JP3862303B2 - ボールグリッドアレイデバイスの取付装置 - Google Patents

ボールグリッドアレイデバイスの取付装置 Download PDF

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Publication number
JP3862303B2
JP3862303B2 JP14150095A JP14150095A JP3862303B2 JP 3862303 B2 JP3862303 B2 JP 3862303B2 JP 14150095 A JP14150095 A JP 14150095A JP 14150095 A JP14150095 A JP 14150095A JP 3862303 B2 JP3862303 B2 JP 3862303B2
Authority
JP
Japan
Prior art keywords
grid array
ball grid
support member
array device
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP14150095A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0850975A (ja
Inventor
ケイ．ファフ ウェイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wayne KPfaff
Original Assignee
Wayne KPfaff
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/258,348 external-priority patent/US5419710A/en
Application filed by Wayne KPfaff filed Critical Wayne KPfaff
Publication of JPH0850975A publication Critical patent/JPH0850975A/ja
Application granted granted Critical
Publication of JP3862303B2 publication Critical patent/JP3862303B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP14150095A 1994-06-10 1995-06-08 ボールグリッドアレイデバイスの取付装置 Expired - Fee Related JP3862303B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/258,348 US5419710A (en) 1994-06-10 1994-06-10 Mounting apparatus for ball grid array device
US08/382,487 US5611705A (en) 1994-06-10 1995-02-01 Mounting apparatus for ball grid array device
US08/258348 1995-02-01
US08/382487 1995-02-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004164921A Division JP4170259B2 (ja) 1994-06-10 2004-06-02 ボールグリッドアレイデバイスの取付装置

Publications (2)

Publication Number Publication Date
JPH0850975A JPH0850975A (ja) 1996-02-20
JP3862303B2 true JP3862303B2 (ja) 2006-12-27

Family

ID=26946583

Family Applications (3)

Application Number Title Priority Date Filing Date
JP14150095A Expired - Fee Related JP3862303B2 (ja) 1994-06-10 1995-06-08 ボールグリッドアレイデバイスの取付装置
JP2004164921A Expired - Fee Related JP4170259B2 (ja) 1994-06-10 2004-06-02 ボールグリッドアレイデバイスの取付装置
JP2006277589A Expired - Fee Related JP4156002B2 (ja) 1994-06-10 2006-10-11 ボールグリッドアレイデバイスの検査方法、製作方法及びボールグリッドアレイデバイス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2004164921A Expired - Fee Related JP4170259B2 (ja) 1994-06-10 2004-06-02 ボールグリッドアレイデバイスの取付装置
JP2006277589A Expired - Fee Related JP4156002B2 (ja) 1994-06-10 2006-10-11 ボールグリッドアレイデバイスの検査方法、製作方法及びボールグリッドアレイデバイス

Country Status (5)

Country Link
US (1) USRE39418E1 (de)
JP (3) JP3862303B2 (de)
DE (1) DE19521137A1 (de)
FR (1) FR2721145A1 (de)
GB (1) GB2290176B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3360179B2 (ja) * 1994-09-06 2002-12-24 ザ ウィタカー コーポレーション ボールグリッドアレーソケット
US5859538A (en) * 1996-01-31 1999-01-12 Hewlett-Packard Company Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both
JP3676523B2 (ja) * 1996-10-22 2005-07-27 株式会社エンプラス コンタクトピン及び電気的接続装置
US6294920B1 (en) * 1999-06-07 2001-09-25 Wayne K. Pfaff Test mounting for surface mount device packages
DE10053745B4 (de) 2000-10-30 2004-07-15 Heigl, Helmuth, Dr.-Ing. Vorrichtung und Verfahren zur Kontaktierung eines oder mehrerer Anschlüsse an einem elektronischen Bauteil
US6969270B2 (en) * 2003-06-26 2005-11-29 Intel Corporation Integrated socket and cable connector
KR100675343B1 (ko) 2004-12-20 2007-01-29 황동원 반도체용 테스트 및 번인 소켓
JP4769538B2 (ja) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 電子部品用コンタクタ及びコンタクト方法
JP4729346B2 (ja) * 2005-06-30 2011-07-20 株式会社エンプラス 電気部品用ソケット
JP4802059B2 (ja) * 2006-07-27 2011-10-26 株式会社エンプラス 電気部品用ソケット
US7972159B2 (en) * 2008-08-26 2011-07-05 Hon Hai Precision Ind. Co., Ltd. Electrical connector for test socket
TWM360464U (en) * 2008-11-10 2009-07-01 Hon Hai Prec Ind Co Ltd Electrical connector
US8622764B2 (en) * 2011-02-09 2014-01-07 Intel Corporation Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
KR101419364B1 (ko) 2012-09-11 2014-07-16 주식회사 아이에스시 핸들러용 인서트
KR101860792B1 (ko) 2018-02-28 2018-05-25 (주)퀀텀테크 반도체 테스트용 소켓
KR102146290B1 (ko) * 2019-04-04 2020-08-21 황동원 반도체 소자 테스트용 lidless BGA 소켓장치
KR102658375B1 (ko) * 2021-10-13 2024-04-18 (주)아이윈솔루션 포인팅 애큐러시가 향상된 고집적 번인 소켓

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4420205A (en) * 1981-09-14 1983-12-13 Augat Inc. Low insertion force electronic component socket
US4501461A (en) * 1983-12-27 1985-02-26 International Telephone And Telegraph Corporation Zero insertion force socket
US4739257A (en) * 1985-06-06 1988-04-19 Automated Electronic Technology, Inc. Testsite system
US4836798A (en) * 1987-12-21 1989-06-06 Wells Electronics, Inc. Zero insertion socket with normally closed contacts
US5073117A (en) * 1989-03-30 1991-12-17 Texas Instruments Incorporated Flip-chip test socket adaptor and method
JPH0630280B2 (ja) * 1990-05-14 1994-04-20 山一電機工業株式会社 接続器
JPH0675415B2 (ja) * 1991-03-15 1994-09-21 山一電機株式会社 リードレス形ｉｃパッケージ用接続器
JP2665419B2 (ja) * 1991-08-13 1997-10-22 山一電機株式会社 電気部品用接続器
US5281160A (en) * 1991-11-07 1994-01-25 Burndy Corporation Zero disengagement force connector with wiping insertion
US5247250A (en) * 1992-03-27 1993-09-21 Minnesota Mining And Manufacturing Company Integrated circuit test socket
JPH0677467B2 (ja) * 1992-12-25 1994-09-28 山一電機株式会社 Ｉｃソケット
US5482471A (en) * 1993-02-24 1996-01-09 Texas Instruments Incorporated Socket apparatus for IC package testing
US5291062A (en) * 1993-03-01 1994-03-01 Motorola, Inc. Area array semiconductor device having a lid with functional contacts

Also Published As

Publication number Publication date
FR2721145A1 (fr) 1995-12-15
JP2007108179A (ja) 2007-04-26
GB2290176A (en) 1995-12-13
JP2004309496A (ja) 2004-11-04
USRE39418E1 (en) 2006-12-05
DE19521137A1 (de) 1995-12-14
GB9509228D0 (en) 1995-06-28
JPH0850975A (ja) 1996-02-20
JP4170259B2 (ja) 2008-10-22
GB2290176B (en) 1997-07-02
JP4156002B2 (ja) 2008-09-24

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