JP3862303B2 - ボールグリッドアレイデバイスの取付装置 - Google Patents
ボールグリッドアレイデバイスの取付装置 Download PDFInfo
- Publication number
- JP3862303B2 JP3862303B2 JP14150095A JP14150095A JP3862303B2 JP 3862303 B2 JP3862303 B2 JP 3862303B2 JP 14150095 A JP14150095 A JP 14150095A JP 14150095 A JP14150095 A JP 14150095A JP 3862303 B2 JP3862303 B2 JP 3862303B2
- Authority
- JP
- Japan
- Prior art keywords
- grid array
- ball grid
- support member
- array device
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/258,348 US5419710A (en) | 1994-06-10 | 1994-06-10 | Mounting apparatus for ball grid array device |
US08/382,487 US5611705A (en) | 1994-06-10 | 1995-02-01 | Mounting apparatus for ball grid array device |
US08/258348 | 1995-02-01 | ||
US08/382487 | 1995-02-01 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004164921A Division JP4170259B2 (ja) | 1994-06-10 | 2004-06-02 | ボールグリッドアレイデバイスの取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0850975A JPH0850975A (ja) | 1996-02-20 |
JP3862303B2 true JP3862303B2 (ja) | 2006-12-27 |
Family
ID=26946583
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14150095A Expired - Fee Related JP3862303B2 (ja) | 1994-06-10 | 1995-06-08 | ボールグリッドアレイデバイスの取付装置 |
JP2004164921A Expired - Fee Related JP4170259B2 (ja) | 1994-06-10 | 2004-06-02 | ボールグリッドアレイデバイスの取付装置 |
JP2006277589A Expired - Fee Related JP4156002B2 (ja) | 1994-06-10 | 2006-10-11 | ボールグリッドアレイデバイスの検査方法、製作方法及びボールグリッドアレイデバイス |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004164921A Expired - Fee Related JP4170259B2 (ja) | 1994-06-10 | 2004-06-02 | ボールグリッドアレイデバイスの取付装置 |
JP2006277589A Expired - Fee Related JP4156002B2 (ja) | 1994-06-10 | 2006-10-11 | ボールグリッドアレイデバイスの検査方法、製作方法及びボールグリッドアレイデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | USRE39418E1 (de) |
JP (3) | JP3862303B2 (de) |
DE (1) | DE19521137A1 (de) |
FR (1) | FR2721145A1 (de) |
GB (1) | GB2290176B (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3360179B2 (ja) * | 1994-09-06 | 2002-12-24 | ザ ウィタカー コーポレーション | ボールグリッドアレーソケット |
US5859538A (en) * | 1996-01-31 | 1999-01-12 | Hewlett-Packard Company | Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both |
JP3676523B2 (ja) * | 1996-10-22 | 2005-07-27 | 株式会社エンプラス | コンタクトピン及び電気的接続装置 |
US6294920B1 (en) * | 1999-06-07 | 2001-09-25 | Wayne K. Pfaff | Test mounting for surface mount device packages |
DE10053745B4 (de) | 2000-10-30 | 2004-07-15 | Heigl, Helmuth, Dr.-Ing. | Vorrichtung und Verfahren zur Kontaktierung eines oder mehrerer Anschlüsse an einem elektronischen Bauteil |
US6969270B2 (en) * | 2003-06-26 | 2005-11-29 | Intel Corporation | Integrated socket and cable connector |
KR100675343B1 (ko) | 2004-12-20 | 2007-01-29 | 황동원 | 반도체용 테스트 및 번인 소켓 |
JP4769538B2 (ja) * | 2005-02-22 | 2011-09-07 | 富士通セミコンダクター株式会社 | 電子部品用コンタクタ及びコンタクト方法 |
JP4729346B2 (ja) * | 2005-06-30 | 2011-07-20 | 株式会社エンプラス | 電気部品用ソケット |
JP4802059B2 (ja) * | 2006-07-27 | 2011-10-26 | 株式会社エンプラス | 電気部品用ソケット |
US7972159B2 (en) * | 2008-08-26 | 2011-07-05 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector for test socket |
TWM360464U (en) * | 2008-11-10 | 2009-07-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8622764B2 (en) * | 2011-02-09 | 2014-01-07 | Intel Corporation | Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices |
KR101419364B1 (ko) | 2012-09-11 | 2014-07-16 | 주식회사 아이에스시 | 핸들러용 인서트 |
KR101860792B1 (ko) | 2018-02-28 | 2018-05-25 | (주)퀀텀테크 | 반도체 테스트용 소켓 |
KR102146290B1 (ko) * | 2019-04-04 | 2020-08-21 | 황동원 | 반도체 소자 테스트용 lidless BGA 소켓장치 |
KR102658375B1 (ko) * | 2021-10-13 | 2024-04-18 | (주)아이윈솔루션 | 포인팅 애큐러시가 향상된 고집적 번인 소켓 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4420205A (en) * | 1981-09-14 | 1983-12-13 | Augat Inc. | Low insertion force electronic component socket |
US4501461A (en) * | 1983-12-27 | 1985-02-26 | International Telephone And Telegraph Corporation | Zero insertion force socket |
US4739257A (en) * | 1985-06-06 | 1988-04-19 | Automated Electronic Technology, Inc. | Testsite system |
US4836798A (en) * | 1987-12-21 | 1989-06-06 | Wells Electronics, Inc. | Zero insertion socket with normally closed contacts |
US5073117A (en) * | 1989-03-30 | 1991-12-17 | Texas Instruments Incorporated | Flip-chip test socket adaptor and method |
JPH0630280B2 (ja) * | 1990-05-14 | 1994-04-20 | 山一電機工業株式会社 | 接続器 |
JPH0675415B2 (ja) * | 1991-03-15 | 1994-09-21 | 山一電機株式会社 | リードレス形icパッケージ用接続器 |
JP2665419B2 (ja) * | 1991-08-13 | 1997-10-22 | 山一電機株式会社 | 電気部品用接続器 |
US5281160A (en) * | 1991-11-07 | 1994-01-25 | Burndy Corporation | Zero disengagement force connector with wiping insertion |
US5247250A (en) * | 1992-03-27 | 1993-09-21 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket |
JPH0677467B2 (ja) * | 1992-12-25 | 1994-09-28 | 山一電機株式会社 | Icソケット |
US5482471A (en) * | 1993-02-24 | 1996-01-09 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
-
1995
- 1995-05-05 GB GB9509228A patent/GB2290176B/en not_active Expired - Fee Related
- 1995-05-30 FR FR9506362A patent/FR2721145A1/fr active Pending
- 1995-06-08 JP JP14150095A patent/JP3862303B2/ja not_active Expired - Fee Related
- 1995-06-09 DE DE19521137A patent/DE19521137A1/de not_active Withdrawn
-
2000
- 2000-11-17 US US09/715,290 patent/USRE39418E1/en not_active Expired - Lifetime
-
2004
- 2004-06-02 JP JP2004164921A patent/JP4170259B2/ja not_active Expired - Fee Related
-
2006
- 2006-10-11 JP JP2006277589A patent/JP4156002B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2721145A1 (fr) | 1995-12-15 |
JP2007108179A (ja) | 2007-04-26 |
GB2290176A (en) | 1995-12-13 |
JP2004309496A (ja) | 2004-11-04 |
USRE39418E1 (en) | 2006-12-05 |
DE19521137A1 (de) | 1995-12-14 |
GB9509228D0 (en) | 1995-06-28 |
JPH0850975A (ja) | 1996-02-20 |
JP4170259B2 (ja) | 2008-10-22 |
GB2290176B (en) | 1997-07-02 |
JP4156002B2 (ja) | 2008-09-24 |
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