WO2003058713A3 - Chipmodul für chipkarten - Google Patents

Chipmodul für chipkarten Download PDF

Info

Publication number
WO2003058713A3
WO2003058713A3 PCT/DE2003/000011 DE0300011W WO03058713A3 WO 2003058713 A3 WO2003058713 A3 WO 2003058713A3 DE 0300011 W DE0300011 W DE 0300011W WO 03058713 A3 WO03058713 A3 WO 03058713A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
module
cards
card body
card
Prior art date
Application number
PCT/DE2003/000011
Other languages
English (en)
French (fr)
Other versions
WO2003058713A2 (de
Inventor
Hans-Georg Mensch
Original Assignee
Infineon Technologies Ag
Hans-Georg Mensch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Hans-Georg Mensch filed Critical Infineon Technologies Ag
Priority to EP03729206A priority Critical patent/EP1464081A2/de
Publication of WO2003058713A2 publication Critical patent/WO2003058713A2/de
Publication of WO2003058713A3 publication Critical patent/WO2003058713A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Im Bereich der Verbindungsstelle zwischen dem Chipmodul und dem Kartenkörper einer Chipkarte ist der Chipträger (1) mit einer als Verstärkung (3) vorgesehenen und gegebenenfalls strukturierten Schicht versehen. Das ermöglicht im Bereich der Verbindung des Chipmoduls mit dem Kartenkörper eine selektive Anpassung der mechanischen Eigenschaften und der Oberflächeneigenschaften des Chipträgers an den Befestigungsrand des Kartenkörpers. Die Schicht auf dem Befestigungsrand des Chipträgers kann insbesondere eine dort auf der dem Kartenkörper zugewandten Seite des Chipträgers aufgebrachte Metallisierung sein.
PCT/DE2003/000011 2002-01-08 2003-01-07 Chipmodul für chipkarten WO2003058713A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP03729206A EP1464081A2 (de) 2002-01-08 2003-01-07 Chipmodul

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002100382 DE10200382B4 (de) 2002-01-08 2002-01-08 Chipmodul für Chipkarten
DE10200382.3 2002-01-08

Publications (2)

Publication Number Publication Date
WO2003058713A2 WO2003058713A2 (de) 2003-07-17
WO2003058713A3 true WO2003058713A3 (de) 2004-02-26

Family

ID=7711643

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000011 WO2003058713A2 (de) 2002-01-08 2003-01-07 Chipmodul für chipkarten

Country Status (4)

Country Link
EP (1) EP1464081A2 (de)
CN (1) CN100380638C (de)
DE (1) DE10200382B4 (de)
WO (1) WO2003058713A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004029585A1 (de) * 2004-06-18 2006-01-19 Infineon Technologies Ag Chip-Package
DE602005021515D1 (de) 2004-09-02 2010-07-08 Nxp Bv Identifizierungsdokument mit kontaktlosem rfid-chip
DE102005002733B4 (de) * 2005-01-20 2016-05-12 Giesecke & Devrient Gmbh Tragbarer Datenträger
DE102006061943B4 (de) 2006-12-29 2023-03-30 Pictiva Displays International Limited Lichtemittierende Vorrichtung
US8830695B2 (en) 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
DE102007012504B4 (de) * 2007-01-25 2022-02-10 Osram Oled Gmbh Elektronische Vorrichtung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952545A1 (de) * 1997-10-16 1999-10-27 Citizen Watch Co., Ltd. Ic-karte
JP2000058705A (ja) * 1998-08-12 2000-02-25 Hitachi Ltd 半導体装置およびその製造方法
EP1014445A1 (de) * 1998-12-24 2000-06-28 Shinko Electric Industries Co. Ltd. Trägersubstrat für Halbleiteranordnung
JP2000232179A (ja) * 1999-02-10 2000-08-22 Shinko Electric Ind Co Ltd Ｐｇａ型電子部品用基板、その製造方法及び半導体装置
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2644630B1 (fr) * 1989-03-20 1994-05-27 Sgs Thomson Microelectronics Procede d'encartage de micromodules et son application a la realisation de cartes a puces
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
JPH05139082A (ja) * 1991-11-19 1993-06-08 Hitachi Ltd 電子装置
JPH0976678A (ja) * 1995-09-20 1997-03-25 Dainippon Printing Co Ltd Ｉｃカード用ｉｃモジュールおよびｉｃカード
DE19623826C2 (de) * 1996-06-14 2000-06-15 Siemens Ag Verfahren zur Herstellung eines Trägerelements für Halbleiterchips

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952545A1 (de) * 1997-10-16 1999-10-27 Citizen Watch Co., Ltd. Ic-karte
JP2000058705A (ja) * 1998-08-12 2000-02-25 Hitachi Ltd 半導体装置およびその製造方法
EP1014445A1 (de) * 1998-12-24 2000-06-28 Shinko Electric Industries Co. Ltd. Trägersubstrat für Halbleiteranordnung
JP2000232179A (ja) * 1999-02-10 2000-08-22 Shinko Electric Ind Co Ltd Ｐｇａ型電子部品用基板、その製造方法及び半導体装置
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 11 3 January 2001 (2001-01-03) *
See also references of EP1464081A2 *

Also Published As

Publication number Publication date
EP1464081A2 (de) 2004-10-06
DE10200382A1 (de) 2003-07-24
CN1613149A (zh) 2005-05-04
DE10200382B4 (de) 2006-05-04
WO2003058713A2 (de) 2003-07-17
CN100380638C (zh) 2008-04-09

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