CN1463570A - Printed circuit board with mounted printed circuit on it, and system of electrical components connected with said printed circuit board - Google Patents
Printed circuit board with mounted printed circuit on it, and system of electrical components connected with said printed circuit board Download PDFInfo
- Publication number
- CN1463570A CN1463570A CN 02801828 CN02801828A CN1463570A CN 1463570 A CN1463570 A CN 1463570A CN 02801828 CN02801828 CN 02801828 CN 02801828 A CN02801828 A CN 02801828A CN 1463570 A CN1463570 A CN 1463570A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- synthetic resin
- paillon foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Packaging Frangible Articles (AREA)
Abstract
A system comprises a printed circuit board with circuits printed on it and electric and/or magnetic components that are electrically connected to these circuits, and further comprises a housing for the printed circuit board, said housing being formed of a synthetic resin foil that may surround the printed circuit board at least partly. The plastic foil is preferably folded around the printed circuit board so as to be box-shaped. Alternatively, the plastic foil may be a shrink foil.
Description
The present invention relates to a kind of system that is equipped with printed circuit board (PCB), this system comprises printed circuit that is arranged on the described circuit board and the electric component that is electrically connected on the described printed circuit.
Such system is known.This known system comprises the three dimensional printed circuit boards with printed circuit, the copper strips of this printed circuit (being called " track " in the practice) with such as resistance, the electric component of coil and electric capacity etc. is electrically connected.Also comprise the shell that is used for such printed circuit board (PCB) according to prior art system, this housing designs is the preformed box shape support of a kind of metal (steel) or synthetic resin.The box shape support of this preformed metal or synthetic resin generally includes two parts, i.e. lower member or bottom parts and upper-part or top part.
The shortcoming of the system that this is known is, the manufacturing position metal of this system or the synthetic resin shell, in practice printed circuit board (PCB) manufacturing and relevant electric component and subsequently be installed in that (metal processing and/or synthetic resin injection-molded belong to and another different branch of electronic component assembling) at diverse location, makes this corresponding component (above-mentioned parts) of this housing must be transported to the position of assembled printed circuit boards and electric component independently from the production position in the housing.Because the cost that has related to high cost of transportation and delayed to cause, this situation is unengaging economically, and the means of transportation of transporting such housing also is uneconomic (shell more than 90% is by aircraft dispatch) economically.Another shortcoming of prior art is, every kind of printed circuit board (PCB) needs the housing of production respective type in principle, and is therefore inefficent and expensive.From logistic viewpoint, known system usually comprises that at least two parts (being described lower part and top) are very inconvenient at last.
The objective of the invention is to overcome the shortcoming of prior art, a kind of printed circuit board (PCB) with the printed circuit that is provided with thereon that comprises promptly is provided, also comprise the electric component that is electrically connected with described printed circuit, with the shell that is used for printed circuit board (PCB), in principle, this housing can be transported and be used efficiently for every kind of printed circuit board (PCB).
Therefore, the system of the type of beginning described in the paragraph is characterised in that according to the present invention, by forming shell to the synthetic resin paillon foil that small part is wrapped up this printed circuit board (PCB).Can tempting economically mode transport this synthetic resin, for example on spool, and no matter the 3D shape of the type of employed printed circuit board (PCB), this paillon foil may be used to wrap up every kind of printed circuit board (PCB).Use the synthetic resin paillon foil to be meant that as shell part of present usefulness replaces the shell that comprises a plurality of parts according to the relevant supply shortcoming of having of prior art.Preferably, this synthetic resin paillon foil surrounds this printed circuit board (PCB) fully.
According to a preferred embodiment of the invention, the synthetic resin paillon foil is to be formed by the shrinkage paillon foil.This shrinkage paillon foil is implemented as particularly a kind of shrinkage cover.By different advantageous variant, can make the synthetic resin paillon foil be folded into boxed-section shape around printed circuit board (PCB).In two modification, the synthetic resin paillon foil is supplied on the spool, so that from spool, the synthetic resin paillon foil is cut into the length that needs, provide around printed circuit board (PCB) then.Seal the overlapping edge of synthetic resin paillon foil if necessary, so that obtain the shell of sealing.
According to another preferred embodiment of system of the present invention, this synthetic resin PVC, nylon or polyester manufacturing.
In another preferred embodiment of system according to the present invention, this printed circuit board (PCB) comprises a ballast that is used to supply with fluorescent lamp.Usually, such ballast comprises the feedway of supplying with this lamp firm power, and also comprises the device for changing light of adjusting watt level if necessary.
The invention still further relates to a shell and printed circuit board (PCB) (preferably including the ballast of a supply fluorescent lamp), this printed circuit board (PCB) is very suitable for using in system according to the present invention.
The present invention also comprises the method that a shell is provided around printed circuit board (PCB), this printed circuit board (PCB) comprises printed circuit disposed thereon and the electric component that is electrically connected with described circuit, described method is characterised in that, a kind of synthetic resin annulus of foil that is used as shell makes and wraps up described printed circuit board (PCB) at least in part around the printed circuit board (PCB) setting.As mentioned above, printed circuit board (PCB) particularly fully is wrapped in this synthetic resin paillon foil.
In the preferred embodiment of the method according to this invention, use a kind of shrinkage paillon foil.In further advantageous variant, around folding this synthetic resin of this printed circuit board (PCB).
To understand above and other feature of the present invention with reference to following embodiment.Accompanying drawing comprises:
Fig. 1 is with the perspective view of shrinkage cover parcel three dimensional printed circuit boards according to the present invention; With
Fig. 2 except the synthetic resin paillon foil has replaced the shrinkage cover shown in Fig. 1, is folded into box shape around this printed circuit board (PCB) corresponding to Fig. 1.
Fig. 1 illustrates the three dimensional printed circuit boards 1 that is provided with printed circuit, and the copper track on the printed circuit is represented with Reference numeral 2.Different electric component 3, particularly resistance, coil, electric capacity etc. be welded on the printed circuit board (PCB) 1 in case with copper track 2 electric contacts.Solid line represents to be implemented as the synthetic resin paillon foil (being nylon in this example) of shrinkage cover 4, and this shrinkage cover 4 forms the shell of printed circuit board (PCB) 1.Notice that shrinkage cover 4 is not must complete closed printed circuit board (PCB) 1.Figure 1A is illustrated in the positions of shrinkage cover 4 before shrinking, and Figure 1B relates to the enclosure location of the qualification after the contraction.
Fig. 2 is corresponding to Fig. 1, and except the shrinkage cover is replaced by PVC synthetic resin paillon foil 5, this synthetic resin paillon foil 5 is converted into a box (box shape) and sealed in the position of overlapping edge around printed circuit board (PCB) 1.Although the synthetic resin paillon foil 5 complete closed printed circuit board (PCB)s 1 that fold in Fig. 2 are always this is not necessary in practice.Represent with identical Reference numeral corresponding to the parts among Fig. 2 of the parts of Fig. 1.Fig. 2 A-2C illustrates the different folding steps of the enclosure location (Fig. 2 C) that reaches qualification continuously.
According to modification among Fig. 1 and the modification among Fig. 2, use a kind of synthetic resin paillon foil of unanimity, its thickness is 0.25-1mm, particularly at 0.1-1mm, 0.2mm roughly more particularly.This synthetic resin paillon foil is transported to the position of assembled printed circuit boards and relevant electric component on spool.Cut the part that is fit to of this synthetic resin paillon foil then from spool, then around the printed circuit board (PCB) setting.
Should notice that the present invention is not restricted to the embodiments shown; The present invention also is included in other modification in the appended claim scope.
Claims (10)
1. system that is provided with printed circuit board (PCB), this system comprises printed circuit that is arranged on the described plate and the electric device that is electrically connected with described printed circuit board (PCB), and the housing that is used for printed circuit board (PCB), it is characterized in that this housing is formed by the synthetic resin paillon foil that can wrap up this printed circuit board (PCB) at least in part.
2. a kind of system according to claim 1, wherein, the synthetic resin paillon foil is formed by the shrinkage paillon foil.
3. a kind of system according to claim 1, wherein, the synthetic resin paillon foil can be folded around this printed circuit board (PCB).
4. according to claim 2 or 3 described a kind of systems, wherein, the synthetic resin paillon foil is by PVC, and nylon or polyester are made.
5. according to each described a kind of system of claim 1-4, wherein, printed circuit board (PCB) comprises the ballast that is used to supply with fluorescent lamp.
6. one kind is applicable to reliably according to the housing in each described a kind of system of claim 1-5.
7. printed circuit board (PCB), it preferably includes a ballast that is used to supply with a fluorescent lamp, and this printed circuit board (PCB) is readily applied to according in each described a kind of system of claim 1-5.
8. one kind centers on the method that a printed circuit board (PCB) provides a housing, this method is included in circuit that is provided with on the printed circuit board (PCB) and the electric device that is electrically connected with described circuit, it is characterized in that the synthetic resin paillon foil is set to center on the housing of this printed circuit board (PCB) so that wrap up described printed circuit board (PCB) at least in part.
9. a kind of method according to claim 8 wherein, is used a kind of shrinkage paillon foil.
10. a kind of method according to claim 8, wherein, the synthetic resin paillon foil is folded around this printed circuit board (PCB).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01201964 | 2001-05-25 | ||
| EP01201964.2 | 2001-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1463570A true CN1463570A (en) | 2003-12-24 |
Family
ID=8180366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02801828 Pending CN1463570A (en) | 2001-05-25 | 2002-05-22 | Printed circuit board with mounted printed circuit on it, and system of electrical components connected with said printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1463570A (en) |
| WO (1) | WO2002096169A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006045895A1 (en) * | 2006-09-28 | 2008-04-10 | Siemens Ag | Electronic assembly and method of manufacturing an electronic assembly for use in automotive electronics |
| DE102008058287B4 (en) * | 2008-11-20 | 2010-09-16 | Continental Automotive Gmbh | Electronic module with a sealing element and method for manufacturing the module |
| DE102017104893B4 (en) | 2017-03-08 | 2022-01-13 | Sick Ag | Optoelectronics module and method for producing an optoelectronics module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695926A (en) * | 1986-07-01 | 1987-09-22 | Bell Of Pennsylvania | Encapsulation and insulation of electronic circuit board structures |
| US4858075A (en) * | 1987-01-30 | 1989-08-15 | Bell Of Pennsylvania | RF shielded and electrically insulated circuit board structure and method of making same |
| US5319522A (en) * | 1992-12-17 | 1994-06-07 | Ford Motor Company | Encapsulated product and method of manufacture |
| TW311267B (en) * | 1994-04-11 | 1997-07-21 | Raychem Ltd | |
| US5557064A (en) * | 1994-04-18 | 1996-09-17 | Motorola, Inc. | Conformal shield and method for forming same |
| US6134121A (en) * | 1998-02-02 | 2000-10-17 | Motorola, Inc. | Housing assembly utilizing a heat shrinkable composite laminate |
-
2002
- 2002-05-22 WO PCT/IB2002/001771 patent/WO2002096169A1/en not_active Application Discontinuation
- 2002-05-22 CN CN 02801828 patent/CN1463570A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002096169A1 (en) | 2002-11-28 |
| WO2002096169A8 (en) | 2002-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |