WO2000019472A1 - Fusible sur puce et son procede de fabrication - Google Patents

Fusible sur puce et son procede de fabrication Download PDF

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Publication number
WO2000019472A1
WO2000019472A1 PCT/JP1999/005299 JP9905299W WO0019472A1 WO 2000019472 A1 WO2000019472 A1 WO 2000019472A1 JP 9905299 W JP9905299 W JP 9905299W WO 0019472 A1 WO0019472 A1 WO 0019472A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
shaped substrate
fuse
electrodes
fuse element
Prior art date
Application number
PCT/JP1999/005299
Other languages
English (en)
Japanese (ja)
Inventor
Yoshimitsu Motoki
Ichiro Ishiyama
Morikatsu Yamazaki
Mahito Shimada
Yutaka Nomura
Takayuki Nakayama
Kouji Fukuhisa
Original Assignee
Hokuriku Electric Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co., Ltd. filed Critical Hokuriku Electric Industry Co., Ltd.
Priority to JP2000572882A priority Critical patent/JP4183385B2/ja
Publication of WO2000019472A1 publication Critical patent/WO2000019472A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0412—Miniature fuses specially adapted for being mounted on a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/048—Fuse resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/44—Structural association with a spark-gap arrester

Definitions

  • the present invention relates to a chip-type fuse provided on a chip-shaped substrate with a heating resistor and a fuse element that is blown by heat from the heating resistor.
  • Japanese Patent Application Laid-Open No. 7-153533 discusses a conventional example of a chip-type fuse provided with a heating resistor and a fuse element that is blown off by heat from the heating resistor on a chip-shaped substrate. It is shown.
  • this chip type fuse a fuse element is formed on a resistor via an insulating layer.
  • This publication also discloses a technique of using a chip type fuse so that when an excessive current flows through the fuse element, the fuse element is blown by the current, and the fuse element is blown by the heat generated by the resistor. ing.
  • the conventional chip-type fuse a plurality of heating resistors formed on a substrate are covered with an insulating resin such as an epoxy resin, and a low-melting metal is formed as a fuse on this resin layer.
  • an insulating resin such as an epoxy resin
  • a low-melting metal is formed as a fuse on this resin layer.
  • the fuse since the fuse is formed on the surface of the insulating resin layer which is not flat, it is difficult to form the fuse element, and the production cost is increased due to a low yield.
  • the conventional chip type fuse requires a resistor in the external circuit to mount the chip type fuse.
  • An object of the present invention is to provide a highly reliable chip type fuse capable of directly blowing a fuse element by an excessive current and fusing the fuse element even by heat generated by a heating resistor, and a manufacturing method thereof. It is to provide a method.
  • -Another object of the present invention is to provide a chip type fuse in which a heating resistor and a fuse element are formed side by side on a surface of a chip-shaped substrate, until the fuse element is blown by the heat from the heating resistor.
  • An object of the present invention is to provide a chip type fuse that can shorten the fusing time.
  • Still another object of the present invention is to provide a chip type fuse in which a heating resistor and a fuse element are formed side by side on a surface of a chip-shaped substrate until the fuse element is blown by the heat from the heating resistor.
  • An object of the present invention is to provide a chip type fuse having less variation in fusing time.
  • Another object of the present invention is to provide a chip-type fuse that can prevent short-circuiting between electrodes by soldering.
  • Another object of the present invention is to provide a chip fuse in which the fuse element is reliably blown when an excessive current flows through the fuse element.
  • the chip-type fuse of the present invention includes a chip-shaped substrate having a front surface and a back surface, a heating resistor formed on the front surface of the chip-shaped substrate, and a heating resistor formed on the surface of the chip-shaped substrate. And a fuse element that is blown by heat.
  • the heating element and the fuse element are connected to each other when an excessive current flows through the fuse element, the fuse element is blown by the excessive current, and when an overvoltage is applied to the heating element, the heating element generates heat.
  • ADVANTAGE OF THE INVENTION According to this invention, a fuse element can be reliably formed on the surface of a chip-shaped board
  • a spacer means may be provided on the back surface of the chip-shaped substrate to contact the substrate surface of the circuit board on which the chip-type fuse is mounted to form a space between the substrate surface and the back surface.
  • the air in the space formed by the spacer means exerts a heat insulating function of preventing heat from the heating resistor from being transmitted to the circuit board. Therefore, the fuse element can be blown by the heat of the heat generating resistor in a shorter time in the case where the spacer means is provided than in the case where the spacer means is not provided.
  • the spacer means may be formed of a material having lower thermal conductivity than the chip-shaped substrate.
  • the spacer means can be provided easily and at low cost.
  • the pattern of the spacer means is preferably determined so that the thickness of the space formed between the back surface of the chip-shaped substrate and the circuit board is substantially constant. In this way, the thermal insulation effect of the space becomes substantially equal to the whole chip-shaped substrate, so that the fusing characteristics of the fuse element are stabilized. If the protrusion size of the spacer means becomes too small, the thermal insulation function of the space gradually decreases, and the practical effect of the spacer means decreases. If the protrusion size is too large, this space is more likely to become an obstacle to soldering.
  • the range of the lower limit value and the upper limit value of the protruding dimension is preferably in the range of 60 im to 150. Needless to say, even if the protrusion dimension does not fall within this range, it is included in the technical scope of the present invention as long as the effects of the present invention can be obtained.
  • the structure and position of the electrodes formed on the chip-shaped substrate are arbitrary. However, in order to make soldering to the electrodes on the circuit board more reliable, one or more surface electrodes electrically connected to the heating resistor and the fuse element are electrically connected to the surface of the chip-shaped substrate. Form one or more connected surface electrodes. A plurality of back electrodes electrically connected to the plurality of front electrodes are further formed on the back surface of the chip-shaped substrate. Then, on the outer surface connecting the front surface and the back surface of the chip-shaped substrate, a plurality of side electrodes connecting the plurality of front electrodes and the plurality of back electrodes partially overlap the corresponding front electrode and the back electrode. It is formed as follows.
  • the front surface electrode, the back surface electrode, and the side surface electrode are generally formed using a metal glaze conductive paste obtained by kneading conductive powder into glass.
  • the thickness of the side electrode tends to be reduced at the corners of the chip-shaped substrate. If the thickness of the electrode portion at this corner is too small, the resistance value of this portion becomes large, generating Joule heat at this portion, which may increase the blow time of the fuse. Therefore, such a problem can be solved by forming a supplemental electrode on the overlapping portion of the side electrode and the surface electrode or between the two.
  • the molten solder may form a bridge between the back electrodes, causing a short circuit between the electrodes. Therefore, if the aforementioned spacer means is formed in a pattern that can prevent the formation of a bridge of molten solder between a plurality of back electrodes, such a problem can be solved. Condition can be effectively prevented.
  • the chip-shaped substrate may be provided with a concave portion that opens toward the rear surface side below the heating resistor and the fuse element.
  • the shape and depth of the recess are determined so that heat generated from the heating resistor is transmitted to the fuse element as much as possible. Even in this case, the heat transfer from the heating resistor to the fuse element is improved, and the fusing time of the fuse element is shortened.
  • the material and configuration of the fuse element are arbitrary. In order to reliably form a fuse element on the surface of a chip-shaped substrate, it must be formed independently between a pair of surface electrodes formed on the surface of the chip-shaped substrate and separated from other adjacent electrodes. One or more auxiliary electrodes are provided, and a fuse material layer made of a conductive material that melts when heated to a predetermined temperature or more is used as a pair of surface electrodes.
  • the fuse material layer can be formed by heating and melting a cream solder layer formed over a pair of surface electrodes and one or more auxiliary electrodes, using a cream solder, for example, and then curing the cream solder layer.
  • a cream solder for example
  • the surface of the chip-shaped substrate is necessary to form the fuse element before forming the fuse element. It is preferable to overcoat with an insulating material except for a necessary part. This is to prevent the flux generated when the fuse element is formed using cream solder from adhering to the heating resistor and the like.
  • the spacer means is formed by printing, it is formed before forming the fuse element.
  • the fuse element is preferably formed at the end of the manufacturing process. This is to prevent the fuse element from being blown by the heat applied when forming the spacer means.
  • FIG. 2 shows a bottom view of the chip-shaped substrate of FIG.
  • FIG. 3 shows a plan view of the chip fuse of FIG. 1 with a part omitted.
  • FIG. 4 is a partially enlarged sectional view showing the structure of the side electrode.
  • FIG. 5 is a circuit diagram of the chip fuse of the embodiment of FIG.
  • FIG. 6 and FIG. 7 are a plan view and a rear view of a chip-like substrate used in the second embodiment of the present invention.
  • FIG. 9 is a diagram showing a mounted state of a chip type fuse.
  • FIG. 10 is a rear view of the chip-shaped substrate showing a different example of the spacer means.
  • FIGS. 11 (A) and 11 (B) are a partial cross-sectional perspective view and a cross-sectional view showing an example in which a concave portion opening toward the back surface side is formed below the heating resistor and the fuse element of the chip-shaped substrate. .
  • FIG. 1 shows the chip of the present invention
  • FIG. 2 shows a plan view of a ceramic chip substrate 1 used in the first embodiment of the type fuse
  • FIG. 2 shows a bottom view of the chip substrate 1.
  • FIG. 3 shows a plan view of a chip type fuse with a part omitted.
  • three semicircular concave portions 3 to 5 are formed on one long side 2 of two long sides extending in the longitudinal direction of the chip-shaped substrate 1.
  • One arc-shaped concave portion 7 is also formed at the center of the other long side 6.
  • These recesses 3 to 5 and recess 7 extend along the side surface connecting front surface 1 a and back surface 1 b of chip-shaped substrate 1.
  • concave portions 10 and 11 each having a U-shape when viewed from a plane are formed.
  • the mounting hooks of a case (not shown) that covers the surface la of the chip-shaped substrate are fitted into these recesses.
  • the surface 1 a of the chip-shaped substrate 1 has surface electrodes 12, 13, 14 for connection formed adjacent to the recesses 3 to 5 and the recess 7, an intermediate electrode 15, and an auxiliary electrode 16. And 17 and a portion connected to the surface electrode 14 and extending in the longitudinal direction of the chip-shaped substrate 1 and electrode portions 18 a and 19 a extending from the end of this portion along the short sides 8 and 9. Wiring sections 18 and 19 are provided. These electrodes and wiring portions are formed using a metal glaze conductive paste obtained by kneading conductive powders such as Ag and Ag-Pd into glass paste. The pattern is printed using screen printing, and the paste firing temperature is about 850 ° C.
  • the intermediate electrode 15 is formed substantially at the center of the space between the pair of surface electrodes 12 and 13, and the electrode portion 15 a of the intermediate electrode 15 is a pair of wiring portions 18 and 19. It is located at the center of the space between the opposing electrode portions 18a and 19a.
  • the two auxiliary electrodes 16 and 17 are adjacent to each other between the main body 15b of one surface electrode 12 and the intermediate electrode 15 and the main body 15b and the other surface electrode 13 It is formed independently (separated or electrically insulated) from the electrodes. Further, as shown in FIG. 2, on the back surface of the chip-shaped substrate 1, four back electrodes 20 to 23 adjacent to the ends of the recesses 3 to 5 and the recess 7 are provided with the above-mentioned metal glaze conductive paste.
  • the back electrode 21 is a dummy electrode used for soldering when it is necessary to increase the soldering strength.
  • the side electrodes 24 as shown in FIG. 4 are formed using the above-mentioned metal glaze conductive paste. Is done.
  • the side electrode 24 is on the outer surface connecting the front surface 1 a and the back surface 1 b of the chip-shaped substrate 1. And partially overlap the corresponding front and back electrodes. When the side electrode 24 is formed in this manner, the thickness of the side electrode 24 tends to be reduced at the corners of the chip-shaped substrate 1.
  • a supplementary electrode 25 is formed on the side surface electrode 24 and the surface electrode 13 so as to overlap with each other, thereby supplementing the portion of the side electrode 24 whose thickness is reduced. Supplementary electrode 25 is also formed using a metal glaze conductive paste.
  • the same connection structure as that shown in FIG. 4 is used to connect other surface electrodes other than the electrodes shown in FIG. 4 to the back electrode. As described above, in FIG. 3, for simplicity of illustration, only the position of the side electrode 24 is shown by a broken line, and its presence is omitted. It should be noted that, unlike this example, a supplementary electrode may be formed directly on the surface electrode 13 and the end of the side electrode 24 may be formed on the supplementary electrode.
  • the resistor 26 is formed.
  • the heating resistor 26 may be a thick film resistor printed and baked with a silver-palladium paint using glass as a binder, or a thick film resistor formed using a metal glaze resistor paint such as Ru R2-glass. Is formed by The firing temperature of these resistive paints is also about 85 Ot :.
  • an insulating material made of a glass material is used on the surface of the chip-shaped substrate 1 except for a portion for forming a fuse element 27 and a soldering electrode portion described later.
  • Overcoat is formed. After forming the overcoat, a fuse material layer is formed so as to extend over a part of the surface electrodes 12 and 13, the main body 15 b of the intermediate electrode 15 and the auxiliary electrodes 16 and 17. Thus, a fuse element 27 is formed.
  • the fuse material layer for example, a cream formed over a pair of surface electrodes 12 and 13 and two auxiliary electrodes 16 and 17 and an intermediate electrode 15 using cream solder. Form a solder layer.
  • the fuse element 27 is formed by heating the cream solder layer while pressing it from above, melting the -cream solder, and curing it as it is.
  • auxiliary electrodes 16 and 17 are provided between a pair of surface electrodes 12 and 13 as in this example, the molten cream solder (conductive material) is hardened while being restrained to some extent.
  • the auxiliary electrodes 16 and 17 serve as anchors (retaining portions) to stop the melted cream solder, so that the fuse material layer can be reliably formed.
  • the auxiliary electrodes 16 and 17 collect the molten conductive material because the fuse element 27 is not restrained.
  • the fuse element 27 can be easily blown by acting as an attraction.
  • the fuse material layer constituting the fuse element 27 can be formed from a eutectic solder alloy such as a low melting point metal such as Pb—Sn, Pb—Sb, and Sn—Sb. .
  • the circuit diagram of the chip type fuse of this embodiment is as shown in FIG.
  • This chip-type fuse is connected to the cut-off portion of the circuit protected by the electrodes 12 and 13, and connected to the electrode 14 where the overvoltage of the circuit to be protected is to be detected.
  • the split resistors R1 and R2 are connected to the heating resistor 26 formed between the intermediate electrode 15, the electrode 18a, and the electrode 19a (FIG. 3).
  • the divided fuse portions HI and H 2 are formed by a fuse element 27 formed between the intermediate electrode 15, the electrode 12, and the electrode 13. In this circuit configuration, when an excessive voltage is applied from the electrode 14 to the divided resistance portions R 1 and R 2, a current flows through at least one of the divided fuse portions H 1 and H 2.
  • FIG. 8 is a plan view showing a state in which an overcoat 128 of glass is formed on the surface of the chip-shaped substrate 101 of the second embodiment.
  • a fuse element 127 to be formed later is indicated by a broken line.
  • the chip-shaped substrate 10 is located at a position sandwiching the center of the heating resistor 12 6 and the fuse element 12 27 arranged side by side on the chip-shaped substrate 10 1.
  • a pair of through holes that pass through 1 in the thickness direction 129 and 130 are formed.
  • the pair of through-holes 12 9 and 13 0 are long in the direction in which the heat-generating resistor 12 6 extends so that heat generated from the heat-generating resistor 12 The size is determined.
  • the heat generated from the heating resistor 126 does not dissipate outside the pair of through-holes 129 and 130, and is collected at the center of the fuse element 127.
  • the fuse element 127 can be blown by the heat from the heating resistor 126 in a shorter time.
  • the back surface 101 of the chip-shaped substrate 101 is in contact with the substrate surface 100a of the circuit board 100 (see FIG. 9) on which the chip fuse is mounted. Then, a convex member or spacer means 1311 to 1334 for forming a space between the front surface 100a and the rear surface 101b of the substrate is provided.
  • the spacer means 13 1 to 13 4 are printed on the back surface 101 b of the chip-shaped substrate 101 using a synthetic resin paste made of a thermosetting resin such as an epoxy resin. Has formed. The height of the spacer means 13 1 to 13 4 can be set to an arbitrary height by applying the paste multiple times.
  • the spacer means 13 1 to 13 34 can be easily and inexpensively provided.
  • the spacer means 13 1 to 13 34 are formed before forming the fuse element 127 and after forming the glass overcoat 128.
  • the air in the space formed by the spacer means 13 1 to 13 4 will generate heat from the heat generating resistor 126. It has a thermal insulation function that prevents transmission to the circuit board 100. Therefore, when the spacer means 13 1 to 13 4 are provided, the heating resistor 1 2 6 is provided in a shorter time than when the spacer means 13 1 to 13 4 are not provided. With this heat, the fuse element 127 can be blown.
  • the spacer means 13 1 to 13 4 should be connected to the chip-like substrate 10. It may be made of a material having a lower thermal conductivity than 1.
  • the pattern or position of the spacer means 13 1 to 13 4 is determined by changing the thickness of the space formed between the back surface 101 b of the chip-like substrate 101 and the circuit board 100. The dimensions are determined so that they are almost constant. By doing so, the thermal insulation effect of the space becomes substantially equal to the entire chip-shaped substrate 101, so that the fusing characteristics of the fuse elements 127 are stabilized.
  • the range of the lower limit and the upper limit of the protruding dimension is preferably in the range of 60 m to 150 / m.
  • the molten solder may form a bridge between the adjacent back electrodes, and a short circuit may occur between the electrodes. Therefore, as shown in FIG. 10, if the spacer means 135 and 1336 are formed in a pattern for preventing a bridge of molten solder from being formed between adjacent back electrodes, such a case can be obtained. This can effectively prevent a situation from occurring.
  • through holes 12 9 and 13 0 are formed in the chip-shaped substrate to suppress the dissipation of heat from the heating resistor 1 26.
  • a concave portion 237 opening toward the back side is formed in the lower part of the heating resistor 222 and the fuse element 227 in the chip-shaped substrate 201.
  • the shape and depth of the concave portion 237 may be determined so that heat generated from the heating resistor 226 is transmitted to the fuse element 227 as much as possible. Even in this case, the heat transfer from the heating resistor to the fuse element is improved, and the fusing time of the fuse element is shortened.
  • the through holes 129 and 130 used in the second embodiment may be used in combination with the concave portions 237.
  • a fuse element can be formed reliably, and moreover, the function which blows a fuse element by an overcurrent and the function which blows a fuse element by the heat generation of a heating resistor has a function with reliability.
  • a high chip type fuse can be obtained.

Landscapes

  • Fuses (AREA)

Abstract

L'invention concerne une résistance chauffante (26) et un fusible (27) fondant sous l'effet de la chaleur de la résistance (26), prévus sur la surface d'une substrat de puce (1). La résistance (26) et le fusible (27) sont connectés au plan électrique, de sorte que le fusible (27) fonde en réaction à la circulation de surplus de courant ou à la génération de chaleur dans la résistance chauffante (26), lorsqu'une surtension est appliquée sur cette dernière (26). Le substrat de puce (1) est doté sur son envers (1b) de moyens d'espacement (131-134) grâce auxquels un espace est créé entre l'envers (1b) et l'avant d'une carte de circuit imprimé, par contact avec la surface frontale de la puce sur laquelle ledit fusible est fixé.
PCT/JP1999/005299 1998-09-28 1999-09-28 Fusible sur puce et son procede de fabrication WO2000019472A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000572882A JP4183385B2 (ja) 1998-09-28 1999-09-28 チップ型ヒューズ及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP27356298 1998-09-28
JP10/273562 1998-09-28
JP133899 1999-01-06
JP11/1338 1999-01-06

Publications (1)

Publication Number Publication Date
WO2000019472A1 true WO2000019472A1 (fr) 2000-04-06

Family

ID=26334553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/005299 WO2000019472A1 (fr) 1998-09-28 1999-09-28 Fusible sur puce et son procede de fabrication

Country Status (2)

Country Link
JP (1) JP4183385B2 (fr)
WO (1) WO2000019472A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
JP2013179096A (ja) * 2009-09-04 2013-09-09 Qiankun Kagi Kofun Yugenkoshi 保護装置
WO2015059955A1 (fr) * 2013-10-24 2015-04-30 株式会社村田製作所 Élément fusible et procédé de fabrication associé
CN107404104A (zh) * 2016-05-20 2017-11-28 聚鼎科技股份有限公司 保护元件及其电路保护装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07230749A (ja) * 1994-02-17 1995-08-29 Uchihashi Estec Co Ltd 抵抗・温度ヒュ−ズ
JPH0935603A (ja) * 1995-07-25 1997-02-07 Nec Kansai Ltd 抵抗内蔵型温度ヒューズ
JPH0963442A (ja) * 1995-08-28 1997-03-07 Nec Kansai Ltd 抵抗温度ヒューズ
JPH1021817A (ja) * 1996-07-01 1998-01-23 Omron Corp 抵抗温度ヒューズ
JPH10188759A (ja) * 1996-12-26 1998-07-21 Nec Kansai Ltd 温度ヒューズ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07230749A (ja) * 1994-02-17 1995-08-29 Uchihashi Estec Co Ltd 抵抗・温度ヒュ−ズ
JPH0935603A (ja) * 1995-07-25 1997-02-07 Nec Kansai Ltd 抵抗内蔵型温度ヒューズ
JPH0963442A (ja) * 1995-08-28 1997-03-07 Nec Kansai Ltd 抵抗温度ヒューズ
JPH1021817A (ja) * 1996-07-01 1998-01-23 Omron Corp 抵抗温度ヒューズ
JPH10188759A (ja) * 1996-12-26 1998-07-21 Nec Kansai Ltd 温度ヒューズ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
JP2013179096A (ja) * 2009-09-04 2013-09-09 Qiankun Kagi Kofun Yugenkoshi 保護装置
JP2015053271A (ja) * 2009-09-04 2015-03-19 乾坤科技股▲ふん▼有限公司 保護装置
WO2015059955A1 (fr) * 2013-10-24 2015-04-30 株式会社村田製作所 Élément fusible et procédé de fabrication associé
JPWO2015059955A1 (ja) * 2013-10-24 2017-03-09 株式会社村田製作所 ヒューズ素子及びその製造方法
CN107404104A (zh) * 2016-05-20 2017-11-28 聚鼎科技股份有限公司 保护元件及其电路保护装置
CN107404104B (zh) * 2016-05-20 2019-05-07 聚鼎科技股份有限公司 保护元件及其电路保护装置

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