WO1990006518A1 - Appareil d'essai sans fil - Google Patents

Appareil d'essai sans fil Download PDF

Info

Publication number
WO1990006518A1
WO1990006518A1 PCT/US1989/005331 US8905331W WO9006518A1 WO 1990006518 A1 WO1990006518 A1 WO 1990006518A1 US 8905331 W US8905331 W US 8905331W WO 9006518 A1 WO9006518 A1 WO 9006518A1
Authority
WO
WIPO (PCT)
Prior art keywords
test
fixture
pattern
probe
probes
Prior art date
Application number
PCT/US1989/005331
Other languages
English (en)
Inventor
Robert D. Roberts
Ronald L. Stamp
Original Assignee
Cimm, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cimm, Inc. filed Critical Cimm, Inc.
Publication of WO1990006518A1 publication Critical patent/WO1990006518A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch

Definitions

  • This invention relates to the field of automatic testing of electronic circuit boards and more particularly to a test fixture for electrically connecting circuit boards to automatic test equipment.
  • PCBs Printed circuit board assemblies
  • PCBs consisting of electronic components mounted on a board of insulating material and connected to form electronic circuits by printed, electrically conductive traces, are found in virtually all electronic and electronically controlled products manufactured today. Products from the very simple (toasters, microwave ovens, washers and dryers), to the more complex (televisions, games, automative) to the most sophisticated (computers, satellites, telecommunications, aerospace) all contain many PCBs. The ability to repeatedly and economically build and verify electronic circuits is the key to the entire electronics industry. PCBs provide a very convenient method of producing electronic circuits, normally in
  • PCBs are tested electrically during the production process. Those that fail are repaired and retested until they are fixed or determined to be unrepairable and scrapped. Various tests can be performed to verify that a PCB operates correctly, including shorts and continuity tests, in-circuit tests, and functional tests. Automatic test equipment (ATE) for executing such tests is available from a variety of vendors with most vendors providing several varieties of testers.
  • ATE Automatic test equipment
  • automatic test equipment for production testing of printed circuit boards includes numerous electronic signal sources and detectors
  • test electronics or test resources which are selectively connected to a plurality of contact points or probes in a receiver.
  • a test fixture provides a mechanical and electrical interface between these receiver probes and test sites on the underside of a circuit board to be tested.
  • Suitable control circuits are provided to actuate the test fixture, and initiate the desired test to be performed, with the test results being presented on various types of readout devices.
  • Such vacuum actuated test fixtures are typically constructed from three plates commonly referred to as a probe plate, a top plate and an interface panel.
  • the probe plate is generally a thick plate made from insulating material having holes therethrough corresponding to the locations of test sites on the circuit card under test. Electrically conductive probing elements are mounted in these holes.
  • the probing elements comprise a
  • SUBSTITUTESHEET spring-loaded probe seated in a probe receptacle having a wirewrap tail extending therefrom.
  • a top plate having holes corresponding to the locations of the probing elements, is mounted on alignment pins and held above the probe plate by counterforce springs. The top plate supports the unit to be tested.
  • a sealed vacuum chamber is formed above the probe plate. When air is withdrawn from this vacuum chamber, the top plate is drawn toward the probe plate causing heads of the spring-loaded probes to pass through corresponding holes in the top plate and strike the associated test sites on the unit under test.
  • the interface panel of the prior art vacuum actuated test fixture is mounted below the probe plate.
  • a lower surface of the interface panel is provided with electrical contacts in a pattern which matches the pattern of receiver probes. Upon actuation, these interface panel contacts are brought into physical contact with the receiver probes.
  • posts or wirewrap tails are provided in a pattern which corresponds to the contacts on the lower surface and each post is electrically connected to its corresponding contact.
  • the tails of individual probe receptacles are connected by electrical wire to an appropriate post on the interface panel.
  • the individual wires connecting probe receptacles to posts on the interface panel typically have a length of about twenty inches. This expanse of wire is needed to allow the test fixture to be opened and hand wired. Since the test fixture normally contains hundreds of closely spaced probes, assembly of the wired fixture requires substantial manual labor and
  • SUBSTITUTE SHEET results in a mass of wiring within the finished fixture. Moreover, the extended wire lengths inside the fixture adversely affect the quality and speed of testing. These concerns have previously been addressed by using twisted wire pairs, coaxial cables, shielded cables or by adding electronic test components or ground planes to the fixture. Unfortunately, resulting fixtures have proven very time consuming and costly to construct, as well as difficult to modify.
  • ATE To reduce cable length between the test resources and unit under test, some ATE has recently been built with distributed receivers.
  • the receiver probes instead of being concentrated in a relatively small area, as was common in the past, are spatially distributed or spread out to allow the test electronics to be placed right under the probes and thereby reduce the wiring internal to the tester.
  • the problems associated with excessive wire lengths within the test fixture persist.
  • the wireless test fixture of the present invention employs an interface printed circuit board (PCB). On the upper surface of the interface PCB there is provided a first array of electrically conductive pads in a first pattern which exactly matches a pattern of test sites on a unit to be tested.
  • PCB interface printed circuit board
  • a second array of electrically conductive pads is provided on the lower surface of the interface PCB.
  • the pads of the second array are arranged in a second pattern which exactly matches the pattern of probes of a designated distributed receiver.
  • Interconnection means in the interface PCB connect individual pads of the first array to selected individual pads of the second array.
  • the area on' the lower surface of the interface PCB populated by said second pattern of pads generally underlies the area on the upper surface populated by said first pattern.
  • the pads in said second pattern are spatially distributed such that a pad corresponding to a desired test resource is likely to be proximate a pad in said first pattern corresponding to a test site requiring the desired test resource.
  • Individual pads of said first pattern are connected to the closest unused pad of the second pattern which corresponds to the desired test resource for said individual pad.
  • the wireless test fixture is provided with a plurality of floating spring-loaded probes mounted directly in a specially constructed probe plate. Each of the probes is slidably mounted for substantially free axial movement in a respective aperture of the probe plate.
  • the wireless test fixture of the present invention is preferably actuated by reducing the air pressure in an airtight first chamber formed above the probe plate, while maintaining atmospheric pressure in a second chamber formed below the probe plate.
  • the probe plate preferably comprises an upper probe plate, a lower probe plate and a sealing membrane sandwiched therebetween.
  • the sealing membrane provides a vacuum barrier between said first and second chambers.
  • the probe plate is provided with a custom layout of apertures in a pattern which matches the pattern of test sites on the underside of the UUT.
  • Each aperture in the probe plate consists of a first through hole in the upper probe plate dimensioned to provide a smooth slip-fit for the probe, and a second through hole in said lower probe plate.
  • the second through hole is axially aligned with the first through hole and has a larger lateral extent to provide a relief which allows the sealing membrane, where penetrated by a probe, to tent about said probe and form a vacuum seal thereabqut, without impeding the substantially free movement of the probe.
  • the integrity of the vacuum actuation is maintained while ensuring physical and high quality electrical contact at both ends of the floating probes.
  • the wireless test fixture is designed to accommodate subsequent modification.
  • the first pattern on the upper surface of the interface PCB preferably includes additional pads axially aligned with initially unused test sites on the underside of the UUT, and the top plate and probe plate are provided
  • SUBSTITUTESHEET with axially extending apertures axially aligned with said additional pads to accommodate later insertion of additional probes.
  • a constraint is also imposed on the interconnection means of the interface PCB such that individual pads on the opposite surfaces of the interface PCB are always connected by a first trace on the upper surface, a via through the interface PCB, and a second trace on the lower surface thereof. These traces allow for ready cutting of an original interconnection path, if needed, and rerouting thereof, if desired.
  • Spare pads are also provided on the upper surface of the interface PCB in an auxiliary field outside the area occupied by the first pattern. The spare pads are interconnected through the interface PCB to individual pads in the second pattern and thereby to additional test resources. The spare pads may be subsequently selectively connected to individual pads in the first pattern if such additional resources are needed.
  • the interface PCB is releasably mounted to the fixture so as to facilite ready removal and replacement thereof without disassembling the rest of the fixture. This feature facilitates modification or adaption of a particular test fixture to different testers.
  • the wireless test fixture can be provided in kit form for subsequent assembling and customizing. The invention further contemplates the provision of voltage distribution plane(s) in the interface PCB, gold plating of the pads to ensure high quality electrical connection, use of mechanical restraining means to limit upward movement of floating probes, and standardization of the fixture envelope and other adaptions to facilitate automatic
  • the present invention affords a host of advantages including higher speed, better quality and more controlled testing.
  • the wireless test fixture is significantly thinner making it easier to store, retrieve and otherwise handle, either automatically or manually.
  • the new fixture is easier to build since instead of tedious and time consuming hand wiring it utilizes standard printed circuit board manufacturing technology.
  • the interface PCB and the overall wireless test fixture can be accurately and economically manufactured and assure high quality electrical contacting as well as quick and easy subsequent modification.
  • the new test fixture is also rugged and reliable, applicable to a broad range of testers, automation ready, and amenable to user customization.
  • Fig. 1 is an isometric view of a wireless test fixture, with a notch cut out of it to illustrate internal features, constructed in accordance with the principles of the present invention ?
  • Fig. 2 is a cross-sectional view of the wireless test fixture, in its unactuated state, taken along lines A-A of Figure 1?
  • Fig. 3 is a top view of an interface PCB used in the wireless test fixture of the present invention ?
  • S UB S TITUTESHEET Fig. 4 is a view of the lower surface of the interface PCB of Figure 3?
  • Fig. 5 is a partial, cut-away cross-sectional view of an embodiment of an interface PCB?
  • Fig. 6 is a partial cross-sectional view illustrating the mounting of a floating probe in a specially constructed probe plate of the present invention?
  • Fig. 6a is a partial cross-sectional view of a modified probe mounting arrangement depicting mechanical restraining means for limiting upward probe motion?
  • Fig. 7 is a cross-sectional view of a wireless test fixture of the present invention, in its actuated state, and situated on an associated receiver.
  • Wireless test fixture 10 provides an electrical interface between a unit under test 12 and automatic test equipment (not shown).
  • the unit under test typically comprises a printed circuit board having various circuit components mounted on its top surface with legs extending through the board, and a determined pattern of test sites on the underside thereof.
  • the wireless test fixture of the present invention like previous fixtures, is typically customized to the particular board type or unit to be tested.
  • Test fixture 10 includes a substantially rigid perpheral frame 14, which may for example be made
  • Probe plate 16 is mounted atop frame 14 a probe plate 16 w h ich in turn supports a plurality of spring-loaded pro b es 18.
  • Probe plate 16 is preferably of a special construction, described hereinafter, which allows the probes 18 extending therethrough to "float" while maintaining a vacuum seal about each probe.
  • Probes 18 are arranged in a pattern which matches the pattern of initially used test sites on UUT 12, with individual probes being longitudinally aligned with particular test sites.
  • top plate 20 is supported above and in substantially parallel relationship to probe plate 16 by a peripheral gasket 22.
  • Top plate 20 serves to support the UUT 12 and contains a plurality of through holes. Each through hole in the top plate is axially aligned with a respective probe 18 and is sized to permit passage therethrough of at least the top portion of the respective probe.
  • An edge seal 24 is located on the upper surface of top plate 20 for receiving UUT 12 and providing an airtight seal thereabout.
  • Guide pins 26 ensure proper alignment of the unit under test with the various components of the test fixture.
  • interface PCB 28 Mounted below and substantially parallel to probe plate 16 is an interface PCB 28.
  • interface PCB 28 has electrically conductive pads on its upper surface in a first pattern which matches the pattern of test sites on the UUT and a second pattern of electrically conductive pads on its lower surface which matches a probe field of a designated distributed receiver.
  • test fixture 10 When test fixture 10 is actuated, the pads on the top surface of interface PCB 28 are brought into direct physical contact with the lower ends of probes 18 while the pads on the lower surface of the interface PCB are physically contacted by the receiver probes.
  • Interface PCB 28 is preferably releasably mounted by brackets, hinges or other suitable mounting means 30 to fixture frame 14 in a manner which facilitates ready release and replacement of the interfce PCB without disassembling the rest of the fixture.
  • fixture 10 facilitates automatic handling of the fixture.
  • the fixture is also provided with laterally protruding, longitudinally extending tongues 32 on opposite sides thereof to allow for automatic transport of the fixture in a fully automated test and repair system such as that described in commonly owned U.S. patent application serial number 129,825.
  • fixture 10 may be provided with alignment holes 34 at either end thereof and other adaptions to make it automation ready.
  • FIG. 2 shows the interrelationship of the components of wireless test fixture 10 in greater detail.
  • like elements are identified by like reference numbers.
  • conventional elements such as mounting or fastening means, guide pins and the like have not been depicted.
  • only representative components e.g. probes, plate apertures, pads, etc.
  • wireless test fixture 10 is shown, in its unactuated state, resting upon a peripheral gasket 36 of a distributed receiver 38.
  • T h e receiver comprises a plate 40 supporting a field of
  • Receiver 38 may be either a native receiver available with the original automatic test equipment or a receiver specially constructed or adapted for use with the wireless test fixture of this invention. In any event, the receiver should be distributed, i.e. its probes should be spatially distributed over a relatively large area generally coincident with the area covered by the UUT.
  • the interface PCB 28 at the bottom of fixture 10 includes a first set of electrically conductive pads so, 50' on the upper surface 52 thereof and a second set of electrically conductive pads 54 on its lower surface 56.
  • the layout of these pads and their interconnection will be described hereinafter with reference to Figures 3-5.
  • the probe plate includes an upper probe plate 58, a lower probe plate 60 and a sealing membrane 62 " sandwiched therebetween.
  • the sealing membrane 62 serves as a vacuum barrier, and, where penetrated by a probe 18 as a vacuum seal.
  • the so assembled probe plate mounts a plurality of spring-loaded probes 18 in apertures, generally designated 64, extending through the probe plate in an axial direction generally perpendicular to the plane of the probe plate.
  • the probes are generally parallel, axially extending, electrically conductive elements.
  • Each probe 18 has a spring-loaded tip 66 at its upper end and is axially aligned with a respective test site, e.g. 68, on the underside 70 of UUT 12.
  • the probes are
  • SUBSTITUTESHEET thus arrayed in a custom layout which exactly matches a pattern of initial test sites on the underside of the UUT.
  • Probes 18 preferably "float", i.e. they are mounted directly in probe plate apertures 64, in a manner that permits their substantially free axial movement relative to the probe plate.
  • apertures 64' are preferably drilled through upper probe plate 58 and lower probe plate 60 at locations axially aligned with possible future test sites on the UUT. However, the seal membrane 62 is not pierced at these locations until a probe is actually ready to be inserted.
  • the top surface of upper probe plate 58 bears conventional stops 72 and has counter bores or pockets 74 in which are placed conventional counterforce springs 76.
  • Top plate 20 is supported, as shown, above probe plate 16 by peripheral gasket 22.
  • Top plate 20 contains a series of axially extending through holes 78 which are axially aligned with probes 18. Apertures 78 are dimensioned to accommodate passage therethrough of probe tips 66.
  • top plate 20 is preferably provided with auxiliary through holes 78' aligned with potential future test sites on the UUT 12 in order to facilitate subsequent modification of the fixture.
  • Located on the upper surface of top plate 20 are an edge seal 24, which provides an airtight peripheral seal about UUT 12, and conventional stops 80.
  • the test fixture illustrated in Figure 2 is of the moving top plate variety, although the invention is applicable to other types of fixtures as well.
  • a tube 82 is mounted in the fixture so that it extends through interface PCB 28 and probe plate 16. Tube 82, in conjunction with vacuum port 48,
  • SUB S TITUTE SHEET serves to connect an airtight first chamber formed a b ove probe plate 16 to a vacuum source (not shown) . Actuation of the test fixture results in lowering of t h e top plate, bringing the underside of UUT 12 into pressing engagement with the tips 66 of probes 18.
  • test fixture 10 The actuation of test fixture 10 will be described in more detail hereinafter with respect to Figure 7, but first a detailed description of the construction of interface PCB 28, and specially constructed probe plate 16 will be presented.
  • the upper surface 52 of interface PCB 28 is provided with a first set of electrically conductive contact pads 50.
  • Pads 50 are arranged in a first pattern which matches exactly the pattern of initially used test sites on the bottom of UUT 12 and accordingly a pad 50 is located directly beneath each probe 18. Additional pads 50* are preferably included on the upper surface of the interface PCB 28 in axial alignment with the probe plate- apertures 64' and top plate apertures 78' to allow for easy subsequent modification of the test fixture.
  • Each pad 50 is connected by a first trace 84 on upper surface 52 to a via 86 extending through the interface PCB.
  • the first pattern of pads 50, 50' on upper surface 52 populate a first area generally coincident with the area covered by UUT 12. Outside of this area, spare pads 88 may be provided to affor d spare test resources, if needed, as described hereinafter.
  • the lower surface 56 of interface PCB 28 is provided with a second pattern of electrically conductive pads 54 arranged in a pattern which exactly matches the field of probes of the associated distributed receiver.
  • Pads 54 which correspond to different test resources are distributed over a second area which is generally coincident with the area covered by the UUT and generally underlies the first area on the upper surface of the interface PCB. By spreading out pads 54 over this second area, the different test resources are, in effect, distributed, thereby increasing the probability of having a desired test resource pad 54 physically near a test site pad 50 requiring same.
  • test site pads on the upper surface of the interface PCB can be selectively connected to the closest unused pad of the desired test resource type, on the underside of the interface PCB. Pad interconnection lengths are thereby minimized resulting in enhanced quality of testing.
  • a trace 89 on lower surface 56 is used to connect each individual pad 54 to an associated via 86.
  • each interconnection includes a trace 84 on the upper surface connected to a trace 89 on the lower surface by a via 86.
  • the via is either filled or lined with electrically conductive material, e.g. copper, to form, in association with the electrically conductive traces, a continuous electrical pathway between the selected pads.
  • electrically conductive material e.g. copper
  • vias 86 must be airtight. The imposed constraint of always employing surface traces to interconnect the selected pads on opposite surfaces
  • SUBSTITUTE SHEET of the interface PCB ensures that any such interconnecting pathway can be subsequently cut and rerouted, if required. This affords a unique modification capability to the interface PCB. Optimally, all of the pads on interface PCB
  • the pads are preferably gold plated to afford a contact resistance of no more than about 5-10 milliohms.
  • the ends of the probes are advantageously, similarly treated.
  • Interface PCB 28 may comprise a multilayer board containing one or more voltage distribution planes.
  • an internal power plane 90 may be provided as a convenient way to distribute power and an internal ground plane 92 used to provide additional signal quality shielding. Construction of such multilayer boards, like the layout and creation of the patterns of pads and routing of interconnection paths can all be accomplished with techniques known in the printed circuit board manufacturing art.
  • spare pads 88 may be initially connected to pads on the lower surface of interface PCB 28 to provide for spare test resources. Spare pads 88 can then, if needed, later be selectively connected to appropriate pads in the first pattern on upper surface 52.
  • interface PCB 28 replaces both the discrete wiring and interface panel of earlier wired fixtures and affords excellent signal quality and controlled path lengths, as well as unique modification capabilities.
  • Probe plate 16 includes an upper plate 58, a lower plate 60 and a thin sheet of sealing membrane 62 sandwiched therebetween. Although not drawn to scale, the relative thicknesses of the layers of probe plate 16 are generally as shown in Figure 6.
  • Upper plate 58 is provided with apertures 94 extending axially therethrough. Apertures 94 are preferably drilled or otherwise formed with a diameter just slightly larger than the outer diameter of probe 18. Upper plate 58 is composed of a material such as PET plastic, which provides a smooth slip-fit for the probe 18 on the inner bearing surface of aperture 94 to allow for substantially free axial movement of the probe in this aperture.
  • Lower plate 60 is provided with corresponding coaxial apertures 96 having a somewhat larger diameter or lateral extent, than apertures 94. Lower plate 60 serves to keep the sealing membrane 62 from sagging at locations other than apertures 96. Apertures 96 provide a relief which allows membrane 62 to deflect downward and form a vacuum seal about the body of probe 18. Lower plate 60 is preferably composed of electrically insulating material such as a fiberglass material.
  • Sealing membrane 62 comprises a sheet of thin, initially continuous material which provides a vacuum barrier between aligned apertures 94 and 96, when unpunctured.
  • a sealing membrane such as ASTAT 800 static dissipative material available from Alphastat of Salem, Massachusetts, with a thickness of about 6 mils, has been found to be suitable for this purpose.
  • SUBSTITUTESHEET 94 a small hole or pin prick is made in the center of the portion of sealing membrane 62 underlying the aperture.
  • the probe 18 is then inserted into aperture 94 until it protrudes through the hole in sealing membrane 62 and aperture 96 in the lower plate.
  • the portion of the sealing membrane circumscribing the body of pro b e 18 is deflected into the relief provided by aperture 96 and tends to form a cone or tent about the b o d y of the probe, as shown in Figure 6.
  • the tenting sealing membrane 62 forms a vacuum seal about probe 18 and the relatively higher air pressure below the probe plate, during fixture actuation, acts to increase sealing effectiveness.
  • FIG. 6a A variation of the floating probe-probe plate arrangement is depicted .in Fig. 6a.
  • probe 18 is provided with mechanical restraining means 19 about its lower end for limiting upward motion of the probe.
  • Restraining means 19 may comprise, for example, a standard, short length, electrically conductive probe receptacle which snap fits on and to the lower end of probe 18.
  • the restraining means travels with the floating probe and, since its lateral extent is greater than that of aperture 94 in upper probe plate 58, serves to limit the extent of substantially free upwar d movement of the probe. This is useful in preventing unwanted upward dislodgement of a probe if its tip should become imbedded in or otherwise attached to the
  • probe 18 may be separated, in situ, from restraining means 19 by applying suitable upward force to probe tip 66. Restraining means 19 is retained below upper probe plate 58 and maintained in a generally upright orientation by the extended depth of lower probe plate 60', so that a replacement probe may be readily inserted therein.
  • Actuation of the wireless test fixture of the present invention is depicted in Figure 7. Actuation begins by reducing the air pressure through vacuum port 46 in the space between interface PCB 28 and receiver plate 40. Since atmospheric pressure is maintained in the chamber directly above interface PCB 28 and about the test fixture 10, pressure differential causes the fixture to be lowered on the receiver 38 compressing receiver gasket 36 and bringing pads 54 on the lower surface of the interface PCB 28 into intimate contact with the tips of receiver probes 42. The use of vacuum as the actuating mechanism and of distributed stops 44 on the top of receiver plate 40 serve to maintain the interface PCB in a desired planar configuration.
  • the fixture can be used on multi-vendor or in-house test systems of different varieties to perform various tests including functional and in-circuit tests.
  • the fixture design is simple and reliable and uses industry standard replaceable probes and gold contacts throughout to ensure, high quality electrical connection.
  • the interface PCB of the fixture can be constructed using known circuit board manufacturing technology and eliminates the need for labor intensive hand wiring.
  • the fixture can be provided in kit form allowing the user to assemble and customize it. Provision is also made for subsequent modification of the fixture or adaption to different test equipment.
  • the low, flat profile of the wireless test fixture is ideal for storage and retrieval, either manual or automatic and the fixture is readily adapted for automated transport and handling in a fully automated test and repair environment.
  • SUBSTITUTE SHS can be made without departing from the scope of the invention.
  • actuating means other than vacuum may be utilized, or vacuum may be drawn everywhere inside the fixture, or double headed spring-loaded probes may be employed in place of the floating probes under certain circumstances, or the additional and spare pads on the upper surface of the interface PCB may be deleted if no change in test sites or test resource application is envisioned.
  • the invention is applicable to test fixtures in different orientations and to fixtures other than those of the moving top plate type.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

Afin d'éliminer l'encombrement constitué par les fils de connexion dans des appareils d'essai, la présente invention propose un appareil d'essai sans fil (10) servant à établir une interface entre une unité à tester (UUT) (12) et un récepteur décentralisé (38) d'un équipement d'essai automatique, qui contient une carte de circuits imprimés d'interface (28) et un réseau de sondes flottantes (18) montées dans une plaque à sondes de configuration spéciale (16). La carte de circuits imprimés d'interface (28) comporte sur sa surface supérieure (52) un groupe de plots électroconducteurs (50), disposés dans une configuration sur mesure qui correspond exactement à la conformation des sites d'essai situés sur la face inférieure de l'unité à tester (12). Un second groupe de plots électroconducteurs (54) est disposé sur la surface inférieure (56) de la carte de circuits imprimés d'interface (28) selon une configuration qui correspond exactement au champ des sondes (42) d'un récepteur décentralisé (38). Les plots séparés des deux groupes sont connectés sélectivement par des lignes d'interconnexion de longueur réduite régulée, ce qui permet également une modification ultérieure des interconnexions.
PCT/US1989/005331 1988-11-28 1989-11-27 Appareil d'essai sans fil WO1990006518A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27676988A 1988-11-28 1988-11-28
US276,769 1988-11-28

Publications (1)

Publication Number Publication Date
WO1990006518A1 true WO1990006518A1 (fr) 1990-06-14

Family

ID=23058005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1989/005331 WO1990006518A1 (fr) 1988-11-28 1989-11-27 Appareil d'essai sans fil

Country Status (1)

Country Link
WO (1) WO1990006518A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0526922A2 (fr) * 1991-07-10 1993-02-10 Schlumberger Technologies, Inc. Dispositif modulaire de test de plaquettes de circuits imprimés ayant un récepteur sans câblage
US5218292A (en) * 1991-12-06 1993-06-08 Sigmatech Co., Ltd. Apparatus for inspecting internal circuit of semiconductor device
GB2267786A (en) * 1992-06-09 1993-12-15 Everett Charles Tech Test fixture
EP0915343A2 (fr) * 1997-11-05 1999-05-12 Feinmetall GmbH Dispositif de contact facile à entretenir
EP0915344A2 (fr) * 1997-11-05 1999-05-12 Feinmetall GmbH Tête de sonde pour microstructures avec interface
GB2335548A (en) * 1998-03-20 1999-09-22 Capital Formation Inc Floating spring probe pcb test fixture
WO2002041017A1 (fr) * 2000-11-20 2002-05-23 Test Plus Electronic Gmbh Adaptateur de test servant a tester une carte de circuits imprimes
US6628130B2 (en) * 2001-07-18 2003-09-30 Agilent Technologies, Inc. Wireless test fixture for printed circuit board test systems
US6650134B1 (en) * 2000-02-29 2003-11-18 Charles A. Schein Adapter assembly for connecting test equipment to a wireless test fixture
EP1512979A2 (fr) * 1996-10-29 2005-03-09 Agilent Technologies Inc. (a Delaware Corporation) Dispositif de test de circuits imprimés avec guidage des pointes de test
SG131801A1 (en) * 2005-10-20 2007-05-28 Agilent Technologies Inc No-wire pcb with integrated circuit and method for testing using the same
US7928750B2 (en) * 2004-02-05 2011-04-19 Formfactor, Inc. Contactless interfacing of test signals with a device under test
WO2019082259A1 (fr) * 2017-10-24 2019-05-02 井上商事株式会社 Gabarit d'inspection
CN110610021A (zh) * 2019-07-31 2019-12-24 贵州省广播电视信息网络股份有限公司 一种layout设计ddr布线的快捷的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
US4403822A (en) * 1979-07-31 1983-09-13 Marconi Instruments Limited Electrical probe apparatus
US4544886A (en) * 1982-09-30 1985-10-01 M-Rel, Inc. Circuit board test fixture
US4551673A (en) * 1980-10-13 1985-11-05 Riba-Pruftechnik Gmbh Testing arrangement for printed circuit boards
US4626776A (en) * 1984-06-07 1986-12-02 O. B. Test Group, Inc. Programmable test fixture
US4746861A (en) * 1986-08-21 1988-05-24 Tti Testron, Inc. Test fixture for printed circuit board assembly
JPS63122140A (ja) * 1986-11-12 1988-05-26 Hitachi Ltd 半導体素子検査装置及びその製法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
US4403822A (en) * 1979-07-31 1983-09-13 Marconi Instruments Limited Electrical probe apparatus
US4551673A (en) * 1980-10-13 1985-11-05 Riba-Pruftechnik Gmbh Testing arrangement for printed circuit boards
US4544886A (en) * 1982-09-30 1985-10-01 M-Rel, Inc. Circuit board test fixture
US4626776A (en) * 1984-06-07 1986-12-02 O. B. Test Group, Inc. Programmable test fixture
US4746861A (en) * 1986-08-21 1988-05-24 Tti Testron, Inc. Test fixture for printed circuit board assembly
JPS63122140A (ja) * 1986-11-12 1988-05-26 Hitachi Ltd 半導体素子検査装置及びその製法

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0526922A2 (fr) * 1991-07-10 1993-02-10 Schlumberger Technologies, Inc. Dispositif modulaire de test de plaquettes de circuits imprimés ayant un récepteur sans câblage
EP0526922A3 (en) * 1991-07-10 1994-05-18 Schlumberger Technologies Inc Modular board test system having wireless receiver
US5218292A (en) * 1991-12-06 1993-06-08 Sigmatech Co., Ltd. Apparatus for inspecting internal circuit of semiconductor device
GB2267786A (en) * 1992-06-09 1993-12-15 Everett Charles Tech Test fixture
US5300881A (en) * 1992-06-09 1994-04-05 Everett Charles Technologies, Inc. Test fixture
US5422575A (en) * 1992-06-09 1995-06-06 Everett Charles Technologies, Inc. Test fixture with adjustable bearings and optical alignment system
GB2267786B (en) * 1992-06-09 1996-08-21 Everett Charles Tech Test fixture
US5557211A (en) * 1992-06-09 1996-09-17 Everett Charles Technologies, Inc. Vacuum test fixture for printed circuit boards
EP1512979A3 (fr) * 1996-10-29 2005-06-15 Agilent Technologies Inc. (a Delaware Corporation) Dispositif de test de circuits imprimés avec guidage des pointes de test
EP1512980A3 (fr) * 1996-10-29 2005-06-15 Agilent Technologies Inc. (a Delaware Corporation) Dispositif de test de circuits imprimés avec guidage des pointes de test
EP1512980A2 (fr) * 1996-10-29 2005-03-09 Agilent Technologies Inc. (a Delaware Corporation) Dispositif de test de circuits imprimés avec guidage des pointes de test
EP1512979A2 (fr) * 1996-10-29 2005-03-09 Agilent Technologies Inc. (a Delaware Corporation) Dispositif de test de circuits imprimés avec guidage des pointes de test
US6066957A (en) * 1997-09-11 2000-05-23 Delaware Capital Formation, Inc. Floating spring probe wireless test fixture
EP0915343A2 (fr) * 1997-11-05 1999-05-12 Feinmetall GmbH Dispositif de contact facile à entretenir
EP0915344A2 (fr) * 1997-11-05 1999-05-12 Feinmetall GmbH Tête de sonde pour microstructures avec interface
EP0915343A3 (fr) * 1997-11-05 2001-01-31 Feinmetall GmbH Dispositif de contact facile à entretenir
EP0915344A3 (fr) * 1997-11-05 2001-01-31 Feinmetall GmbH Tête de sonde pour microstructures avec interface
DE19900833B4 (de) * 1998-03-20 2007-05-16 Capital Formation Inc Testhalterung
GB2335548B (en) * 1998-03-20 2000-01-26 Capital Formation Inc Floating spring probe test fixture
FR2776390A1 (fr) * 1998-03-20 1999-09-24 Capital Formation Inc Appareil d'essai sans fil a sondes flottantes a ressort
GB2335548A (en) * 1998-03-20 1999-09-22 Capital Formation Inc Floating spring probe pcb test fixture
US6650134B1 (en) * 2000-02-29 2003-11-18 Charles A. Schein Adapter assembly for connecting test equipment to a wireless test fixture
WO2002041017A1 (fr) * 2000-11-20 2002-05-23 Test Plus Electronic Gmbh Adaptateur de test servant a tester une carte de circuits imprimes
US6628130B2 (en) * 2001-07-18 2003-09-30 Agilent Technologies, Inc. Wireless test fixture for printed circuit board test systems
US7928750B2 (en) * 2004-02-05 2011-04-19 Formfactor, Inc. Contactless interfacing of test signals with a device under test
SG131801A1 (en) * 2005-10-20 2007-05-28 Agilent Technologies Inc No-wire pcb with integrated circuit and method for testing using the same
WO2019082259A1 (fr) * 2017-10-24 2019-05-02 井上商事株式会社 Gabarit d'inspection
CN110610021A (zh) * 2019-07-31 2019-12-24 贵州省广播电视信息网络股份有限公司 一种layout设计ddr布线的快捷的方法

Similar Documents

Publication Publication Date Title
US6469531B1 (en) Loaded-board, guided-probe test fixture
EP0855037B1 (fr) Accessoire a broches tombantes pour carte equipee
US6292004B1 (en) Universal grid interface
TW522240B (en) Test fixture for testing backplanes or populated circuit boards
US5389885A (en) Expandable diaphragm test modules and connectors
WO1990006518A1 (fr) Appareil d'essai sans fil
US5252916A (en) Pneumatic test fixture with springless test probes
CA1290461C (fr) Ensemble de broches d'essai pour dispositif d'essai de circuit imprime
US5767692A (en) Device for converting the test point grid of a machine for electrically testing unassembled printed circuit boards
JPH10170611A (ja) 実装済み回路基板の標準及び制限アクセス・ハイブリッド試験用取付具
JP2755486B2 (ja) フォイル・アダプタを有するプリント回路基板テスト装置
US4496903A (en) Circuit board test fixture
US5945838A (en) Apparatus for testing circuit boards
US6340893B1 (en) Printed circuit board test apparatus and method
US20040183648A1 (en) Strain sensors and housings and circuit boards with integrated strain sensors
US6191601B1 (en) Test fixture for matched impedance testing
EP0135384B1 (fr) Assemblage de sonde
US6628130B2 (en) Wireless test fixture for printed circuit board test systems
US6407565B1 (en) Loaded-board, guided-probe test fixture
EP0943924A2 (fr) Dispositif de test de circuits imprimés avec guidage des pointes de test
US6784675B2 (en) Wireless test fixture adapter for printed circuit assembly tester
EP0115135A1 (fr) Fixation électrique pour tester des circuits imprimés et similaires
US5276395A (en) Bed-of-pins test fixture
US6498299B2 (en) Connection structure of coaxial cable to electric circuit substrate
JP2002529708A (ja) プリント回路基板テスタ

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP KR

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE ES FR GB IT LU NL SE