WO2003070524A1 - Method for creating a conductor track on a carrier component and corresponding carrier component - Google Patents
Method for creating a conductor track on a carrier component and corresponding carrier component Download PDFInfo
- Publication number
- WO2003070524A1 WO2003070524A1 PCT/EP2003/001823 EP0301823W WO03070524A1 WO 2003070524 A1 WO2003070524 A1 WO 2003070524A1 EP 0301823 W EP0301823 W EP 0301823W WO 03070524 A1 WO03070524 A1 WO 03070524A1
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- WO
- WIPO (PCT)
- Prior art keywords
- conductor track
- carrier component
- conductor
- component
- carrier
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
Definitions
- the invention relates to a method for producing a conductor track on a carrier component, in particular on a motor vehicle carrier component, and a carrier component produced by the method.
- the aim is to have the shortest possible replacement period, that is to say the shortest possible time between ordering an end customer and delivering a motor vehicle from the production site.
- the components delivered to the production site have a high degree of prefabrication.
- the object of the invention is to enable a flexible and cost-effective method for producing a conductor track on a carrier component.
- a conductor track is applied directly to a carrier component by means of a beam-bound thermal-kinetic application or spraying method.
- a particle beam is guided relative to the carrier component.
- a conductor track is in particular a conductor track of a cable set of an on-board network in the motor vehicle sector.
- the carrier component is, for example, a molded component or part of a molded component, wherein the molded component can be any motor vehicle component that is provided for laying a cable set or for arranging electrical components.
- the molded component is, for example, a door, a door module, a semi-finished product (sheet metal) or the fitting area.
- the carrier component can be made of any material, for example metal or plastic.
- the method is not limited to the automotive sector, but is generally suitable for generating a conductor track on components from a wide variety of technical fields.
- the method is also particularly suitable for producing a conductor track in electrical household appliances and in electrical toys.
- Radiation-bound thermal-kinetic application methods are generally understood to mean application methods in which a particle stream, namely the material to be applied, in particular copper particles, is directed onto the carrier component with kinetic energy and after the supply of heat as a particle beam. Such a method is also generally referred to as thermal spraying, as it is listed in DIN 32530. A single conductor track is generated directly with the particle beam. There is therefore no need for a mask that has the desired circuit pattern reproduces and is swept over a large area by the particle stream. Apertures, electromagnetic fields or so-called encased flows can be provided for the most targeted application possible, that is, for focusing the particle beam.
- thermal is to be understood to mean that the particles of the particle stream in particular soften, melt or melt, or that they are at least heated to such an extent that they cause a thermal change in the surface of the carrier component.
- the thermal change can be a reduction in the surface hardness, softening or melting of the surface.
- kinetic is to be understood to mean that the momentum of the particles is sufficiently high that, when they hit the surface, they are at least partially pressed into this surface, which may have previously been softened.
- This method advantageously enables the conductor track to be produced directly, that is to say directly by spraying on conductive material, without the need for pretreatment or the use of chemical agents.
- the desired conductor pattern can be flexibly produced on the carrier component, depending on the desired requirement, on any desired and shaped carrier components. It is not necessary to lay individual cables or cable strands manually. Rather, a high degree of automation can be achieved. Instead of bending the individual cables, the generation of the respective conductor track takes place with the targeted guided particle beam.
- the entire vehicle electrical system of a motor vehicle can be designed quickly, flexibly and inexpensively by the method, so that a cable-free electrical system can be obtained. Due to the direct integration on the carrier component without protruding parts, the applied conductor track is also well protected against mechanical damage, for example due to a marten bite.
- a major advantage in the formation of the conductor track structure with the help of the thermal-kinetic application process is the high flexibility, since any conductor track structures can also be produced on complex molded components with the spraying process. No pretreatment of the carrier component or the use of masks or covers is required for this. In addition, the conductor track be generated quickly.
- the spraying process also has the advantage that a selective and, in particular, chemical-free treatment of the carrier component is possible.
- the beam is preferably directed through apertures, electromagnetic rays or through jacketed currents.
- several tool or spray heads are operated simultaneously in a grid arrangement. As a result, the individual conductor tracks are generated simultaneously.
- the conductor track material to be applied in particular copper, is at least partially melted during the spraying process. Due to the heat input, the surface of the carrier component preferably melts at least partially, so that the germ layer and the interconnect material bond intimately and preferably integrally.
- the layer thickness of the conductor track can be set appropriately thick by a suitable choice of the spraying parameters or by repeated painting over with a view to a sufficiently high electrical conductivity. Flame spraying enables the conductor track to be applied very quickly and economically with comparatively little technical effort.
- cold gas spraying is also suitable.
- This process is also known as beam plating.
- particles with very high kinetic energy impact the carrier component.
- the particles are partially accelerated to the speed of sound or above.
- the diameter of the particles for example copper particles, is for example in the range between 10 and 100 ⁇ m.
- cold gas spraying bulk application is possible at a high rate. Due to the high kinetic energy, comparatively low temperatures are sufficient, so that the temperature load on the carrier component and the spray material, that is to say the particles, is low. Overall, a high spray rate and a high application efficiency are possible and thick layers can be applied.
- the particles are usually carried along by a carrier gas, which is preferably an inert gas such as nitrogen. As a result, the risk of undesired oxidation of the particles is kept low, so that the conductor track produced has good conductivity.
- non-conductive impurities in particular silicon, are expediently mixed with the particle beam.
- These impurities which are preferably in the range of 0.01-1.6% by weight, have a favorable influence on the conductivity of the conductor tracks produced without changing the mechanical properties.
- the conductor track is preferably non-adhesively connected in a partial section to the carrier component.
- a large number of such sections are provided, the conductor track spanning the individual sections.
- the arrangement of sections without or with very little liability is used to compensate for tolerances. In this way, for example, different expansions between the carrier component and the conductor track caused by temperature can be compensated for without the conductor track being subjected to excessive mechanical stresses.
- the surface of the carrier component is pretreated in such a way that the conductor track only sticks in the desired sections.
- the pattern of the adhesive areas can be periodic and have, for example, a hatching character.
- the conductor track is preferably applied at least partially on a compensating layer which is floatingly connected to the carrier component, that is to say only loosely connected.
- the floating bearing of the compensation layer with the conductor track attached to it serves to compensate for tolerances when shear or shear stresses occur in the support component or also in a transition area between two support components. Due to the floating mounting of the compensation layer on the carrier component, any voltages that may occur are not or only to a small extent transferred to the conductor track, so that it is only slightly loaded and remains undamaged.
- the compensating layer is formed, for example, by a suitable rubber lacquer which separates from the carrier component after crosslinking. Adjacent to the compensation layer, the conductor track is attached to a layer firmly connected to the carrier component, for example an epoxy resin layer, or else directly on the carrier component.
- the material structure of the conductor track already applied is changed.
- the conductor track is thermally treated, in particular with a laser, or also pressure-treated.
- a further coating is expediently applied to the applied conductor track.
- This is used either in combination or in combination to increase the conductivity or as a protective layer against corrosion and / or as an insulating protective layer.
- a PU material or rubber is applied to the conductor track as a corrosion protection layer.
- the conductor track itself can also consist of a corrosion-resistant material, for example a tin-bronze alloy. This then has the advantage that the conductor track can be contacted directly at any position.
- the carrier component is treated, for example, with a liquid or with compressed air in a rinsing process.
- mechanical cleaning processes such as brushes or laser treatment are also available.
- the adhesion of the conductor track is increased by a suitable fixing process.
- the conductor track or several conductor tracks are applied in such a way that an electrical functional component is generated.
- This is for example a capacitor, a coil or a resistor.
- the conductor tracks are suitably geometrically designed.
- bankss- the conductor cross-section is varied in order to set a certain resistance.
- a corresponding capacitor area is predetermined by the conductor track or by a specific partial area of the conductor track, and the conductor track is guided in a suitable manner to produce a coil.
- the conductor tracks can also be designed as a shield.
- the functional component is preferably also designed as a safety-relevant sensor. For example, changes in capacitance of a capacitor formed by the conductor tracks in the area of a body outer panel are used as an indication of a deformation and the deployment of an airbag is initiated.
- a plurality of conductor tracks are arranged in layers one above the other.
- the conductor tracks have a sufficient distance from each other, especially in critical areas. They are therefore generated in particular in areas with a high tendency to arc, for example in contact areas, with a wide grid dimension and in safe areas with a narrow grid dimension.
- At least one additional conductor track is arranged, which serves as a sensor, for example, for the occurrence of an elevated temperature and thus an arc.
- the conductor path arranged between conductor paths with potential differences is part of a switch-off circuit, so that if an arc occurs, the affected persons
- Conductors can be separated from the power supply.
- - Contact points are preferably provided in a zigzag or sawtooth arrangement so that the creepage distance between the contact points is as large as possible and at the same time the grid of the contact points (connection grid) is kept as small as possible.
- the conductor track is not completely connected to the carrier component, but rather can be separated or lifted off from it in a separate area. This is preferably achieved in that a separating element or a separating layer is applied under the conductor track.
- an extension is applied to the carrier component, onto which the conductor track extends, so that a type of cable tail is formed.
- This cable tail is used, for example, to route the cable set from the door area to the rest of the body of the motor vehicle.
- connection conductor For simple electrical contacting of a connecting conductor, it is preferably placed with one conductor end on the area of the conductor track structure and is connected to it in an electrically conductive manner by the subsequent application of the conductor track. A direct material connection is created between the connection conductor and the conductor track, since the connection conductor is “coated” with the conductor track. A subsequent soldering process is not necessary. If the heat from the particle beam is sufficient, the end of the connection conductor does not need to be stripped Rather, insulation is destroyed when the conductor track is applied.
- the conductor ends of the connection conductors are suitably shaped for the largest possible connection and contact areas.
- the ends of the ladder are appropriately touched or busied.
- the conductor ends are preferably provided with recesses or holes, for example by punching out.
- a molded connector part is applied to the carrier component, which is then at least partially covered or coated with a portion of the conductor track.
- the molded plug part is designed as an insert made of metal or plastic, which for example has the contour of a plug pin or a socket. This contour is covered with the conductor track. In order to make contact with the conductor track, it is then only necessary to apply a correspondingly designed mating connector to this contact plug.
- plug systems can be realized in this way, in which the shape, orientation and pitch of the individual contact plugs can be chosen almost arbitrarily by appropriate design of the plug molding.
- connections and codings that are reliable and / or self-locking.
- the direct contacting of the conductor track when it is applied also offers itself when contacting component or circuit carriers with one another or for contacting connections to electrical devices such as motors, loudspeakers and the like.
- the conductor track is contacted with the circuit carrier, for example a circuit board, or a circuit carrier assembly.
- a contact element for example a contact pin
- the contact pin is either continuously conductive or has insulated areas and can also be designed in the manner of a socket. Instead of the contact pin, a contact socket or contact plates can be used, which are pressed against each other.
- contacting with the contact pin can also be achieved by pressing against the conductor track generated or by forming an insulation displacement contact or other contacts.
- an electrical component is contacted by the conductor track generated with the beam-bound application method.
- the component is arranged, for example, on a printed circuit board. This measure can replace the soldering or conductive adhesive processes commonly used today for contacting components.
- the conductor track structure of a circuit carrier is preferably generated at least partially using the beam-bound application method.
- This provides an alternative to conventional printed circuit board manufacturing for assembling printed circuit boards.
- an existing circuit board can be modified in a simple manner. This modification can be in addition to further conductor tracks or in a deposition of conductive material on an existing conductor track to increase its conductivity.
- a contact element is guided through the component and that the conductor track is contacted with the contact element on both sides.
- the conductor track is expediently in direct contact with the contact element directly during application. Since the component often separates a wet from a dry area, the contact element is expediently guided sealingly through the component.
- the contact element is designed, for example, as a metal rivet and pressed into a non-conductive component in a sealing manner.
- the contact element is preferably surrounded by an insulation layer or, for example, a rubber grommet.
- the conductor track is first applied to the carrier component and then converted to the desired final shape of the molded component by a forming process, for example by deep drawing.
- the carrier component is therefore preferably designed as a semifinished product, which is either completely planar or already pre-contoured.
- the conductor track in the forming area of the carrier component is dimensioned such that the conductor track has the desired electrical properties after the forming.
- the conductor track is applied with a greater thickness in the forming area than in the rest of the area. This prevents cracking of the conductor track during forming, for example during deep drawing, and ensures sufficient conductor track thickness in the final shape.
- the layer thickness is appropriately designed. In the automotive field, layer thicknesses of typically between 20 ⁇ m and 1 mm are applied.
- the conductor track is applied to the surface of a strand-like molded component, such as an electrical cable, a hose or a pipe.
- a strand-like molded component such as an electrical cable, a hose or a pipe.
- This offers many design options for customary strand-like molded components, and these molded components can be provided with an additional function.
- the coating is preferably applied through a plurality of spray nozzles arranged next to one another.
- a plurality of discrete conductor tracks which are run parallel to one another.
- These can also be arranged on the inner surface of a hose or pipe.
- the conductor track is applied to the inner surface, for example, during the extrusion process of a plastic hose with a suitable spray nozzle.
- the arrangement of conductor tracks on the inner surface of a pipe is useful, for example, for empty pipes for domestic installation technology, so that an electrical connection is also created via the conductor track of the empty pipe.
- the grid dimension of the seed layers for several conductor tracks is chosen closely in order to choose a large ratio of the area of the conductor tracks to the area covered during the spraying process.
- the conductor tracks are designed to be wide and low.
- the conductor tracks are preferably combined in corridors, the width of which essentially corresponds to the width of the jet during the spraying process, or the width of the jet is adapted to the width of the corridor.
- the particle beam is bundled by an enveloping beam. This measure also serves for sound insulation
- nozzles or spray heads are used for the spraying process, these are arranged in a suitable manner and in particular can be switched on and off individually.
- Excess material, in particular copper powder is removed by a cleaning process and sent for reprocessing.
- the environment during the spraying process for example a coating jet or a transport jet, is formed by an inert gas such as nitrogen.
- the object is further achieved by a carrier component to which a conductor track is applied using the method described and is integrally connected to the carrier component.
- a carrier component to which a conductor track is applied using the method described and is integrally connected to the carrier component.
- the advantages and preferred configurations listed with regard to the method can also be applied analogously to the carrier component.
- FIG. 1 shows a schematic illustration of the application method for applying a conductor track to a carrier component
- FIG. 2 shows a greatly simplified illustration of a multi-layer structure of a molded component in the manner of an exploded illustration
- FIG. 3 shows a molded component with integrated conductor tracks in a multi-layer structure
- FIG. 4A shows a top view 4B is a sectional view through the molded component according to FIG. 4A according to the section line 4B-4B
- FIG. 4B shows a sectional component with a number of integrated conductor tracks and with two integrated contact plugs
- Fig. 5 is an enlarged view of a contact area of a connecting conductor
- FIG. 6A is a sectional sectional view through a molded component with an integrated conductor track before a forming process
- FIG. 66BB shows the molded component according to FIG. 9A after a forming process
- Fig. 7 is a greatly simplified representation of a motor vehicle door as a molded component
- FIG. 8 shows a schematic illustration of a plurality of tool heads of a spraying method operated in parallel
- circuit carrier assembly consisting of two circuit carriers which are contacted with one another via contact pins
- Fig. 12 is a schematic diagram for the application of discrete conductor tracks on the outer jacket of a molded component designed as a tube.
- the carrier component 4 has a surface layer 5 which, depending on the material of the carrier component 4, is either directly the surface of the carrier component 4 or was applied as an independent surface layer in an extra process step.
- the surface layer 5 is an insulating lacquer layer.
- the conductor track 10 is applied directly to the surface of the carrier component 4. Immediate here means that no preparatory measures are necessary and that the conductor track 10 is produced directly by flame spraying.
- the material to be applied in particular copper, is heated in a nozzle 98 of a spray head and at least partially melted or melted on.
- the copper is fed to the spray head in particular as a powder, the grain size of which can cover a wide range of approximately 5 ⁇ m down to the mm range.
- the speed of the particles is in the range of m / s and can reach the speed of sound - especially with cold gas spraying.
- the particles are sprayed onto the carrier component 4 as a particle beam 82 carried by an inert carrier gas.
- An aperture 98A is provided for focusing the particle beam 82.
- the particle beam 82 therefore creates a single conductor track, the width of which is determined by the degree of focusing.
- the spray head is displaced relative to the carrier component 4, high travel speeds in the range of a few m / s (for example approximately 2-10 m / s) and above being achievable. Both the kinetics and the heat of the particles cause the sprayed-on particles to interact with the surface layer 5 such that the particles remain securely adhering to the surface.
- Flame spraying has the essential advantage that it enables a very fast and, in particular, automatable application of a complex conductor track structure on the carrier component 4.
- the surface can be pretreated, for example, by applying heat, so that the surface layer 5 is somewhat softened and the particles applied by flame spraying remain better adherent. Overall, this method can be used to replace time-consuming manual laying of individual cables in a vehicle electrical system.
- the carrier component 4 can have almost any configuration.
- FIG. 2 shows a merely square section from a molded component 2A with a multilayer structure.
- this molded component 2A it is provided that insulating layers 6 and conductive planes 8 follow one another in alternating sequence, two insulating layers 6A.6B having a discrete conductor pattern with conductor paths 10 being provided, the conductor paths 10 being applied by flame spraying.
- the conductive levels 8 can also be formed with the flame spraying.
- the multilayer structure is completed at the top by a protective layer 12.
- the conductive levels 8 are formed over a large area and without a preferred direction.
- the carrier component 4 has a separating area 14, in which the level above does not adhere.
- this separation area 14 a partial lifting of the multilayer structure applied to the carrier component 4 is possible.
- a portion 16 of the multilayer structure is therefore loose and not firmly connected to the carrier component 4.
- This loose section 16 is by a shown upward bent corner of the individual layers applied to the support member 4.
- the loose section 16 is particularly suitable, for example, for contacting a plug, since the section 16 can be easily inserted into the plug.
- a separating layer for example, is applied to the separating area 14 to produce the loose partial area 16. Their properties are chosen so that the level 6 above cannot adhere.
- a separating part is placed loosely on the separating area, the subsequent layer adhering to the separating part.
- regions can also be provided when producing the conductor track 10, in which the conductor track 10 is not adhesively connected to the carrier component 4.
- these non-adhesive sub-sections are bridged by the conductor track 10 and serve to compensate for tolerances in the case of mechanical stresses, for example due to different coefficients of thermal expansion between the conductor track 10 and the carrier component 4.
- the molded component 2B according to FIG. 3 has a multi-layer structure in which discrete conductor tracks 10 are arranged in layers on top of one another.
- the multi-layer structure creates a three-dimensional conductor pattern.
- Various of the individual conductor tracks 10 can be connected to one another by cross connections 30 in order to also implement complex wiring patterns.
- This multilayer structure is surrounded overall by a protective layer 12. This is preferably used both for insulation and for corrosion protection purposes. This is preferably a layer made of PU material.
- FIG. 4A and 4B show the design of a contact plug 56, with which the conductor tracks 10 integrated on the molded component 2 can be contacted via a plug connection, for example with a conventional cable.
- a connector molded part 52 is first applied to the carrier component 4, for example by means of an adhesive layer 50.
- the conductor tracks 10 are then produced, which are pulled over the carrier component 4 and over the plug-shaped part 52.
- a multi-layer structure can be provided.
- the molded connector part 52 is U-shaped in cross section in the exemplary embodiment and has two elongated webs 54, the length of which extends over several of the conductor tracks 10, as can be seen from FIG. 4A.
- connection conductor 58 A particularly simple way of contacting a connecting conductor 58 is shown in FIG. 5.
- the connection conductor 58 is simply placed on the carrier component 4 and then it is covered by the conductor track 10.
- the conductor ends 62 are preferably suitably shaped in order to provide the largest possible contact area.
- the conductor ends 62 are provided, for example, with recesses, windows or are chamfered or have a special profile, such as a dovetail profile.
- the molded components 2 In the automotive field, the molded components 2 often have a complex geometry with a surface that is difficult to access for a coating process. According to an embodiment explained with reference to FIGS. 6A and 6B, the conductor track 10, an entire conductor track pattern or even a complete layer structure is therefore applied to a preferably flat, planar support component 4. As an alternative to this, the carrier component 4 can also already be preformed. The molded component 2C is then converted into the desired final shape by a shaping process, as is illustrated schematically in FIG. 6B. When the conductor track 10 is applied to the initially flat carrier component 4, the conductor track 10 is dimensioned in a forming region 64 such that it has the desired electrical properties after the forming. According to the exemplary embodiment according to FIGS.
- the thickness in the forming area 64 is dimensioned such that a homogeneous and constant thickness of the conductor track 10 is achieved after the forming, as is illustrated in FIG. 6B.
- FIG. 7 shows the application of a motor vehicle door 66 as a molded component 2D.
- a cable set 68 is integrally connected to this door 66.
- the cable set 68 comprises a number of individual conductor tracks 10, via which individual electrical components 70 are connected. These electrical components are, for example, a motor for an electrical window regulator, a loudspeaker or a device for central locking.
- a control unit 72 is also arranged. The individual components 70 are controlled by the control unit 72.
- the individual conductor tracks 10 of the cable set 68 are connected, for example, directly to a body panel of the door 66 provided with an insulation layer.
- the cable set 68 can also be integrated in a so-called door module 74, which as such is connected to the door 66.
- Such a door module 74 represents a molded component and is shown in broken lines in FIG.
- One of the conductor tracks 10 shown has a tapered intermediate section 76 in which the cross-sectional area of the conductor track 10 is reduced.
- This intermediate section 76 thereby forms an electrical functional component in the sense of a resistor.
- Such functional components can be implemented in a simple manner due to the manufacturing process.
- the desired resistance can be set precisely by varying the width of the conductor track.
- the conductor tracks 10 can also be designed as antennas, capacitors or coils.
- a cable tail 78 is provided which protrudes beyond the molded component 2D.
- an extension 80 shown in dotted lines, is placed on the molded component 2D and the conductor tracks 10 are then applied to it, so that the conductor tracks 10 extend from the molded part 2D onto the extension 80.
- FIG. 2 represents a further alternative to the formation of a loose partial area 16.
- the conductor track 10 is mechanically fixed and is connected to the carrier component 4 with a very low installation height. Due to the low installation height, it is possible to also pass the conductor track 10 around the edges of a sheet under a seal. This is of interest, for example, in the case of a so-called door module carrier on which several electrical components such as window regulators, loudspeakers, etc. are integrated.
- the conductor track 10 can namely be guided around an edge under a seal which seals an outer wet area from an inner dry area. This eliminates the need to provide complex cable glands from the wet to the dry area.
- the mechanically fixed connection to the carrier component 4 also ensures a certain level of theft protection, since, for example, it is not possible to short-circuit two loose conductors.
- the conductor track 10 can be additionally covered by an in particular conductive and grounded barrier layer with the interposition of an insulation layer.
- a plurality of tool heads 97 are arranged next to one another in a grid for the simultaneous generation of a plurality of conductor tracks 10 and are displaced in the feed direction 100.
- An aperture 98A is assigned to each of the tool heads for focusing the respective particle beam 82.
- the tool heads 97 are operated simultaneously, each of which can be switched on or off individually.
- the arrangement in a grid means that several conductor tracks 10 and complex conductor track structures can be generated very quickly.
- two circuit carriers 102 forming a circuit carrier assembly are shown in an exploded view, on which components 99 connected via a conductor track structure 103 are arranged.
- the two circuit carriers 102 are plated through via contact pins 104, that is to say electrically connected to one another.
- the circuit carriers 102 are, for example, printed circuit boards or generally printed Conductor pattern formed.
- the contact pins 104 are used to contact the circuit carriers 102 with a conductor track 10 (not shown in FIG. 13), ie the conductor track 10 is guided to the contact pins 104. In particular, the contact is formed directly when the conductor track is generated. This results in a direct material connection between the conductor track 10 and the contact pins 104. Contacts to electrical components, such as motors or loudspeakers, can also be produced in the same way.
- the components 99 can advantageously also be contacted quickly and easily by flame spraying.
- the conductor track 10 generated by the flame spraying is drawn over corresponding contact feet of the components.
- the complete interconnect structure 103 can also be produced by flame spraying on the circuit carrier 102.
- a component 110 In the motor vehicle area, it is often necessary to conduct an electrical line from a wet area 106 to a dry area 108 through a component 110 (FIG. 10).
- the component 110 is, for example, a door panel or a door lining.
- the passage of the line through the component 110 must be sealed against moisture.
- rubber grommets are provided for this purpose, through the cavity of which individual wire lines are guided.
- FIG. 10 shows two alternative configurations of a contact element 112A.B.
- the contact element 112A shown in the lower half of the figure is designed as a solid rivet which is passed directly through the component 110.
- the contact element 112B to the component 110 is sealed once more, for example with an insulating or rubber sleeve 114.
- the contact element 112B is passed through the rubber sleeve 114.
- the rubber sleeve 114 is required in particular when the component 110 itself is conductive, so that the contact element 112B must be insulated from the component 110.
- Conductor tracks 10 are contacted directly on both sides of the contact elements 112A.B, so that there is an electrical connection from the wet area 106 into the dry area 108.
- a conductor track 10 is guided over the joint area of two adjoining molded components 2F.
- the conductor track 10 is applied to a compensating layer 116, which is only floatingly supported on the two molded components 2E, that is to say it lies only loosely thereon.
- the conductor track 10 is firmly connected to the respective molded components 2E. If a shear stress in the transverse direction 118 occurs between the two molded components 2E, for example due to mechanical or thermal stresses, this shear stress is absorbed by the, in particular, flexible compensation layer 116 and is not transmitted to the conductor track 10.
- the compensating layer 116 is, in particular, a rubber lacquer which has been detached from the carrier components 4 of the respective molded components 2E by appropriate subsequent treatment, in particular crosslinking.
- the conductor track 10 can also be applied to strand-shaped, non-planar molded components 2F. 16, a hose 120 is provided as a carrier component for the application of the conductor track 10. A total of three conductor tracks 10 are applied to the outside of the hose 120 by a spraying process. For this purpose, nozzles 98 are arranged around the hose 120 at 120 ° intervals, from which the particle jet 82 emerges.
- the hose is, for example, the outer sheath of a conventional cable, in particular a foamed cable.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003221487A AU2003221487A1 (en) | 2002-02-22 | 2003-02-22 | Method for creating a conductor track on a carrier component and corresponding carrier component |
DE10390587T DE10390587D2 (en) | 2002-02-22 | 2003-02-22 | Method for producing a conductor track on a carrier component and carrier component |
EP03717193A EP1478551A1 (en) | 2002-02-22 | 2003-02-22 | Method for creating a conductor track on a carrier component and corresponding carrier component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002107589 DE10207589A1 (en) | 2002-02-22 | 2002-02-22 | Method for producing a conductor track on a carrier component and carrier component |
DE10207589.1 | 2002-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003070524A1 true WO2003070524A1 (en) | 2003-08-28 |
Family
ID=27740335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/001823 WO2003070524A1 (en) | 2002-02-22 | 2003-02-22 | Method for creating a conductor track on a carrier component and corresponding carrier component |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1478551A1 (en) |
AU (1) | AU2003221487A1 (en) |
DE (2) | DE10207589A1 (en) |
WO (1) | WO2003070524A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006034767A1 (en) * | 2004-09-29 | 2006-04-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Electrical assembly and method for the production of an electrical assembly |
FR2878069A1 (en) * | 2004-11-15 | 2006-05-19 | Plastic Omnium Cie | Plastic panel for use as e.g. rear casement of motor vehicle, has electric conduction unit including band made of conducting material, placed on surface of panel by projecting fusion material in form of thin droplets on panel |
WO2006082170A1 (en) | 2005-02-02 | 2006-08-10 | Siemens Aktiengesellschaft | Cold gas spraying method |
DE102006032440A1 (en) * | 2006-07-13 | 2008-01-17 | Siemens Ag | High-current conductor, in particular for an electric arc furnace, and method for forming a high-current conductor |
WO2008113304A1 (en) | 2007-03-19 | 2008-09-25 | Buhmann, Robert | Panel devices comprising electric circuit boards and method for the production thereof |
DE102008051921A1 (en) | 2007-11-02 | 2009-05-14 | Gfe Fremat Gmbh | Multilayer system with contact elements and method for creating a contact element for a multilayer system |
WO2013110416A1 (en) * | 2012-01-24 | 2013-08-01 | Robert Bosch Gmbh | Gearbox control module with oil-resistant conductor paths |
WO2019030254A1 (en) * | 2017-08-10 | 2019-02-14 | Siemens Aktiengesellschaft | Method for producing a power module |
AT523652A4 (en) * | 2020-02-28 | 2021-10-15 | Lkr Leichtmetallkompetenzzentrum Ranshofen Gmbh | Process for the production of a multi-layer functional component as well as a functional component |
Families Citing this family (9)
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DE10352829A1 (en) * | 2003-11-12 | 2005-06-23 | Hilti Ag | Commutator for commutator motors has supporting body consisting glass, e.g. transparent, bright glass, with electrically conductive segments on external peripheral surface; supporting body can be section of glass tube |
DE102004055534B4 (en) * | 2004-11-17 | 2017-10-05 | Danfoss Silicon Power Gmbh | Power semiconductor module with an electrically insulating and thermally highly conductive layer |
DE102006015198A1 (en) * | 2006-04-01 | 2007-10-11 | Semikron Elektronik Gmbh & Co. Kg | Connecting device for electronic components |
DE102007019329A1 (en) * | 2007-04-24 | 2008-10-30 | Innovaris Gmbh & Co. Kg | Components produced by thermal spraying from predominantly metallic materials |
DE102008009106B4 (en) * | 2008-02-14 | 2010-04-08 | Behr-Hella Thermocontrol Gmbh | Printed circuit board for electrical circuits |
DE102011002872B4 (en) * | 2011-01-19 | 2018-11-15 | Federal-Mogul Sealing Systems Gmbh | Method for producing a cylinder head gasket and cylinder head gasket produced thereby |
DE102012214264A1 (en) * | 2012-08-10 | 2014-02-13 | Robert Bosch Gmbh | Printed circuit board, has releasing agent layer formed such that substrate layer in region of agent layer is removed from electrical conductive layer while electrical conductive contact is formed in region of printed circuit board edge |
DE102016219568A1 (en) * | 2016-10-07 | 2017-11-16 | Continental Automotive Gmbh | Method for producing a circuit arrangement and circuit arrangement |
DE102023101372B3 (en) | 2023-01-20 | 2024-03-28 | Audi Aktiengesellschaft | Electronic arrangement, motor vehicle and method for electrical connection |
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DE19502044A1 (en) * | 1995-01-12 | 1996-07-18 | Lars Ickert | Manufacturing multiple layer two=dimensional and three=dimensional circuit boards |
WO1999061282A1 (en) | 1998-05-27 | 1999-12-02 | Lear Corporation | Trim panel having grooves with integrally formed electrical circuits |
WO2000007850A1 (en) * | 1998-08-05 | 2000-02-17 | Lear Automotive Dearborn, Inc. | Trim panel having electrical connectors |
US6161889A (en) * | 1998-10-26 | 2000-12-19 | Lear Automotive Dearborn, Inc. | Ribbed trim panel for thermal spraying of electrical circuit |
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DE1665852A1 (en) * | 1967-01-20 | 1971-01-28 | Siemens Ag | Process for the production of curved electrical circuit boards |
WO1994007611A1 (en) * | 1992-10-01 | 1994-04-14 | Motorola, Inc. | Method for forming circuitry by a spraying process with stencil |
JP2000244100A (en) * | 1999-02-24 | 2000-09-08 | Yazaki Corp | Flame spray circuit body and its manufacture |
DE10109087A1 (en) * | 2001-02-24 | 2002-10-24 | Leoni Bordnetz Sys Gmbh & Co | Method for producing a molded component with an integrated conductor track |
-
2002
- 2002-02-22 DE DE2002107589 patent/DE10207589A1/en not_active Withdrawn
-
2003
- 2003-02-22 EP EP03717193A patent/EP1478551A1/en not_active Withdrawn
- 2003-02-22 WO PCT/EP2003/001823 patent/WO2003070524A1/en not_active Application Discontinuation
- 2003-02-22 AU AU2003221487A patent/AU2003221487A1/en not_active Abandoned
- 2003-02-22 DE DE10390587T patent/DE10390587D2/en not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19502044A1 (en) * | 1995-01-12 | 1996-07-18 | Lars Ickert | Manufacturing multiple layer two=dimensional and three=dimensional circuit boards |
WO1999061282A1 (en) | 1998-05-27 | 1999-12-02 | Lear Corporation | Trim panel having grooves with integrally formed electrical circuits |
US6106303A (en) * | 1998-05-27 | 2000-08-22 | Lear Automotive Dearborn, Inc. | Trim panel having grooves with integrally formed electrical circuits |
WO2000007850A1 (en) * | 1998-08-05 | 2000-02-17 | Lear Automotive Dearborn, Inc. | Trim panel having electrical connectors |
US6161889A (en) * | 1998-10-26 | 2000-12-19 | Lear Automotive Dearborn, Inc. | Ribbed trim panel for thermal spraying of electrical circuit |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006034767A1 (en) * | 2004-09-29 | 2006-04-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Electrical assembly and method for the production of an electrical assembly |
FR2878069A1 (en) * | 2004-11-15 | 2006-05-19 | Plastic Omnium Cie | Plastic panel for use as e.g. rear casement of motor vehicle, has electric conduction unit including band made of conducting material, placed on surface of panel by projecting fusion material in form of thin droplets on panel |
US8021715B2 (en) | 2005-02-02 | 2011-09-20 | Siemens Aktiengesellschaft | Cold gas spraying method |
WO2006082170A1 (en) | 2005-02-02 | 2006-08-10 | Siemens Aktiengesellschaft | Cold gas spraying method |
DE102006032440A1 (en) * | 2006-07-13 | 2008-01-17 | Siemens Ag | High-current conductor, in particular for an electric arc furnace, and method for forming a high-current conductor |
WO2008113304A1 (en) | 2007-03-19 | 2008-09-25 | Buhmann, Robert | Panel devices comprising electric circuit boards and method for the production thereof |
DE102008051921A1 (en) | 2007-11-02 | 2009-05-14 | Gfe Fremat Gmbh | Multilayer system with contact elements and method for creating a contact element for a multilayer system |
US8728572B2 (en) | 2007-11-02 | 2014-05-20 | Interpane Entwicklungs-Und Beratungsgesellschaft Mbh | Method for constructing contact element for multi-layer system |
DE102008051921B4 (en) | 2007-11-02 | 2023-02-16 | Gfe Fremat Gmbh | Layer system and method for creating a contact element for a layer system |
WO2013110416A1 (en) * | 2012-01-24 | 2013-08-01 | Robert Bosch Gmbh | Gearbox control module with oil-resistant conductor paths |
WO2019030254A1 (en) * | 2017-08-10 | 2019-02-14 | Siemens Aktiengesellschaft | Method for producing a power module |
AT523652A4 (en) * | 2020-02-28 | 2021-10-15 | Lkr Leichtmetallkompetenzzentrum Ranshofen Gmbh | Process for the production of a multi-layer functional component as well as a functional component |
AT523652B1 (en) * | 2020-02-28 | 2021-10-15 | Lkr Leichtmetallkompetenzzentrum Ranshofen Gmbh | Process for the production of a multi-layer functional component as well as a functional component |
Also Published As
Publication number | Publication date |
---|---|
DE10390587D2 (en) | 2004-11-18 |
EP1478551A1 (en) | 2004-11-24 |
DE10207589A1 (en) | 2003-10-16 |
AU2003221487A1 (en) | 2003-09-09 |
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