DE19502044A1 - Manufacturing multiple layer two=dimensional and three=dimensional circuit boards - Google Patents

Manufacturing multiple layer two=dimensional and three=dimensional circuit boards

Info

Publication number
DE19502044A1
DE19502044A1 DE19502044A DE19502044A DE19502044A1 DE 19502044 A1 DE19502044 A1 DE 19502044A1 DE 19502044 A DE19502044 A DE 19502044A DE 19502044 A DE19502044 A DE 19502044A DE 19502044 A1 DE19502044 A1 DE 19502044A1
Authority
DE
Germany
Prior art keywords
manufacturing
metal
sprayed onto
melting point
dimensional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19502044A
Other languages
German (de)
Inventor
Lars Ickert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19502044A priority Critical patent/DE19502044A1/en
Publication of DE19502044A1 publication Critical patent/DE19502044A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

In the manufacturing process for making conductive connections or tracks, fluid metal and fluid plastic is sprayed onto a substrate and sticks to it. The spray nozzle and the substrate are moved relative to each other, as required. The beam of metal is preferably homogeneous and is incident on the substrate without mixing with the surrounding gases. Preferably, the metal is sprayed on a material with a lower or equal melting point. Alternatively, it may be sprayed on a material with a higher melting point. The metal is preferably sprayed in an inert gas atmosphere. Using this method, several conductive tracks may be formed. Individual planes are connected by spraying over and, if desired, using additional heat sources.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung mehrlagiger 2D (Fig. 1) und 3D (Fig. 2)-Leiterplatten mittels Urformen d. h. Aufspritzen der Leiter- und Isolationswerkstoffe sowie zum Befestigen der Bauelemente (elektrisch leitend oder isolierend) auf einer Leiteplatte.The invention relates to a method for producing multilayer 2D ( FIG. 1) and 3D ( FIG. 2) printed circuit boards by means of master forms, that is to say by spraying on the conductor and insulation materials, and for fastening the components (electrically conductive or insulating) on a printed circuit board.

Stand der TechnikState of the art

Gegenwärtig werden einlagige Leiterplatten größtenteils subtraktiv durch Ätzen hergestellt, wobei auch bei Mustern zunächst eine Belichtungsmaske erstellt werden muß. Mehrlagige Leiterplatten (Multilayer) werden entweder auf ähnlichem Wege hergestellt und mittels komplexer Technologien miteinander verbunden sowie durchkontaktiert oder mittels des Multiwire-Verfahrens hergestellt.Currently, single layer circuit boards are mostly subtractively made by etching, an exposure mask must also be created for patterns. Multi-layer printed circuit boards (multilayer) are either manufactured in a similar way and connected with each other by means of complex technologies or plated through or by means of of the Multiwire process.

Weiterhin ist es noch möglich für Muster Universalleiterplatten zu benutzen und diese nach Bedarf zu konfigurieren.Furthermore, it is still possible to use universal printed circuit boards for samples and these Configure needs.

Nachteile gängiger VerfahrenDisadvantages of common procedures

Die Umweltbelastung durch in der Galvanik verwendete Chemikalien ist hoch.The environmental impact of chemicals used in electroplating is high.

Subtraktive und semiadditive Verfahren nutzen nur einen geringen Teil des aufgebrachten Werkstoffes.Subtractive and semi-additive processes use only a small part of the applied material.

Die Erstellung von Mustern ist aufwendig (Ätzmaske . . . ) und im Bereich der MID so gar fast unmöglich.The creation of patterns is complex (etching mask...) And so in the field of MID almost impossible.

Gängige Verfahren der Musterherstellung sind entweder sehr teuer (z. B. Multiwire) oder mit Nachteilen im Layout verbunden, da z. B. Universalleiterplatten unnütze Strukturen aufweisen, wodurch evtl. störende Kapazitäten etc. entstehen, und auch nicht mit dem Layout der serienmäßig gefertigten Leiterplatte übereinstimmen.Common pattern making processes are either very expensive (e.g. Multiwire) or associated with disadvantages in the layout, because e.g. B. Universal circuit boards useless Have structures, which can create disruptive capacities etc., and also do not match the layout of the standard printed circuit board.

Die Auswahl der Materialien ist durch die Technologischen Anforderungen begrenzt.The choice of materials is limited by the technological requirements.

Ziel und Aufgabe der Erfindung ist es, ein Fertigungsverfahren anzugeben, das die o.g. Nachteile mindert oder beseitigt und die konstruktiven Möglichkeiten erweitert. The aim and object of the invention is to provide a manufacturing process that the above. Reduces or eliminates disadvantages and extends the design options.  

Vorteile des Vorgeschlagenen FertigungsverfahrensAdvantages of the proposed manufacturing process

Umweltschonende Fertigung von Leiterplatten ohne Einsatz Chemischer Prozesse.Environmentally friendly production of printed circuit boards without the use of chemical processes.

Äußerst Flexible Fertigung von Mustern und Kleinserien.Extremely flexible production of samples and small series.

Geringe Kosten für die Anschaffung einer entsprechenden universellen Anlage.Low costs for the purchase of a corresponding universal system.

Eine direkte Anbindung an ein CAD-System ist einfach möglich.A direct connection to a CAD system is easily possible.

Die Auswahl an Trägermaterialien ist sehr vielfältig, so daß auch niedrigschmelzende Kunststoffe und Naturstoffe wie z. B. selbst Holz als Trägermaterial in Frage kommen.The selection of carrier materials is very diverse, so that even low-melting ones Plastics and natural materials such as B. even wood as a substrate.

Die Herstellung von 3D-Leiterplatten (MID) ist auch mit "alten", d. h. ansonsten für diese Technik nicht geeigneten Spritzgußteilen möglich.The production of 3D printed circuit boards (MID) is also possible with "old", i.e. H. otherwise for this technique is not suitable for injection molded parts.

Ein Durchkontaktieren verschiedener Ebenen in nachfolgenden Prozeßschritten ist nicht mehr nötig.Through-contacting of different levels in subsequent process steps is necessary no longer necessary.

Weitere MöglichkeitenMore options

Wenn es gelingt, Bauteile fest haftend mit einem hochschmelzenden "Lot" zu verbinden (z. B. Kupferlegierung) wird es möglich Baugruppen herzustellen, welche eine höhere mechanische Stabilität aufweisen, als dies mit Zinnlegierungen möglich ist. Die Thermische Belastung ist dabei durch die lokale Erwärmung der Bauteile gering.When it is possible to bond components firmly with a high-melting "solder" (e.g. copper alloy) it is possible to manufacture assemblies that have a higher have mechanical stability than is possible with tin alloys. The thermal The local heating of the components means that the load is low.

Erweist es sich als möglich, mittels Mikromechanischer Techniken Spritzdüsenanordnungen herzustellen, so ist auch ein Einsatz in der Serienfertigung möglich.It has been found possible to use spray nozzle arrangements using micromechanical techniques manufacture, it can also be used in series production.

Claims (11)

1. Fertigungsverfahren zur Herstellung leitender Verbindungen bzw. von Leiterbahnen, dadurch gekennzeichnet, daß flüssiges Metall und flüssiger Kunststoff auf einen Trägerkörper gespritzt wird und auf diesem haftet, wobei Spritzdüse und Trägermaterial zweckentsprechend relativ zueinander bewegt werden.1. Manufacturing process for the production of conductive connections or conductor tracks, characterized in that liquid metal and liquid plastic is sprayed onto and adheres to a carrier body, the spray nozzle and carrier material being appropriately moved relative to one another. 2. Fertigungsverfahren zur leitenden und/oder isolierenden Verbindung von Bauteilen auf einem Trägermaterial, gekennzeichnet dadurch, daß nach Anspruch 1 verfahren wird.2. Manufacturing process for the conductive and / or insulating connection of components a carrier material, characterized in that the procedure according to claim 1. 3. Fertigungsverfahren nach Anspruch 1 und 2, dadurch gekennzeichnet, daß der Metallstrahl in sich homogen ist und ohne eine Durchmischung mit den Umgebungsgasen auf den Trägerkörper auftrifft.3. Manufacturing method according to claim 1 and 2, characterized in that the Metal jet is homogeneous in itself and without mixing with the Ambient gases strikes the carrier body. 4. Fertigungsverfahren nach Anspruch 1 und 2, dadurch gekennzeichnet, daß der Metallstrahl in Tröpfchenform auf den Trägerkörper auftrifft.4. Manufacturing method according to claim 1 and 2, characterized in that the Metal beam in droplet form strikes the carrier body. 5. Fertigungsverfahren nach Anspruch 1 bis 4, dadurch gekennzeichnet, daß das Metall auf einen Werkstoff mit niedrigerem oder gleichem Schmelzpunkt aufgespritzt wird.5. Manufacturing method according to claim 1 to 4, characterized in that the metal is sprayed onto a material with a lower or the same melting point. 6. Fertigungsverfahren nach Anspruch 1 bis 4, dadurch gekennzeichnet, daß das Metall auf einen Werkstoff mit höherem Schmelzpunkt aufgespritzt wird.6. Manufacturing method according to claim 1 to 4, characterized in that the metal is sprayed onto a material with a higher melting point. 7. Fertigungsverfahren nach Anspruch 1 bis 6, dadurch gekennzeichnet, daß das Aufspritzen des Metalls in einer inerten Gasatmosphäre stattfindet.7. Manufacturing method according to claim 1 to 6, characterized in that the Spraying of the metal takes place in an inert gas atmosphere. 8. Fertigungsverfahren nach Anspruch 1 bis 7, dadurch gekennzeichnet, daß mehrere Leiterbahnebenen auf diese Weise aufgebracht werden, wobei die Kontaktierung der einzelnen Ebenen durch Überspritzen und erforderlichenfalls unter Zuhilfenahme einer zusätzlichen Wärmequelle wie z. B. eines Laserstrahls erfolgt und eine Isolation sich kreuzender Leiterbahnen mittels Kunststoff, welcher ebenfalls flüssig aufgebracht wird, erfolgt.8. Manufacturing method according to claim 1 to 7, characterized in that several Conductor levels are applied in this way, the contacting of the individual layers by overmolding and, if necessary, with the help of a additional heat source such. B. a laser beam and isolation itself crossing interconnects using plastic, which is also liquid is applied. 9. Fertigungsverfahren nach Anspruch 1 bis 8, dadurch gekennzeichnet, daß der Kunststoffstrahl/Metallstrahl kontinuierlich oder Abschnittweise kontinuierlich aufgebracht wird (Plotterprinzip).9. Manufacturing method according to claim 1 to 8, characterized in that the Plastic jet / metal jet continuously or in sections continuously is applied (plotter principle). 10. Fertigungsverfahren nach Anspruch 1 bis 9, dadurch gekennzeichnet, daß das Material mittels mehrerer Spritzdüsen aufgebracht wird, die nebeneinander angeordnet sind und nacheinander in Position gebracht oder aktiviert werden (Rasterdruckerprinzip, z. B. Tintenstrahldrucker).10. Manufacturing method according to claim 1 to 9, characterized in that the material is applied by means of several spray nozzles which are arranged next to one another and be successively positioned or activated (Raster printer principle, e.g. inkjet printer). 11. Fertigungsverfahren nach Anspruch 1 bis 10, dadurch gekennzeichnet, daß als Isolierlage zwischen Leiterbahnebenen eine Isolierfolie aufgebracht wird, welche an den durchzukontaktierenden Stellen mechanisch mittels Laserstrahl, mittels des Metallstrahls oder auf anderem Wege durchbrochen wird oder die schon vor dem Aufbringen an den entsprechenden Stellen perforiert wurde.11. Manufacturing method according to claim 1 to 10, characterized in that as Insulating layer between conductor levels an insulating film is applied, which the points to be contacted mechanically by means of a laser beam, by means of the Metal beam or is broken in some other way or before the Application was perforated at the appropriate places.
DE19502044A 1995-01-12 1995-01-12 Manufacturing multiple layer two=dimensional and three=dimensional circuit boards Withdrawn DE19502044A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19954973A1 (en) * 1999-11-16 2001-03-15 Bayerische Motoren Werke Ag Process for applying conducting pathways to plastic surfaces, e.g. in vehicles comprises applying a melt acting in the cold state as conducting pathways onto the plastic surface, and applying an insulating material to the melt
GB2358965A (en) * 1999-10-13 2001-08-08 Yazaki Corp Three dimensional circuit body and method of manufacturing the same
EP1225795A2 (en) * 2001-01-19 2002-07-24 Yazaki Corporation Method and apparatus for forming electric circuit
WO2002068245A1 (en) * 2001-02-24 2002-09-06 Leoni Ag Method for producing a moulded component comprising an integrated conductor strip and moulded component
WO2003070524A1 (en) * 2002-02-22 2003-08-28 Leoni Ag Method for creating a conductor track on a carrier component and corresponding carrier component
DE10209414A1 (en) * 2002-03-05 2003-10-02 Siemens Ag Contactless high frequency signal transmission unit for car steering columns has printed circuit coils molded into plastic support
DE10231248A1 (en) * 2002-07-11 2004-02-12 Moeller Gmbh Trigger system for an electrical circuit breaker that responds to overload and has a heated bimetallic sensor system coupled to a contact actuator
DE10317879A1 (en) * 2003-04-17 2004-11-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. System for manufacturing molded interconnect device (MID) with at least one conductive path, with MID containing substrate surface of thermally softening, electrically insulating material for conductive path location
EP1547126A2 (en) * 2002-08-05 2005-06-29 The Research Foundation Of State University Of New York System and method for manufacturing embedded conformal electronics
US7062849B2 (en) 2001-10-03 2006-06-20 Yazaki Corporation Method for producing circuitry using molten metal droplets
CN101909399A (en) * 2009-06-04 2010-12-08 晟铭电子科技股份有限公司 Circuit board structure and manufacture method thereof
WO2013113994A1 (en) * 2012-01-30 2013-08-08 Stora Enso Oyj Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2358965A (en) * 1999-10-13 2001-08-08 Yazaki Corp Three dimensional circuit body and method of manufacturing the same
US6384345B1 (en) 1999-10-13 2002-05-07 Yazaki Corporation Three dimensional circuit body and method of manufacturing the same
GB2358965B (en) * 1999-10-13 2002-05-15 Yazaki Corp Three dimensional circuit body and method of manufacturing the same
DE19954973A1 (en) * 1999-11-16 2001-03-15 Bayerische Motoren Werke Ag Process for applying conducting pathways to plastic surfaces, e.g. in vehicles comprises applying a melt acting in the cold state as conducting pathways onto the plastic surface, and applying an insulating material to the melt
EP1225795A3 (en) * 2001-01-19 2005-07-13 Yazaki Corporation Method and apparatus for forming electric circuit
EP1225795A2 (en) * 2001-01-19 2002-07-24 Yazaki Corporation Method and apparatus for forming electric circuit
US7833567B2 (en) 2001-01-19 2010-11-16 Yazaki Corporation Method for forming electrical circuit by jetting molten metal
WO2002068245A1 (en) * 2001-02-24 2002-09-06 Leoni Ag Method for producing a moulded component comprising an integrated conductor strip and moulded component
US7062849B2 (en) 2001-10-03 2006-06-20 Yazaki Corporation Method for producing circuitry using molten metal droplets
WO2003070524A1 (en) * 2002-02-22 2003-08-28 Leoni Ag Method for creating a conductor track on a carrier component and corresponding carrier component
DE10209414A1 (en) * 2002-03-05 2003-10-02 Siemens Ag Contactless high frequency signal transmission unit for car steering columns has printed circuit coils molded into plastic support
DE10231248A1 (en) * 2002-07-11 2004-02-12 Moeller Gmbh Trigger system for an electrical circuit breaker that responds to overload and has a heated bimetallic sensor system coupled to a contact actuator
EP1547126A2 (en) * 2002-08-05 2005-06-29 The Research Foundation Of State University Of New York System and method for manufacturing embedded conformal electronics
DE10317879A1 (en) * 2003-04-17 2004-11-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. System for manufacturing molded interconnect device (MID) with at least one conductive path, with MID containing substrate surface of thermally softening, electrically insulating material for conductive path location
CN101909399A (en) * 2009-06-04 2010-12-08 晟铭电子科技股份有限公司 Circuit board structure and manufacture method thereof
WO2013113994A1 (en) * 2012-01-30 2013-08-08 Stora Enso Oyj Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
US10085350B2 (en) 2012-01-30 2018-09-25 Stora Enso Oyj Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed

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