WO2002096169A1 - Printed circuit board with mounted components housed in a resin foil - Google Patents

Printed circuit board with mounted components housed in a resin foil Download PDF

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Publication number
WO2002096169A1
WO2002096169A1 PCT/IB2002/001771 IB0201771W WO02096169A1 WO 2002096169 A1 WO2002096169 A1 WO 2002096169A1 IB 0201771 W IB0201771 W IB 0201771W WO 02096169 A1 WO02096169 A1 WO 02096169A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
synthetic resin
housing
foil
Prior art date
Application number
PCT/IB2002/001771
Other languages
French (fr)
Other versions
WO2002096169A8 (en
Inventor
Bram K. G. Mader
Onno Van Tertholen
Herman W. EIKELBOOM
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Publication of WO2002096169A1 publication Critical patent/WO2002096169A1/en
Publication of WO2002096169A8 publication Critical patent/WO2002096169A8/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the invention relates to a system provided with a printed circuit board comprising printed circuits provided on said board and electrical components that are electrically connected to said printed circuits, as well as a housing for the printed circuit board.
  • the known system comprises a three- dimensional printed circuit board with printed circuits whose copper strips (in practice referred to as "tracks") are electrically connected to electric components such as resistors, coils, capacitors and the like.
  • the system in accordance with the prior art additionally comprises a housing for such a printed circuit board, which housing is designed so as to be a preformed box-shaped holder of metal (steel) or synthetic resin.
  • This preformed metal or synthetic resin, box-shaped holder is generally composed of two parts, i.e. a lower part or bottom part and an upper part or top part.
  • a drawback of the known system resides in that the metal or synthetic resin housing thereof is manufactured, in practice, at a different location from the one where the printed circuit board and the associated electrical components are manufactured and subsequently mounted in the housing (metal working and/or synthetic resin injection molding belong to another branch than the assembly of electronic components) so that the (above- mentioned parts of the) housing must be separately transported from the production location to the location where the printed circuit board and the electric components are assembled.
  • This is economically unattractive because it involves high transport costs and costs resulting from delays, but also the means of transport used to ship such housings is economically unattractive (more than 90% is transported by plane).
  • a system of the type mentioned in the opening paragraph is characterized in accordance with the invention in that the housing is formed by a synthetic resin foil that can at least partly envelop the printed circuit board.
  • the synthetic resin foil can be transported in an economically attractive way, for example on reels, and this foil can be used to envelop each type of printed circuit board, irrespective of the three-dimensional shape of the type of printed circuit board used.
  • the use of the synthetic resin foil as a housing means that the housing is now in one piece instead of a housing, in accordance with the prior art, that is composed of several portions with the associated logistic drawbacks.
  • the synthetic resin foil entirely surrounds the printed circuit board.
  • the synthetic resin foil is formed by a shrink foil.
  • the shrink foil is embodied so as to be, in particular, a shrink sleeve.
  • the synthetic resin foil can be folded around the printed circuit board so as to be box-shaped.
  • the synthetic resin foil is supplied on reels, so that a necessary length of synthetic resin foil is cut from a reel and subsequently provided around the printed circuit board. Overlapping edges of the synthetic resin foil are "sealed" if necessary, so that a closed housing is obtained.
  • the synthetic resin foil is made of PVC, nylon or polyester.
  • the printed circuit board comprises a ballast for feeding a fluorescent lamp.
  • a ballast comprises supply means to deliver a stabilized power to the lamp and, if necessary, dimmer means to adjust the power level.
  • the invention also relates to a housing and a printed circuit board (preferably comprising a ballast for feeding a fluorescent lamp) which is evidently suitable for use in a system in accordance with the invention.
  • a printed circuit board preferably comprising a ballast for feeding a fluorescent lamp
  • the invention also comprises a method of providing a housing around a printed circuit board including printed circuits provided thereon and electric components that are electrically connected to said printed circuits, a characteristic feature of said method being that a synthetic resin foil serving as a housing is provided around the printed circuit board so as to at least partly envelop said printed circuit board.
  • a synthetic resin foil serving as a housing is provided around the printed circuit board so as to at least partly envelop said printed circuit board.
  • the printed circuit board is enveloped, in particular, entirely in the synthetic resin foil.
  • a shrink foil In a preferred embodiment of a method in accordance with the invention, use is made of a shrink foil. In a further preferred modification, the synthetic resin foil is folded around the printed circuit board.
  • Fig. 1 is a diagrammatic, perspective view of a three-dimensional printed circuit board enveloped by a shrink sleeve as a housing in accordance with the invention
  • Fig. 2 corresponds to Fig. 1, with the exception that, instead of the shrink sleeve shown in Fig. 1, a synthetic resin foil is folded in a box-like manner around the printed circuit board.
  • Fig. 1 shows a three-dimensional printed circuit board 1 provided with printed circuits the copper tracks of which bear reference numeral 2.
  • Various electric components 3, in particular resistors, coils, capacitors etc. are soldered onto the printed circuit board 1 so as to be in electric contact with the copper tracks 2.
  • Continuous lines indicate a synthetic resin foil (in this case of nylon) which is embodied so as to be a shrink sleeve 4, which forms a housing for the printed circuit board 1. It is noted that the shrink sleeve 4 does not necessarily have to enclose the printed circuit board 1 completely.
  • Fig. 1 A shows a situation prior to shrinkage of the shrink sleeve 4, while Fig. IB relates to a definitive housing situation after shrinkage.
  • Fig. 2 corresponds to Fig.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A system comprising a printed circuit board with circuits printed on it and electric and/or magnetic components that are electrically connected to these circuits, and further comprising a housing for the printed circuit board, said housing being formed of a synthetic resin foil that may surround the printed circuit board at least partly. The plastic foil is preferably folded around the printed circuit board so as to be box-shaped. Alternatively, the plastic foil may be a shrink foil.

Description

PRINTED CIRCUIT BOARD WITH MOUNTED COMPONENTS HOUSED IN A RESIN FOIL
The invention relates to a system provided with a printed circuit board comprising printed circuits provided on said board and electrical components that are electrically connected to said printed circuits, as well as a housing for the printed circuit board.
Such a system is generally known. The known system comprises a three- dimensional printed circuit board with printed circuits whose copper strips (in practice referred to as "tracks") are electrically connected to electric components such as resistors, coils, capacitors and the like. The system in accordance with the prior art additionally comprises a housing for such a printed circuit board, which housing is designed so as to be a preformed box-shaped holder of metal (steel) or synthetic resin. This preformed metal or synthetic resin, box-shaped holder is generally composed of two parts, i.e. a lower part or bottom part and an upper part or top part.
A drawback of the known system resides in that the metal or synthetic resin housing thereof is manufactured, in practice, at a different location from the one where the printed circuit board and the associated electrical components are manufactured and subsequently mounted in the housing (metal working and/or synthetic resin injection molding belong to another branch than the assembly of electronic components) so that the (above- mentioned parts of the) housing must be separately transported from the production location to the location where the printed circuit board and the electric components are assembled. This is economically unattractive because it involves high transport costs and costs resulting from delays, but also the means of transport used to ship such housings is economically unattractive (more than 90% is transported by plane). An additional drawback of the known system resides in that each type of printed circuit board requires, in principle, the manufacture of a corresponding type of housing, which is inefficient and expensive. Finally, from the point of view of logistics, it is inconvenient that the housing of the known system is often composed of at least two portions (i.e. said lower and upper portions). It is an object of the invention to overcome the drawbacks of the prior art by providing a system that comprises a printed circuit board with printed circuits provided thereon and electric components electrically connected to said printed circuits, as well as a housing for the printed circuit board, which housing can be transported more efficiently and can be used, in principle, for each type of printed circuit board.
To achieve this, a system of the type mentioned in the opening paragraph is characterized in accordance with the invention in that the housing is formed by a synthetic resin foil that can at least partly envelop the printed circuit board. The synthetic resin foil can be transported in an economically attractive way, for example on reels, and this foil can be used to envelop each type of printed circuit board, irrespective of the three-dimensional shape of the type of printed circuit board used. The use of the synthetic resin foil as a housing means that the housing is now in one piece instead of a housing, in accordance with the prior art, that is composed of several portions with the associated logistic drawbacks. Preferably, the synthetic resin foil entirely surrounds the printed circuit board. In a preferred embodiment of a system in accordance with the invention, the synthetic resin foil is formed by a shrink foil. The shrink foil is embodied so as to be, in particular, a shrink sleeve. In a different preferred modification, the synthetic resin foil can be folded around the printed circuit board so as to be box-shaped. In both modifications, the synthetic resin foil is supplied on reels, so that a necessary length of synthetic resin foil is cut from a reel and subsequently provided around the printed circuit board. Overlapping edges of the synthetic resin foil are "sealed" if necessary, so that a closed housing is obtained.
In a further preferred embodiment of a system in accordance with the invention, the synthetic resin foil is made of PVC, nylon or polyester.
In a still further preferred embodiment of a system in accordance with the invention, the printed circuit board comprises a ballast for feeding a fluorescent lamp. As is customary, such a ballast comprises supply means to deliver a stabilized power to the lamp and, if necessary, dimmer means to adjust the power level.
The invention also relates to a housing and a printed circuit board (preferably comprising a ballast for feeding a fluorescent lamp) which is evidently suitable for use in a system in accordance with the invention.
The invention also comprises a method of providing a housing around a printed circuit board including printed circuits provided thereon and electric components that are electrically connected to said printed circuits, a characteristic feature of said method being that a synthetic resin foil serving as a housing is provided around the printed circuit board so as to at least partly envelop said printed circuit board. As mentioned hereinabove, the printed circuit board is enveloped, in particular, entirely in the synthetic resin foil.
In a preferred embodiment of a method in accordance with the invention, use is made of a shrink foil. In a further preferred modification, the synthetic resin foil is folded around the printed circuit board.
These and other aspects of the invention are apparent from and will be elucidated with reference to the embodiments(s) described hereinafter. In the drawings: Fig. 1 is a diagrammatic, perspective view of a three-dimensional printed circuit board enveloped by a shrink sleeve as a housing in accordance with the invention; Fig. 2 corresponds to Fig. 1, with the exception that, instead of the shrink sleeve shown in Fig. 1, a synthetic resin foil is folded in a box-like manner around the printed circuit board.
Fig. 1 shows a three-dimensional printed circuit board 1 provided with printed circuits the copper tracks of which bear reference numeral 2. Various electric components 3, in particular resistors, coils, capacitors etc. are soldered onto the printed circuit board 1 so as to be in electric contact with the copper tracks 2. Continuous lines indicate a synthetic resin foil (in this case of nylon) which is embodied so as to be a shrink sleeve 4, which forms a housing for the printed circuit board 1. It is noted that the shrink sleeve 4 does not necessarily have to enclose the printed circuit board 1 completely. Fig. 1 A shows a situation prior to shrinkage of the shrink sleeve 4, while Fig. IB relates to a definitive housing situation after shrinkage. Fig. 2 corresponds to Fig. 1 , with the exception that the shrink sleeve 4 is replaced by a synthetic resin foil 5 of PVC which is folded like a box (in a box-shaped manner) around the printed circuit board 1 and sealed at the location of the overlapping edges. Although in Fig. 2 the folded synthetic resin foil 5 completely encloses the printed circuit board 1, this is not always necessary in practice. Parts of Fig. 2 that correspond to parts of Fig. 1 are indicated by means of the same reference numerals. Figs. 2A through 2C successively show various folding steps to arrive at a definitive housing situation (Fig. 2C). In the modification in accordance with Fig. 1 as well as in the modification in accordance with Fig. 2 use is made of a uniform synthetic resin foil of constant thickness ranging between 0.05 mm and 1 mm, in particular between 0.1 mm and 1 mm, more particularly approximately 0.2 mm. This synthetic resin foil is transported on reels to the location where the printed circuit board and the associated electric components are assembled. Subsequently, a suitable part of the synthetic resin foil is cut from a reel and subsequently provided around the finished printed circuit board.
It is noted that the invention is not limited to the embodiments shown; it also includes other modifications within the scope of the appended claims.

Claims

CLAIMS:
1. A system provided with a printed circuit board comprising printed circuits provided on said board and electrical components that are electrically connected to said printed circuits, as well as a housing for the printed circuit board, characterized in that the housing is formed by a synthetic resin foil which can at least partly envelop the printed circuit board.
2. A system as claimed in claim 1, wherein the synthetic resin foil is formed by a shrink foil.
3. A system as claimed in claim 1, wherein the synthetic resin foil can be folded around the printed circuit board.
4. A system as claimed in claim 2 or 3, wherein the synthetic resin foil is made of PVC, nylon or polyester.
5. A system as claimed in any one of the claims 1 through 4, wherein the printed circuit board comprises a ballast for feeding a fluorescent lamp.
6. A housing that is evidently suitable for use in a system as claimed in any one of the claims 1 through 5.
7. A printed circuit board which preferably comprises a ballast for feeding a fluorescent lamp, and which is evidently suitable for use in a system as claimed in any one of the claims 1 through 5.
8. A method of providing a housing around a printed circuit board comprising printed circuits which are provided thereon and electric components which are electrically connected to said printed circuits, characterized in that a synthetic resin foil is provided as a housing around the printed circuit board so as to at least partly envelop said printed circuit board.
9. A method as claimed in claim 8, wherein use is made of a shrink foil.
10. A method as claimed in claim 8, wherein the synthetic resin foil is folded around the printed circuit board.
PCT/IB2002/001771 2001-05-25 2002-05-22 Printed circuit board with mounted components housed in a resin foil WO2002096169A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01201964.2 2001-05-25
EP01201964 2001-05-25

Publications (2)

Publication Number Publication Date
WO2002096169A1 true WO2002096169A1 (en) 2002-11-28
WO2002096169A8 WO2002096169A8 (en) 2002-12-27

Family

ID=8180366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/001771 WO2002096169A1 (en) 2001-05-25 2002-05-22 Printed circuit board with mounted components housed in a resin foil

Country Status (2)

Country Link
CN (1) CN1463570A (en)
WO (1) WO2002096169A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045895A1 (en) * 2006-09-28 2008-04-10 Siemens Ag Electronic assembly and method of manufacturing an electronic assembly for use in automotive electronics
DE102008058287A1 (en) * 2008-11-20 2010-06-02 Continental Automotive Gmbh Electronic module i.e. motor vehicle control device, has sealing agent formed by edges of film that is applied on sides of interconnect device via components of device in order to mechanically fasten components to interconnect device
DE102017104893A1 (en) 2017-03-08 2018-09-13 Sick Ag Photonics module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695926A (en) * 1986-07-01 1987-09-22 Bell Of Pennsylvania Encapsulation and insulation of electronic circuit board structures
US4858075A (en) * 1987-01-30 1989-08-15 Bell Of Pennsylvania RF shielded and electrically insulated circuit board structure and method of making same
US5319522A (en) * 1992-12-17 1994-06-07 Ford Motor Company Encapsulated product and method of manufacture
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
US5739463A (en) * 1994-04-11 1998-04-14 Raychem Corporation Sealed electronic packaging for environmental protection of active electronics
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695926A (en) * 1986-07-01 1987-09-22 Bell Of Pennsylvania Encapsulation and insulation of electronic circuit board structures
US4858075A (en) * 1987-01-30 1989-08-15 Bell Of Pennsylvania RF shielded and electrically insulated circuit board structure and method of making same
US5319522A (en) * 1992-12-17 1994-06-07 Ford Motor Company Encapsulated product and method of manufacture
US5739463A (en) * 1994-04-11 1998-04-14 Raychem Corporation Sealed electronic packaging for environmental protection of active electronics
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
US6134121A (en) * 1998-02-02 2000-10-17 Motorola, Inc. Housing assembly utilizing a heat shrinkable composite laminate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045895A1 (en) * 2006-09-28 2008-04-10 Siemens Ag Electronic assembly and method of manufacturing an electronic assembly for use in automotive electronics
DE102008058287A1 (en) * 2008-11-20 2010-06-02 Continental Automotive Gmbh Electronic module i.e. motor vehicle control device, has sealing agent formed by edges of film that is applied on sides of interconnect device via components of device in order to mechanically fasten components to interconnect device
DE102008058287B4 (en) * 2008-11-20 2010-09-16 Continental Automotive Gmbh Electronic module with a sealing element and method for manufacturing the module
DE102017104893A1 (en) 2017-03-08 2018-09-13 Sick Ag Photonics module
DE102017104893B4 (en) 2017-03-08 2022-01-13 Sick Ag Optoelectronics module and method for producing an optoelectronics module

Also Published As

Publication number Publication date
WO2002096169A8 (en) 2002-12-27
CN1463570A (en) 2003-12-24

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