WO2003010603A1 - Composition radiosensible de type positif et procede de formation d'un motif - Google Patents

Composition radiosensible de type positif et procede de formation d'un motif Download PDF

Info

Publication number: WO2003010603A1
Authority: WO; WIPO (PCT)
Prior art keywords: positive type; group; hydrolyzable; forming pattern; composition
Prior art date: 2001-07-24

Application number

PCT/JP2002/007343

Other languages

English (en)

French (fr)

Inventor

Kentarou Tamaki

Tomohiro Utaka

Akira Nishikawa

Original Assignee

Jsr Corporation

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-07-24

Filing date

2002-07-19

Publication date

2003-02-06

2002-07-19 Application filed by Jsr Corporation filed Critical Jsr Corporation

2002-07-19 Priority to KR1020047000936A priority Critical patent/KR100817377B1/ko

2002-07-19 Priority to US10/484,716 priority patent/US7005231B2/en

2002-07-19 Priority to EP02751650A priority patent/EP1411390A4/en

2002-07-19 Priority to JP2003515916A priority patent/JP3882816B2/ja

2003-02-06 Publication of WO2003010603A1 publication Critical patent/WO2003010603A1/ja

Links

Classifications

- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/134—Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms
- G02B6/1347—Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms using ion implantation
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/121—Channel; buried or the like

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Optics & Photonics (AREA)
Spectroscopy & Molecular Physics (AREA)
Materials For Photolithography (AREA)
Compositions Of Macromolecular Compounds (AREA)
Silicon Polymers (AREA)

PCT/JP2002/007343 2001-07-24 2002-07-19 Composition radiosensible de type positif et procede de formation d'un motif WO2003010603A1 (fr)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
KR1020047000936A KR100817377B1 (ko)	2001-07-24	2002-07-19	포지티브형 감방사선성 조성물 및 패턴 형성 방법
US10/484,716 US7005231B2 (en)	2001-07-24	2002-07-19	Positive type radiosensitive composition and method for forming pattern
EP02751650A EP1411390A4 (en)	2001-07-24	2002-07-19	RADIATION SENSITIVE COMPOSITION OF THE POSITIVE TYPE AND METHOD FOR FORMING A STRUCTURE
JP2003515916A JP3882816B2 (ja)	2001-07-24	2002-07-19	ポジ型感放射線性組成物およびパターン形成方法

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2001-222706		2001-07-24
JP2001222706		2001-07-24
JP2001352419		2001-11-16
JP2001-352419		2001-11-16

Publications (1)

Publication Number	Publication Date
WO2003010603A1 true WO2003010603A1 (fr)	2003-02-06

Family

ID=26619157

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PCT/JP2002/007343 WO2003010603A1 (fr)	2001-07-24	2002-07-19	Composition radiosensible de type positif et procede de formation d'un motif

Country Status (7)

Country	Link
US (1)	US7005231B2 (ja)
EP (1)	EP1411390A4 (ja)
JP (1)	JP3882816B2 (ja)
KR (1)	KR100817377B1 (ja)
CN (1)	CN1238766C (ja)
TW (1)	TWI300516B (ja)
WO (1)	WO2003010603A1 (ja)

Cited By (12)

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JP2004295104A (ja) *	2003-03-03	2004-10-21	Rohm & Haas Electronic Materials Llc	ポリマー、およびそれを含むフォトレジスト
JP2005181638A (ja) *	2003-12-18	2005-07-07	Kyocera Corp	シロキサンポリマ皮膜形成方法および光導波路
JP2005325344A (ja) *	2004-04-14	2005-11-24	Rohm & Haas Electronic Materials Llc	導波路組成物およびそれより形成された導波路
JP2006139083A (ja) *	2004-11-12	2006-06-01	Sekisui Chem Co Ltd	感光性樹脂組成物、薄膜パターン形成方法及び電子機器用絶縁膜
EP1605021A4 (en) *	2003-03-18	2007-09-12	Jsr Corp	RADIATION-CURABLE COMPOSITION, OPTICAL WAVEGUIDE AND FORMATION METHOD THEREOF
JP2008023715A (ja) *	2006-07-18	2008-02-07	Canon Inc	液体吐出ヘッドおよびその製造方法
US7366381B2 (en)	2003-03-31	2008-04-29	Jsr Corporation	Optical waveguide chip and optical component comprising same
JP2008122916A (ja) *	2006-10-16	2008-05-29	Hitachi Chem Co Ltd	感光性樹脂組成物、シリカ系被膜の形成方法、及びシリカ系被膜を備える装置及び部材
JP2011209694A (ja) *	2010-03-30	2011-10-20	Sam Xunyun Sun	マイクロフォトリソグラフィ用の多階調の感光性ハードマスク
JP2012237778A (ja) *	2011-05-10	2012-12-06	Adeka Corp	光路変換機能を有する光導波路の製造方法
WO2014087998A1 (ja) *	2012-12-07	2014-06-12	Ｄｓｐ五協フード＆ケミカル株式会社	新規なスルホニウム塩化合物、その製造方法及び光酸発生剤
JP2014114225A (ja) *	2012-12-07	2014-06-26	Dsp Gokyo Food & Chemical Co Ltd	新規スルホニウム塩、その製造方法、及び、光酸発生剤

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KR100870020B1 (ko) *	2002-10-04	2008-11-21	삼성전자주식회사	용해 특성을 조절하는 감광성 수지 조성물 및 이를 이용한이층 구조의 패턴 형성 방법
KR100564565B1 (ko) *	2002-11-14	2006-03-28	삼성전자주식회사	실리콘을 함유하는 폴리머 및 이를 포함하는 네가티브형레지스트 조성물과 이들을 이용한 반도체 소자의 패턴형성 방법
JP4379596B2 (ja) *	2004-06-10	2009-12-09	信越化学工業株式会社	犠牲膜形成用組成物、パターン形成方法、犠牲膜及びその除去方法
JP2006030919A (ja) *	2004-07-22	2006-02-02	Kansai Paint Co Ltd	光導波路の作成方法
US20070299176A1 (en) *	2005-01-28	2007-12-27	Markley Thomas J	Photodefinable low dielectric constant material and method for making and using same
TWI391454B (zh) *	2005-06-17	2013-04-01	Nissan Chemical Ind Ltd	用於形成膜之塗覆流體及其膜與形成膜之方法
US7618683B2 (en) *	2006-01-12	2009-11-17	Fujifilm Corporation	Ink composition, inkjet recording method, printed material, process for producing lithographic printing plate, and lithographic printing plate
US8329774B2 (en) *	2008-01-15	2012-12-11	Toagosei Co., Ltd.	Organosilicon compounds which have oxetanyl groups, and a method for the production and curable compositions of the same
JP5047057B2 (ja) *	2008-05-20	2012-10-10	東洋インキＳｃホールディングス株式会社	カラーフィルタ用感光性着色組成物及びカラーフィルタ
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KR101622797B1 (ko) *	2008-07-17	2016-05-19	제이에스알 가부시끼가이샤	제1막의 개질 방법 및 이것에 이용하는 산 전사 수지막 형성용 조성물
JP4960330B2 (ja) *	2008-10-21	2012-06-27	株式会社Ａｄｅｋａ	ポジ型感光性組成物及び永久レジスト
WO2010073933A1 (ja) *	2008-12-26	2010-07-01	東亞合成株式会社	オキセタニル基を有するケイ素化合物の製造方法
JP5423367B2 (ja) *	2009-01-23	2014-02-19	Ｊｓｒ株式会社	酸転写用組成物、酸転写用膜及びパターン形成方法
JP5504823B2 (ja) *	2009-10-28	2014-05-28	Ｊｓｒ株式会社	感放射線性組成物、保護膜、層間絶縁膜、及びそれらの形成方法
WO2011084250A2 (en)	2009-12-21	2011-07-14	Dow Corning Corporation	Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins
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SG11201402918VA (en) *	2011-12-26	2014-10-30	Toray Industries	Photosensitive resin composition and process for producing semiconductor element
CN103809374B (zh) *	2012-11-02	2019-11-05	日铁化学材料株式会社	触摸面板用遮光性组合物和触摸面板
JP5997041B2 (ja) *	2012-12-26	2016-09-21	東京応化工業株式会社	感光性樹脂組成物
CN106030417B (zh) *	2014-02-21	2020-02-28	东京毅力科创株式会社	光增感化学放大型抗蚀剂材料及使用了其的图案形成方法、以及半导体器件、光刻用掩模和纳米压印用模板的制造方法
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JPH07258604A (ja) *	1995-02-21	1995-10-09	Toray Ind Inc	光学材料および光学材料用コーティング組成物
JPH0940779A (ja) *	1995-08-01	1997-02-10	Toshiba Corp	ポリシロキサン、ポリシロキサン組成物、絶縁膜の製造方法、着色部材の製造方法及び導電膜の製造方法
EP0965618A1 (en)	1998-06-18	1999-12-22	JSR Corporation	Photo-curable composition and photo-cured product
JP2000056453A (ja) *	1998-08-03	2000-02-25	Shin Etsu Chem Co Ltd	レジスト材料及びその製造方法
JP2000180643A (ja) *	1998-10-05	2000-06-30	Nippon Telegr & Teleph Corp <Ntt>	光導波路用感光性組成物およびその製造方法および高分子光導波路パタ―ン形成方法
JP2001083342A (ja)	1999-09-09	2001-03-30	Jsr Corp	光導波路形成用組成物、光導波路の形成方法、および光導波路
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2002
- 2002-07-16 TW TW091115855A patent/TWI300516B/zh not_active IP Right Cessation
- 2002-07-19 WO PCT/JP2002/007343 patent/WO2003010603A1/ja active Application Filing
- 2002-07-19 KR KR1020047000936A patent/KR100817377B1/ko not_active IP Right Cessation
- 2002-07-19 CN CNB028097173A patent/CN1238766C/zh not_active Expired - Fee Related
- 2002-07-19 EP EP02751650A patent/EP1411390A4/en not_active Withdrawn
- 2002-07-19 US US10/484,716 patent/US7005231B2/en not_active Expired - Lifetime
- 2002-07-19 JP JP2003515916A patent/JP3882816B2/ja not_active Expired - Fee Related

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JP2001083342A (ja)	1999-09-09	2001-03-30	Jsr Corp	光導波路形成用組成物、光導波路の形成方法、および光導波路
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Title
See also references of EP1411390A4 *

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2011103014A (ja) *	2003-03-03	2011-05-26	Rohm & Haas Electronic Materials Llc	ポリマー、およびそれを含むフォトレジスト
JP2004295104A (ja) *	2003-03-03	2004-10-21	Rohm & Haas Electronic Materials Llc	ポリマー、およびそれを含むフォトレジスト
EP1605021A4 (en) *	2003-03-18	2007-09-12	Jsr Corp	RADIATION-CURABLE COMPOSITION, OPTICAL WAVEGUIDE AND FORMATION METHOD THEREOF
US7366381B2 (en)	2003-03-31	2008-04-29	Jsr Corporation	Optical waveguide chip and optical component comprising same
CN100385276C (zh) *	2003-03-31	2008-04-30	Jsr株式会社	光波导芯片以及含有该芯片的光学元件
JP2005181638A (ja) *	2003-12-18	2005-07-07	Kyocera Corp	シロキサンポリマ皮膜形成方法および光導波路
JP2005325344A (ja) *	2004-04-14	2005-11-24	Rohm & Haas Electronic Materials Llc	導波路組成物およびそれより形成された導波路
JP2006139083A (ja) *	2004-11-12	2006-06-01	Sekisui Chem Co Ltd	感光性樹脂組成物、薄膜パターン形成方法及び電子機器用絶縁膜
JP2008023715A (ja) *	2006-07-18	2008-02-07	Canon Inc	液体吐出ヘッドおよびその製造方法
JP2008122916A (ja) *	2006-10-16	2008-05-29	Hitachi Chem Co Ltd	感光性樹脂組成物、シリカ系被膜の形成方法、及びシリカ系被膜を備える装置及び部材
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