UY24454A1 - Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductora - Google Patents
Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductoraInfo
- Publication number
- UY24454A1 UY24454A1 UY24454A UY24454A UY24454A1 UY 24454 A1 UY24454 A1 UY 24454A1 UY 24454 A UY24454 A UY 24454A UY 24454 A UY24454 A UY 24454A UY 24454 A1 UY24454 A1 UY 24454A1
- Authority
- UY
- Uruguay
- Prior art keywords
- conductive plate
- construction elements
- electronic construction
- procedure
- precise positioning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Emergency Protection Circuit Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Thermistors And Varistors (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Resistance Welding (AREA)
- Fuses (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Placa conductora y procedimiento para el posicionamiento preciso de los elementos de construcción electrónicos en la superficie de la placa conductora, en cuyo caso los elementos de construcción electrónicos has de ser unidos de forma eléctricamente conductiva y estable, mediante la técnica de soldadura Reflow. La placa conductora configurada de acuerdo con la invención está especialmente destinada para el uso en conjuntos con dispositivos de protección de máximo de tensión, en los cuales se aplican descargadores de sobretensión, varistores y diodos como elementos construcción electrónicos de componentes electrónicos en la superficie. La placa conductora dispone de zonas adaptadas para el alojamiento de elementos de construcción electrónica. Dichas zonas aseguran que los elementos de construcción electrónicos queden sujetados en la posición deseada, después de la aplicación de la pasta de soldar y antes de la propia realización de la soldadura.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19610586A DE19610586B4 (de) | 1996-03-18 | 1996-03-18 | Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte |
DE1996111631 DE19611631C1 (de) | 1996-03-25 | 1996-03-25 | Modul mit einem Gehäuse und einer Grundplatte |
DE19620340A DE19620340C1 (de) | 1996-05-21 | 1996-05-21 | Überspannungs - Schutzstecker |
Publications (1)
Publication Number | Publication Date |
---|---|
UY24454A1 true UY24454A1 (es) | 1997-03-04 |
Family
ID=27216039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
UY24454A UY24454A1 (es) | 1996-03-18 | 1997-02-07 | Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductora |
Country Status (29)
Country | Link |
---|---|
US (1) | US5999412A (es) |
EP (1) | EP0797379B1 (es) |
JP (1) | JPH104250A (es) |
KR (1) | KR19990008482A (es) |
CN (1) | CN1168078A (es) |
AR (1) | AR006169A1 (es) |
AT (1) | ATE224634T1 (es) |
AU (1) | AU713077B2 (es) |
BG (1) | BG62425B1 (es) |
BR (1) | BR9701324A (es) |
CA (1) | CA2199898A1 (es) |
CO (1) | CO4560406A1 (es) |
CZ (1) | CZ292485B6 (es) |
DE (1) | DE59708222D1 (es) |
DK (1) | DK0797379T3 (es) |
ES (1) | ES2183993T3 (es) |
HU (1) | HUP9700597A3 (es) |
ID (1) | ID16239A (es) |
IL (1) | IL120102A (es) |
NO (1) | NO970383L (es) |
NZ (1) | NZ314160A (es) |
PL (1) | PL182659B1 (es) |
PT (1) | PT797379E (es) |
SG (1) | SG52925A1 (es) |
SI (1) | SI0797379T1 (es) |
TR (1) | TR199700165A2 (es) |
UA (1) | UA42784C2 (es) |
UY (1) | UY24454A1 (es) |
YU (1) | YU48977B (es) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2321135B (en) * | 1997-01-11 | 2001-06-27 | Furse W J & Co Ltd | Improvements in or relating to thermal trip arrangements |
FR2770739B1 (fr) * | 1997-11-05 | 2000-01-28 | Lacme | Appareil electrificateur de cloture |
AUPP308498A0 (en) * | 1998-04-20 | 1998-05-14 | Krone Aktiengesellschaft | Electrical connector |
US20020046627A1 (en) | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
DE19836456C1 (de) * | 1998-08-12 | 2000-04-20 | Kostal Leopold Gmbh & Co Kg | Elektrische Leiterplatte und Verfahren zur Herstellung derselben |
US6239977B1 (en) * | 1999-05-17 | 2001-05-29 | 3Com Corporation | Technique for mounting electronic components on printed circuit boards |
EP1325505A4 (en) * | 2000-09-18 | 2006-11-02 | Meder Electronic | FLEXIBLE RELAY MOUNT WITH SURFACE MOUNTING WITHOUT CONDUCTORS |
US7155004B1 (en) | 2002-11-22 | 2006-12-26 | Adc Incorporated | System and method of delivering DSL services |
US7409053B1 (en) | 2002-11-22 | 2008-08-05 | Adc Telecommunications, Inc. | System and method of providing DSL services on a telephone network |
DE102004046394B4 (de) * | 2004-08-24 | 2007-03-01 | Dehn + Söhne Gmbh + Co. Kg | Steckbare Überspannungsschutz-Anordnung |
DE102004061681B4 (de) | 2004-12-22 | 2006-10-26 | Adc Gmbh | Kabelsteckverbinder für Leiterplatten |
US20070047526A1 (en) * | 2005-08-26 | 2007-03-01 | Bryan Kennedy | Systems and methods for conecting between telecommunications equipment |
US7522721B2 (en) * | 2005-08-26 | 2009-04-21 | Adc Telecommunications, Inc. | System for broadband service delivery |
US7643631B2 (en) * | 2005-08-26 | 2010-01-05 | Adc Telecommunications, Inc. | Enclosure for broadband service delivery system |
US8064182B2 (en) * | 2007-02-28 | 2011-11-22 | Adc Telecommunications, Inc. | Overvoltage protection plug |
CN101295570B (zh) * | 2007-04-25 | 2011-11-23 | 聚鼎科技股份有限公司 | 保护电路板和其过电流保护元件 |
DE102007050590B4 (de) * | 2007-10-23 | 2017-04-13 | Tyco Electronics Services Gmbh | Verteileranschlussmodul |
US7946863B2 (en) | 2008-04-25 | 2011-05-24 | Adc Telecommunications, Inc. | Circuit protection block |
US8411404B2 (en) * | 2008-05-27 | 2013-04-02 | Adc Telecommunications, Inc. | Overvoltage protection plug |
EP2790477B1 (en) | 2013-04-08 | 2018-06-13 | Electrolux Appliances Aktiebolag | A fixing device for a capacitor and a cooking oven including a cooling channel with the fixing device |
DE102014103419B4 (de) | 2014-03-13 | 2018-05-24 | Epcos Ag | Überspannungsableiter mit Schutz vor Erwärmung |
US9763328B1 (en) * | 2016-03-11 | 2017-09-12 | Continental Automotive Systems, Inc. | Electrolytic capacitor retention device |
CN106231790A (zh) * | 2016-07-27 | 2016-12-14 | 上海摩软通讯技术有限公司 | 一种印制电路板及制作方法及移动终端 |
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DE1071170B (es) * | 1959-12-17 | |||
US2777039A (en) * | 1954-06-29 | 1957-01-08 | Standard Coil Prod Co Inc | Resistor elements adapted for use in connection with printed circuits |
US2990498A (en) * | 1956-07-02 | 1961-06-27 | Gen Electric | Capacitor |
GB820824A (en) * | 1956-07-02 | 1959-09-30 | Gen Electric | Improvements in capacitors and mountings therefor |
US2869041A (en) * | 1956-11-08 | 1959-01-13 | Admiral Corp | Mounting means |
US3049647A (en) * | 1958-09-02 | 1962-08-14 | Sylvania Electric Prod | Electrical chassis |
US3142783A (en) * | 1959-12-22 | 1964-07-28 | Hughes Aircraft Co | Electrical circuit system |
US3349480A (en) * | 1962-11-09 | 1967-10-31 | Ibm | Method of forming through hole conductor lines |
GB1246127A (en) * | 1968-08-20 | 1971-09-15 | Lilly Industries Ltd | Bis-piperazinyl compounds |
DE2032994B2 (de) * | 1970-07-03 | 1972-07-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Anordnung zum einbau und verdrahten von ueberspannungsableitern in geraeten und anlagen der nachrichtentechnik, insbesondere in garnituren und endgestellen von fernmeldekabelanlagen |
DE2713650C2 (de) * | 1977-03-28 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | Fügeverbindung zweier Kunststoffteile |
DE8234198U1 (de) * | 1982-12-06 | 1986-03-13 | Siemens AG, 1000 Berlin und 8000 München | Kleinhörgerät |
DE3323687C2 (de) | 1983-07-01 | 1986-12-18 | Krone Gmbh, 1000 Berlin | Überspannungsableitermagazin für Anschlußleisten der Fernmeldetechnik |
US4542439A (en) * | 1984-06-27 | 1985-09-17 | At&T Technologies, Inc. | Surface mount component |
DE3501710A1 (de) * | 1985-01-19 | 1986-07-24 | Allied Corp., Morristown, N.J. | Leiterplatte mit integralen positioniermitteln |
GB2204184A (en) * | 1987-04-29 | 1988-11-02 | Stanley Bracey | Mounting electronic components on substrates |
JPH029193A (ja) * | 1988-06-28 | 1990-01-12 | Nec Corp | プリント基板 |
EP0439546A1 (de) * | 1988-10-20 | 1991-08-07 | Siemens Aktiengesellschaft | Verfahren und vorrichtung zum löten von drähten von bauelementen zur montage auf oberflächen |
JPH02224293A (ja) * | 1989-02-27 | 1990-09-06 | Toshiba Corp | 印刷配線板 |
US4985601A (en) * | 1989-05-02 | 1991-01-15 | Hagner George R | Circuit boards with recessed traces |
US5055637A (en) * | 1989-05-02 | 1991-10-08 | Hagner George R | Circuit boards with recessed traces |
DE4016366C2 (de) | 1990-05-21 | 1994-04-28 | Siemens Nixdorf Inf Syst | Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte |
DE4026004A1 (de) | 1990-08-14 | 1992-02-20 | Krone Ag | Schutzschaltung und schutzstecker in telekommunikationsanlagen |
DE4026233A1 (de) * | 1990-08-18 | 1992-02-20 | Peter Hiller | Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung |
DE9012638U1 (de) * | 1990-09-04 | 1990-11-08 | Siemens AG, 8000 München | Im Spritzgußverfahren hergestellte Leiterplatte |
DE9012951U1 (de) * | 1990-09-11 | 1990-11-15 | Siemens AG, 8000 München | Schutzstecker für Leitungen in einem Verteiler einer Telekommunikationsanlage |
JPH04163987A (ja) * | 1990-10-29 | 1992-06-09 | Nec Corp | チップ部品実装方式 |
DE4215041C3 (de) * | 1991-05-22 | 1997-09-25 | Siemens Ag | Elektronisches Steuergerät |
DE4126913A1 (de) | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
AU2739892A (en) | 1991-10-29 | 1993-05-06 | Alcatel N.V. | Method of producing solid solder coatings |
DE9201118U1 (de) * | 1992-01-30 | 1992-03-12 | Siemens AG, 8000 München | Leiterplatte |
DE4225484C1 (de) * | 1992-07-30 | 1993-12-23 | Krone Ag | Schutzstecker für Anschluß- und Trennleisten der Telekommunikations- und Datentechnik |
US5412538A (en) * | 1993-07-19 | 1995-05-02 | Cordata, Inc. | Space-saving memory module |
US5579212A (en) * | 1993-07-29 | 1996-11-26 | Sun Microsystems, Inc. | Protective cover for a silicon chip device and method relating thereto |
DE4403053C1 (de) * | 1994-01-28 | 1995-03-23 | Krone Ag | Luftfunkenstrecke zum Festlegen der Höchstspannung an einem Überspannungsableiter |
US5600175A (en) * | 1994-07-27 | 1997-02-04 | Texas Instruments Incorporated | Apparatus and method for flat circuit assembly |
DE4437122C2 (de) * | 1994-10-01 | 1996-07-18 | Krone Ag | Überspannungsschutzstecker |
DE29611468U1 (de) * | 1996-06-20 | 1996-09-05 | Siemens AG, 80333 München | Gasgefüllter Überspannungsableiter mit drei Elektroden für liegende Anordnung |
-
1997
- 1997-01-28 ES ES97101240T patent/ES2183993T3/es not_active Expired - Lifetime
- 1997-01-28 DK DK97101240T patent/DK0797379T3/da active
- 1997-01-28 DE DE59708222T patent/DE59708222D1/de not_active Expired - Lifetime
- 1997-01-28 EP EP97101240A patent/EP0797379B1/de not_active Expired - Lifetime
- 1997-01-28 AT AT97101240T patent/ATE224634T1/de active
- 1997-01-28 SI SI9730440T patent/SI0797379T1/xx unknown
- 1997-01-28 PT PT97101240T patent/PT797379E/pt unknown
- 1997-01-29 NO NO970383A patent/NO970383L/no not_active Application Discontinuation
- 1997-01-30 IL IL12010297A patent/IL120102A/xx unknown
- 1997-01-30 NZ NZ314160A patent/NZ314160A/en unknown
- 1997-02-04 AU AU12513/97A patent/AU713077B2/en not_active Ceased
- 1997-02-07 UY UY24454A patent/UY24454A1/es unknown
- 1997-02-14 CO CO97007791A patent/CO4560406A1/es unknown
- 1997-02-28 SG SG1997000604A patent/SG52925A1/en unknown
- 1997-03-06 TR TR97/00165A patent/TR199700165A2/xx unknown
- 1997-03-10 AR ARP970100940A patent/AR006169A1/es not_active Application Discontinuation
- 1997-03-10 CZ CZ1997716A patent/CZ292485B6/cs not_active IP Right Cessation
- 1997-03-11 PL PL97318893A patent/PL182659B1/pl unknown
- 1997-03-11 US US08/815,114 patent/US5999412A/en not_active Expired - Lifetime
- 1997-03-11 JP JP9056228A patent/JPH104250A/ja active Pending
- 1997-03-12 YU YU9197A patent/YU48977B/sh unknown
- 1997-03-12 BG BG101319A patent/BG62425B1/bg unknown
- 1997-03-12 KR KR1019970008277A patent/KR19990008482A/ko not_active IP Right Cessation
- 1997-03-13 CA CA002199898A patent/CA2199898A1/en not_active Abandoned
- 1997-03-14 ID IDP970818A patent/ID16239A/id unknown
- 1997-03-14 UA UA97031160A patent/UA42784C2/uk unknown
- 1997-03-17 HU HU9700597A patent/HUP9700597A3/hu unknown
- 1997-03-18 BR BR9701324A patent/BR9701324A/pt not_active IP Right Cessation
- 1997-03-18 CN CN97104504A patent/CN1168078A/zh active Pending
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