of the main chip and other chips (Temperature) are different. If the heat dissipation substrate in the related technology is used to dissipate the main chip and other chips, the main chip will transfer heat to the other chips through the heat dissipation substrate, so that heat between different chips is transferred to each other, resulting in heat dissipation of other chips. Problems occur, and therefore, the heat dissipation efficiency of the heat dissipation device in the related art is low.
  • the processor chip and the memory chip in the server are generally packaged in the same packaged chip.
  • the processor chip (such as GPU or CPU) can generate 250-300 watts of heat, or even 400-500 watts.
  • the temperature specification is about 100 degrees Celsius
  • the heat generation of memory chips is generally less than 20 watts
  • the case temperature specification is about 70 degrees Celsius. If the heat dissipation device in the related technology is used to dissipate the processor chip and the memory chip, the heat on the processor chip will be transferred to the memory chip through the heat dissipation substrate, causing the memory chip to overheat, which will cause the working state of the memory chip. affected.
  • an embodiment of the present application provides a heat dissipation device, which can perform heat dissipation by partitioning multiple chips on the sealed chip to reduce the heat dissipation between different chips.
  • the degree of heat influence effectively improves the heat dissipation efficiency of the heat sink.
  • the heat dissipating device 00 may include a heat dissipating substrate 001, a heat dissipating component 002, and a plurality of heat dissipating fins 003 disposed on a first side of the heat dissipating substrate 001, wherein the heat dissipating fins 003 are used to dissipate the heat dissipating substrate 001.
  • the heat dissipation substrate 001, the heat dissipation component 002, and the heat dissipation fin 003 may be made of copper.
  • the first surface of the heat dissipating component 002 is fixedly disposed on the second side of the heat dissipating substrate 001. There is a gap X between the side of the heat dissipating component 002 and the heat dissipating substrate 001.
  • the second surface of the heat dissipating component 002 is used to dissipate heat from the first surface.
  • the devices are attached to dissipate heat from the first heat sink device.
  • first side and the second side of the heat dissipation substrate 001 are opposite sides thereof, and the first and second sides of the heat dissipation module 002 are opposite surfaces of the heat dissipation module, and the side surfaces are A surface of the heat dissipation component 002 other than the first surface and the second surface.
  • the heat dissipation component 002 and the heat dissipation substrate 001 may be connected by welding or gluing.
  • the thermal resistance between the heat dissipating component 002 and the heat dissipating substrate 001 can be reduced, thereby reducing the heat generated by the heat resistance.
  • the area on the second side of the heat-dissipating substrate 001 where the heat-dissipating component 002 is not provided is used for bonding with other heat-dissipating components.
  • the heat-generating power of the first heat-dissipating component is greater than that of other heat-dissipating components.
  • Devices other than heat sinks are other than heat sinks.
  • the heat on the first to-be-radiated component cannot be transferred from the side of the heat-dissipating component to other to-be-radiated components.
  • the heat transfer path is reduced. , Reduces the heat transferred between the first to-be-radiated component and other to-be-radiated components, thereby reducing the degree of thermal influence between different to-be-radiated components, and can effectively dissipate other to-be-radiated components through the heat dissipation substrate 001, which improves the Heat dissipation efficiency of the heat dissipation device 00.
  • the first to-be-dissipated heat sink device may be a main chip such as a CPU or a GPU on a packaged chip
  • the other to-be-dissipated heat sink device may be other to-be-dissipated components other than the main chip on the combined chip.
  • the heat sink device can be an HBM chip other than the GPU on the packaged chip or other to-be-cooled parts with low power consumption.
  • the heat dissipating component 002 When the heat dissipating component 002 is used to dissipate heat from the main chip in the packaged chip, and the area where the heat dissipating component 002 is not provided on the second side of the heat dissipation substrate 001 is used to dissipate heat from other chips in the packaged chip, the main chip The heat cannot be transferred from the side of the heat sink to other chips, which reduces the heat transferred between the main chip and other chips, thereby reducing the degree of heat influence between the two. Therefore, it can solve the problem of low heat dissipation efficiency of the sealed chip. problem.
  • the interface conductive material layer may be made of materials such as thermally conductive silicone and silicone grease, and the interface is conductive relative to the implementation in which the heat dissipation component 002 is in direct contact with the first heat sink component, and the heat dissipation substrate 001 is in direct contact with other heat sink components to be cooled.
  • the arrangement of the material layer can reduce the thermal resistance caused by direct contact, and can increase the degree of fit between the heat dissipation component 002 and the first heat sink component, and increase the heat dissipation substrate 001 and other heat sink components. The degree of fit between them to ensure the effective transfer of heat, thereby improving the heat dissipation efficiency of the heat sink; on the other hand, it can also reduce the risk of damage to the heat sink.
  • the heat dissipating device 00 is generally used to dissipate an object including a plurality of to-be-radiated components, and the plurality of to-be-radiated components may include at least one first to-be-radiated component and at least one other to-be-radiated component, and The amount of heat generated by the first to-be-radiated component is generally greater than the amount of heat generated by other to-be-radiated components.
  • a heat dissipating component 002 is used to dissipate heat for the first to-be-radiated component, and accordingly, the position of the heat-dissipating component 002 can be set according to the position of the first to-be-radiated component.
  • the heat dissipating component 002 can be used to dissipate heat for the main chip in the packaged chip. Accordingly, the position of the heat dissipating component 002 can be set according to the position of the main chip.
  • the positional relationship between the heat dissipating component 002 and the first heat sink component can satisfy: the orthographic projection of the heat dissipating component 002 on the heat dissipation substrate 001 coincides with the orthographic projection of the first heat sink component on the heat dissipating substrate 001, or the heat dissipation
  • the orthographic projection of the component 002 on the heat radiation substrate 001 covers the orthographic projection of the first to-be-radiated component on the heat radiation substrate 001.
  • the orthographic projection is a projection in which a plurality of parallel projection lines irradiate a projection object in a direction perpendicular to the projection surface, so that the projection object is formed on the projection surface.
  • the orthographic projection of the heat dissipating component 002 on the heat dissipating substrate 001 refers to: a plurality of parallel projection lines irradiate the heat dissipating component 002 in a direction perpendicular to the heat dissipating substrate 001, so that the heat dissipating component 002 is formed on the heat dissipating substrate 001.
  • the orthographic projection of the first to-be-radiated component on the heat-dissipating substrate 001 refers to: a plurality of parallel projection lines irradiate the first to-be-radiated component in a direction perpendicular to the heat-dissipating substrate 001, so that the projection of the first to-be-radiated-component to be formed on the heat-dissipating substrate 001 .
  • the second surface of the heat dissipating component 002 includes an area that is attached to the first heat dissipating component and the In the area where the heat sink component 002 is attached to the first heat sink component, the heat from the area where the heat sink component 002 is attached to the first heat sink component can be transferred to the area where the heat sink component 002 is not attached to the heat sink component.
  • the heat is dissipated in the area where the first to-be-radiated member is attached, which increases the heat-dissipating area for dissipating heat from the first to-be-radiated member, thereby improving heat dissipation efficiency.
  • the setting position of the second surface of the heat dissipating component 002 and the second surface of the heat dissipating substrate 001 in the region where the heat dissipating component 002 is not provided may be adjusted.
  • the height difference of the installation position on the side makes both the heat dissipating component 002 and the heat dissipating substrate 001 able to make good contact with the components to be dissipated.
  • the second side of the heat dissipating substrate 001 may further be provided with a first groove (not shown in FIG. 1). Out), the heat dissipating component 002 is disposed in the first groove, so that the second surface of the heat dissipating component 002 is attached to the first heat sink component, and an area where the heat dissipating component 002 is not provided on the second side of the heat dissipating substrate 001 and Other heat sink parts to be fitted.
  • the second surface of the heat dissipation component 002 is coplanar with the opening surface of the first groove.
  • a heat-conducting pad may be fixedly disposed on the second side of the heat-dissipating substrate 001, so that the heat-dissipating component 002 is fixed to the heat-dissipating through the heat-conducting pad.
  • the second side of the substrate 001 ensures that both the heat dissipating component 002 and the heat dissipating substrate 001 can be in good contact with the component to be dissipated.
  • a thermal pad may also be provided on the second side of the heat-dissipating substrate 001 accordingly. 004 (please refer to FIG. 2) to ensure that the at least two to-be-radiated components M are attached to the heat-dissipating substrate 001.
  • the thickness of the heat dissipating substrate 001 at the first groove may be smaller than a first threshold, and the first threshold may be configured according to business requirements, for example, The first threshold may be 5 millimeters.
  • a closed vacuum cavity is disposed in the heat dissipation component 002, or, referring to FIG. 3, the surface of the heat dissipation substrate 001 on the second side and the inner wall of the heat dissipation component 002 may form a vacuum cavity Q.
  • a working medium W may be disposed in the vacuum chamber, and the volume of the working medium W in the vacuum chamber is smaller than the volume of the vacuum chamber, and the working medium is used to dissipate heat from the heat sink.
  • the working medium W may be a liquid having good heat exchange performance such as methanol, an aqueous solution of ethylene glycol, a refrigerant, and water.
  • the orthographic projection of the first to-be-radiated component on the heat-dissipating substrate 001 is located inside the orthographic projection of the vacuum cavity on the heat-dissipating substrate 001.
  • the working medium W in the vacuum cavity can be absorbed.
  • the heat is vaporized, and the vaporized working medium W rises to the top of the vacuum chamber, and because the temperature of the top of the vacuum chamber is lower than the temperature of the bottom of the vacuum chamber, the working medium W rising to the top of the vacuum chamber encounters The cold will liquefy, and will return to the bottom of the vacuum cavity after liquefaction, thereby achieving effective heat dissipation of the first heat sink to be cooled.
  • the working medium W has a phase change inside the vacuum chamber, that is, the state of the working medium W in the vacuum chamber.
  • the change realizes the primary heat dissipation, and after the working medium W transfers the heat to the heat dissipation substrate 001, the heat can be re-radiated through the heat dissipation substrate 001, and the first heat dissipation can be achieved through the primary heat dissipation and re-heat dissipation process.
  • Fast thermal dissipation of the device is a phase change inside the vacuum chamber, that is, the state of the working medium W in the vacuum chamber.
  • the first heat sink member to be cooled is not passed through the heat sink substrate 001.
  • the heat is transferred to other to-be-radiated components, thereby reducing the degree of heat influence between the first to-be-radiated component and other to-be-radiated components.
  • the inner surface of the vacuum chamber may be further provided with a porous structure (not shown in FIG. 2).
  • the porous structure may be a structure formed by laying copper powder on the inner surface of the vacuum cavity and performing a sintering treatment on the copper powder.
  • the diameter of the copper powder particles is a second threshold (for example, the second threshold is 80-150 microns)
  • the pore diameter of each pore may be 50-80 microns.
  • the porous structure may be formed The capillary structure inside the vacuum cavity.
  • the capillary force provided by the capillary structure can fix the working medium W in the hole of the vacuum chamber away from the first side of the heat dissipation substrate 001 (ie, the bottom of the vacuum cavity), so that the working medium W is concentratedly heated.
  • the porous structure may fix the vaporized working medium W in the hole of the vacuum cavity near the first side of the heat dissipation substrate 001 (ie, the top of the vacuum cavity), so that the vaporized working medium W is concentrated to dissipate heat, so as to accelerate vaporization.
  • the liquefied working medium W can be returned to the bottom of the vacuum chamber under the action of the capillary force provided by the capillary structure, so as to realize the circulating flow of the working medium W in the vacuum chamber.
  • a support post 005 may be further provided inside the vacuum cavity.
  • the support post 005 may be made of copper.
  • the support pillar 005 may be a columnar structure formed by injecting copper powder into a mold, and pressing and sintering the copper powder in the mold.
  • one end of the support post 005 is used to support a first surface of the heat dissipating component 002, and the other end of the support post 005 is used to support a first surface of the heat dissipating component 002.
  • Two sides When the vacuum cavity is a cavity formed by a plurality of surfaces of the heat dissipating component 002 and a surface of the heat dissipating substrate 001 on the second side, one end of the support post 005 is used to support the surface of the heat dissipating substrate 001 on the second side. The other end of the support post 005 is used to support the second surface of the heat dissipation component 002 surrounding the vacuum cavity.
  • the heat dissipation device 00 may further include a protective shell 006 fastened on the heat dissipation substrate 001, the protective shell 006 covers a plurality of heat dissipation fins 003, and a gap between the plurality of heat dissipation fins 003.
  • a working medium W is provided therein, and a gap between the plurality of radiating fins 003 forms a flow channel through which the working medium W flows.
  • the protective shell 006 is covered with a plurality of radiating fins 003 to form a closed space, so that the working fluid can circulate in the closed space without leakage of the working fluid.
  • the working medium W in the gap between the heat dissipation fin 003 is used for heat exchange with the heat dissipation substrate 001 and the heat dissipation fin 003 to dissipate the heat on the heat dissipation substrate 001 and the heat dissipation fin 003.
  • a working medium inlet (not shown in FIG. 4) and a working medium outlet (not shown in FIG. 4) are relatively provided on the protective shell 006. When the heat sink is to be cooled, it can be input from the working medium inlet.
  • the lower temperature working medium W, the working medium W can perform heat exchange with the cooling fin 003 and the cooling substrate 001 during the flow, and flow out from the working medium outlet after cooling, so as to realize the cooling substrate 001 and the cooling fin 003. Convection heat dissipation, thereby achieving heat dissipation to the heat sink device.
  • the working medium W may be a liquid having good heat exchange performance such as methanol, an aqueous solution of ethylene glycol, a refrigerant, and water.
  • the positions of the inlet of the working medium and the outlet of the working medium may be set according to actual needs. For example, the inlet of the working medium and the outlet of the working medium may be respectively disposed on two opposite sides of the protective shell 006.
  • the heat dissipating method of the heat dissipating fins 003 can be adopted for the heat dissipating of the heat dissipating devices in zones, and the implementation methods can include at least the following:
  • each adjacent two cooling fins 003 in the first region is smaller than that in the second region (such as the left region in FIG. 5).
  • L and the right region R) each adjacent two heat dissipation fins 003 are spaced apart to realize the partitioning of the heat dissipation fins 003, and heat is dissipated through the partitioned heat dissipation fins 003.
  • the orthographic projection of the first region on the heat dissipation substrate 001 covers the orthographic projection of the first heat sink element on the heat dissipation substrate 001, and the orthographic projection of the second region on the heat dissipation substrate 001 covers the other heat sink elements on the heat dissipation substrate 001.
  • Orthographic projection. When there is a gap between the distances of the heat radiation fins 003 in different regions, the heat radiation areas for heat radiation using the heat radiation fins 003 in the corresponding regions are different. Among them, the area of the heat radiation fins 003 with a smaller distance has a larger heat radiation area. This larger heat dissipation area can dissipate heat more quickly.
  • the spacing of the cooling fins 003 in different regions is different, and the working medium W is provided in the gap between the cooling fins 003, the flow velocity and the flow rate of the working medium W in the corresponding regions will be different. Accordingly, the working medium W dissipates different heat, and then achieves district heat dissipation in different areas.
  • the difference can be expressed as: when the distance between the heat dissipation fins 003 is larger, the flow rate and velocity of the working medium W in the corresponding area are larger, and accordingly, the more heat is radiated through the working medium W.
  • the first to-be-radiated device and the second region corresponding to the first region can be Corresponding other to-be-heat-dissipated components implement zoned heat dissipation, and speed up the heat-dissipation of other to-be-radiated components to solve the problem of heat-dissipating bottlenecks caused by the low junction temperature of other to-be-radiated components.
  • Table 1 shows the values of the distance between the heat dissipation fins 003 in the left region L, the middle region M, and the right region R shown in FIG. 5 when the flow rate of the working fluid inlet is 1 liter / minute (LPM).
  • LPM liter / minute
  • the left region The flow velocity of the working medium W in L, the middle region M and the right region R is 0.121 m / s, 0.128 m / s, and 0.122 m / s, and the flow rates are 0.293 LPM, 0.412 LPM, and 0.295 LPM, respectively.
  • the velocity of the working medium W in the left region L, the middle region M, and the right region R is 0.156 m / s, 0.081m / s, and 0.155m / s, and the flows are 0.372LPM, 0.258LPM, and 0.370LPM, respectively.
  • the equal pitch means that the pitch of the heat dissipation fins 003 in the left region L, the middle region M, and the right region R is 0.35 mm
  • the variable pitch means that the pitch of the heat dissipation fins 003 in the middle region M is 0.35 mm.
  • the distance between the heat dissipation fins 003 in the side region L and the right region R is 0.5 mm.
  • the heat dissipation device 00 may further include: a shunt component 007, which is used to input the working medium W input from the working medium inlet to the first area and the second area, respectively. . Since working fluid outlets are provided in both the first and second areas, the working fluid W in the first area tends to be more inclined when the working fluid W is input into the first and second areas, respectively, according to the flow characteristics of the fluid. Because the working medium W provided in the first area flows out, the working medium W in the second area tends to flow out through the working medium outlet provided in the second area, thereby reducing the heat exchange of the working medium W between different areas. Possibility to ensure the realization of partition heat dissipation.
  • the heat dissipation device 00 may include: a shunt component 007. Different resistances may be set at the working medium entrances in different areas through the shunt component 007 to control the first area and the second area. The flow rate of the working medium W in the two regions, and / or, the flow rate of the working medium W in the first region and the second region is controlled, and then the working medium W with different flow rates and / or different flows is used to dissipate heat to further reduce the different regions. Possibility of heat exchange between working medium W.
  • the first side of the heat dissipating substrate 001 near the heat dissipating fin 003 may further be provided with a baffle, which is used to divide the area where the heat dissipating fin 003 is located into the first part.
  • a region such as region M in FIG. 7
  • a second region such as region L and region R in FIG. 7
  • FIG. 6 is a schematic diagram of installing a shunt assembly 007 in the heat dissipation device 00. As shown in FIG. 6, the area on the heat dissipation substrate 001 is divided into a first area and a second area, and a working medium outlet is provided in each area (Not shown in FIG.
  • FIG. 7 is a schematic diagram of installing a shunt assembly 007 and a baffle in the heat dissipation device 00. As shown in FIG.
  • the area on the heat dissipation substrate 001 is divided into a first area and a second area, and a working medium outlet is provided in each area C, and a baffle is provided between the first area and the second area.
  • the shunt assembly 007 inputs the working medium W to the first and second areas respectively, the working medium W can follow the heat dissipation fins in each area.
  • the gap of 003 flows to the outlet of the working medium in the corresponding area (the dotted line in FIG. 7 is the circulation path of the working medium W), and then the heat dissipation is achieved by partitions.
  • the heat dissipation fin 003 can also be designed so that the working fluid channel formed by the heat dissipation fin 003 has a direction of flow, for example, the working fluid flow channel formed by the working fluid in the heat dissipation fin 003. Under the action of flow, the flow direction can be the direction shown by the arrow in FIG. 8.
  • the heat-dissipating device 00 may further include: a heat pipe 008, one end of which may be embedded between the heat-dissipating substrate 001 and the second to-be-radiated component M1
  • the other end of the heat pipe 008 may be disposed at the working medium inlet (or other low temperature place), and the heat pipe 008 is used to transfer the heat on the second radiator member to the working medium inlet (or other low temperature place) ).
  • the second to-be-radiated component may be any one to-be-radiated component, and the other to-be-radiated component is a device other than the first to-be-radiated component M2.
  • a plurality of second to-be-radiated components may be included in the to-be-radiated component, and the plurality of second to-be-radiated components may be sequentially arranged in accordance with the flow direction of the working medium W.
  • the working medium W dissipates other to-be-radiated components
  • the second to-be-radiated component that is upstream of the working-material flow direction (for convenience of description, it is simply referred to as the second upstream to-be-radiated component).
  • the heat is transferred to the second heat sink to be located downstream of the working fluid flow direction (for convenience of description, it is referred to as the second heat sink to be cooled downstream).
  • a heat pipe 008 is provided between the heat sink component and the heat dissipation substrate 001, so that the second heat sink component to be cooled downstream is transmitted to the working fluid inlet through the heat pipe 008, so as to dissipate heat from the second heat sink component to be cooled downstream, thereby avoiding the second heat sink component to be upstream.
  • the second to-be-radiated component that the working medium W first flows through is the second to-be-radiated component upstream of the working medium flow direction, and the second to-be-radiated heat that the working medium W flows through later
  • the device is the second to-be-dissipated heat sink downstream of the working fluid flow direction.
  • the heat pipe 008 can be adjusted according to the difference in thickness between the second to-be-radiated component and other to-be-radiated components except the second to-be-radiated component (for ease of description, it will be referred to as other to-be-radiated components below).
  • a second groove H2 may be further provided on the second side of the heat dissipating substrate 001, and the heat pipe 008 is provided.
  • the second surface of the heat pipe 008 is attached to the second heat sink member, and the area on the second side of the heat dissipation substrate 001 where the heat pipe 008 and the heat dissipation component 002 are not provided is attached to other heat sink members.
  • the second surface of the heat pipe 008 and the opening surface of the second groove H2 are coplanar.
  • a heat conducting pad may be fixedly disposed on the second side of the heat dissipation substrate 001, so that the heat pipe 008 is fixed to the heat dissipation substrate 001 through the heat conducting pad.
  • FIG. 9 uses FIG. 9 as an example to describe the implementation process of the heat dissipation device provided in the embodiment of the present application for heat dissipation:
  • the four second heat sink components M1 are respectively disposed on both sides of the first heat sink component M2, the second surface of the heat dissipation component 002 is attached to the first heat sink component M2, and the second heat dissipation substrate 001
  • the area where the heat dissipating component 002 is not provided on the side is attached to the four second heat dissipating components M1, and there is a gap between the side of the heat dissipating component 002 and the heat dissipating substrate 001, so that the heat on the first heat dissipating component M2 cannot be dissipated.
  • the side of the module 002 is transferred to the second to-be-radiated component M1, which reduces the heat transferred between the first to-be-radiated component M2 and the second to-be-radiated component M1, and reduces the first to-be-radiated component M2 and the second to-be-radiated component M1.
  • the degree of influence between the heat therefore, improves the heat dissipation efficiency of the heat sink 00.
  • the orthographic projection of the heat dissipating component 002 on the heat dissipating substrate 001 covers the orthographic projection of the first to-be-radiated component M2 on the heat dissipating substrate 001, that is, the second surface of the heat dissipating component 002 includes and An area where the first heat sink member M2 is to be attached and an area where the first heat sink member is not to be attached. Since the heat in the area where the heat dissipating component 002 is attached to the first heat sink member M2 can be transferred to the area where the heat dissipating component 002 is not attached to the heat sink component, it can be passed through the area which is not attached to the first heat sink component M2. The heat dissipation in the area increases the heat dissipation area for heat dissipation of the first to-be-radiated heat sink M2, which further improves the heat dissipation efficiency.
  • the heat-dissipating fins are also partitioned on the first side of the heat-dissipating substrate 001, and the grouping method of the heat-dissipating fins is shown in FIG. 7.
  • the partitioning method shown is in the second area corresponding to the second heat sink member M1 (such as the area L and the area R in FIG. 7 or FIG. 9) and the first area corresponding to the first heat sink member M2 (such as the one in FIG. 7 or FIG. 9).
  • a baffle is provided between the 9th region M), and the working medium W is input to the first region and the second region through the shunt assembly 007, respectively.
  • the working substance W in the first region and the second region can be along the respective The gap of the heat dissipation fins 003 in the region flows to the working fluid outlet in the corresponding region.
  • the working fluid W in each region can perform heat exchange with the heat dissipation substrate 001 in the corresponding region while flowing in the gap of the heat dissipation fins 003.
  • the heat can be taken away to realize the heat dissipation of the heat dissipation substrate 001.
  • the working medium W in the radiating fin 003 flows in the direction indicated by the dotted arrow in FIG. 9, the second to-be-radiated components M1 and M1 in the second region L and the second region R, which are downstream of the working medium flow direction, and A heat pipe 008 is also arranged between the heat dissipation substrates 001, and the other end of the heat pipe 008 is arranged upstream of the working fluid flow direction.
  • the heat pipe 008 can transfer the heat on the second heat sink member M1 to the lower temperature worker.
  • heat radiation is performed to the downstream second to-be-radiated component M1, thereby avoiding the heat of the upstream second to-be-radiated component M1 from cascading with the temperature of the downstream second to-be-radiated component to ensure the heat dissipation device. Effective cooling.
  • the heat dissipation device provided by the embodiment of the present application can ensure the heat dissipation efficiency of the heat dissipation device. Therefore, when the heat dissipating device is used to dissipate heat from the packaged chip, and the heat dissipating component is used to dissipate heat from the main chip such as the GPU in the packaged chip, the area where the heat dissipating component is not provided on the second side of the heat dissipating substrate is used.
  • the heat dissipation efficiency when the hermetically sealed chip is radiated can be improved.
  • the positions and numbers of the heat dissipating components 002 and the heat pipes 008 can be adjusted according to the layout of the components to be dissipated.
  • the relative positions of the heat dissipating component 002 and the heat pipe 008 on the heat dissipating substrate 001 may include: surrounding / middle (please refer to FIG. 10), both sides (please refer to FIG. 11), up and down (please refer to FIG. 12), and semi-enclosed (please 13 and 14) and other relative positions.
  • heat can also be dissipated from the first heat sink to be dissipated through the heat pipe 008, and other heat sinks can be dissipated from the heat dissipating component 002.
  • a plurality of heat dissipating components 002 may be provided in the heat dissipating device 00, and the first heat dissipating component and other heat dissipating components are dissipated through the plurality of heat dissipating components 002, respectively.
  • a plurality of heat pipes 008 may be provided in the heat dissipating device 00, and the first heat-dissipating component and other heat-dissipating components are dissipated through the plurality of heat pipes 008, respectively.
  • a plurality of heat pipes 008 and a plurality of heat dissipating components 002 may be provided in the heat dissipating device 00, and one or more heat pipes 008 and one or more heat dissipating may be combined, and any heat sink device to be dissipated may be dissipated.
  • each server was cooled by multiple heat sinks 00, and each server was equipped with a NVIDIA P100 model GPU under the evolutionary power consumption condition.
  • a 420-watt GPU case temperature specification 105 ° C
  • four 15-watt HBM chips case temperature specification 95 ° C
  • the working medium W provided in each heat dissipation device 00 is an ethylene glycol aqueous solution
  • the flow rate of the working medium W provided in the gap between the heat dissipation fins 003 is 1 L / min.
  • the temperature of the working medium W in the first region corresponding to the GPU and the temperature of the working medium W in the second region corresponding to the HBM chip are basically the same. Within 1 degree Celsius.
  • the second heat dissipation device for partitioning the working fluid channel is used for heat dissipation, the difference between the temperature of the working medium W in the first area and the temperature of the working medium W in the second area reaches about 5 degrees Celsius, compared with the use of the first heat dissipation device. During heat dissipation, the temperature of the working medium W in the second region decreases.
  • the third heat dissipation device 00 for partitioning the working fluid channel and partitioning the heat dissipation substrate 001 provided by the embodiment of the present application is used to dissipate heat
  • the difference between the temperature of the working medium W in the first region and the temperature of the working medium W in the second region reaches about 12 degrees Celsius.
  • the temperature of the working medium W in the second region is reduced by about 4 degrees Celsius, and the case temperature of the HBM chip is reduced by 3-4 degrees Celsius.
  • the first heat dissipation device and the third heat dissipation device 00 for heat dissipation, please refer to Table 2 for the temperatures of the GPU and HBM chip.
  • Table 2 when the first heat dissipation device is used for heat dissipation, the case temperature of the HBM chip is higher than its case temperature.
  • the third heat sink 00 when using the third heat sink 00 to dissipate heat, there is a temperature margin of 2.9 degrees Celsius between the case temperature of the HBM chip and its case temperature specification. Therefore, the use of the heat sink 00 provided in the embodiment of this application can meet the requirements for GPU and HBM chips.
  • the heat dissipation requirement improves the heat dissipation efficiency of the heat dissipation device 00.
  • the material of each component of the heat sink can be improved according to the simulation results of the heat sink's heat dissipation, so as to reduce the cost of the improved heat sink on the basis of ensuring heat dissipation efficiency.
  • a lower cost material can be used to manufacture the heat dissipation component to reduce the cost of the improved heat dissipation device.
  • the heat dissipation device provided in the embodiment of the present application includes a heat dissipation substrate and a heat dissipation component. There is a gap between the side of the heat dissipation component and the heat dissipation substrate, so that the heat on the first to-be-radiated component cannot be removed from the heat dissipation component.
  • the side of the heat sink is transferred to other heat sinks.
  • the heat transfer path is reduced, the heat transferred between the first heat sink and other heat sinks is reduced, and the distance between different heat sinks is reduced.
  • the degree of influence of heat can effectively dissipate heat to other components to be dissipated through the heat dissipating substrate, thereby improving the heat dissipating efficiency of the heat dissipating device.
  • FIG. 15 is a flowchart of a method for manufacturing a heat sink according to an embodiment of the present application. As shown in FIG. 15, the method for manufacturing the heat sink may include:
  • Step 301 Provide a heat dissipation substrate.
  • the heat dissipation substrate may be made of copper.
  • Step 302 A plurality of heat dissipation fins are provided on a first side of the heat dissipation substrate.
  • the heat dissipation fins are used to dissipate heat on the heat dissipation substrate.
  • the cooling fins may be made of copper.
  • a plurality of heat dissipation fins may be provided at equal intervals or variable intervals, and when the fins are provided at variable intervals, the implementation manner of the variable pitch of the heat dissipation fins may refer to the partition setting in the foregoing embodiment of the heat dissipation device. Several implementation manners of the cooling fins are not repeated here.
  • Step 303 A heat dissipation component is provided on the second side of the heat dissipation substrate.
  • the first surface of the heat dissipation component is fixedly connected to the heat dissipation substrate, and a gap exists between a side surface of the heat dissipation component and the heat dissipation substrate.
  • the heat dissipating component may be provided with a structure having a cavity, or the surface of the heat dissipating substrate on the second side and the inner wall of the heat dissipating component may be surrounded by a structure having a cavity.
  • the second surface of the heat dissipating component is adapted to be attached to the first to-be-radiated component to dissipate heat on the first to-be-radiated component.
  • the area on the second side of the heat dissipation substrate where no heat dissipation component is provided is used for bonding with other heat sink components.
  • the heat generation power of the first heat sink component is greater than the heat power of the other heat sink components. Devices other than the first heat sink device.
  • first side and the second side of the heat dissipation substrate are opposite sides of the heat dissipation substrate
  • the first surface and the second surface of the heat dissipation component are opposite surfaces of the heat dissipation component
  • the side is the first surface of the heat dissipation component.
  • Surface and second surface may be connected by welding.
  • the implementation manner of the heat dissipation component is different according to the difference in thickness between the first heat dissipation component and other heat dissipation components.
  • a heat-conducting pad may be fixedly disposed on the second side of the heat-dissipating substrate, and A heat dissipation component is provided on the side.
  • the implementation of disposing the heat-dissipating component on the second side of the heat-dissipating substrate includes: at a preset position on the second side of the heat-dissipating substrate.
  • a first groove is provided, and the heat dissipation component is fixedly disposed in the first groove, wherein the depth of the first groove is less than or equal to the thickness of the heat dissipation component along the depth direction.
  • the cavity structure may be disposed on the second side of the heat dissipating substrate in the manner of disposing the heat dissipating component described above.
  • the heat dissipating component is a cavity structure with an opening, please refer to FIG. 16.
  • the implementation of step 303 may include:
  • Step 3031 Provide a cavity structure with one side open.
  • the cavity structure opened on one side may be a structure such as a cube, a prism, or a cylinder opened on one side, which is not specifically limited in the embodiment of the present application.
  • Step 3032 Lay copper powder on the surface of the preset position on the second side of the heat dissipation substrate and inside the cavity structure.
  • the preset position is a position on the second side of the heat dissipation substrate where the heat dissipation component is expected to be disposed.
  • Step 3033 Install a support post inside the cavity structure.
  • the support post may be made of copper.
  • the support pillar may be a columnar structure formed by injecting copper powder into a mold, and pressing and sintering the copper powder in the mold.
  • Step 3034 Fix the cavity structure in which the copper powder is laid on a preset position on the second side of the heat dissipation substrate.
  • the cavity structure with copper powder inside is fixed at a preset position on the second side of the heat dissipation substrate, the cavity structure opened on that side and the surface of the heat dissipation substrate on the second side are enclosed into a closed cavity structure.
  • one end of the support pillar is used to support the second side of the heat dissipation substrate surrounding the vacuum cavity, and the other end of the support pillar is used to support the surface of the heat dissipation component surrounding the vacuum cavity on the second side, In order to improve the pressure resistance and bending resistance of the vacuum cavity.
  • a support pillar may also be installed inside the heat dissipation component. At this time, one end of the support pillar is used to support the first surface of the heat dissipation component, and the support pillar The other end is used to support the second side of the heat dissipation component.
  • Step 3035 Perform a sintering process on the heat dissipation substrate provided with a cavity structure to obtain a heat dissipation component provided with a porous structure on an inner surface.
  • the porous structure can form a capillary structure inside the vacuum cavity.
  • the capillary force provided by the capillary structure can fix the working medium in the hole of the vacuum cavity away from the first side of the heat dissipation substrate (that is, the bottom of the vacuum cavity), so that the working medium Centralized heating to speed up the vaporization of the working fluid.
  • the porous structure can fix the vaporized working medium in a hole in the vacuum cavity near the first side of the heat dissipation substrate (that is, the top of the vacuum cavity), so that the vaporized working medium can be concentrated to dissipate heat, so as to speed up the vaporized working medium. Quality liquefaction process.
  • the liquefied working fluid can be returned to the bottom of the vacuum cavity under the action of the capillary force provided by the capillary structure, so as to realize the circulating flow of the working fluid in the vacuum cavity.
  • a heat pipe may also be provided on the second side of the heat dissipation substrate.
  • the heat pipe may be arranged in a manner corresponding to that of the heat dissipation component, and the location of the heat pipe may be set according to actual needs.
  • the heat pipe may be disposed at one end of the heat pipe embedded in the heat-dissipating substrate and Between the second to-be-radiated components, the other end of the heat pipe is set at the working fluid inlet (or other lower temperature).
  • the heat pipe is used to transfer heat from the second to-be-radiated component to the working fluid inlet (or other Lower temperature).
  • Step 304 Perform a vacuuming process on the cavity, which is a cavity included inside the heat dissipation component, or the cavity is a cavity surrounded by the heat dissipation component and the heat dissipation substrate.
  • Step 305 Inject a working fluid into the cavity after the vacuum treatment, and the volume of the injected working fluid is smaller than the volume of the cavity.
  • the working medium may be a liquid having good heat exchange performance such as methanol, an ethylene glycol aqueous solution, a refrigerant, and water.
  • Step 306 Perform a sealing process on the cavity after the working fluid is injected.
  • the sealing process is used to maintain the cavity in a vacuum state, thereby ensuring the circulating flow of the working fluid inside the cavity.
  • the method for manufacturing a heat sink includes a heat sink substrate and a heat sink component.
  • a gap exists between a side surface of the heat sink component and the heat sink substrate so that The heat cannot be transferred from the side of the heat dissipation component to other heat sink components.
  • the heat transfer path is reduced, the heat transferred between the first heat sink component and other heat sink components is reduced, and the difference is reduced.
  • the degree of influence of the heat between the heat sinks can effectively dissipate heat to other heat sinks through the heat dissipation substrate, thereby improving the heat dissipation efficiency of the heat sink.
  • the server may include a server case and a heat dissipation device.
  • the server case is provided with a first heat sink component and other heat sink components.
  • the heat dissipation device includes any one of FIG. 1 to FIG. 9. The heat dissipation device is used for dissipating heat for the first to-be-radiated component and other to-be-radiated components in the server case.
  • the first to-be-radiated component and other to-be-radiated components are packaged in a packaged chip, and the heat sink is bonded to the packaged chip.
  • the server provided in the embodiment of the present application includes a heat dissipation device, which is used to dissipate the first heat sink component and other heat sink components in the server chassis.
  • the heat dissipation device includes a heat dissipation substrate and heat dissipation. Components, there is a gap between the side of the heat sink component and the heat sink substrate, so that the heat on the first heat sink component cannot be transferred from the side of the heat sink component to other heat sink components. Compared with related technologies, the heat transfer path is reduced.
  • the heat dissipation efficiency of the server further improves the working efficiency of the server.
  • the program may be stored in a computer-readable storage medium.
  • the storage medium mentioned may be a read-only memory, a magnetic disk or an optical disk.

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Abstract

本申请公开了一种散热装置及其制造方法、服务器，属于硬件散热技术领域。散热装置包括：散热基板、散热组件和设置在散热基板的第一侧上的多个散热翅片，散热翅片用于散发散热基板上的热量；散热组件的第一面固定设置在散热基板的第二侧，散热组件的侧面与散热基板之间存在间隙，散热组件的第二面用于与第一待散热器件贴合，以将第一待散热器件上的热量散发；散热基板的第二侧上未设置散热组件的区域用于与其他待散热器件贴合，第一待散热器件的发热功率大于其他待散热器件的发热功率，其他待散热器件为除第一待散热器件之外的器件。由此提高了散热装置的散热效率。

Description

散热装置及其制造方法、服务器 技术领域
本发明涉及硬件散热技术领域，尤其涉及一种散热装置及其制造方法、服务器。
背景技术
随着服务器中芯片性能的不断提高，芯片的发热量越来越大，同时，由于服务器内部器件的集成度较高，使得服务器中的热量高度集中，因此，如何有效地对服务器进行散热是亟待解决的问题。
服务器中的芯片可以包括：处理芯片、以及存储芯片等其他小功耗芯片，该处理芯片可以包括中央处理器(Central Process Unit；CPU)和图形处理器(Graphics Processing Unit；GPU)等，该存储芯片可以包括高位宽存储器(High Bandwidth Memory；HBM)芯片等。一般地，处理芯片、存储芯片等其他小功耗芯片被封装在同一合封芯片中。相关技术中，采用散热装置对合封芯片进行散热，该散热装置包括散热基板和均匀排布在散热基板上的多个散热翅片，其中，散热基板为一整体结构，其贴合在合封芯片的表面，用于与合封芯片进行热交换，散热翅片用于与散热基板进行热交换，以散发散热基板上的热量，进而对合封芯片进行散热。
但是，由于合封芯片中存在发热量不同的芯片，例如：HBM芯片和GPU的发热量不同，采用相关技术对合封芯片进行散热时，该发热量不同的芯片之间会通过基板产生热传递，使得不同芯片之间的热量相互影响，导致对合封芯片进行散热的散热效率较低。
发明内容
本申请提供了一种散热装置及其制造方法、服务器，可以解决相关技术中对合封芯片进行散热的散热效率较低的问题，本申请提供的技术方案如下：
第一方面，本申请提供了一种散热装置，所述散热装置包括：散热基板、散热组件和设置在所述散热基板的第一侧上的多个散热翅片，所述散热翅片用于散发所述散热基板上的热量；所述散热组件的第一面固定设置在所述散热基板的第二侧，所述散热组件的侧面与所述散热基板之间存在间隙，所述散热组件的第二面用于与第一待散热器件贴合，以将所述第一待散热器件上的热量散发，所述第一侧和所述第二侧为相对设置的两侧，所述第一面与所述第二面为所述散热组件上相对设置的两个表面，所述侧面为所述散热组件上除所述第一面和所述第二面外的表面；所述散热基板的第二侧上未设置所述散热组件的区域用于与其他待散热器件贴合，所述第一待散热器件的发热功率大于所述其他待散热器件的发热功率，所述其他待散热器件为除所述第一待散热器件之外的器件。
由于散热组件的侧面与散热基板之间存在间隙，使得第一待散热器件上的热量无 法从散热组件的侧面传递至其他待散热器件，相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板有效地为其他待散热器件散热，提高了散热装置的散热效率。
可选地，该散热组件在散热基板上的正投影可以覆盖第一待散热器件在散热基板上的正投影，这样一来，散热组件的第二面中包括与第一待散热器件贴合区域和未与待散热器件贴合的区域，且散热组件与第一待散热器件贴合区域中的热量可传递至该散热组件未与待散热器件贴合的区域中，并通过该未与待散热器件贴合的区域散热，以增大对该第一待散热器件进行散热的散热面积，进而提高散热效率。
在一种可实现方式中，所述散热组件内设置有真空腔体，所述真空腔体内设置有工质，所述工质的体积小于所述真空腔体的体积，所述工质用于对待散热器件散热。
在另一种可实现方式中，所述散热基板位于所述第二侧的表面和所述散热组件的内壁围成真空腔体，所述真空腔体内设置有工质，所述工质的体积小于所述真空腔体的体积，所述工质用于对待散热器件散热。
在真空腔体内通过工质将第一待散热器件的热量传递至散热基板的过程中，该工质在真空腔体内部发生了相变，实现了对热量的一次散热，并在工质将热量传递至散热基板后，可通过散热基板对热量进行再次散热，通过该一次散热和再次散热过程能够实现对第一待散热器件的快速散热。并且，由于该散热器件的侧面与散热基板之间存在间隙，因此，在散热组件内对第一待散热器件进行散热的过程中，不会通过散热基板将第一待散热器件上的热量传递至其他待散热器件，进而减小了不同待散热器件之间的热量影响程度。
可选地，所述真空腔体的内表面设置有多孔结构。该多孔结构可形成真空腔体内部的毛细结构，该毛细结构提供的毛细力能够将工质固定在真空腔体远离散热基板第一侧(即真空腔体的底部)的孔中，使得工质集中受热，以加快工质的汽化过程。或者，该多孔结构可以将汽化后的工质固定在真空腔体靠近散热基板第一侧(即真空腔体的顶部)的孔中，使得汽化后的工质集中散热，以加快汽化后的工质的液化过程。并且，液化后的工质在该毛细结构提供的毛细力的作用下，可回流至真空腔体的底部，以实现工质在该真空腔体中的循环流动。
作为形成多孔结构的一种可实现方式，所述多孔结构可以是通过在所述内表面上铺设铜粉并对所述铜粉执行烧结处理后形成的结构。
可选地，为了保证能够通过真空腔体对第一待散热器件有效地散热，所述第一待散热器件在所述散热基板上的正投影位于所述真空腔体在所述散热基板上的正投影内部。
并且，为了提高该真空腔体的耐压和抗弯折能力，所述真空腔体内部设置有支撑柱。
作为设置散热组件的一种可实现方式，所述散热基板的第二侧设置有第一凹槽，所述散热组件设置在所述第一凹槽中，所述散热组件的第二面与所述第一凹槽的开口面共面，使得散热组件和散热基板均能够与待散热器件良好接触。
为了进一步提高散热装置的散热效率，可以采用对散热翅片分区的散热方式对待 散热器件进行分区散热，其实现方式至少可以包括以下几种：
在第一种可实现方式中，位于第一区域中的每相邻两个散热翅片的间距小于位于第二区域中的每相邻两个散热翅片的间距，所述第一区域在所述散热基板上的正投影覆盖所述第一待散热器件在所述散热基板上的正投影，所述第二区域在所述散热基板上的正投影覆盖所述其他待散热器件在所述散热基板上的正投影。
当不同区域中的散热翅片的间距存在差距时，对应区域中利用散热翅片进行散热的散热面积不同，其中，散热翅片的间距较小的区域中的散热面积较大，通过该较大的散热面积能够更快地散发热量。
可选地，所述散热装置还包括：扣置在所述散热基板上的保护壳，所述保护壳包覆所述多个散热翅片，所述多个散热翅片的间隙中设置有工质。该保护壳包覆多个散热翅片能够形成密闭空间，使得工质在该密闭空间流通，不会出现工质泄露。
当不同区域中的散热翅片的间距存在差距，且散热翅片的间隙中设置有工质时，对应区域中工质的流速和流量会存在差异，相应的，通过工质散发的热量不同，进而在不同区域中实现分区散热，以解决由于其他待散热器件结温较低所引起的散热瓶颈问题。
在第二种可实现方式中，所述散热装置还包括：分流组件，所述分流组件用于将由工质入口输入的工质分别输入至第一区域和第二区域；其中，所述第一区域和所述第二区域中均设置有工质出口，所述第一区域在所述散热基板上的正投影覆盖所述散热组件在所述散热基板上的正投影，所述第二区域在所述散热基板上的正投影与所述散热组件在所述散热基板上的正投影不重叠。
由于第一区域和第二区域中均设置有工质出口，根据流体的流动性质，当分别将工质输入至第一区域和第二区域中时，第一区域中的工质更倾向于通过设置在第一区域中的工质出口流出，第二区域中的工质更倾向于通过设置在第二区域中的工质出口流出，从而降低不同区域间工质进行热交换的可能性，能够保证分区散热的实现。
在第三种可实现方式中，所述散热装置还包括：分流组件，所述分流组件用于控制所述第一区域和所述第二区域中工质的流速，和/或，所述分流组件还用于控制所述第一区域和所述第二区域中工质的流量，进而通过该不同流速和/或不同流量的工质进行散热，以进一步降低不同区域间工质进行热交换的可能性。
在第四种可实现方式中，所述散热基板靠近所述散热翅片的第一侧上设置有挡板，所述挡板用于将散热翅片所在的区域分隔为第一区域和第二区域，以实现第一区域和第二区域中的流道分区，使得第一区域中的工质与第二区域中的工质无法换流，进而降低不同区域间工质进行热交换的可能性。
可选地，为了保证对其他待散热器件的有效散热，所述散热装置还包括：热管，所述热管的一端嵌入所述散热基板与第二待散热器件之间，所述热管的另一端设置在工质入口处，所述热管用于将所述第二待散热器件上的热量传递至所述工质入口(或者其他温度较低处)。
作为设置散热组件的一种可实现方式，所述散热基板远离所述散热翅片的第一侧还设置有第二凹槽，所述热管设置在所述第二凹槽中，使得所述热管远离所述散热翅片的第一侧与第二凹槽的开口面共面，以使热管、散热组件和散热基板均能够与待散 热器件良好接触。
可选地，所述工质的体积V1与所述真空腔体的体积V2满足：V1＝a×V2，所述a∈[0.3～0.5]。
可选地，为了尽量减小散热组件与其连接的散热基板之间的热交换，所述第一凹槽处的散热基板的厚度小于5毫米。
作为一种可实现方式，所述支撑柱由铜制成。
并且，所述散热组件与所述散热基板通过焊接的方式连接。
其中，所述第一待散热器件包括：中央处理器CPU或图形处理器GPU，所述其他待散热器件包括：高位宽存储器HBM芯片。
第二方面，本申请提供了一种散热装置的制造方法，包括：提供一散热基板；在所述散热基板的第一侧设置多个散热翅片，所述散热翅片用于散发所述散热基板上的热量；在所述散热基板的第二侧设置散热组件，所述散热组件的第一面与所述散热基板固定连接，所述散热组件的侧面与所述散热基板之间存在间隙，所述散热组件的第二面用于与第一待散热器件贴合，以将所述第一待散热器件上的热量散发，所述第一侧和所述第二侧为相对设置的两侧，所述第一面与所述第二面为所述散热组件上相对设置的两个表面，所述侧面为所述散热组件上除所述第一面和所述第二面外的表面；其中，所述散热基板的第二侧上未设置所述散热组件的区域用于与其他待散热器件贴合，所述第一待散热器件的发热功率大于所述其他待散热器件的发热功率，所述其他待散热器件为除所述第一待散热器件之外的器件。
可选地，所述散热组件内设置有具有腔体的结构，或者，所述散热基板位于所述第二侧的表面和所述散热组件的内壁围成具有腔体的结构，所述方法还包括：对所述腔体执行抽真空处理；向抽真空处理后的腔体内注入工质，注入的工质的体积小于所述腔体的体积，所述工质用于对待散热器件散热；对注入工质后的腔体执行密封处理。
可选地，所述在所述散热基板的第二侧设置散热组件，包括：提供第一侧开口的腔体结构；在所述散热基板第二侧的预设位置的表面和所述腔体结构的内部铺设铜粉；将内部铺设铜粉的腔体结构固定在所述散热基板第二侧的预设位置上；对设置有所述腔体结构的散热基板执行烧结处理，以得到内表面设置有多孔结构的散热组件。
可选地，在所述将内部铺设铜粉的腔体结构固定在所述散热基板第二侧的预设位置上之前，所述方法还包括：在所述腔体结构的内部安装支撑柱。
可选地，所述在所述散热基板的第二侧设置散热组件，包括：提供所述散热组件；在所述散热基板第二侧的预设位置处设置第一凹槽，所述第一凹槽的深度小于或等于所述散热组件沿所述深度所在方向上的厚度；将所述散热组件固定设置在所述第一凹槽中。
本申请提供的散热装置的制造方法，通过该方法制造散热装置包括散热基板和散热组件，该散热组件的侧面与散热基板之间存在间隙，使得第一待散热器件上的热量无法从散热组件的侧面传递至其他待散热器件，相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板有效地为其他待散热器件散热，提高了散热装置的散热效率。
第三方面，本申请提供了一种服务器，所述服务器包括服务器机箱和散热装置，所述服务器机箱中设置有第一待散热器件和其他待散热器件，所述散热装置包括第一方面所述的散热装置。
可选地，所述第一待散热器件和其他待散热器件封装在合封芯片中，所述散热装置与所述合封芯片贴合。
本申请提供的服务器，该服务器包括散热装置，该散热装置用于为服务器机箱中的第一待散热器件和其他待散热器件散热，由于该散热装置包括散热基板和散热组件，该散热组件的侧面与散热基板之间存在间隙，使得第一待散热器件上的热量无法从散热组件的侧面传递至其他待散热器件，相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板有效地为其他待散热器件散热，提高了散热装置的散热效率，进而提高了服务器的工作效率。
附图说明
图1是本申请实施例提供的一种散热装置的结构示意图；
图2是本申请实施例提供的另一种散热装置的结构示意图；
图3是本申请实施例提供的一种散热组件与散热基板围成真空腔体的结构示意图；
图4是本申请实施例提供的又一种散热装置的结构示意图；
图5是本申请实施例提供的第一区域中每相邻两个散热翅片的间距小于第二区域中每相邻两个散热翅片的间距的示意图；
图6是本申请实施例提供的再一种散热装置的结构示意图；
图7是本申请实施例提供的还一种散热装置的结构示意图；
图8是本申请实施例提供的又一种散热装置的结构示意图；
图9是本申请实施例提供的再一种散热装置的结构示意图；
图10是本申请实施例提供的一种散热组件和热管在散热基板上的相对位置的示意图；
图11是本申请实施例提供的一种散热组件和热管在散热基板上的相对位置的示意图；
图12是本申请实施例提供的另一种散热组件和热管在散热基板上的相对位置的示意图；
图13是本申请实施例提供的又一种散热组件和热管在散热基板上的相对位置的示意图；
图14是本申请实施例提供的再一种散热组件和热管在散热基板上的相对位置的示意图；
图15是本申请实施例提供的一种散热装置的制造方法的流程图；
图16是本申请实施例提供的一种在散热基板的第二侧设置散热组件的方法流程图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。
目前，合封芯片上一般封装有多个芯片，该多个芯片包括主芯片和其他芯片，且该多个芯片的厚度相同，其中，主芯片的发热功率大于其他芯片的发热功率，例如：该主芯片可以为合封芯片上的CPU或GPU等处理器芯片，其他芯片可以为合封芯片上的除GPU外的HBM芯片或其他功耗较小的芯片。相关技术中，可以采用散热装置对合封芯片进行散热，该散热装置包括散热基板和均匀排布在散热基板上的多个散热翅片，该散热基板为一整体结构，其贴合在合封芯片的表面，用于与合封芯片上的多个芯片进行热交换，散热翅片用于与散热基板进行热交换，以散发散热基板上的热量，进而对合封芯片上的多个芯片进行散热。
由于该主芯片在工作过程中的发热量一般大于其他芯片在工作过程中的发热量，且主芯片和其他芯片的壳温(指芯片的表面温度)规格和结温(指芯片的最高允许工作温度)均不同，若采用相关技术中的散热基板为该主芯片和其他芯片散热，该主芯片会通过散热基板向其他芯片传递热量，使得不同芯片之间的热量相互传递，导致其他芯片的散热出现问题，因此，相关技术中散热装置的散热效率较低。例如，服务器中的处理器芯片和存储芯片一般被封装在同一合封芯片中，该处理器芯片(如GPU或CPU)的发热量可达到250-300瓦，甚至达到400-500瓦，其壳温规格约为100摄氏度，存储芯片的发热量一般低于20瓦，其壳温规格约为70摄氏度。若采用相关技术中的散热装置为该处理器芯片和存储芯片散热，该处理器芯片上的热量会通过散热基板传递至存储器芯片上，导致存储器芯片出现超温现象，进而使存储器芯片的工作状态受到影响。
为了解决传统技术中合封芯片散热效率低的问题，本申请实施例提供了一种散热装置，该散热装置能够对合封芯片上的多个芯片进行分区散热，减小了不同芯片之间的热量影响程度，有效地提高了散热装置的散热效率。请参考图1，该散热装置00可以包括：散热基板001、散热组件002和设置在散热基板001的第一侧上的多个散热翅片003，其中，散热翅片003用于散发散热基板001上的热量。可选地，该散热基板001、该散热组件002和该散热翅片003均可以由铜制成。
该散热组件002的第一面固定设置在散热基板001的第二侧，该散热组件002的侧面与散热基板001之间存在间隙X，该散热组件002的第二面用于与第一待散热器件贴合，以将第一待散热器件上的热量散发。其中，上述的散热基板001的第一侧与第二侧为其相对设置的两侧，上述的散热组件002的第一面与第二面为散热组件上相对设置的两个表面，上述侧面为散热组件002上除第一面和第二面外的表面。
可选地，散热组件002和散热基板001可以通过焊接或胶粘的方式连接。当散热组件002和散热基板001通过焊接方式连接时，能够减小散热组件002和散热基板001之间的热阻，进而减少因热阻产生的热量。
散热基板001的第二侧上未设置散热组件002的区域用于与其他待散热器件贴合，第一待散热器件的发热功率大于其他待散热器件的发热功率，其他待散热器件为除第一待散热器件之外的器件。
由于散热组件002的侧面与散热基板001之间存在间隙X，使得第一待散热器件上的热量无法从散热组件的侧面传递至其他待散热器件，相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板001有效地为其他待散热器件散热，提高了散热装置00的散热效率。
示例地，该第一待散热器件可以为合封芯片上的CPU或GPU等主芯片，该其他待散热器件可以为合封芯片上的除主芯片外的其他待散热器件，例如，该其他待散热器件可以为合封芯片上的除GPU外的HBM芯片或其他功耗较小的待散热器件。当将该散热组件002用于与合封芯片中的主芯片散热，将散热基板001的第二侧上未设置散热组件002的区域用于与合封芯片中的其他芯片散热时，该主芯片的热量无法从散热组件的侧面传递至其他芯片，减少了主芯片与其他芯片之间传递的热量，进而减小了两者间热量的影响程度，因此，可以解决合封芯片散热效率较低的问题。
在一种可实现方式中，散热组件002的第二面与第一待散热器件之间，以及，散热基板001的第二侧上未设置散热组件002的区域与其他待散热器件之间可以设置有界面导电材料层，散热组件002的第二面与第一待散热器件通过该界面导电材料层实现贴合，散热基板001的第二侧上未设置散热组件002的区域与其他待散热器件通过该界面导电材料层实现贴合。该界面导电材料层可以由导热硅胶和硅脂等材料制成，相对于散热组件002与第一待散热器件直接接触，以及，散热基板001与其他待散热器件直接接触的实现方式，该界面导电材料层的设置，一方面能够减小因直接接触产生的热阻，并且，可以增加散热组件002与第一待散热器件之间的贴合度，以及，增加散热基板001与其他待散热器件之间的贴合度，以保证热量的有效传递，进而提高散热装置的散热效率；另一方面，还可以降低损坏待散热器件的风险。
需要说明的是，该散热装置00一般用于对包含多个待散热器件的物体进行散热，且该多个待散热器件中可以包括至少一个第一待散热器件和至少一个其他待散热器件，且该第一待散热器件的发热量一般大于其他待散热器件的发热量。并且，在该散热装置00中，散热组件002用于为该第一待散热器件散热，相应的，该散热组件002的位置可根据第一待散热器件的位置进行设置。例如，当散热装置00用于为合封芯片散热时，散热组件002可用于为合封芯片中的主芯片散热，相应的，该散热组件002的位置可根据该主芯片的位置进行设置。
示例地，散热组件002与第一待散热器件的位置关系可以满足：该散热组件002在散热基板001上的正投影与第一待散热器件在散热基板001上的正投影重合，或者，该散热组件002在散热基板001上的正投影覆盖第一待散热器件在散热基板001上的正投影。其中，正投影为平行的多条投射线沿垂直于投影面的方向照射投影物，使投影物在投影面上形成的投影。相应的，散热组件002在散热基板001上的正投影指：平行的多条投射线沿垂直于散热基板001的方向照射散热组件002，使散热组件002在散热基板001上形成的投影。第一待散热器件在散热基板001上的正投影指：平行的多条投射线沿垂直于散热基板001的方向照射第一待散热器件，使第一待散热器件在散热基板001上形成的投影。
当该散热组件002在散热基板001上的正投影覆盖第一待散热器件在散热基板 001上的正投影时，散热组件002的第二面中包括与第一待散热器件贴合的区域和未与待散热器件贴合的区域，由于散热组件002与第一待散热器件贴合区域中的热量可传递至该散热组件002未与待散热器件贴合的区域中，因此，能够通过该未与第一待散热器件贴合的区域散热，增大了对该第一待散热器件进行散热的散热面积，进而提高了散热效率。
在一种可实现方式中，可以根据第一待散热器件的厚度和其他待散热器件的厚度，调节散热组件002的第二面的设置位置与未设置散热组件002的区域中散热基板001第二侧的设置位置的高度差，使得散热组件002和散热基板001均能够与待散热器件良好接触。示例地，当其他待散热器件与第一待散热器件的厚度差小于或等于散热组件002的厚度时，该散热基板001的第二侧上还可以设置有第一凹槽(图1中未示出)，该散热组件002设置在该第一凹槽中，使得散热组件002的第二面与第一待散热器件贴合，且散热基板001的第二侧上未设置散热组件002的区域与其他待散热器件贴合。并且，当其他待散热器件与第一待散热器件的厚度相等时，散热组件002的第二面与第一凹槽的开口面共面。当其他待散热器件与第一待散热器件的厚度差大于散热组件002的厚度时，该散热基板001的第二侧上还可以固定设置有导热垫，使散热组件002通过该导热垫固定在散热基板001的第二侧，以保证散热组件002和散热基板001均能够与待散热器件良好接触。相似地，当其他待散热组件002中包括至少两个待散热器件M，该至少两个待散热器件M之间存在厚度差时，该散热基板001的第二侧上也可以相应设置有导热垫004(请参考图2)，以保证该至少两个待散热器件M均与散热基板001贴合。
可选地，为了尽量减小散热组件002与其连接的散热基板001之间的热交换，第一凹槽处的散热基板001的厚度可以小于第一阈值，第一阈值可以根据业务需求配置，例如，第一阈值可以为5毫米。
进一步地，该散热组件002内设置有封闭的一个真空腔体，或者，请参考图3，散热基板001位于第二侧的表面与散热组件002的内壁可围成一个真空腔体Q。该真空腔体内可设置有工质W，且该真空腔体内工质W的体积小于真空腔体的体积，该工质用于对待散热器件散热。示例地，真空腔体内工质W的体积V1与真空腔体的体积V2可以满足：V1＝a×V2，该a∈[0.3～0.5]。其中，该工质W可以为甲醇、乙二醇水溶液、制冷剂和水等换热性能较好的液体。并且，为了保证能够通过真空腔体对第一待散热器件有效地散热，第一待散热器件在散热基板001上的正投影位于真空腔体在散热基板001上的正投影内部。
这样一来，当第一待散热器件的热量传递至与该第一待散热器件贴合的散热组件002的第二面(即真空腔体的底部)时，真空腔体内的工质W可吸收该热量并汽化，汽化后的工质W上升至真空腔体的顶部，且由于真空腔体顶部的温度低于真空腔体的底部的温度，该上升至真空腔体的顶部的工质W遇冷会液化，并在液化后回流至真空腔体的底部，进而实现对第一待散热器件的有效散热。
在真空腔体内通过工质W将第一待散热器件的热量传递至散热基板001的过程中，该工质W在真空腔体内部发生了相变，即工质W在真空腔体内发生了状态变化，实现了对热量的一次散热，并在工质W将热量传递至散热基板001后，可通过散热基板 001对热量进行再次散热，通过该一次散热和再次散热过程能够实现对第一待散热器件的快速散热。并且，由于该散热器件的侧面与散热基板001之间存在间隙X，因此，在散热组件002内对第一待散热器件进行散热的过程中，不会通过散热基板001将第一待散热器件上的热量传递至其他待散热器件，进而减小了第一待散热器件与其他待散热器件之间的热量影响程度。
可选地，该真空腔体的内表面还可以设置有多孔结构(图2未示出)。在一种可实现方式中，该多孔结构可以为通过在真空腔的内表面上铺设铜粉，并对该铜粉执行烧结处理后形成的结构。当铜粉颗粒的直径为第二阈值(例如，第二阈值为80～150微米)时，在该多孔结构中，每个孔的孔径可以为50～80微米，此时，该多孔结构可形成真空腔体内部的毛细结构，该毛细结构提供的毛细力能够将工质W固定在真空腔体远离散热基板001第一侧(即真空腔体的底部)的孔中，使得工质W集中受热，以加快工质W的汽化过程。或者，该多孔结构可以将汽化后的工质W固定在真空腔体靠近散热基板001第一侧(即真空腔体的顶部)的孔中，使得汽化后的工质W集中散热，以加快汽化后的工质W的液化过程。并且，液化后的工质W在该毛细结构提供的毛细力的作用下，可回流至真空腔体的底部，以实现工质W在该真空腔体中的循环流动。
并且，为了提高该真空腔体的耐压和抗弯折能力，请继续参考图3，该真空腔体内部还可以设置有支撑柱005。可选地，该支撑柱005可以由铜制成。例如，该支撑柱005可以为将铜粉注入模具，并在该模具中对铜粉进行压制并烧结后形成的柱状结构。
当该散热组件002的多个表面围成真空腔体时，该支撑柱005的一端用于支撑该散热组件002的第一面，该支撑柱005的另一端用于支撑该散热组件002的第二面。当该真空腔体为散热组件002的多个表面与散热基板001位于第二侧的表面围成的腔体时，该支撑柱005的一端用于支撑该散热基板001的位于第二侧的表面，该支撑柱005的另一端用于支撑围成该真空腔体的散热组件002的第二面。
可选地，请参考图4，散热装置00还可以包括：扣置在散热基板001上的保护壳006，该保护壳006包覆多个散热翅片003，该多个散热翅片003的间隙中设置有工质W，多个散热翅片003的间隙形成工质W流通的流道。该保护壳006包覆多个散热翅片003能够形成密闭空间，使得工质在该密闭空间流通，不会出现工质泄露。该散热翅片003间隙中的工质W用于与散热基板001和散热翅片003进行热交换，以散发该散热基板001和散热翅片003上的热量。并且，该保护壳006上还相对设置有工质入口(图4中未示出)和工质出口(图4中未示出)，在对待散热器件进行散热时，可从该工质入口输入温度较低的工质W，工质W在流动过程中可与散热翅片003和散热基板001进行热交换，并在散热后从工质出口流出，以实现对散热基板001和散热翅片003的对流散热，进而实现对待散热器件的散热。其中，该工质W可以为甲醇、乙二醇水溶液、制冷剂和水等换热性能较好的液体。该工质的入口和工质的出口的位置可以根据实际需要进行设置，例如：该工质的入口和工质的出口可以分别设置在保护壳006相对设置的两个侧面上。
为了进一步提高散热装置00的散热效率，可以采用对散热翅片003分区的散热方 式对待散热器件进行分区散热，其实现方式至少可以包括以下几种：
在第一种可实现方式中，请参考图5，第一区域(如图5中中部区域M)中每相邻两个散热翅片003的间距小于第二区域(如图5中左侧区域L和右侧区域R)中每相邻两个散热翅片003的间距，以实现散热翅片003的分区，并通过分区后的散热翅片003进行散热。其中，第一区域在散热基板001上的正投影覆盖第一待散热器件在散热基板001上的正投影，第二区域在散热基板001上的正投影覆盖其他待散热器件在散热基板001上的正投影。当不同区域中的散热翅片003的间距存在差距时，对应区域中利用散热翅片003进行散热的散热面积不同，其中，散热翅片003的间距较小的区域中的散热面积较大，通过该较大的散热面积能够更快地散发热量。
并且，当不同区域中的散热翅片003的间距不同，且散热翅片003的间隙中设置有工质W时，对应区域中工质W的流速和流量会存在差异，相应的，通过工质W散发的热量不同，进而在不同区域中实现分区散热。其中，该差异可表现为：当散热翅片003的间距越大时，对应区域中工质W的流量和流速越大，相应的，通过工质W散发的热量越多。当第一区域中每相邻两个散热翅片003的间距小于第二区域中每相邻两个散热翅片003的间距时，能够对第一区域对应的第一待散热器件和第二区域对应的其他待散热器件实现分区散热，并加快对其他待散热器件的散热，以解决由于其他待散热器件结温较低所引起的散热瓶颈问题。
示例地，表1示出了工质入口的流量为1升/分钟(LPM)时，图5所示的左侧区域L、中部区域M和右侧区域R中散热翅片003的间距取值不同时，左侧区域L、中部区域M和右侧区域R中工质W的流速及流量分配情况，请参考表1，当所有区域中散热翅片003的间距为等间距时，左侧区域L、中部区域M和右侧区域R中工质W的流速分别为0.121米每秒(m/s)、0.128m/s和0.122m/s，流量分别为0.293LPM、0.412LPM和0.295LPM。当左侧区域L、中部区域M和右侧区域R中散热翅片003的间距为变间距时，左侧区域L、中部区域M和右侧区域R中工质W的流速分别为0.156米m/s、0.081m/s和0.155m/s，流量分别为0.372LPM、0.258LPM和0.370LPM，根据该表1可知，当将左侧区域L、中部区域M和右侧区域R中散热翅片003的间距设置为变间距时，左侧区域L和右侧区域R中工质W的流速和流量相对于中部区域M中工质W的流速和流量均增大了27％，可显著提高左侧区域L和右侧区域R处的散热能力，因此，能够实现对第一待散热器件和其他待散热器件的分区散热，可以解决由于其他待散热器件结温较低所引起的散热瓶颈问题。其中，等间距是指左侧区域L、中部区域M和右侧区域R中散热翅片003的间距均为0.35毫米，变间距是指中部区域M中散热翅片003的间距为0.35毫米，左侧区域L和右侧区域R中散热翅片003的间距为0.5毫米。
表1
Figure PCTCN2018118909-appb-000001
在第二种可实现方式中，请参考图6，散热装置00还可以包括：分流组件007，该分流组件007用于将由工质入口输入的工质W分别输入至第一区域和第二区域。由于第一区域和第二区域中均设置有工质出口，根据流体的流动性质，当分别将工质W输入至第一区域和第二区域中时，第一区域中的工质W更倾向于通过设置在第一区域中的工质出口流出，第二区域中的工质W更倾向于通过设置在第二区域中的工质出口流出，从而降低不同区域间工质W进行热交换的可能性，能够保证分区散热的实现。
在第三种可实现方式中，请参考图6，散热装置00可以包括：分流组件007，可以通过该分流组件007在不同区域的工质入口处设置不同的阻力，以控制第一区域和第二区域中工质W的流速，和/或，控制第一区域和第二区域中工质W的流量，进而通过该不同流速和/或不同流量的工质W进行散热，以进一步降低不同区域间工质W进行热交换的可能性。
在第四种可实现方式中，请参考图7，散热基板001靠近散热翅片003的第一侧上还可以设置有挡板，该挡板用于将散热翅片003所在的区域分隔为第一区域(如图7中区域M)和第二区域(如图7中区域L和区域R)，以实现第一区域和第二区域中的流道分区，使得第一区域中的工质W与第二区域中的工质W无法换流，进而降低不同区域间工质W进行热交换的可能性。
需要说明的是，上述四种实现分区散热的方式可以单独使用，也可以组合使用，本申请实施例对其不做具体限定。示例地，图6为在散热装置00中设置分流组件007的示意图，如图6所示，散热基板001上的区域分为第一区域和第二区域，每个区域中均设置有工质出口(图6中未示出)，且第一区域中每相邻两个散热翅片003的间距小于第二区域中每相邻两个散热翅片003的间距，分流组件007将工质W分别输入至第一区域和第二区域后，工质W可沿着每个区域中的散热翅片003的间隙流向对应区域中的工质出口(图6中虚线为工质W的流通路径)，进而实现分区散热。图7为在散热装置00中设置分流组件007和挡板的示意图，如图7所示，散热基板001上的区域分为第一区域和第二区域，每个区域中均设置有工质出口C，且第一区域与第二区域之间设置有挡板，分流组件007将工质W分别输入至第一区域和第二区域后，工质W可沿着每个区域中的散热翅片003的间隙流向对应区域中的工质出口(图7中虚线为工质W的流通路径)，进而实现分区散热。
除此之外，还可以对散热翅片003进行设计，使得在通过散热翅片003形成的工质流道具有导流方向，例如：工质在散热翅片003形成的工质流道的导流作用下，其流动方向可以为图8中箭头所示的方向。
可选地，为了保证对其他待散热器件的有效散热，请参考图9，该散热装置00还可以包括：热管008，该热管008的一端可以嵌入散热基板001与第二待散热器件M1之间，该热管008的另一端可以设置在工质入口处(或者其他温度较低处)，该热管008用于将第二待散热器件上的热量传递至工质入口处(或者其他温度较低处)。该第二待散热器件可以为其他待散热器件中的任一待散热器件，该其他待散热器件为除第一待散热器件M2外的器件。
在一种可实现方式中，待散热器件中可以包括多个第二待散热器件，该多个第二待散热器件可以按照工质W的流动方向依次排列，当通过散热翅片003间隙中的工质W对其他待散热器件进行散热时，由于工质W流动时会将处于工质流动方向上游的第二待散热器件(为便于描述，将其简称为上游的第二待散热器件)的热量传递至处于工质流动方向下游(为便于描述，将其简称为下游的第二待散热器件)的第二待散热器件上，因此，在设置热管008时，可以仅在下游的第二待散热器件与散热基板001间设置热管008，以通过热管008将下游的第二待散热器件传递至工质入口处，实现对该下游的第二待散热器件的散热，进而避免因上游的第二待散热器件的热量传递至下游的第二待散热器件所引起的温度级联。其中，沿着工质W的流动方向，该工质W先流经的第二待散热器件为处于工质流动方向上游的第二待散热器件，该工质W后流经的第二待散热器件为处于工质流动方向下游的第二待散热器件。
其中，可以根据第二待散热器件与其他待散热器件中除第二待散热器件外的待散热器件(为便于描述，下文仍将其称为其他待散热器件)的厚度差，调节热管008用于贴合第二待散热器件的第一面的设置位置与未设置散热组件002和热管008区域中散热基板001的第二侧的设置位置的高度差，使得热管008、散热组件002和散热基板001均能够与待散热器件良好接触。示例地，当其他待散热器件与第二待散热器件的厚度差小于或等于散热组件002的厚度时，该散热基板001的第二侧上还可以设置有第二凹槽H2，该热管008设置在该第二凹槽H2中，使得热管008的第二面与第二待散热器件贴合，且散热基板001的第二侧上未设置热管008和散热组件002的区域与其他待散热器件贴合。并且，当其他待散热器件与第二待散热器件的厚度相等时，热管008的第二面与第二凹槽H2的开口面共面。当其他待散热器件与第二待散热器件的厚度差大于热管008的厚度时，该散热基板001的第二侧上还可以固定设置有导热垫，使热管008通过该导热垫固定在散热基板001的第二侧，以保证热管008、散热组件002和散热基板001均能够与待散热器件良好接触。
下面以图9为例，对本申请实施例提供的散热装置对其进行散热的实现过程进行说明：
如图9所示，4个第二待散热器件M1分别设置在第一待散热器件M2的两侧，散热组件002的第二面与第一待散热器件M2贴合，散热基板001的第二侧上未设置散热组件002的区域与4个第二待散热器件M1贴合，且该散热组件002的侧面与散热基板001之间存在间隙，使得第一待散热器件M2上的热量无法从散热组件002的侧面传递至第二待散热器件M1，减少了第一待散热器件M2和第二待散热器件M1之间传递的热量，减小了第一待散热器件M2和第二待散热器件M1之间的热量影响程度，因此，提高了散热装置00的散热效率。
并且，请继续参考图9，该散热组件002在散热基板001上的正投影覆盖第一待散热器件M2在散热基板001上的正投影，也即是，散热组件002的第二面中包括与第一待散热器件M2贴合的区域和未与待散热器件贴合的区域。由于散热组件002与第一待散热器件M2贴合区域中的热量可传递至该散热组件002 未与待散热器件贴合的区域中，因此，能够通过该未与第一待散热器件M2贴合的区域散热，增大了对该第一待散热器件M2进行散热的散热面积，进一步地提高了散热效率。
同时，根据4个第二待散热器件M1和第一待散热器件M2的设置位置，在散热基板001第一侧还对散热翅片进行了分区，且该散热翅片的分组方式请参考图7所示的分区方式，在第二待散热器件M1对应的第二区域(如图7或图9中区域L和区域R)和第一待散热器件M2对应的第一区域(如图7或图9中区域M)之间设置有挡板，且通过分流组件007将工质W分别输入至第一区域和第二区域，该第一区域和该第二区域中的工质W可沿着各自区域中的散热翅片003的间隙流向对应区域中的工质出口，各个区域中的工质W在散热翅片003的间隙中流动的过程中可与对应区域中的散热基板001进行热交换，且工质W流出工质出口时可将该热量带走，以实现对散热基板001的散热。
进一步地，当散热翅片003中的工质W沿图9中虚线箭头所示的方向流动时，第二区域L和第二区域R中处于工质流动方向下游的第二待散热器件M1与散热基板001之间还设置有热管008，且该热管008的另一端设置在工质流动方向的上游处，该热管008可将第二待散热器件M1上的热量传递至该温度较低的工质流动方向的上游处，实现对该下游的第二待散热器件M1的散热，进而避免上游的第二待散热器件M1的热量与下游的第二待散热器件的温度级联，以保证散热装置的有效散热。
由上可知，通过本申请实施例提供的散热装置可保证散热装置的散热效率。因此，当将该散热装置用于对合封芯片进行散热，且将散热组件用于对合封芯片中的GPU等主芯片进行散热，将散热基板的第二侧上未设置散热组件的区域用于对合封芯片中的HBM芯片等其他芯片进行散热时，相较于相关技术，能够提高对该合封芯片进行散热时的散热效率。
可选地，上述散热组件002和热管008的设置位置和数量均可以根据待散热器件的布局进行调整。例如：散热组件002和热管008在散热基板001上的相对位置可以包括：周围/中间(请参考图10)、两侧(请参考图11)、上下(请参考图12)和半包围(请参考图13和图14)等相对位置。
在对待散热器件散热时，也可以通过热管008对第一待散热器件散热，通过散热组件002对其他待散热器件散热。或者，散热装置00中也可以设置多个散热组件002，通过该多个散热组件002分别对第一待散热器件和其他待散热器件散热。或者，散热装置00中也可以设置多个热管008，通过该多个热管008分别对第一待散热器件和其他待散热器件散热。或者，散热装置00中可以设置多个热管008和多个散热组件002，可以将一个或多个热管008与一个或多个散热进行组合，并对任一待散热器件进行散热。
在散热的仿真过程中，分别通过多个散热装置00对多个服务器散热，每个服务器中均部署了NVIDIA P100型号GPU在演进功耗条件下的合封芯片，该合封芯片内部封装了功耗为420瓦的GPU(壳温规格105℃)和四个功耗为15瓦的HBM芯片(壳温规格95℃)。并且，每个散热装置00中设置的工质W均 为乙二醇水溶液，且散热翅片003间隙中设置的工质W的流量均为1L/min。其仿真结果如下：
采用相关技术中的第一散热装置对该服务器散热时，GPU对应的第一区域中工质W的温度和HBM芯片对应的第二区域中工质W的温度基本相同，两者的温度差距在1摄氏度以内。采用对工质流道分区的第二散热装置进行散热时，第一区域中工质W的温度和第二区域中工质W的温度的差值达到5摄氏度左右，相对于采用第一散热装置散热时，第二区域中工质W的温度降低了。采用本申请实施例提供的对工质流道分区且对散热基板001分区的第三散热装置00进行散热时，第一区域中工质W的温度和第二区域中工质W的温度的差值达到12摄氏度左右，相对于采用第一散热装置散热时，第二区域中工质W的温度降低了约4摄氏度，且HBM芯片的壳温降低了3-4摄氏度。
采用该第一散热装置和该第三散热装置00散热时，GPU和HBM芯片的温度请参考表2，根据表2可知：采用第一散热装置散热时，HBM芯片的壳温高于其壳温规格，采用第三散热装置00散热时，HBM芯片的壳温与其壳温规格之间存在2.9摄氏度的温度余量，因此，采用本申请实施例提供的散热装置00能够满足对GPU和HBM芯片的散热需求，提高了散热装置00的散热效率。
表2
Figure PCTCN2018118909-appb-000002
可选地，实际设计散热装置时，可以根据散热装置对待散热器件散热的仿真结果，对制造散热装置中各个组件的材料进行改进，以在保证散热效率的基础上降低改进后的散热装置的成本。例如：可以选择较低成本的材料制造散热组件，以降低改进后的散热装置的成本。
综上所述，本申请实施例提供的散热装置，该散热装置包括散热基板和散热组件，该散热组件的侧面与散热基板之间存在间隙，使得第一待散热器件上的热量无法从散热组件的侧面传递至其他待散热器件，相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板有效地为其他待散热器件散热，提高了散热装置的散热效率。
图15为本申请实施例提供的一种散热装置的制造方法的流程图，如图15所示，该散热装置的制造方法可以包括：
步骤301、提供一散热基板。
可选地，该散热基板可以由铜制成。
步骤302、在散热基板的第一侧设置多个散热翅片。
其中，散热翅片用于将散热基板上的热量散发。可选地，散热翅片可以由 铜制成。
并且，在设置散热翅片时，可以等间距或变间距设置多个散热翅片，且变间距设置翅片时，该散热翅片的变间距的实现方式可以参考前述散热装置实施例中分区设置散热翅片的几种实现方式，此处不再赘述。
步骤303、在散热基板的第二侧设置散热组件，该散热组件的第一面与散热基板固定连接，该散热组件的侧面与散热基板之间存在间隙。
其中，该散热组件内可以设置有具有腔体的结构，或者，该散热基板位于第二侧的表面与散热组件的内壁可以围成具有腔体的结构。并且，该散热组件的第二面用于与第一待散热器件贴合，以将第一待散热器件上的热量散发。且散热基板的第二侧上未设置散热组件的区域用于与其他待散热器件贴合，该第一待散热器件的发热功率大于该其他待散热器件的发热功率，该其他待散热器件为除该第一待散热器件之外的器件。并且，散热基板的第一侧与第二侧为散热基板相对设置的两侧，散热组件的第一面与第二面为散热组件上相对设置的两个表面，侧面为散热组件上除第一面和第二面外的表面。可选地，该散热组件的第一面与散热基板的第二侧可以通过焊接方式连接。
在设置散热组件时，根据第一待散热组件和其他待散热组件的厚度差，该设置散热组件的实现方式不同。示例地，当其他待散热器件与第一待散热器件的厚度差大于散热组件的厚度时，可以先在该散热基板的第二侧上固定设置导热垫，然后在导热垫远离散热基板的第一侧上设置散热组件。当其他待散热器件与第一待散热器件的厚度差小于或等于散热组件的厚度时，该在散热基板的第二侧设置散热组件的实现方式包括：在散热基板第二侧的预设位置处设置第一凹槽，将散热组件固定设置在该第一凹槽中，其中，第一凹槽的深度小于或等于散热组件沿深度所在方向上的厚度。
可选地，当散热组件设置有具有腔体的结构时，可按照上述设置散热组件的设置方式将该腔体结构设置在散热基板的第二侧上。当该散热组件为具有开口的腔体结构时，请参考图16，该步骤303的实现方式可以包括：
步骤3031、提供一侧开口的腔体结构。
可选地，该一侧开口的腔体结构可以为一侧开口的立方体、多棱柱体或圆柱体等结构，本申请实施例对其不做具体限定。
步骤3032、在散热基板第二侧的预设位置的表面和腔体结构的内部铺设铜粉。
其中，该预设位置为散热基板第二侧上预计设置散热组件的位置。
步骤3033、在腔体结构的内部安装支撑柱。
可选地，该支撑柱可以由铜制成。例如，该支撑柱可以为将铜粉注入模具，并在该模具中对铜粉进行压制并烧结后形成的柱状结构。
步骤3034、将内部铺设铜粉的腔体结构固定在散热基板第二侧的预设位置上。
将内部铺设铜粉的腔体结构固定在散热基板第二侧的预设位置上后，该一侧开口的腔体结构与散热基板位于第二侧的表面围成了封闭的腔体结构，此时， 该支撑柱的一端用于支撑围成该真空腔体的散热基板的第二侧，该支撑柱的另一端用于支撑围成该真空腔体的散热组件的位于第二侧的表面，以提高该真空腔体的耐压和抗弯折能力。
需要说明的是，当散热组件为封闭的腔体结构时，该散热组件的内部也可以安装有支撑柱，此时，该支撑柱的一端用于支撑该散热组件的第一面，该支撑柱的另一端用于支撑该散热组件的第二面。
步骤3035、对设置有腔体结构的散热基板执行烧结处理，以得到内表面设置有多孔结构的散热组件。
该多孔结构可形成真空腔体内部的毛细结构，该毛细结构提供的毛细力能够将工质固定在真空腔体远离散热基板第一侧(即真空腔体的底部)的孔中，使得工质集中受热，以加快工质的汽化过程。或者，该多孔结构可以将汽化后的工质固定在真空腔体靠近散热基板第一侧(即真空腔体的顶部)的孔中，使得汽化后的工质集中散热，以加快汽化后的工质的液化过程。并且，液化后的工质在该毛细结构提供的毛细力的作用下，可回流至真空腔体的底部，以实现工质在该真空腔体中的循环流动。
可选地，也可以在散热基板的第二侧设置热管，该热管的设置方式可相应参考散热组件的设置方式，且该热管的设置位置可以根据实际需要进行设置。示例地，当热管用于对第二待散热器件散热，且通过散热翅片间隙中的工质对第二待散热器件进行散热时，该热管的设置位置可以为：热管的一端嵌入散热基板与第二待散热器件之间，该热管的另一端设置在工质入口处(或者其他温度较低处)，该热管用于将第二待散热器件上的热量传递至工质入口处(或者其他温度较低处)。
步骤304、对腔体执行抽真空处理，该腔体为散热组件内部包括的腔体，或者，该腔体为散热组件与散热基板围成的腔体。
步骤305、向抽真空处理后的腔体内注入工质，注入的工质的体积小于腔体的体积。
其中，该工质可以为甲醇、乙二醇水溶液、制冷剂和水等换热性能较好的液体。并且，真空腔体内工质的体积V1与真空腔体的体积V2可以满足：V1＝a×V2，该a∈[0.3～0.5]。
步骤306、对注入工质后的腔体执行密封处理。
该密封处理用于维持腔体保持为真空状态，进而保证工质在腔体内部的循环流动。
需要说明的是，为了保证散热装置中热管、散热组件和散热基板第二侧上未设置热管和散热组件的区域与待散热器件的良好接触，在完成上述步骤301至步骤306之后，还可以对散热基板的底面进行铣加工，以使散热组件、热管和散热基板均能够与待散热器件良好接触。
综上所述，本申请实施例提供的散热装置的制造方法，通过该方法制造散热装置包括散热基板和散热组件，该散热组件的侧面与散热基板之间存在间隙使得第一待散热器件上的热量无法从散热组件的侧面传递至其他待散热器件， 相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板有效地为其他待散热器件散热，提高了散热装置的散热效率。
需要说明的是，本发明实施例提供的散热装置的制造方法步骤的先后顺序可以进行适当调整，步骤也可以根据情况进行相应增减，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化的方法，都应涵盖在本发明的保护范围之内，因此不再赘述。
本申请实施例提供了一种服务器，该服务器可以包括服务器机箱和散热装置，该服务器机箱中设置有第一待散热器件和其他待散热器件，该散热装置包括图1至图9任一所示的散热装置，该散热装置用于为服务器机箱中的第一待散热器件和其他待散热器件散热。
可选地，第一待散热器件和其他待散热器件封装在合封芯片中，该散热装置与合封芯片贴合。
综上所述，本申请实施例提供的服务器，该服务器包括散热装置，该散热装置用于为服务器机箱中的第一待散热器件和其他待散热器件散热，由于该散热装置包括散热基板和散热组件，该散热组件的侧面与散热基板之间存在间隙，使得第一待散热器件上的热量无法从散热组件的侧面传递至其他待散热器件，相较于相关技术，减少了热量的传递路径，减少了第一待散热器件和其他待散热器件之间传递的热量，进而减小了不同待散热器件之间的热量影响程度，能够通过散热基板有效地为其他待散热器件散热，提高了散热装置的散热效率，进而提高了服务器的工作效率。
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成，也可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。
以上所述仅为本申请的可选实施例，并不用以限制本申请，凡在本申请的原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (27)

  1. 一种散热装置，其特征在于，所述散热装置包括：散热基板、散热组件和设置在所述散热基板的第一侧上的多个散热翅片，所述散热翅片用于散发所述散热基板上的热量；
    所述散热组件的第一面固定设置在所述散热基板的第二侧，所述散热组件的侧面与所述散热基板之间存在间隙，所述散热组件的第二面用于与第一待散热器件贴合，以将所述第一待散热器件上的热量散发，所述第一侧和所述第二侧为相对设置的两侧，所述第一面与所述第二面为所述散热组件上相对设置的两个表面，所述侧面为所述散热组件上除所述第一面和所述第二面外的表面；
    所述散热基板的第二侧上未设置所述散热组件的区域用于与其他待散热器件贴合，所述第一待散热器件的发热功率大于所述其他待散热器件的发热功率，所述其他待散热器件为除所述第一待散热器件之外的器件。
  2. 根据权利要求1所述的散热装置，其特征在于，所述散热组件内设置有真空腔体，所述真空腔体内设置有工质，所述工质的体积小于所述真空腔体的体积，所述工质用于对待散热器件散热。
  3. 根据权利要求1所述的散热装置，其特征在于，所述散热基板位于所述第二侧的表面与所述散热组件的内壁围成真空腔体，所述真空腔体内设置有工质，所述工质的体积小于所述真空腔体的体积，所述工质用于对待散热器件散热。
  4. 根据权利要求2或3所述的散热装置，其特征在于，所述真空腔体的内表面设置有多孔结构。
  5. 根据权利要求4所述的散热装置，其特征在于，所述多孔结构是通过在所述内表面上铺设铜粉并对所述铜粉执行烧结处理后形成的结构。
  6. 根据权利要求2或3所述的散热装置，其特征在于，所述第一待散热器件在所述散热基板上的正投影位于所述真空腔体在所述散热基板上的正投影内部。
  7. 根据权利要求2或3所述的散热装置，其特征在于，所述真空腔体内部设置有支撑柱。
  8. 根据权利要求1至3任一所述的散热装置，其特征在于，所述散热基板的第二侧设置有第一凹槽，所述散热组件设置在所述第一凹槽中，所述散热组件的第二面与所述第一凹槽的开口面共面。
  9. 根据权利要求1至3任一所述的散热装置，其特征在于，位于第一区域中的每相邻两个散热翅片的间距小于位于第二区域中的每相邻两个散热翅片的间距，所述第一区域在所述散热基板上的正投影覆盖所述第一待散热器件在所述散热基板上的正投影，所述第二区域在所述散热基板上的正投影覆盖所述其他待散热器件在所述散热基板上的正投影。
  10. 根据权利要求1至3任一所述的散热装置，其特征在于，所述散热装置还包括：扣置在所述散热基板上的保护壳，所述保护壳包覆所述多个散热翅片，所述多个散热翅片的间隙中设置有工质。
  11. 根据权利要求10所述的散热装置，其特征在于，所述散热装置还包括：分流组件，所述分流组件用于将由工质入口输入的工质分别输入至第一区域和第二区域；
    其中，所述第一区域和所述第二区域中均设置有工质出口，所述第一区域在所述散热基板上的正投影覆盖所述散热组件在所述散热基板上的正投影，所述第二区域在所述散热基板上的正投影与所述散热组件在所述散热基板上的正投影不重叠。
  12. 根据权利要求11所述的散热装置，其特征在于，所述分流组件还用于控制所 述第一区域和所述第二区域中工质的流速，和/或，所述分流组件还用于控制所述第一区域和所述第二区域中工质的流量。
  13. 根据权利要求11或12所述的散热装置，其特征在于，所述散热基板靠近所述散热翅片的第一侧上设置有挡板，所述挡板用于阻挡第一区域中的工质与第二区域中的工质换流。
  14. 根据权利要求10所述的散热装置，其特征在于，所述散热装置还包括：热管，所述热管的一端嵌入所述散热基板与第二待散热器件之间，所述热管的另一端设置在工质入口处，所述热管用于将所述第二待散热器件上的热量传递至所述工质入口处。
  15. 根据权利要求14所述的散热装置，其特征在于，所述散热基板远离所述散热翅片的第一侧还设置有第二凹槽，所述热管设置在所述第二凹槽中，使得所述热管远离所述散热翅片的第一侧与第二凹槽的开口面共面。
  16. 根据权利要求2或3所述的散热装置，其特征在于，所述工质的体积V1与所述真空腔体的体积V2满足：V1＝a×V2，所述a∈[0.3～0.5]。
  17. 根据权利要求1至3任一所述的散热装置，其特征在于，所述第一凹槽处的散热基板的厚度小于5毫米。
  18. 根据权利要求7所述的散热装置，其特征在于，所述支撑柱由铜制成。
  19. 根据权利要求1至3任一所述的散热装置，其特征在于，所述散热组件与所述散热基板通过焊接的方式连接。
  20. 根据权利要求1至3任一所述的散热装置，其特征在于，所述第一待散热器件包括：中央处理器CPU或图形处理器GPU，所述其他待散热器件包括：高位宽存储器HBM芯片。
  21. 一种散热装置的制造方法，其特征在于，包括：
    提供一散热基板；
    在所述散热基板的第一侧设置多个散热翅片，所述散热翅片用于散发所述散热基板上的热量；
    在所述散热基板的第二侧设置散热组件，所述散热组件的第一面与所述散热基板固定连接，所述散热组件的侧面与所述散热基板之间存在间隙，所述散热组件的第二面用于与第一待散热器件贴合，以将所述第一待散热器件上的热量散发，所述第一侧和所述第二侧为相对设置的两侧，所述第一面与所述第二面为所述散热组件上相对设置的两个表面，所述侧面为所述散热组件上除所述第一面和所述第二面外的表面；
    其中，所述散热基板的第二侧上未设置所述散热组件的区域用于与其他待散热器件贴合，所述第一待散热器件的发热功率大于所述其他待散热器件的发热功率，所述其他待散热器件为除所述第一待散热器件之外的器件。
  22. 根据权利要求21所述的方法，其特征在于，所述散热组件内设置有具有腔体的结构，或者，所述散热基板位于所述第二侧的表面与所述散热组件的内壁围成具有腔体的结构，所述方法还包括：
    对所述腔体执行抽真空处理；
    向抽真空处理后的腔体内注入工质，注入的工质的体积小于所述腔体的体积，所述工质用于对待散热器件散热；
    对注入工质后的腔体执行密封处理。
  23. 根据权利要求21或22所述的方法，其特征在于，所述在所述散热基板的第二侧设置散热组件，包括：
    提供一侧开口的腔体结构；
    在所述散热基板第二侧的预设位置的表面和所述腔体结构的内部铺设铜粉；
    将内部铺设铜粉的腔体结构固定在所述散热基板第二侧的预设位置上；
    对设置有所述腔体结构的散热基板执行烧结处理，以得到内表面设置有多孔结构的散热组件。
  24. 根据权利要求23所述的方法，其特征在于，在所述将内部铺设铜粉的腔体结构固定在所述散热基板第二侧的预设位置上之前，所述方法还包括：
    在所述腔体结构的内部安装支撑柱。
  25. 根据权利要求21或22所述的方法，其特征在于，所述在所述散热基板的第二侧设置散热组件，包括：
    提供所述散热组件；
    在所述散热基板第二侧的预设位置处设置第一凹槽，所述第一凹槽的深度小于或等于所述散热组件沿所述深度所在方向上的厚度；
    将所述散热组件固定设置在所述第一凹槽中。
  26. 一种服务器，其特征在于，所述服务器包括服务器机箱和散热装置，所述服务器机箱中设置有第一待散热器件和其他待散热器件，所述散热装置包括权利要求1至20任一所述的散热装置。
  27. 根据权利要求26所述的服务器，其特征在于，所述第一待散热器件和其他待散热器件封装在合封芯片中，所述散热装置与所述合封芯片贴合。
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