WO1998021780A3 - Verbindung zwischen zwei kontaktflächen und verfahren zum herstellen einer solchen verbindung - Google Patents

Verbindung zwischen zwei kontaktflächen und verfahren zum herstellen einer solchen verbindung Download PDF

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Publication number
WO1998021780A3
WO1998021780A3 PCT/DE1997/002642 DE9702642W WO9821780A3 WO 1998021780 A3 WO1998021780 A3 WO 1998021780A3 DE 9702642 W DE9702642 W DE 9702642W WO 9821780 A3 WO9821780 A3 WO 9821780A3
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WO
WIPO (PCT)
Prior art keywords
connection
producing
contacts
contact surfaces
case
Prior art date
Application number
PCT/DE1997/002642
Other languages
English (en)
French (fr)
Other versions
WO1998021780A2 (de
Inventor
Robert Hagen
Bernd Goller
Original Assignee
Siemens Ag
Robert Hagen
Bernd Goller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Robert Hagen, Bernd Goller filed Critical Siemens Ag
Publication of WO1998021780A2 publication Critical patent/WO1998021780A2/de
Publication of WO1998021780A3 publication Critical patent/WO1998021780A3/de

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Es ist ein Verfahren zum Herstellen einer Draht-Bondverbindung zwischen zwei Kontaktflächen (2) vorgesehen, wobei der Verbindungsdraht (5) jeweils mittels zweier auf den Kontaktflächen (2) aufgetragenen Hilfsverbindungen (41, 42) verbunden ist.
PCT/DE1997/002642 1996-11-11 1997-11-11 Verbindung zwischen zwei kontaktflächen und verfahren zum herstellen einer solchen verbindung WO1998021780A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19646431.5 1996-11-11
DE19646431 1996-11-11

Publications (2)

Publication Number Publication Date
WO1998021780A2 WO1998021780A2 (de) 1998-05-22
WO1998021780A3 true WO1998021780A3 (de) 1998-06-25

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015541A (ja) 1999-06-28 2001-01-19 Sumitomo Electric Ind Ltd 半導体装置および半導体装置の製造方法
CN100401488C (zh) * 2001-03-23 2008-07-09 Nxp股份有限公司 具有小回路高度的接线连接的片状模块
EP1367644A1 (de) * 2002-05-29 2003-12-03 STMicroelectronics S.r.l. Elektronische Halbleiteranordnung und Herstellungsverfahren dafür

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041236A (ja) * 1983-08-17 1985-03-04 Nec Corp 電子部品の接続方法
JPH01293626A (ja) * 1988-05-23 1989-11-27 Ricoh Co Ltd フレキシブル配線板におけるワイヤボンディング法
EP0397426A2 (de) * 1989-05-09 1990-11-14 Citizen Watch Co., Ltd. IS-Packungsstruktur und Packungsverfahren
JPH04294552A (ja) * 1991-03-25 1992-10-19 Matsushita Electron Corp ワイヤーボンディング方法
WO1994022166A1 (en) * 1993-03-19 1994-09-29 National Semiconductor Corporation A method of and arrangement for bond wire connecting together certain integrated circuit components
WO1997012394A1 (de) * 1995-09-26 1997-04-03 Siemens Aktiengesellschaft Verfahren zum elektrischen verbinden eines halbleiterchips mit zumindest einer kontaktfläche

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041236A (ja) * 1983-08-17 1985-03-04 Nec Corp 電子部品の接続方法
JPH01293626A (ja) * 1988-05-23 1989-11-27 Ricoh Co Ltd フレキシブル配線板におけるワイヤボンディング法
EP0397426A2 (de) * 1989-05-09 1990-11-14 Citizen Watch Co., Ltd. IS-Packungsstruktur und Packungsverfahren
JPH04294552A (ja) * 1991-03-25 1992-10-19 Matsushita Electron Corp ワイヤーボンディング方法
WO1994022166A1 (en) * 1993-03-19 1994-09-29 National Semiconductor Corporation A method of and arrangement for bond wire connecting together certain integrated circuit components
WO1997012394A1 (de) * 1995-09-26 1997-04-03 Siemens Aktiengesellschaft Verfahren zum elektrischen verbinden eines halbleiterchips mit zumindest einer kontaktfläche

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 165 (E - 327) 10 July 1985 (1985-07-10) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 082 (E - 0889) 15 February 1990 (1990-02-15) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 110 (E - 1329) 8 March 1993 (1993-03-08) *

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