WO2002096169A8 - Printed circuit board with mounted components housed in a resin foil - Google Patents
Printed circuit board with mounted components housed in a resin foilInfo
- Publication number
- WO2002096169A8 WO2002096169A8 PCT/IB2002/001771 IB0201771W WO02096169A8 WO 2002096169 A8 WO2002096169 A8 WO 2002096169A8 IB 0201771 W IB0201771 W IB 0201771W WO 02096169 A8 WO02096169 A8 WO 02096169A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- mounted components
- components housed
- foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packaging Frangible Articles (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01201964 | 2001-05-25 | ||
EP01201964.2 | 2001-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002096169A1 WO2002096169A1 (en) | 2002-11-28 |
WO2002096169A8 true WO2002096169A8 (en) | 2002-12-27 |
Family
ID=8180366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2002/001771 WO2002096169A1 (en) | 2001-05-25 | 2002-05-22 | Printed circuit board with mounted components housed in a resin foil |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1463570A (en) |
WO (1) | WO2002096169A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006045895A1 (en) * | 2006-09-28 | 2008-04-10 | Siemens Ag | Electronic assembly and method of manufacturing an electronic assembly for use in automotive electronics |
DE102008058287B4 (en) * | 2008-11-20 | 2010-09-16 | Continental Automotive Gmbh | Electronic module with a sealing element and method for manufacturing the module |
DE102017104893B4 (en) | 2017-03-08 | 2022-01-13 | Sick Ag | Optoelectronics module and method for producing an optoelectronics module |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4695926A (en) * | 1986-07-01 | 1987-09-22 | Bell Of Pennsylvania | Encapsulation and insulation of electronic circuit board structures |
US4858075A (en) * | 1987-01-30 | 1989-08-15 | Bell Of Pennsylvania | RF shielded and electrically insulated circuit board structure and method of making same |
US5319522A (en) * | 1992-12-17 | 1994-06-07 | Ford Motor Company | Encapsulated product and method of manufacture |
TW311267B (en) * | 1994-04-11 | 1997-07-21 | Raychem Ltd | |
US5557064A (en) * | 1994-04-18 | 1996-09-17 | Motorola, Inc. | Conformal shield and method for forming same |
US6134121A (en) * | 1998-02-02 | 2000-10-17 | Motorola, Inc. | Housing assembly utilizing a heat shrinkable composite laminate |
-
2002
- 2002-05-22 CN CN 02801828 patent/CN1463570A/en active Pending
- 2002-05-22 WO PCT/IB2002/001771 patent/WO2002096169A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2002096169A1 (en) | 2002-11-28 |
CN1463570A (en) | 2003-12-24 |
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