CN100380638C - 芯片模块 - Google Patents
芯片模块 Download PDFInfo
- Publication number
- CN100380638C CN100380638C CNB038020394A CN03802039A CN100380638C CN 100380638 C CN100380638 C CN 100380638C CN B038020394 A CNB038020394 A CN B038020394A CN 03802039 A CN03802039 A CN 03802039A CN 100380638 C CN100380638 C CN 100380638C
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- Prior art keywords
- chip
- stiffener
- edge
- chip carrier
- chip module
- Prior art date
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- Expired - Fee Related
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
在该芯片模块及该芯片卡的卡片本体间的连接点的区域,该芯片载体(1)被提供有具意欲用做加强(3)及可被图样化的层。此使得在该芯片模块至该卡片本体的连接区域,该机械性质及该卡片载体的表面性质可被选择性地适用于该卡片本体的接触边缘。在该卡片载体的接触边缘的层可特别为施用在面对该卡片本体的该芯片载体侧的金属化。
Description
技术领域
本发明涉及芯片卡的芯片模块。
背景技术
芯片卡,例如多媒体记忆卡或智能卡,包括由塑料制成的卡片本体以及***于其间的半导体芯片。此半导体芯片可被用做芯片模块,其中实际芯片接着于芯片载体上,使用芯片载体,芯片被***在卡片本体的凹槽内。该芯片载体还特别具有端触点,以便与卡片阅读机形成外部连接。该芯片载体具接着区域,该半导体芯片接着于其上且一般以封装材料覆盖芯片。在此封装材料周围的是芯片载体的凸出的接着边缘,其黏着式地接于芯片的卡片本体的凹槽的接着边缘,此边缘自该卡片本体的上方侧稍微倒回。
在该芯片载体及该卡片本体之间的连接较佳为通过黏着剂产生。在室温下加工的冷黏着剂,或热融黏着剂(使用此黏着剂可在较高温度及在增加的接触压力下制造黏着结合)被用于此目的。为进行此目的,该芯片载体要具足够的机械稳定度;所以,至少100微米的芯片载体厚度为较佳的。该芯片载体的接着边缘及在卡片本体的凹槽的接着边缘的表面应具备如下性质,使得做为连接表面它们确保尽可能为良好的黏着剂的黏着。黏着剂的良好黏着接着由粗糙的连接表面改良。
一种环氧-树脂-黏结的玻璃纤维织物特别合适用做载体材料。若较便宜的材料及较小厚度的芯片载体被使用,会有黏着结合稳定性的问题发生。在此方面特别关键的是实际植入方法,其中芯片模块被黏着地植入该卡片本体内,高温及高接触压力会使得芯片载体材料变形。
发明内容
本发明目的为提供一种芯片卡的芯片模块的低成本构造,使用此构造可在该卡片本体中提供足够持久的黏着结合。
此目的可通过如下所述芯片模块来实现。
根据本发明提供了一种芯片模块,包括:芯片载体;与芯片载体接着的半导体芯片;芯片载体的一接着边缘侧向地突出于半导体芯片之外;金属化物,其在接着边缘上形成了加强物,并且该加强物被图案化,使得所述加强物沿着所述接着边缘重复地中断以形成多个部分。
在该芯片模块及该卡片本体间的连接点的区域,该芯片载体被提供有用来加强且可被图案化的层。这使得在该芯片模块至该卡片本体的连接区域,该卡片载体的机械特性和表面特性可被选择性地适合于该卡片本体的接触边缘。在该卡片载体的接触边缘的层可特别为施加在面对该卡片本体的该芯片载体一侧上的金属化物。此种金属化物可另外用于半导体芯片的电接触,该芯片载体可在一侧或两侧被金属化,例如通过可能施加了镍/金模光的铜的经施用及经图案化的层。
附图说明
下文为基于图1至5所表示的实例的芯片模块的更详细叙述。
图1、3和4显示了平面视图;图2和5显示了示例性具体实施例的截面区段。
具体实施方式
在图1的平面视图中的左手侧所表示的是一种芯片模块,其中已被注射成型并被封装于做为***或封装的封装材料6内的半导体芯片于中央区域接着于芯片载体1。然而,芯片及封装的形式及结构原则上不受限制。芯片载体的外部接着边缘(其用于该芯片模块在卡片本体内的接着)被提供有加强物3,该加强物3以层的形式施加。在图1的右手侧为所标示长方形图案的局部放大图。所表示的有在一部分封装材料6及加强物3之间的芯片载体1的部分,此处涵盖了接着边缘5。
图2所表示的为芯片卡的截面区段,由此可知芯片模块如何插在卡片本体上。该芯片模块包括具有半导体芯片2的芯片载体1,其已被施用于芯片载体1上并且被注射成型于封装材料6内。在芯片载体1的边缘设有接着边缘5,其设有加强物3。通过该加强物3,该芯片模块被使用黏着剂4而紧密黏着地接着于存在于该卡片本体7的凹槽的接着边缘上。远离该半导体芯片2的芯片载体1的一侧被提供有可为覆盖物或接触层的层10。
图3所表示的是进一步的示例性具体实施例,其中该加强物3具锯齿状的内部边缘。这是因为如果该加强物精密地位于该黏着层4的区域的整个表面积上,那么该芯片载体的加强区域及内部区域之间的过渡特别容易破裂。基于此原因,优选不使该加强物3的内部边缘为如图1所示的直的及规则的,而是使面对该半导体芯片2的加强物的内部边缘形成为锯齿状的、蜿蜒的、曲线的或不规则的。图3的右手侧所表示的是长方形所标示图案的局部放大图,其中加强物3的边缘8在本实例中为锯齿状的,为明显可见。
进一步的有利具体实施例表示于图4。在此实例中,该加强物9以一种方式被图案化而使得其沿接着边缘5被重复地中断。这是因为被施用做为加强目的的层必须具有相关于该黏着层4的良好黏着性质。若该加强物3的表面的黏着性质仍不足以用于此目的,则图案化可产生一种改良,这是因为该图案化可增加相关于该黏着层4进行连接的表面,其显著地改良了该黏着性。
在该加强物9由施用的金属层形成的情况下,图案化较佳为通过光刻技术及后续的蚀刻步骤进行。相应伴随的过切是特别有利的。这种过切具有这样的效果,即用做该加强物9的层具有一些紧邻于芯片载体1的部分,其侧边尺寸比位于距该芯片载体为一段距离处的该加强物9的表面的侧边尺寸更小。因此,该加强物以此方式与该黏着层4互锁。在图4中,在相关于该接着边缘5横向排列的个别条带中的该加强物9的图案化被示出做为实例。
在图5以截面区段示出良好的黏着性质如何在图4的示例性具体实施例中产生,此处假设该加强物9的一部分的某些过切已发生,所以,直接位于该芯片载体1上的该加强物9的部分比面对该卡片本体7的上方侧更窄。在图5所示实例的情况下,假设该加强物9直接位于该卡片本体7上,或是至少在该加强物9及该卡片本体7之间仅存在非常薄的黏着层。该黏着层4基本上仅位于该加强物9的部分之间,并且以此方式在该芯片载体1及该卡片本体7之间产生连接。如果存在该加强物9的过切,那么这便产生了该加强物部分及该黏着层4部分之间的锯齿。因该加强物9被施用于该芯片载体1上,因此产生了显著的改善,特别是在该黏着层4的黏着未良好地黏着于该芯片载体的材料及黏着于该卡片本体(其一般由塑料材料组成)的材料的情况下。
在使用期间,该芯片卡受到机械负荷,例如扭转及或者是弯曲。依据由该卡片本体及芯片模块所组成的几何形状而定,黏着结合的耐久性必须符合在卡片的某些方向上的提高的要求。所以,该经施用加强的图案化可适用于增加负荷的方向上。
标号列表
1 芯片载体
2 半导体芯片
3 加强物
4 黏着层
5 接着边缘
6 封装材料
7 卡片本体
8 加强物边缘
9 加强物
10 层
Claims (4)
1.一种芯片模块,包括:
芯片载体(1);
半导体芯片(2),所述半导体芯片(2)与所述芯片载体(1)接着;
所述芯片载体(1)的一接着边缘(5)侧向地突出于所述半导体芯片(2)之外;
金属化物,其在所述接着边缘(5)上形成了加强物(9),并且所述加强物被图案化,使得所述加强物沿着所述接着边缘(5)重复地中断以形成多个部分。
2.根据权利要求1所述的芯片模块,其特征在于,所述金属化物由铜形成。
3.根据权利要求1所述的芯片模块,其特征在于,所述金属化物还包含镍或金的覆层。
4.根据权利要求1到3中任一项所述的芯片模块,其特征在于,所述加强物的多个部分中的每一个部分均具有上表面,所述上表面面对着远离所述芯片载体(1)的方向,所述加强物的每一个部分的上表面的面积大于所述接着边缘(5)上被所述每一个部分所占据的面积。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002100382 DE10200382B4 (de) | 2002-01-08 | 2002-01-08 | Chipmodul für Chipkarten |
DE10200382.3 | 2002-01-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1613149A CN1613149A (zh) | 2005-05-04 |
CN100380638C true CN100380638C (zh) | 2008-04-09 |
Family
ID=7711643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038020394A Expired - Fee Related CN100380638C (zh) | 2002-01-08 | 2003-01-07 | 芯片模块 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1464081A2 (zh) |
CN (1) | CN100380638C (zh) |
DE (1) | DE10200382B4 (zh) |
WO (1) | WO2003058713A2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004029585A1 (de) * | 2004-06-18 | 2006-01-19 | Infineon Technologies Ag | Chip-Package |
DE602005021515D1 (de) | 2004-09-02 | 2010-07-08 | Nxp Bv | Identifizierungsdokument mit kontaktlosem rfid-chip |
DE102005002733B4 (de) * | 2005-01-20 | 2016-05-12 | Giesecke & Devrient Gmbh | Tragbarer Datenträger |
DE102006061943B4 (de) | 2006-12-29 | 2023-03-30 | Pictiva Displays International Limited | Lichtemittierende Vorrichtung |
US8830695B2 (en) | 2007-01-25 | 2014-09-09 | Osram Opto Semiconductors Gmbh | Encapsulated electronic device |
DE102007012504B4 (de) * | 2007-01-25 | 2022-02-10 | Osram Oled Gmbh | Elektronische Vorrichtung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0952545A1 (en) * | 1997-10-16 | 1999-10-27 | Citizen Watch Co., Ltd. | Ic card |
JP2000058705A (ja) * | 1998-08-12 | 2000-02-25 | Hitachi Ltd | 半導体装置およびその製造方法 |
EP1014445A1 (en) * | 1998-12-24 | 2000-06-28 | Shinko Electric Industries Co. Ltd. | Carrier substrate for producing semiconductor device |
JP2000232179A (ja) * | 1999-02-10 | 2000-08-22 | Shinko Electric Ind Co Ltd | Pga型電子部品用基板、その製造方法及び半導体装置 |
FR2799857A1 (fr) * | 1999-10-14 | 2001-04-20 | Gemplus Card Int | Procede pour le renforcement d'un module de circuit integre de carte a puce |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2644630B1 (fr) * | 1989-03-20 | 1994-05-27 | Sgs Thomson Microelectronics | Procede d'encartage de micromodules et son application a la realisation de cartes a puces |
FR2645680B1 (fr) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | Encapsulation de modules electroniques et procede de fabrication |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
JPH05139082A (ja) * | 1991-11-19 | 1993-06-08 | Hitachi Ltd | 電子装置 |
JPH0976678A (ja) * | 1995-09-20 | 1997-03-25 | Dainippon Printing Co Ltd | Icカード用icモジュールおよびicカード |
DE19623826C2 (de) * | 1996-06-14 | 2000-06-15 | Siemens Ag | Verfahren zur Herstellung eines Trägerelements für Halbleiterchips |
-
2002
- 2002-01-08 DE DE2002100382 patent/DE10200382B4/de not_active Expired - Fee Related
-
2003
- 2003-01-07 WO PCT/DE2003/000011 patent/WO2003058713A2/de not_active Application Discontinuation
- 2003-01-07 CN CNB038020394A patent/CN100380638C/zh not_active Expired - Fee Related
- 2003-01-07 EP EP03729206A patent/EP1464081A2/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0952545A1 (en) * | 1997-10-16 | 1999-10-27 | Citizen Watch Co., Ltd. | Ic card |
JP2000058705A (ja) * | 1998-08-12 | 2000-02-25 | Hitachi Ltd | 半導体装置およびその製造方法 |
EP1014445A1 (en) * | 1998-12-24 | 2000-06-28 | Shinko Electric Industries Co. Ltd. | Carrier substrate for producing semiconductor device |
JP2000232179A (ja) * | 1999-02-10 | 2000-08-22 | Shinko Electric Ind Co Ltd | Pga型電子部品用基板、その製造方法及び半導体装置 |
FR2799857A1 (fr) * | 1999-10-14 | 2001-04-20 | Gemplus Card Int | Procede pour le renforcement d'un module de circuit integre de carte a puce |
Also Published As
Publication number | Publication date |
---|---|
EP1464081A2 (de) | 2004-10-06 |
DE10200382A1 (de) | 2003-07-24 |
WO2003058713A3 (de) | 2004-02-26 |
CN1613149A (zh) | 2005-05-04 |
DE10200382B4 (de) | 2006-05-04 |
WO2003058713A2 (de) | 2003-07-17 |
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