USRE39418E1 - Mounting apparatus for ball grid array device - Google Patents

Mounting apparatus for ball grid array device Download PDF

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Publication number
USRE39418E1
USRE39418E1 US09/715,290 US71529000A USRE39418E US RE39418 E1 USRE39418 E1 US RE39418E1 US 71529000 A US71529000 A US 71529000A US RE39418 E USRE39418 E US RE39418E
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US
United States
Prior art keywords
support member
grid array
ball grid
array device
end portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/715,290
Other languages
English (en)
Inventor
Wayne K. Pfaff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plastronics Socket Partners LP
Plastronics Socket Co Inc
Original Assignee
Plastronics Socket Partners LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/258,348 external-priority patent/US5419710A/en
Application filed by Plastronics Socket Partners LP filed Critical Plastronics Socket Partners LP
Priority to US09/715,290 priority Critical patent/USRE39418E1/en
Application granted granted Critical
Publication of USRE39418E1 publication Critical patent/USRE39418E1/en
Assigned to PLASTRONICS SOCKET COMPANY, INC. reassignment PLASTRONICS SOCKET COMPANY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PFAFF, WAYNE K
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to electronic device mounting and testing apparatus. More particularly, it relates to socket apparatus for holding and making electrical contact with the input/output terminals of ball grid array devices during testing, burn-in and the like.
  • circuit chips are usually contained within a housing or package which supports interconnection leads, pads, etc., on one or more of its external surfaces.
  • high pin count devices are usually mounted in packages in which the input/output terminals are arranged in a grid pattern on one face of the package.
  • the terminals may be in the form of pins extending from the package (usually described as a pin grid array or PGA) or contact pads on the surface of the package.
  • PGA pin grid array
  • BGA ball grid array
  • ball grid array device is usually applied to a device package which has substantially spherical contacts extending from one face thereof, the term is also applied to other structures.
  • bare (unencapsulated) chips are sometimes provided with a grid array of ball-shaped contacts for mounting in a package.
  • the bare chip with ball-shaped contacts is fairly described as a ball grid array device.
  • finished chips are sometimes provided with terminal pads on one surface with ball-like deposits of solder forming interconnections on the terminal pads. The chip is then inverted and attached directly to a corresponding pattern of interconnect pads on a substrate. When heated, the solder balls reflow forming electrical and physical connections.
  • ball grid array and “ball grid array device” mean any structure, including device packages, flip chips and bare dies, carrying a plurality of substantially ball-shaped interconnections on one face thereof which are arranged in a substantially grid-like pattern.
  • the ball terminals are substantially spherical and are arranged on one face of the device package in a predetermined pattern.
  • each ball terminal has a geometric center which is spaced from the surface of the device package from which the ball terminal depends and the geometric centers of the ball terminals lie substantially in a plane parallel with the surface of the device package from which the ball terminals terminal balls depend.
  • This plane (or the corresponding plane for each individual ball terminal ball) is referred to herein as the center, centerline or extended centerline of the ball terminal ball.
  • the ball grid array device is positioned on an interconnect substrate having interconnect pads in an array corresponding to the ball grid array pattern.
  • the ball grid array device is positioned on the substrate so that the terminal balls are individually in contact with interconnect pads on the test substrate.
  • a lid or cover must be used which entraps the device and maintains the ball grid array in register and contact with the interconnect pads.
  • the entrapping lid interferes with proper circulation of cooling air around the device and precludes use of heat sinks even though the device may be designed to operate only in connection with a particular heat sink.
  • Such lids or covers are also difficult to manipulate, may cause damage to the device and generally prevent automated loading and unloading of the test sockets.
  • the present invention avoids the difficulties of the prior art by providing a mounting housing or socket with an open top. No lids, covers, etc., are required. Thus the top face of the device under test is available for attachment of a heat sink or open to cooling air or the like. Furthermore, since the top of the socket or mounting housing is open, devices to be tested can be inserted and removed by automated processes without fear of damaging the devices or the mounting apparatus.
  • the socket or mounting housing housings of the invention comprises a support member having a top face with a plurality of include support members with windows arranged therein to receive the array of interconnection terminal balls depending from the face of a ball grid array package.
  • the socket also includes a base member in which a plurality of axially elongated contact pins or fingers are anchored. One end of each contact finger extends through the base to provide an attachment tail which may be soldered to a burn-in board or the like. The opposite end of each finger projects into one of the windows. The central portion of each finger (between the free end and the base) extends through an aperture in a bending plate mounted between the base and the support member.
  • the bending plate may be fixed or moveable laterally with respect to the support member to move the free ends of the contact fingers with respect to the windows.
  • the end portion of each free end is curved or bent to define a contact tip at the extreme end of the free end which deviates from the axis of the finger.
  • the fingers are mounted so that in the open configuration the free end portions of the contact fingers are adjacent one side of their respective windows extend into a window.
  • a cam is used to move the bending plate laterally, thus simultaneously and uniformly moving the free ends of all the contact fingers in the same direction. The end portions are thus urged into contact with the terminal balls occupying the windows.
  • each finger which is deviated from the axis of the finger
  • the end contacts the terminal ball above the horizontal centerline thereof.
  • the fingers thus provide individual electrical contact to each ball and, since they contact the balls above their centerlines (between the center of each ball and the device face from which it depends), they retain the balls in their respective windows the window and thus entrap the ball grid array device. Since the ball grid array device is held in place by the end portions which contact the balls above their centerlines, the size of the balls may vary within limits without affecting the trapping effect of the contact fingers. Because of the simplicity of design and operation, the socket devices of the invention may be made from a wide variety of available materials.
  • FIG. 1 is an exploded perspective view of the assembly of a ball grid array device with a preferred embodiment of the mounting housing of the invention
  • FIG. 1A is an exaggerated fragmentary view of the top surface of the mounting housing of FIG. 1 ;
  • FIG. 1B is an exaggerated fragmentary view of the ball grid array surface of the ball grid array device of FIG. 1 ;
  • FIG. 2 is a partial sectional view of the mounting housing device of FIG. 1 taken along lines 2 — 2 showing the position of the contact fingers when the mounting housing is in the open condition;
  • FIG. 3 is a partial sectional view of the mounting housing of FIG. 1 taken along lines 2 — 2 showing the position of the contact fingers when a ball grid array has been inserted in a socket and the socket is in the closed position;
  • FIG. 4 is a partial sectional view of the mounting housing of FIG. 1 taken along lines 4 — 4 of FIG. 2 ;
  • FIG. 5 is a diagrammatic representation of the relationship between the end portion of a contact finger as used in the invention and terminal balls of various nominal ball sizes extending from the surface of ball grid array device;
  • FIG. 6 is a partial sectional view of an alternative embodiment of a mounting housing device as shown in FIG. 1 wherein the bending plate is maintained stationary and the top support member is used to move the ball grid array device with respect to the contact fingers;
  • FIG. 7 is a partial sectional view of the device of FIG. 6 showing the relative portions of the ends of the contact fingers and the ball grid array device when the socket is in the closed position.
  • mounting housing and “socket” are used synonymously herein to describe a device or apparatus for holding a ball grid array device while providing electrical contact to each of its terminal balls.
  • mounting housing and “socket” are used synonymously herein to describe a device or apparatus for holding a ball grid array device while providing electrical contact to each of its terminal balls.
  • like numerals are applied to like parts throughout the drawing.
  • FIG. 1 Operational arrangement of a ball grid array device 10 with the mounting housing of the invention is illustrated in FIG. 1 .
  • the ball grid array of device 10 has a bottom face 11 (see FIG. 1B ) on which are formed a plurality of spherically-shaped terminals 12 .
  • the terminals 12 are formed by depositing solder at predetermined locations on mounting pads or the like (not illustrated) on the face 11 of the device.
  • Various methods for forming such terminal balls are known and form no part of this invention. Such processes ordinarily produce substantially spherical bodies (see FIG. 5 ) which depend from the lower face 11 of the ball grid array device.
  • the terminal balls 12 are usually solder which has been deposited and heated so that it contracts into a ball shape by surface tension. Regardless of the method of manufacture, for reference purposes the ball-shaped terminals extending from the face of the ball grid array device are referred to herein as terminal balls or ball terminals.
  • Terminal balls 12 are arranged on the lower face of ball grid array device 10 in a predetermined grid-like pattern.
  • the mounting housing of the invention employs a top support member 22 which has a plurality of windows 23 extending therethrough (see FIG. 1 A). The As shown in FIG. 1A the windows 23 are arranged in a grid pattern matching the grid pattern of the ball terminals terminal balls 12 .
  • top support member 22 defines a single window into which all the terminal balls depend and into which the contact fingers extend with their ends arranged in a grid pattern matching the grid pattern of the terminal balls 12 .
  • the top face 24 of support member 22 may be provided with removeable spacers 35 of various sizes.
  • the spacers 35 define the periphery of each particular ball grid array device and position the ball grid array device to prevent movement thereof laterally with respect to top face 24 . Spacers 35 therefore assure that each ball grid array is aligned with the ball terminals terminal balls 12 depending from the lower face 11 thereof in proper registry and orientation with windows 23 and may be changed as required for each size and shape of ball grid array device package.
  • the socket of the invention is formed of a plurality of plate-like components (described in detail hereinafter) contained within a unitary box-like housing 100 having an open top and open bottom.
  • the housing contains a base member 21 which has a plurality of apertures 30 therein positioned substantially in registry with windows 23 in support member 22 .
  • Each aperture 30 has an internal shoulder 31 (see FIG. 4 ).
  • An elongated contact finger 40 is positioned in each aperture 30 .
  • each elongated contact finger defines an axially elongated body of resilient electrically conductive material such as nickel-coated steel or the like.
  • each contact finger 40 is substantially widened to form shoulders 45 and 46 on opposite ends thereof. Accordingly, when contact fingers 40 are inserted in the base member 21 , tail portions 41 project through apertures 30 and shoulders 46 rest on shoulders 31 . Trap plate 25 having apertures 32 and shoulders 33 in registry with and corresponding to apertures 30 is secured to base member 21 and shoulders 33 . The upper portion 44 of each contact finger 40 extends through an aperture 32 and the shoulders 33 on aperture 32 contact shoulders 45 on the expanded mid-sections 44 of the contact fingers. Accordingly, the contact fingers 40 are securely entrapped and held in place in the base member 21 by trap plate 25 .
  • Tails 41 may be secured in a suitable circuit board, burn-in board or the like. Alternatively, other means for making electrical contact to the circuitry of the supporting medium may be used.
  • each contact finger 40 which extends above the mid-section 43 projects through an aperture 54 in bending plate 28 with its free end 42 terminating in window 23 .
  • the free end portion 42 of each finger 40 is sufficiently elongated to define a generally central axis which is substantially perpendicular to the support surface 24 and extends into a window 23 .
  • the extreme end 42 a is bent or curved to deviate from the central axis and extends into the window 23 toward the support surface 24 but does not extend through the window 23 or surface 24 .
  • the extreme end 42 a should extend as near the surface 24 as possible without extending therethrough. It is only necessary, however, that the extreme end 42 a be above the centerline of the ball terminal which it contacts.
  • each window 23 has a small recess 23 a which accommodates the end portion 42 of contact finger 40 .
  • bending plate 28 is positioned between trap plate 25 and support member 22 but is free for reciprocal movement laterally with respect to the housing. Since mid-sections 43 of contact fingers 40 are securely anchored between the base member 21 and trap plate 25 , lateral movement of bending plate 28 causes corresponding lateral movement of the free end portions 42 of contact fingers 40 .
  • Rotatable cam 50 extends horizontally through the mounting housing adjacent one end surface 29 of the bending plate.
  • the cam 50 is secured in housing 100 on one end by retainer 53 .
  • the opposite end of the cam 50 is controlled by lever 52 .
  • a lobe 51 extending from cam 50 is moved into contact with end surface 29 of plate 28 when lever 52 is moved in a first direction.
  • rotation of a cam 50 (counter-clockwise as shown in FIG. 2 ) cams bending plate 28 in the same direction (to the left as shown in FIG. 2 ). Movement of bending plate 22 thus forces the free end portions 42 in the same direction, withdrawing them from recesses 23 a and causing them to laterally traverse the window 23 .
  • cam 50 is the presently preferred means for moving plate 28 .
  • Other means such as wedge plates, ratchets, plungers and rack-and-pinion arrangements, to name a few, may be designed to perform the relative movement function of the cam.
  • cam and “cam plate” are used herein to describe any mechanical arrangement which moves the upper portion 44 of the contact fingers laterally with respect to the support member 22 .
  • FIG. 2 The position of the upper portions 44 of contact fingers 42 in the housing in the open condition is illustrated in FIG. 2 .
  • the contact fingers 40 are either relaxed or forced into the open position by bending plate 28 .
  • a spring (not shown) may be positioned between the housing 100 and the end of the plate 28 opposite end 29 to ensure that the free end portions 42 are withdrawn into recesses 23 a.
  • a ball grid array device may be positioned with the ball terminals terminal balls 12 depending into windows 23 by simply positioning the ball grid array in the proper position. Since the free end portions 42 are withdrawn into recesses 23 a, the ball terminals terminal balls 12 simply depend into windows 23 .
  • the free end portions 42 of contact fingers 40 are positioned to extend into windows 23 near surface 24 but do not extend above surface 24 . Furthermore, the free end portions 42 are bent so that the extreme end 42 a deviates from the vertical axis of the pin 40 toward the ball terminal ball 12 to form a cup or hook at the extreme end 42 a of the contact finger 40 . As illustrated in FIG. 5 , the extreme end 42 a of free end portion 42 must extend above the centerline of the ball terminal ball 12 . For representative purposes, FIG. 5 illustrates the relative position of extreme end 42 a in contact with a ball terminal ball when the nominal ball size is 0.030 inch.
  • Nominal ball sizes of 0.030 inch may vary from about 0.035 to about 0.024 inch in diameter.
  • the point of contact on the ball may vary slightly with variations in ball size.
  • the point of contact between the extreme end 42 a of contact finger 40 will be approximately five degrees (5°) above the extended centerline of the ball terminal ball 12 .
  • FIG. 3 The relative positions of the Components components of the mounting housing and the ball grid array device when the housing is in the closed condition is illustrated in FIG. 3 .
  • lobe 51 on cam 50 has forced plate 28 to the left as shown in FIG. 3 .
  • the extreme ends 42 a of contact fingers 40 have moved in the same direction until they contact the surface of ball terminals terminal balls 12 .
  • the mid-section 44 of each contact finger 40 is bowed until a contact pressure of approximately thirty-five (35) grams is applied to each ball terminal ball.
  • the apparatus of the invention therefore provides a totally zero insertion force socket for mounting ball grid array devices for testing and burn-in.
  • the test device may be simply positioned on the top face of the mounting housing by gravity. No force of any sort is applied to the device package or the ball terminals terminal balls 12 during insertion or removal.
  • the bending plate 28 is cammed laterally to cause the free ends 42 of the contact fingers 40 to move into contact with the terminal balls 12 . It will be recognized, however, that other arrangements may be employed to move the terminal balls 12 with respect to free ends 42 of the contact fingers.
  • each contact finger 40 extends through an aperture 54 in bending plate 28 .
  • the apertures 54 are positioned with respect to the apertures 32 to bias the free ends 42 of the contact finger in a direction which is offset with respect to apertures 32 .
  • the contact fingers are reverse-curved in the section which passes through the bending plate 28 and the apertures 54 in the bending plate 28 are positioned to bias the ends 42 in the direction of curvature.
  • the extreme ends 42 a of the contact fingers 40 each exert a lateral and downward force on the ball terminal at approximately five degrees (5°) above its centerline.
  • the pressure exerted by each individual finger is limited so that there is no risk of damage to the ball terminals 12 .
  • the contact fingers 40 are withdrawn (or the top plate moved) to the open position, the ball grid array device 10 may be removed simply by gravity or with a vacuum pencil or the like. It is particularly noteworthy that the invention not only permits total zero insertion force and withdrawal force, no pressure whatsoever is ever applied to the ball grid array device except to the terminal balls 12 . In fact, the entire top surface of the ball grid array device is exposed since no lid or cover is employed. Cooling air may be circulated thereover or a heat sink may be applied thereto. Furthermore, since test devices may be loaded simply by vertical movement by gravity, the test apparatus of the invention may be easily loaded and unloaded by automated equipment.
  • all reactive forces caused by engagement between the device and the socket are contained within the body of the socket housing and not transmitted to the burn-in board.
  • opening (or closing) the socket by moving the ends 42 of the contact fingers with respect to the ball terminal balls 12 can involve substantial force.
  • a typical contact force requirement is approximately one (1) ounce of force exerted on each terminal ball 12 by each finger 42 .
  • the cumulative contact force applied is greater than sixty-two (62) pounds. This constitutes a substantial force with which to reckon since a burn-in board or the like may include a multitude of sockets and each socket is repeatedly loaded and unloaded.
  • the materials used for manufacture of the mounting housing of the invention may be varied as desired, depending upon the application.
  • the physical size and shape of the components may be arranged to accommodate any particular ball grid array device.
  • the contact fingers 40 are shown as axially elongated metal strips as may be cut or stamped from flat ribbon stock.
  • the fingers 40 could be formed from wire stock and may be formed into various configurations without departing from the principles of the invention.
  • the fingers may be anchored in the socket as desired by any suitable means. If the socket is to be used for burn-in purposes, heat resistant materials, of course, should be employed.
  • the design is particularly attractive for use in hostile environments since, in its preferred embodiment, very few moving parts are employed and the opening and closing functions can be readily automated. Thus the preferred structure is extremely reliable and functional in extended repetitive use.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
US09/715,290 1994-06-10 2000-11-17 Mounting apparatus for ball grid array device Expired - Lifetime USRE39418E1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/715,290 USRE39418E1 (en) 1994-06-10 2000-11-17 Mounting apparatus for ball grid array device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/258,348 US5419710A (en) 1994-06-10 1994-06-10 Mounting apparatus for ball grid array device
US08/382,487 US5611705A (en) 1994-06-10 1995-02-01 Mounting apparatus for ball grid array device
US09/715,290 USRE39418E1 (en) 1994-06-10 2000-11-17 Mounting apparatus for ball grid array device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US08/382,487 Reissue US5611705A (en) 1994-06-10 1995-02-01 Mounting apparatus for ball grid array device

Publications (1)

Publication Number Publication Date
USRE39418E1 true USRE39418E1 (en) 2006-12-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
US09/715,290 Expired - Lifetime USRE39418E1 (en) 1994-06-10 2000-11-17 Mounting apparatus for ball grid array device

Country Status (5)

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US (1) USRE39418E1 (de)
JP (3) JP3862303B2 (de)
DE (1) DE19521137A1 (de)
FR (1) FR2721145A1 (de)
GB (1) GB2290176B (de)

Cited By (4)

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US20100055936A1 (en) * 2008-08-26 2010-03-04 Hon Hai Precision Industry Co., Ltd. Electrical connector for test socket
US20100120270A1 (en) * 2008-11-10 2010-05-13 Hon Hai Precision Industry Co., Ltd. Test socket assembly having stacked insulative boards
US20140082915A1 (en) * 2011-02-09 2014-03-27 Russell S. Aoki Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
US20220163561A1 (en) * 2019-04-04 2022-05-26 Dong Weon Hwang Lidless bga socket apparatus for testing semiconductor device

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US5859538A (en) * 1996-01-31 1999-01-12 Hewlett-Packard Company Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both
JP3676523B2 (ja) * 1996-10-22 2005-07-27 株式会社エンプラス コンタクトピン及び電気的接続装置
US6294920B1 (en) * 1999-06-07 2001-09-25 Wayne K. Pfaff Test mounting for surface mount device packages
DE10053745B4 (de) 2000-10-30 2004-07-15 Heigl, Helmuth, Dr.-Ing. Vorrichtung und Verfahren zur Kontaktierung eines oder mehrerer Anschlüsse an einem elektronischen Bauteil
US6969270B2 (en) * 2003-06-26 2005-11-29 Intel Corporation Integrated socket and cable connector
KR100675343B1 (ko) 2004-12-20 2007-01-29 황동원 반도체용 테스트 및 번인 소켓
JP4769538B2 (ja) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 電子部品用コンタクタ及びコンタクト方法
JP4729346B2 (ja) * 2005-06-30 2011-07-20 株式会社エンプラス 電気部品用ソケット
JP4802059B2 (ja) * 2006-07-27 2011-10-26 株式会社エンプラス 電気部品用ソケット
KR101419364B1 (ko) 2012-09-11 2014-07-16 주식회사 아이에스시 핸들러용 인서트
KR101860792B1 (ko) 2018-02-28 2018-05-25 (주)퀀텀테크 반도체 테스트용 소켓
KR102658375B1 (ko) * 2021-10-13 2024-04-18 (주)아이윈솔루션 포인팅 애큐러시가 향상된 고집적 번인 소켓

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US20100055936A1 (en) * 2008-08-26 2010-03-04 Hon Hai Precision Industry Co., Ltd. Electrical connector for test socket
US7972159B2 (en) * 2008-08-26 2011-07-05 Hon Hai Precision Ind. Co., Ltd. Electrical connector for test socket
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Also Published As

Publication number Publication date
FR2721145A1 (fr) 1995-12-15
JP2007108179A (ja) 2007-04-26
GB2290176A (en) 1995-12-13
JP3862303B2 (ja) 2006-12-27
JP2004309496A (ja) 2004-11-04
DE19521137A1 (de) 1995-12-14
GB9509228D0 (en) 1995-06-28
JPH0850975A (ja) 1996-02-20
JP4170259B2 (ja) 2008-10-22
GB2290176B (en) 1997-07-02
JP4156002B2 (ja) 2008-09-24

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