WO2002096169A8 - Printed circuit board with mounted components housed in a resin foil - Google Patents

Printed circuit board with mounted components housed in a resin foil

Info

Publication number
WO2002096169A8
WO2002096169A8 PCT/IB2002/001771 IB0201771W WO02096169A8 WO 2002096169 A8 WO2002096169 A8 WO 2002096169A8 IB 0201771 W IB0201771 W IB 0201771W WO 02096169 A8 WO02096169 A8 WO 02096169A8
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
mounted components
components housed
foil
Prior art date
Application number
PCT/IB2002/001771
Other languages
French (fr)
Other versions
WO2002096169A1 (en
Inventor
Herman W Di Eikelboom
Bram K G Mader
Tertholen Onno Van
Original Assignee
Koninkl Philips Electronics Nv
Bram K G Mader
Tertholen Onno Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Bram K G Mader, Tertholen Onno Van filed Critical Koninkl Philips Electronics Nv
Publication of WO2002096169A1 publication Critical patent/WO2002096169A1/en
Publication of WO2002096169A8 publication Critical patent/WO2002096169A8/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A system comprising a printed circuit board with circuits printed on it and electric and/or magnetic components that are electrically connected to these circuits, and further comprising a housing for the printed circuit board, said housing being formed of a synthetic resin foil that may surround the printed circuit board at least partly. The plastic foil is preferably folded around the printed circuit board so as to be box-shaped. Alternatively, the plastic foil may be a shrink foil.
PCT/IB2002/001771 2001-05-25 2002-05-22 Printed circuit board with mounted components housed in a resin foil WO2002096169A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01201964 2001-05-25
EP01201964.2 2001-05-25

Publications (2)

Publication Number Publication Date
WO2002096169A1 WO2002096169A1 (en) 2002-11-28
WO2002096169A8 true WO2002096169A8 (en) 2002-12-27

Family

ID=8180366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/001771 WO2002096169A1 (en) 2001-05-25 2002-05-22 Printed circuit board with mounted components housed in a resin foil

Country Status (2)

Country Link
CN (1) CN1463570A (en)
WO (1) WO2002096169A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045895A1 (en) * 2006-09-28 2008-04-10 Siemens Ag Electronic assembly and method of manufacturing an electronic assembly for use in automotive electronics
DE102008058287B4 (en) * 2008-11-20 2010-09-16 Continental Automotive Gmbh Electronic module with a sealing element and method for manufacturing the module
DE102017104893B4 (en) 2017-03-08 2022-01-13 Sick Ag Optoelectronics module and method for producing an optoelectronics module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695926A (en) * 1986-07-01 1987-09-22 Bell Of Pennsylvania Encapsulation and insulation of electronic circuit board structures
US4858075A (en) * 1987-01-30 1989-08-15 Bell Of Pennsylvania RF shielded and electrically insulated circuit board structure and method of making same
US5319522A (en) * 1992-12-17 1994-06-07 Ford Motor Company Encapsulated product and method of manufacture
TW311267B (en) * 1994-04-11 1997-07-21 Raychem Ltd
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate

Also Published As

Publication number Publication date
WO2002096169A1 (en) 2002-11-28
CN1463570A (en) 2003-12-24

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