WO2001082384A1 - Composant semi-conducteur emetteur de rayonnement et son procede de fabrication - Google Patents

Composant semi-conducteur emetteur de rayonnement et son procede de fabrication Download PDF

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Publication number
WO2001082384A1
WO2001082384A1 PCT/DE2001/001002 DE0101002W WO0182384A1 WO 2001082384 A1 WO2001082384 A1 WO 2001082384A1 DE 0101002 W DE0101002 W DE 0101002W WO 0182384 A1 WO0182384 A1 WO 0182384A1
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WO
WIPO (PCT)
Prior art keywords
layer
semiconductor
radiation
substrate
reflector
Prior art date
Application number
PCT/DE2001/001002
Other languages
German (de)
English (en)
Inventor
Stefan Bader
Berthold Hahn
Volker HÄRLE
Hans-Jürgen LUGAUER
Manfred Mundbrod-Vangerow
Dominik Eisert
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10020464A external-priority patent/DE10020464A1/de
Priority claimed from DE10026255A external-priority patent/DE10026255A1/de
Priority claimed from DE10051465A external-priority patent/DE10051465A1/de
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to US10/239,106 priority Critical patent/US6878563B2/en
Priority to EP01931363.4A priority patent/EP1277240B1/fr
Priority to JP2001579374A priority patent/JP2003532298A/ja
Publication of WO2001082384A1 publication Critical patent/WO2001082384A1/fr
Priority to US11/067,349 priority patent/US7691659B2/en
Priority to US11/065,769 priority patent/US20060011925A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Definitions

  • the invention relates to a radiation-emitting
  • Radiation-emitting semiconductor components based on GaN are known, for example, from US Pat. No. 5,210,051.
  • Such semiconductor components contain a semiconductor body with an active GaN layer which is applied to an SiC substrate. The semiconductor body is contacted on the front on the light-coupling GaN layer and on the rear on the SiC substrate.
  • III-V nitride semiconductor refers to these ternary and quaternary mixed crystals and gallium nitride itself.
  • the GaN layers grown on sapphire have a high number of lattice defects.
  • a disadvantage of radiation-emitting GaN semiconductor devices is that on the surface, at which the radiation generated in the semiconductor body is coupled out, a large refractive index jump occurs during the transition from the semiconductor body to the environment.
  • a large jump in the refractive index means that a considerable part of the radiation is reflected back into the semiconductor body and the radiation yield of the component is thereby reduced.
  • One reason for this is the total reflection of the radiation generated on the coupling-out surface. Light rays are completely reflected back into the semiconductor body if the angle of incidence of the light rays on the decoupling surface is greater than the total reflection angle, based in each case on the surface normal. With increasing difference between the refractive index of the semiconductor body and the environment, the total reflection angle decreases and the proportion of the total reflected radiation increases.
  • One means of increasing the radiation yield is to apply a reflector to the substrate of the semiconductor body. This is shown for example in DE 43 05 296. As a result, the radiation reflected back into the semiconductor body is in turn directed in the direction of
  • Decoupling surface directed so that the part of the radiation reflected back is not lost, but at least partially is also coupled out after one or more internal reflections.
  • the radiation yield of the component is reduced by the SiC layer, since part of the radiation generated is absorbed in the SiC layer. Furthermore, the epitaxial formation of an SiC layer with sufficient crystal quality also requires a high manufacturing effort.
  • the present invention has for its object to provide a III-V nitride semiconductor device with increased luminous efficiency. Furthermore, it is an object of the present invention to develop a method for producing such semiconductor components.
  • the radiation-emitting semiconductor component is designed as a thin-film component which in particular has no radiation-absorbing substrate.
  • the semiconductor body of the component is formed by a stack-like plurality of different III-V nitride semiconductor layers.
  • an active semiconductor layer based on GaN or a related nitride generates electromagnetic radiation which is coupled out through a first main surface of the stack.
  • a reflector is applied to a second main surface of the stack, so that the part of the radiation which is initially reflected back into the semiconductor body when decoupled is again directed in the direction of the decoupling surface by means of this reflector.
  • a further portion is decoupled after one or more internal reflections on the reflector. Overall, the degree of coupling out is increased compared to a GaN semiconductor component according to the prior art.
  • the GaN-based semiconductor layers consist of GaN, AlN, InN, AlGaN, InGaN, InAlN or AIInGaN.
  • the central wavelength of the radiation generated can be set in a wide range from the visible spectral range to the ultraviolet spectral range.
  • blue and green light-emitting diodes, UV light-emitting diodes and corresponding laser diodes can be realized with particular advantage.
  • the reflector can be formed by a metallic contact surface his. This serves both as a reflector and for the electrical contacting of the semiconductor body. In this embodiment, advantageously no further devices for contacting the semiconductor body are required on the reflector side. Al and Ag as well as Al and Ag alloys are particularly suitable as the material for the contact surfaces.
  • the reflector is formed by a dielectric mirror coating.
  • Such mirroring can be produced by applying a layer sequence of Si0 2 or Ti0 2 to the semiconductor body. Dielectric mirroring can advantageously achieve a loss-free reflection in a wide wavelength range.
  • the reflector has a transparent first layer applied to the second main surface and a reflecting second layer applied thereon.
  • the contact layer can be optimized both in terms of its electrical properties and its reflection properties in a simple manner.
  • the entire free surface of the semiconductor body or a partial area thereof is roughened. This roughening interferes with the total reflection on the coupling-out surface and thereby advantageously further increases the degree of optical coupling-out.
  • an intermediate layer is first applied to a substrate.
  • a plurality of different III-V nitride semiconductor layers are deposited on this intermediate layer. These layers form the semiconductor body of the component.
  • the substrate including the intermediate layer is formed from the stack of III-V nitride layers thus formed replaced.
  • a reflector is applied to one of the two main surfaces of the semiconductor body.
  • an Si substrate is used, on which an SiC intermediate layer is applied.
  • SiC is particularly suitable for the production of GaN-based components, since it has a lattice constant similar to GaN, so that GaN-based layers deposited on SiC have a small number of lattice defects.
  • the intermediate layer is applied by means of a wafer bonding process and then thinned.
  • the Si wafer can advantageously be connected to the SiC wafer by forming an SiO 2 layer.
  • the intermediate layer can be grown epitaxially, as a result of which particularly homogeneous intermediate layers can be produced.
  • the reflector is formed by applying a reflective metal contact to the GaN semiconductor body. Due to their reflectivity and their bonding properties, Ag and Al as well as Ag and Al alloys are particularly suitable as materials for the metal contact.
  • a further embodiment of the manufacturing method consists in designing the reflector as a dielectric mirror in the form of a plurality of dielectric layers, which results in the advantages of a dielectric reflector described above.
  • the manufacturing process is continued by a
  • Roughening of the semiconductor body the entire free surface of the semiconductor body or partial areas thereof to be roughened.
  • a roughening that is particularly effective with regard to increasing the light yield is produced by etching the semiconductor body or by means of a sandblasting process.
  • a mask layer is applied to the intermediate layer before the III-V nitride layers are deposited.
  • This mask layer structures the layers and in particular divides the III-V nitride layers into several, non-contiguous areas. This prevents cracking and detachment of the intermediate layer from the substrate with great advantage.
  • An oxide mask is advantageously formed as a mask, in particular when SiC is used as the interlayer material.
  • a plurality of III-V nitride layers are applied epitaxially to a composite substrate which has a substrate body and an intermediate layer, the thermal
  • Expansion coefficient of the substrate body is similar or greater than the thermal expansion coefficient of the III-V nitride layers.
  • a composite substrate is to be understood here as a substrate which contains at least two regions, the substrate body and the intermediate layer, and as such represents the starting substrate for the epitaxy process.
  • the intermediate layer is not applied epitaxially to the substrate body, but preferably by means of a wafer bonding process.
  • the thermal properties are determined primarily by the substrate body, while the epitaxial surface and, in particular, its lattice constant are determined largely independently by the intermediate layer.
  • the intermediate layer can thus advantageously be optimally adapted to the lattice constant of the layers to be applied.
  • the intermediate layer is therefore preferably made so thin that the thermal expansion coefficient of the entire composite substrate essentially corresponds to the expansion coefficient of the substrate body.
  • the substrate body is at least twenty times thicker than the intermediate layer.
  • the substrate body contains SiC, preferably polycrystalline (poly-SiC), sapphire, GaN or AlN.
  • Expansion coefficient of SiC is similar to the expansion coefficient of GaN-based materials, the other materials mentioned have a larger thermal expansion coefficient than GaN-based materials. This advantageously prevents cracking when the epitaxially applied layers cool.
  • the intermediate layer contains SiC, silicon, sapphire, MgO, GaN or AlGaN. These materials are particularly suitable for forming an essentially monocrystalline surface with a lattice constant matched to GaN.
  • An Si (111) surface or a monocrystalline SiC surface on which the GaN-based layers are grown is preferably used as the epitaxial surface.
  • the GaN-based layers are deposited on a composite substrate in which the intermediate layer is covered by a
  • Wafer bonding method is applied to the substrate body. Is preferably between the substrate body and Intermediate layer, an adhesive layer, for example made of silicon oxide.
  • a thicker intermediate layer can first be bonded onto the substrate body, which is then thinned to the required thickness, for example by grinding or splitting.
  • a mask layer is formed on the composite substrate before the III-V nitride layers are deposited, so that the III-V nitride layers only grow on the areas of the epitaxial surface uncovered by the mask.
  • these layers are advantageously interrupted in the layer plane and additional protection against tensile stress and the associated crack formation are achieved.
  • a further preferred embodiment of the invention consists in structuring the III-V nitride layers into individual semiconductor layer stacks after the deposition on the composite substrate.
  • a carrier is then applied to the III-V nitride semiconductor layer stack and the composite substrate is detached.
  • the composite substrate can thus be reused at least in part.
  • a thin-film component is produced in this way.
  • a thin-film component is to be understood as a component that does not contain an epitaxial substrate. In the case of radiation-emitting semiconductor components, an increase in the radiation yield is achieved since absorption of the radiation generated in the epitaxial substrate, as occurs in particular with SiC substrates, is avoided.
  • the so-called re-bonding of the semiconductor layer stacks from the composite substrate to a carrier just described can also be carried out in two steps in the invention, the GaN-based semiconductor layer stacks first being bonded to an intermediate carrier and then to the actual carrier, so that finally the actual carrier is bonded to the carrier Place of the composite substrate occurs.
  • Semiconductor layer stacks produced in this way advantageously have a corresponding layer sequence such as GaN-based ones
  • the manufacturing process is based on the
  • Semiconductor layer stack formed a reflector layer to increase the radiation yield. Due to the high refractive index of GaN-based materials, the radiation yield in GaN-based semiconductor components is largely limited by reflection at the interfaces of the semiconductor body. In the case of radiation-emitting semiconductor bodies without an absorbing substrate, the reflector layer can advantageously be used on the
  • Decoupling area reflected radiation components are in turn directed back to the outcoupling area. This further increases the radiation yield.
  • the reflector layer is preferably formed as a metal layer which contains, for example, aluminum, silver or a corresponding aluminum or silver alloy. Such a metal layer can advantageously also be used as a contact surface. Alternatively, the reflector layer can also be formed by dielectric mirroring in the form of a plurality of dielectric layers.
  • At least part of the surface of the semiconductor layer stack is roughened. This will make one
  • the roughening is preferably carried out by etching or a sandblasting process.
  • FIG. 1 shows a schematic sectional view of a first exemplary embodiment of a semiconductor component according to the invention
  • Figure 2 is a schematic sectional view of a second embodiment of an inventive
  • Figure 3 is a schematic representation of a first
  • FIG. 4 is a schematic representation of a second embodiment of a manufacturing method according to the invention.
  • FIG. 5 shows a schematic sectional illustration of a further exemplary embodiment of a production method according to the invention.
  • Figure 6 is a schematic sectional view of a further embodiment of a manufacturing method according to the invention.
  • Figure 7 is a schematic sectional view of another embodiment of an inventive
  • the radiation-emitting semiconductor component shown in FIG. 1 has a plurality of different semiconductor layers 1 arranged in a stack, which consist of GaN or a ternary or quaternary compound based thereon. During operation, an active zone 2 is formed within these layers, in which the radiation 5 is generated.
  • the layer stack is delimited by a first main surface 3 and a second main surface 4. Essentially, the radiation 5 generated is coupled out through the first main surface 3 into the adjacent environment.
  • a reflector 6 is applied to the second main surface 4, formed by an Ag layer which is vapor-deposited directly onto the semiconductor body.
  • the semiconductor body is contacted on the coupling-out side via the contact surface 12 and on the reflector side via the Ag reflector layer.
  • the contacting on the reflector side can take place, for example, in that the semiconductor body is placed on the reflector side on a metal body which serves both as a carrier and for the current supply.
  • the reflector 6 causes part of the radiation 5, which is reflected back into the semiconductor body at the coupling out on the first main surface 3, again in the direction of the first main surface 3 is reflected, so that the total amount of radiation coupled out by the first main surface 3 is increased.
  • This increase is made possible by the fact that the component is designed as a thin-layer component without a radiation-absorbing substrate and the
  • Reflector 6 is applied directly to the GaN semiconductor body.
  • the exemplary embodiment of a semiconductor component according to the invention shown in FIG. 2 differs from the component shown in FIG. 1 in that the surface of the semiconductor body has a roughening 7.
  • This roughening 7 causes the radiation 5 to be scattered on the first main surface 3, so that the total reflection on the first main surface 3 is disturbed. Furthermore, this scattering prevents the generated radiation from being guided by continuous, identical reflections between the two main surfaces 3 and 4 or the reflector 6 in the manner of a light guide without leaving the semiconductor body.
  • the roughening 7 thus further increases the light yield.
  • FIG. 3 shows a first exemplary embodiment of a manufacturing method according to the invention.
  • the starting point is an Si substrate 8, FIG. 3a.
  • an SiC intermediate layer 9 is applied to this Si substrate by means of a wafer bonding process, an SiO 2 layer 10 being formed between the two substrates, FIG. 3b.
  • the SiC substrate 9 is thinned down to a few micrometers, FIG. 3c.
  • a plurality of different GaN semiconductor layers 1, which form the semiconductor body of the component according to the invention, are deposited epitaxially on the thinned SiC substrate 9 by means of a MOCVD method, FIG. 3d.
  • the Si substrate 8 and the SiC intermediate layer 9 are removed, FIG. 3e.
  • a reflective metallic surface is applied to a main surface 4 of the GaN semiconductor body Contact surface 6, consisting of an Ag or Al alloy, evaporated, Fig. 3f.
  • the semiconductor body can then be moved by a sandblast or roughened by etching with a suitable etching mixture.
  • FIG. 4 runs up to and including the thinning of the SiC substrate 9 (FIGS. 4a to 4c) analogously to the first exemplary embodiment described above.
  • an oxide mask 11 is applied to the SiC layer 9 before the GaN layers 1 are deposited, FIG. 4d.
  • This oxide mask 11 has the effect that in the next step the GaN layers 1 only grow on the partial areas of the SiC intermediate layer not covered by the mask.
  • the reflector 6, FIG. 4g is produced as described above.
  • a composite substrate with a substrate body 21 made of poly-SiC is used, on which a monocrystalline SiC intermediate layer 22 is bonded in a known manner.
  • an adhesive layer 23, for example made of silicon oxide, is formed between the substrate body 21 and the intermediate layer 22, FIG. 5a.
  • a plurality of Ga ⁇ -based layers 24 are grown epitaxially on this Nerbund substrate, FIG. 5b.
  • the structure of the layer sequence is not subject to any fundamental restrictions.
  • an active, radiation-generating layer is preferably formed, which is surrounded by one or more cladding layers and / or waveguide layers.
  • the active layer can be formed by a plurality of thin individual layers in the form of a single or multiple quantum well structure.
  • a buffer layer for example based on AlGa ⁇
  • electrically conductive channels for example based on InGa ⁇ , can be included in the buffer layer.
  • the Ga ⁇ -based layers 24 are then divided into individual semiconductor layer stacks 25 by a lateral structuring, preferably by a mesa etching, FIG. 5c.
  • the composite substrate including the intermediate layer 22 is then detached from the semiconductor layer stacks 25, FIG. 5e. This can be done for example by a
  • Etching processes are carried out in which the intermediate layer 22 or the adhesive layer 23 is destroyed.
  • the can Substrate body 21 can be reused in a further production cycle.
  • contact surfaces 30 are applied to the thin-film semiconductor bodies 25 thus formed, FIG. 5f.
  • the semiconductor layer stacks 25 are separated, FIG. 5g, and further processed in the usual way.
  • a composite substrate is again used, which is essentially formed by a poly-SiC substrate body 21 and an Si (III) intermediate layer 22.
  • the intermediate layer 22 is applied to the substrate body 21 " with the aid of a wafer bonding process, with the formation of a silicon oxide adhesive layer 23, FIG. 6a.
  • FIG. 6b A plurality of GaN-based layers are in turn grown on this composite substrate, FIG. 6b, which is finally provided with a contact layer 28, for example made of platinum, FIG. 6c.
  • the GaN-based layers 24 are subsequently subdivided into individual semiconductor layer stacks 25 by means of an etching structuring, FIG. 6d.
  • a bond solder 32 and then a reflector 29 made of a silver or aluminum alloy are deposited on the areas of the contact layer 28 which are not covered by the passivation layer, FIG. 6f.
  • the semiconductor layer stacks 25 are then eutectically bonded to a carrier 26 with the reflector 29, FIG. 6g.
  • the substrate body 21 is removed and can thus be reused.
  • the individual semiconductor layer stacks are provided on the upper side with contact areas 30, FIG. 6i.
  • the semiconductor layer stacks can subsequently be separated and, if appropriate, installed in a housing (not shown).
  • FIG. 7 The exemplary embodiment of a manufacturing method according to the invention shown in FIG. 7 represents a variant of the previous exemplary embodiments.
  • FIG. 7a a composite substrate is used as the epitaxial substrate, FIG. 7a.
  • a mask layer 27 is applied to the epitaxial surface of the intermediate layer 22, FIG. 7b.
  • the GaN-based layers 24 thus only grow on the areas of the epitaxial surface that are not covered by the mask layer 27 (epitaxial window), FIG. 7c.
  • the GaN-based layers 24 are interrupted in the direction of the layer plane. This also prevents tensile stress in the eptiactically deposited layers in the cooling phase.
  • the manufacturing process can subsequently be continued as in the other exemplary embodiments.

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Recrystallisation Techniques (AREA)

Abstract

L"invention concerne un composant semi-conducteur émetteur de rayonnement à base GaN, dont le corps semi-conducteur est formé par un empilement de différentes couches de semi-conducteurs GaN (1). Le corps semi-conducteur présente une première face principale (3) et une seconde face principale (4). L"invention est caractérisée en ce que le rayonnement produit est extrait par la première face principale (3) et en ce qu"un réflecteur (6) est agencé sur la seconde face principale (4). En outre, l"invention concerne un procédé de fabrication d"un composant semi-conducteur selon l"invention, caractérisé en ce qu"on applique tout d"abord sur un substrat (8) une couche intermédiaire (9) et, sur celle-ci, une pluralité de couches GaN (1) qui forment le corps semi-conducteur du composant, puis en ce qu"on sépare le substrat (8) et la couche intermédiaire (9), et en ce qu"on forme un réflecteur (6) sur une face principale du corps semi-conducteur.
PCT/DE2001/001002 2000-04-26 2001-03-16 Composant semi-conducteur emetteur de rayonnement et son procede de fabrication WO2001082384A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/239,106 US6878563B2 (en) 2000-04-26 2001-03-16 Radiation-emitting semiconductor element and method for producing the same
EP01931363.4A EP1277240B1 (fr) 2000-04-26 2001-03-16 Procédé de fabrication d'un composant semi-conducteur emetteur de lumière
JP2001579374A JP2003532298A (ja) 2000-04-26 2001-03-16 発光半導体素子
US11/067,349 US7691659B2 (en) 2000-04-26 2005-02-25 Radiation-emitting semiconductor element and method for producing the same
US11/065,769 US20060011925A1 (en) 2000-04-26 2005-02-25 Radiation-emitting semiconductor element and method for producing the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE10020464A DE10020464A1 (de) 2000-04-26 2000-04-26 Strahlungsemittierendes Halbleiterbauelement auf GaN-Basis
DE10020464.3 2000-04-26
DE10026255.4 2000-05-26
DE10026255A DE10026255A1 (de) 2000-04-26 2000-05-26 Lumineszenzdiosdenchip auf der Basis von GaN und Verfahren zum Herstellen eines Lumineszenzdiodenbauelements mit einem Lumineszenzdiodenchip auf der Basis von GaN
DE10051465A DE10051465A1 (de) 2000-10-17 2000-10-17 Verfahren zur Herstellung eines Halbleiterbauelements auf GaN-Basis
DE10051465.0 2000-10-17

Related Child Applications (3)

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US10239106 A-371-Of-International 2001-03-16
US11/065,769 Division US20060011925A1 (en) 2000-04-26 2005-02-25 Radiation-emitting semiconductor element and method for producing the same
US11/067,349 Continuation US7691659B2 (en) 2000-04-26 2005-02-25 Radiation-emitting semiconductor element and method for producing the same

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EP (2) EP2270875B1 (fr)
JP (1) JP2003532298A (fr)
CN (1) CN1292494C (fr)
TW (1) TW567616B (fr)
WO (1) WO2001082384A1 (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1385215A2 (fr) * 2002-07-08 2004-01-28 Nichia Corporation Dispositif semiconducteur à nitrure avec un substrat soudé et procédé de fabrication correspondant
JP2004128507A (ja) * 2002-09-30 2004-04-22 Osram Opto Semiconductors Gmbh 電磁ビームを放出する半導体チップおよびその製造方法
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US20040056254A1 (en) 2004-03-25
US20050282373A1 (en) 2005-12-22
US6878563B2 (en) 2005-04-12
US7691659B2 (en) 2010-04-06
EP2270875A1 (fr) 2011-01-05
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US20060011925A1 (en) 2006-01-19

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